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product structure silicon monolithic integrated circuit this product has no designed protection against radioactive rays . 1/ 21 tsz02201-0j3j0aj00150-1-2 ? 2012 rohm co., ltd. all rights reserved. 03.oct.2014 rev.002 tsz22111 ? 14 ? 001 www.rohm.com 4.5v to 5.5v, 3.0a 1ch synchronous buck converter with integrated fet BD9134MUV general description BD9134MUV is rohms high efficiency step -down switching regulator designed to provide a voltage as low as 3.3 v from a supply voltage of 5v. it offers hig h efficiency by using pulse skip control technology and synchronous switches, and provides fast transient response to sudden load changes by implementing current mode control. features ? fast transient response because of current mode pwm control system ? high efficiency for all load ranges because of synchronous switches (nch/nch fet) and sllm tm (simple light load mode) ? soft-start function ? thermal shutdown and uvlo functions ? short-circuit protection with time delay function ? shutdown function applicati ons power supply for lsi including dsp, microcomputer and asic key specifications ? input voltage range: 4.5v to 5.5v ? output voltage range: 3.25v to 3.35v ? output current: 3.0a(max) ? switching frequency: 1mhz(typ) ? high side fet on-resistance: 82m (typ) ? low side fet on-resistance: 70m(typ) ? standby current: 0a (typ) ? operating temperature range: - 40 c to +105 c package w(typ) x d(typ) x h(max) typical application circuit figure 1. typical application circuit vqfn020v4040 4.00mm x 4.00mm x 1.00mm en v out ith pvcc vcc sw gnd, pgnd c in v cc r ith c ith v out c o l c bst c 1 r f datashee t downloaded from: http:///
2/ 21 BD9134MUV tsz02201-0j3j0aj00150-1-2 ? 2012 rohm co., ltd. all rights reserved. 03.oct.2014 rev.002 www.rohm.com tsz22111 ? 15 ? 001 pin configuration (top view) pin description pin no. pin name function pin no. pin name function 1 sw power switch node 11 gnd ground pin 2 sw power switch node 12 vout output voltage detection pin 3 sw power switch node 13 ith gmamp output pin/connected to phase compensation capacitor 4 sw power switch node 14 n.c. no connection 5 sw power switch node 15 n.c. no connection 6 pvcc power switch supply pin 16 n.c. no connection 7 pvcc power switch supply pin 17 en enable pin (ac tive high 8 pvcc power switch supply pin 18 pgnd power switch ground pin 9 bst bootstrapped voltage input pin 19 pgnd power switch ground pin 10 vcc power supply input pin 20 pgnd power switch ground pin block diagram output pgnd gnd gm amp r s q osc uvlo tsd + v cc vcc clk slope en current comp soft start current sense/ protect + driver logic + vref ith vout r ith c ith pv cc sw pvcc bst vcc 5v input scp figure 2 . pin configuration figure 3. block diagram 1 2 3 4 5 6 7 8 9 10 20 19 18 17 16 15 14 13 12 11 n.c. sw pgnd gnd it h n.c. bst vcc vout en pvcc downloaded from: http:///
3/ 21 BD9134MUV tsz02201-0j3j0aj00150-1-2 ? 2012 rohm co., ltd. all rights reserved. 03.oct.2014 rev.002 www.rohm.com tsz22111 ? 15 ? 001 absolute maximum ratings (ta=25 c ) parameter symbol limit unit v cc voltage v cc -0.3 to +7 (note 1) v pvcc voltage pv cc -0.3 to +7 (note 1) v bst voltage v bst -0.3 to +13 v b st _s w voltage v bst - sw -0.3 to +7 v en voltage v en -0.3 to +7 v sw,ith voltage v sw , v ith -0.3 to +7 v power dissipation 1 pd1 0.34 (note 2) w power dissipation 2 pd2 0.70 (note 3) w power dissipation 3 pd3 1.21 (note 4) w power dissipation 4 pd4 3.56 (note 5) w operating temperature range topr -40 to +105 c storage temperature range tstg -55 to +150 c maximum junction temperature tjmax +150 c (note 1) pd should not be exceeded. (note 2) ic only (note 3) mounted on a 1-layer 74.2mmx74.2mmx1.6mm glass-epoxy board, occupied area by copper foil : 10.29mm 2 (note 4) mounted on a 4-layer 74.2mmx74.2mmx1.6mm glass-epoxy board, occupied area by copper foil : 10.29mm 2 , in each layers (note 5) mounted on a 4-layer 74.2mmx74.2mmx1.6mm glass-epoxy board, occupied area by copper foil : 5505mm 2 , in each layers caution: operating the ic over the absolute maximum ratings may damage the ic. the damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. therefore, it is important to consider circuit protection m easures such as adding a fuse, in case the ic is operated over the absolute maximum ratings. recommended operating conditions (ta=-40c to +105c) parameter symbol limit unit min typ max power supply voltage v cc 4.5 5 5.5 v pv cc 4.5 5 5.5 v en voltage v en 0 - 5.5 v output current i sw - - 3.0 (note 6) a (note 6) pd should not be exceeded. electrical characteristics (ta=25 c v cc =pv cc =5v, v en =v cc , unless otherwise specified.) parameter symbol limit unit conditions min typ max standby current i stb - 0 10 a en=gnd active current i cc - 250 500 a en low voltage v enl - gnd 0.8 v standby mode en high voltage v enh 2.0 v cc - v active mode en input current i en - 1 10 a v en =5v oscillation frequency f osc 0.8 1 1.2 mhz high side fet on-resistance r onh - 82 115 m pv cc =5v low side fet on-resistance r onl - 70 98 m pv cc =5v output voltage v out 3.25 3.3 3.35 v ith s i nk current i thsi 10 18 - a v out =4.1v ith source current i thso 10 18 - a v out =2.5v uvlo threshold voltage v uvlo1 3.6 3.8 4.0 v v cc =5v to 0v uvlo release voltage v uvlo2 3.65 3.9 4.2 v v cc =0v to 5v soft-start time t ss 2.5 5 10 ms timer latch time t latch 0.5 1 2 ms output short circuit threshold voltage v scp - 1.65 2.4 v v out =3.3v to 0v downloaded from: http:///
4/ 21 BD9134MUV tsz02201-0j3j0aj00150-1-2 ? 2012 rohm co., ltd. all rights reserved. 03.oct.2014 rev.002 www.rohm.com tsz22111 ? 15 ? 001 typical performance curves figure 6. output voltage vs output current output voltage: v out [v] ou tput current: i out [a] v cc =5v ta=25c [v out =3.3v] figure 7. output voltage vs temperature output voltage: v out [v] temperature: ta[c] v cc =5v i o =0a figure 5. output voltage vs en voltage output voltage: v out [v] en voltage: v en [v] v cc =5v ta=25c i o =0a figure 4. output voltage vs input voltage output voltage: v out [v] input voltage: v cc [v] [v out =3.3v] ta=25c i o =3a [v out =3.3v] [v out =3.3v] downloaded from: http:///
5/ 21 BD9134MUV tsz02201-0j3j0aj00150-1-2 ? 2012 rohm co., ltd. all rights reserved. 03.oct.2014 rev.002 www.rohm.com tsz22111 ? 15 ? 001 typical performance curves C continued figure 10 . on -resistance vs temperature temperature: ta[c] on -resistance: r on [ ] v cc =5v figure 11. en voltage vs temperature en voltage: v en [ v] temperature: ta[c] v cc =5v figure 9. frequency vs temperature frequency: f osc [mhz] temperature: ta[c] v cc =5v figure 8. efficiency vs output current efficiency: [%] output current: i out [ma] v cc =5v ta=25c v ou t =3.3v downloaded from: http:///
6/ 21 BD9134MUV tsz02201-0j3j0aj00150-1-2 ? 2012 rohm co., ltd. all rights reserved. 03.oct.2014 rev.002 www.rohm.com tsz22111 ? 15 ? 001 typical performance curves C continued typical waveforms figure 13 . frequency vs input voltage frequency: f osc [mhz] input voltage: v cc [v] figure 14 . soft-start waveform v cc =5v ta=25c i o =0a v out v cc =pvcc =en figure 12 . circuit current vs temperature circuit current: i cc [ a] v cc =5v temperature: ta [c] [v out =3.3v] ta=25c figure 15 . sw waveform (io=10ma) v cc =5v ta=25c v out =3.3v] v out sw downloaded from: http:///
7/ 21 BD9134MUV tsz02201-0j3j0aj00150-1-2 ? 2012 rohm co., ltd. all rights reserved. 03.oct.2014 rev.002 www.rohm.com tsz22111 ? 15 ? 001 typical waveforms C continued figure 18. transient respon se (io=3a to 1a, 10s) v cc =5v ta=25c figure 17. transient response (io=1a to 3a, 10s) v cc =5v ta=25c figure 16. sw waveform (io=3a) v cc =5v ta=25c [pwm v out =3.3v] [v out =3.3v] [v out =3.3v] v ou t i out v ou t i ou t downloaded from: http:///
8/ 21 BD9134MUV tsz02201-0j3j0aj00150-1-2 ? 2012 rohm co., ltd. all rights reserved. 03.oct.2014 rev.002 www.rohm.com tsz22111 ? 15 ? 001 application information 1. operation BD9134MUV is a synchronous step-down switching regulator that achieves fast transient response by employing current mode pwm control system. it utilizes switching operation either in pwm (pulse width modulation) mode for heavier load, or sllm tm (simple light load mode) operation for lighter load to improve efficiency. (1) synchronous rectifier integrated synchronous rectification using two mosfets reduces power dissipation and increases efficiency when compared to converters using external diodes. internal shoot-through current limiting circuit further reduces power dissipation. (2) current mode pwm control the pwm control signal of this ic depends on two feedback loops, the voltage feedback and the inductor current feedback. (a) pwm (pulse width modulation) control the clock signal coming from osc has a frequency of 1mhz. when osc sets the rs latch, the p-channel mosfet is turned on and the n-channel mosfet is turned off . the opposite happens when the current comparator (current comp) resets the rs latch i.e. the p-channel mosfet is turned off and the n-channel mosfet is turned on . current comps output is a comparison of two signals, the current feedb ack control signal sense which is a voltage proportional to the current i l , and the voltage feedback control signal, fb. (b) sllm tm (simple light load mode) control when the control mode is shifted by pwm from heavier load to lighter load or vice versa, the switching pulse is designed to turn off with the device held operating in normal pwm control loop. this allows linear operation without voltage drop or deterioration in transient response during the sudden load changes. although the pwm control loop continues to operate with a set signal from osc and a reset signal from current comp, it is so designed such that the reset signal is continuously sent even if the load is changed to light mode where the switching is tuned off and the switching pulses disappe ar . activating the switching discontinuously reduces the switching dissipation and improves the efficiency. figure 19 . diagram of current mode pwm control figure 20 . pwm switching timing diagram figure 21. sllm tm switching timing diagram current comp set reset sw v out pv cc gnd gnd gnd i l (ave) v out (ave) sense fb i l current comp set reset sw v out pv cc gnd gnd gnd 0a v out (ave) sense fb i l not switching osc level shift driver logic r q s i l sw r ith current comp gm amp set reset fb load v out v out sense downloaded from: http:///
9/ 21 BD9134MUV tsz02201-0j3j0aj00150-1-2 ? 2012 rohm co., ltd. all rights reserved. 03.oct.2014 rev.002 www.rohm.com tsz22111 ? 15 ? 001 2. description of operations (1) soft-start function during start-up, the soft-start circuit gradually establishes the output voltage to limit the input current. this prevent s the overshoot in the output voltage and inrush current. (2) shutdown function when the en terminal is low, the device operates in standby mode and all funct ional blocks, such as reference voltage circuit, internal oscillator and drivers are turned off. circuit current during standby is 0a (typ). (3) uvlo function the uvlo circuit detects whether the supplied input voltage is sufficient to obtain the output voltage of this ic. the uvlo threshold, which has a hysteresis of 50mv (typ) to prevent output chattering. figure 22 . soft-start, shutdown, uvlo timing diagram (4) short-circuit protection with time delay function to protect the ic from breakdown, the short-circuit turns the output off when the internal current limiter is activated continuously for a fixed time (t latch ) or more. the output that is kept off may be turned on again by restarting en or by resetting uvlo. figure 23 . short-circuit protection with time delay diagram hysteresis 50mv t ss t ss t ss soft start st andby mode operating mode standby mode operating mode standby mode operating mode standby mode uvlo en uvlo uvlo v cc en v out 1/2v out 1msec output voltage off latch output current in non-control output current in control by limit value (with fall of the output voltage, limit value goes down) en timer latch en standby mode operated mode standby mode operated mode en v out limit i l until output voltage goes up the half of vo or over, timer latch is not operated. (no timer latch, only limit to the output current) downloaded from: http:///
10 / 21 BD9134MUV tsz02201-0j3j0aj00150-1-2 ? 2012 rohm co., ltd. all rights reserved. 03.oct.2014 rev.002 www.rohm.com tsz22111 ? 15 ? 001 3. information on advantages advantage 1 offers fast transient response by using current mode control system. voltage drop due to sudden change in load was reduced. figure 24 . comparison of transient response advantage 2 offers high efficiency for all load ranges. (a) for lighter load: this ic utilizes the current mode control called sllm tm , which reduces various dissipations such as switching dissipation (p sw ), gate charge/discharge dissipation (p gate ), esr dissipation of output capacitor (p esr ) and on -resistance dissipation (p ron ) that may otherwise cause reduction in efficiency. achieves efficiency improvement for lighter load. (b) for heavier load: this ic utilizes the synchronous rectifying mode and uses low on -resistance power mosfets. on -resistance of high side mosfet : 82m(typ) on -resistance of low side mosfet : 70m(typ) achieves efficiency improvement for heavier load. offers high efficiency for all load range with the improvements mentioned above. advantage 3 ? supplied in smaller package due to small-sized power mosfet. reduces mounting area requirement. figure 26 . example application figure 25. efficiency BD9134MUV (load response i o =1a to 3a) ? output capacitor co required for current mode control: 22f ceramic capacitor ? inductance l required for the operating frequency of 1 mhz: 2.2h inductor ? incorporates fet + boot strap diode 0.001 0.01 0.1 1 0 50 100 pwm sllm tm improvement by sllm tm system improvement by synchronous rectifier efficiency [%] output current i out [a] v cc conventional product (load response i o =1a to 3a) v out i out 572mv v out i out 328mv output pgnd gnd gm amp r s q osc uvlo tsd + vcc clk slope en current comp soft start current sense/ protect + driver logic + vref ith vout r ith c ith pv cc sw pvcc bst vcc 3.3v input scp 15mm 20mm r 2 c ith c f c o l r 1 r ith rf c bst c in downloaded from: http:///
11 / 21 BD9134MUV tsz02201-0j3j0aj00150-1-2 ? 2012 rohm co., ltd. all rights reserved. 03.oct.2014 rev.002 www.rohm.com tsz22111 ? 15 ? 001 4. switching regulator efficiency efficiency may be expressed by the equation shown below: efficiency may be improved by reducing the switching regulator power dissipation factors pda as follows: dissipation factors: (1) on -resistance dissipation of inductor and fet pd (i 2 r) where: r coil is the dc resistance of inductor. r on is the on -resistance of fet. i out is the output current. (2) gate charge/ di scharge dissipation pd(gate) where: c gs is the gate capacitance of fet. f is the switching frequency. v is the gate driving voltage of fet. (3) switching dissipation pd(sw) where: f is the reverse transfer capacitance of fet. v is the peak current of gate. (4) esr dissipation of capacitor pd (esr) where: i rms is the ripple current of capacitor. esr is the equivalent series resistance. (5) operating current dissipation of ic pd(ic) where: i cc is the circuit current. ? ? % 100 100 100 ? ? ? ? ? ? ? ? ? ? ? pd p p p p l v i v out out in out in in out out ? ? ? ? on coil out r r i ri pd ? ? ? 2 2 ? ? drive out rss in i f i c v sw pd ? ? ? ? 2 ? ? esr i esr pd rms ? ? 2 ? ? cc in i v ic pd ? ? ? ? 2 v f c gate pd gs ? ? ? downloaded from: http:///
12 / 21 BD9134MUV tsz02201-0j3j0aj00150-1-2 ? 2012 rohm co., ltd. all rights reserved. 03.oct.2014 rev.002 www.rohm.com tsz22111 ? 15 ? 001 5. consideration on permissible dissipation and heat generation since this ic functions with high efficiency without significant heat generation in most applications, no special cons ideration is needed on permissible dissipation or heat generation. in case of extreme conditions, however, including lower i nput voltage, higher output voltage, heavier load, and/or higher temperature, the permissible dissipation and/or heat generatio n must be carefully considered. for dissipation, only conduction losses due to dc resistance of inductor and on-resistance of fet are considered. this is because conduction losses are the most significant among other dissipation mentioned above such as gate charge/discharge dissipation and switching dissipation. ? ? onl onh on on out rd r d r r i p ? ? ? ? ? ? 1 2 where: d is the on duty (=v out /v cc ). r onh is the on -resistance of highside mosfet. r onl is the on -resistance of lowside mosfet. i out is the output current. if v cc =5v, v out =3.3v, r onh =82m, r onl =70m i out =3a, for example, ? ? ? ? ? ? w p r v v d on cc out 70128 .0 07792 .0 3 07792 .0 0238 .0 05412 .0 07 .0 66 .01 082 .0 66 .0 66 .0 0.5/3.3 / 2 ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? since r on h is greater than r on l in this ic, the dissipation increases as the on duty increases. taking into consideration the dissipation stated above, thermal design must be carried out with sufficient margin. figure 27 . thermal derating curve (vqfn020v4040) power dissipation: pd [w] ambient temperature: ta [ c ] 0 25 50 75 100 125 150 0 2.0 3.0 4.0 1.21w 3.56w 1.0 0.70w 0.34w 4 layers (copper foil area : 5505mm 2 ) copper foil in each layers. j -a=35.1c /w 4 layers (copper foil area : 10.29m 2 ) copper foil in each layers. j -a=103.3 c /w 1 layers (copper foil area : 10.29m 2 ) j -a=178.6c /w ic only. j -a=367 .6 c /w 105 downloaded from: http:///
13 / 21 BD9134MUV tsz02201-0j3j0aj00150-1-2 ? 2012 rohm co., ltd. all rights reserved. 03.oct.2014 rev.002 www.rohm.com tsz22111 ? 15 ? 001 6. selection of components externally connected (1) selection of inductor (l) note: current exceeding the current rating of an inductor results in magnetic saturation of the inductor, which decreases efficiency. the inductor must be selected allowing sufficient margin in which the peak current may not exceed its current rating. if v cc =5.0v, v out =3.3v, f=1mhz, i l =0.2x3a=0.6a, for example , ( BD9134MUV) note: select an inductor with low resistance component (such as dcr and acr) to minimize dissipation in the inductor for better efficiency. (2) selection of output capacitor (c o ) (3) selection of input capacitor (c in ) a low esr 22f/10v ceramic capacitor is recommended to reduce esr dissipation of input capacitor for better efficiency. the inductance significantly depends on the output ripple current. as seen in equation (1), the ripple current decreases as the inductor and/or switching frequency increases. appropriate output ripple current should be 20% of the maximum output current. where: i l is the output ripple current, and f is the switching frequency. output capacitor should be selected with the consideration of the stability region and the equivalent series resistance required to minimize the ripple voltage. output ripple voltage is determined by the equation (4) ? ? v esr i v l out ??? ? ??? (4) where: i l is the output ripple current. esr is the equivalent series resistance of output capacitor. note: rating of the capacitor should be determined allowing sufficient margin against output vol tage. a 22f to 100f ceramic capacitor is recommended. less esr allows reduction in output ripple voltage. figure 29 . output capacitor i l v out figure 28 . output ripple current i l v cc i l l c o v cc l co v out esr input capacitor must be a low esr capacitor with a capacitance sufficient to cope with high ripple current to prevent high transient voltage. the ripple current i rms is given by the equation (5 ): when v cc =2 xv out , < worst case > i rmsmax f ig ure 30 . input capacitor v out v cc l c o c in if v cc =5v, v out =3.3v, and i outm ax = 3a, (BD9134MUV) ? ? a i i outmax l ? ? ? 2.0 ? ? ? ? h f v i v v v l cc l out out cc ? ? ? ? ? ? ? ? ? ? h m l ? ? 2.2 87 .1 1 5 6.0 3.3 3.3 5 ? ? ? ? ? ? ? ? ? ? ? a v v v v i i cc out cc out out rms ? ? ? 2 i i out rms ? ? ? ? ? rms rms a i 42 .1 5 3.3 53.3 3 ? ? ? ? ][ ) ( a f v l v v v i cc out out cc l ? ? ? ? ? ? ??? (1) ??? (2) ??? (3) ??? (5) downloaded from: http:///
14 / 21 BD9134MUV tsz02201-0j3j0aj00150-1-2 ? 2012 rohm co., ltd. all rights reserved. 03.oct.2014 rev.002 www.rohm.com tsz22111 ? 15 ? 001 (4) calculating r ith , c ith for phase compensation since the current mode control is designed to limit the inductor current, a pole (phase lag) appears in the low frequency area due to a cr filter consisting of an output capacitor and a load resistance, while a zero (phase lea d) appears in the high frequency area due to the output capa citor and its esr. therefore, the phases are easily compensated by adding a zero to the power amplifier output with c and r as described below to cancel a pole at the power amplifier. stable feedback loop may be achieved by canceling the pole fp (min) produced by the output cap acitor and the load resistance with cr zero correction by the error amplifier. gain [db] phase [deg] figure 31. open loop g ain characteristics a 0 0 - 90 a 0 0 - 90 f z (amp) figure 32 . error amp phase compensation characteristics pole at power amplifier when the output current decreases, the load resistance r o increases and the pole frequency decreases. zero at power amplifier fp(min) fp(max) f z (esr) i outm in i outm ax gain [db] phase [deg] increasing capacitance of the output capacitor lowers the pole frequency while the zero frequency does not change. (this is because when the capacitance is doubled, the capacitor esr is reduced to half.) figure 33 . typical application gnd,pgnd sw pvcc en ad j ith v cc v out c in r ith c ith l esr c o r o v out c bst vcc c f r f ? ? o esr o o c esr fz c r fp ? ? ? ? ? ? ? ? 2 1 2 1 ? ? ith ith amp c r fz ? ? ? ? 2 1 ? ? ? ? load lighter with hz c r fp o omax min ? ? ? ? ? 2 1 ? ? ? ? load heavier with hz c r fp o omin max ? ? ? ? ? 2 1 ? ? ? ? o omax ith ith c r c r min fp amp fz ? ? ? ? ? ? ? ? ? 2 1 2 1 downloaded from: http:///
15 / 21 BD9134MUV tsz02201-0j3j0aj00150-1-2 ? 2012 rohm co., ltd. all rights reserved. 03.oct.2014 rev.002 www.rohm.com tsz22111 ? 15 ? 001 7. BD9134MUV cautions on pcb layout figure 34 . layout diagram (1) layout the input ceramic capacitor c in closer to the pins pv cc and pgnd, and the output capacitor c o closer to the pin pgnd. (2) layout c ith and r ith between the pins ith and gnd as near as possible with least necessary wiring. note: vqfn020v4040 (BD9134MUV) has thermal pad on the reverse of the package. the package thermal performance may be enhanced by bonding the pad to gnd plane which occupies a large area of pcb. 8. recommended components lists on above applicati on symbol part value manufacturer series l coil 2.0h sumida cdr6d28mnp-2r0nc 2.2h sumida cdr6d26np-2r2nc c in ceramic capacitor 22 f murata grm32eb11a226ke20 c o ceramic capacitor 22 f murata grm31cb30j226ke18 c ith ceramic capacitor 1500pf murata gr m18 series r ith resistance .1k rohm mcr03 series c f ceramic capacitor 1000 pf murata grm18 seri es r f resistance 10 rohm mcr03 seri es note: the parts list presented above is an example of recommended parts. although the parts are standard, actual ci rcuit characteristics should be checked on your application carefully before use. be sure to allow sufficient margins to accommodate variations between external devices and this ic when employing the depicted circuit with other circuit constants modified. both static and transient characteristics should be considered in establishing these margins. when switching noise is significant and may affect the system, a low pass filter should be inserted between the vc c and pvcc pins, and a schottky barrier dio de or snubber established between the sw and pgnd pins. downloaded from: http:///
16 / 21 BD9134MUV tsz02201-0j3j0aj00150-1-2 ? 2012 rohm co., ltd. all rights reserved. 03.oct.2014 rev.002 www.rohm.com tsz22111 ? 15 ? 001 i/o equivalent circuit figure 35 . i/o equivalent circuit en ? en pin ? sw pin pv cc sw pv cc pv cc ith ? ith pin v cc ? vout pin pv cc bst ? bst pin pv cc sw vout downloaded from: http:///
17 / 21 BD9134MUV tsz02201-0j3j0aj00150-1-2 ? 2012 rohm co., ltd. all rights reserved. 03.oct.2014 rev.002 www.rohm.com tsz22111 ? 15 ? 001 operational notes 1. reverse connection of power s upply connecting the power supply in reverse polarity can damage the ic. take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and th e ic s power supply pins. 2. power supply lines design the pcb layout pattern to provide low impedance supply lines. separate the ground and supply lines of the digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog block. furthermore, connect a capacitor to ground at all power supply pins . consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. ground voltage ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. 4. ground wiring pattern when using both small-signal and large-current ground traces, the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal ground caused by large currents. also ensure that the ground traces of external components do not cause variations on the ground voltage. the ground lines must be as short and thick as possible to reduce line impedance. 5. thermal consideration should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in deterioration of the properties of the chip. in case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the pd rating. 6. recommended operating conditions these conditions represent a range within which the expected characteristics of the ic can be approximately obtained . the electrical characteristics are guaranteed under the conditions of each parameter. 7. inrush current when power is first supplied to the ic, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the ic has more than one power supply. therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing of connections. 8. operation under strong electromagnetic field operating the ic in the presence of a strong electromagnetic field may cause the ic to malfunction. 9. testing on application boards when testing the ic on an application board, connecting a capacitor directly to a low-impedance output pin may s ubject the ic to stress. always discharge capacitors completely after each process or step. the ics power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. to prevent damage from static discharge, ground the ic during assembly and use similar precautions during transport and storage. 10. inter-pin short and mounting errors ensure that the direction and position are correct when mounting the ic on the pcb. incorrect mounting may result in damaging the ic. avoid nearby pins being shorted to each other especially to ground, power supply and outp ut pin . inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few. downloaded from: http:///
18 / 21 BD9134MUV tsz02201-0j3j0aj00150-1-2 ? 2012 rohm co., ltd. all rights reserved. 03.oct.2014 rev.002 www.rohm.com tsz22111 ? 15 ? 001 operational notes C continued 11. unused input pins input pins of an ic are often connected to the gate of a mos transistor. the gate has extremely high impedance and extremely low capacitance. if left unconnected, the electric field from the outside can easily charge i t. the small charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause unexpected operation of the ic. so unless otherwise specified, unused input pins should be connected to the power supply or ground line. 12. regarding the input pin of the ic this monolithic ic contains p+ isolation and p substrate layers between adjacent elements in order to keep them isolated. p-n junctions are formed at the intersection of the p layers with the n layers of other elements, creating a parasitic diode or transistor. for example (refer to figure below): when gnd > pin a and gnd > pin b, the p-n junction operates as a parasitic diode. when gnd > pin b, the p-n junction operates as a parasitic transistor. parasitic diodes inevitably occur in the structure of the ic. the operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical damage. therefore, conditions that cause these diode s to operate, such as applying a voltage lower than the gnd voltage to an input pin (and thus to the p s ubstrate) should be avoided. figure 36. example of monolithic ic structure 13. thermal shutdown circuit(tsd) this ic has a built-in thermal shutdown circuit that prevents heat damage to the ic. normal operation should alway s be within the ics power dissipation rating. if however the rating is exceeded for a continued perio d, the junction temperature (tj) will rise which will activate the tsd circuit that will turn off all output pins. when the tj falls below the tsd threshold, the circuits are automatically restored to normal operation. note that the tsd circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no circumstances, should the tsd circuit be used in a set design or for any purpose other than protecting the ic from heat damage. 14. selection of inductor it is recommended to use an inductor with a series resistance element (dcr) 0.1 ? or less. especially, note that use of a high dcr inductor will cause an inductor loss, resulting in decreased output voltage. should this condi tion continue for a specified period (soft start time + timer latch time), output short circuit protection will be activated and output will be latched off. when using an inductor over 0.1 ? , be careful to ensure adequate margins for variation between external devices and this ic, including transient as well as static characteristics. furthermore, in any case, it is recommended to start up the output with en after supply voltage is within. n n p + p n n p + p substrate gnd n p + n n p + n p p substrate gnd gnd parasitic elements pin a pin a pin b pin b b c e parasitic elements gnd parasitic elements c be transistor (npn) resistor n region close-by parasitic elements downloaded from: http:///
19 / 21 BD9134MUV tsz02201-0j3j0aj00150-1-2 ? 2012 rohm co., ltd. all rights reserved. 03.oct.2014 rev.002 www.rohm.com tsz22111 ? 15 ? 001 ordering information b d 9 1 3 4 m u v e 2 part number package muv: vqfn020v4040 packaging and forming specification e2 : embossed tape and reel marking diagram (top view) vqfn020v4040 d 9 1 3 4 part number marking lot number 1pin mark downloaded from: http:///
20 / 21 BD9134MUV tsz02201-0j3j0aj00150-1-2 ? 2012 rohm co., ltd. all rights reserved. 03.oct.2014 rev.002 www.rohm.com tsz22111 ? 15 ? 001 physical dimension, tape and reel information package name vqfn020v4040 downloaded from: http:///
21 / 21 BD9134MUV tsz02201-0j3j0aj00150-1-2 ? 2012 rohm co., ltd. all rights reserved. 03.oct.2014 rev.002 www.rohm.com tsz22111 ? 15 ? 001 revision history date revision changes 02.mar.2012 001 new release 03.oct.2014 00 2 applied the rohm standard style and improved understandability. downloaded from: http:///
notice C ge rev.003 ? 2014 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. our products are designed and manufactured for application in ordinary electronic equipments (such as av equipment, oa equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). if you intend to use our products in devices requiring extremely h igh reliability (such as medical equipment (note 1) , transport equipment, traffic equipment, aircraft/spacecraft, nuclear power c ontrollers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (specific applications), please c onsult with the rohm sales representative in advance. unless otherwise agreed in writing by rohm in advance, rohm s hall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arisin g from the use of any rohms products for specific applications. (note1) medical equipment classification of the specific appli cations japan usa eu china class class class b class class | class 2. rohm designs and manufactures its products subject to s trict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adeq uate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the followi ng are examples of safety measures: [a] installation of protection circuits or other protective devic es to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditions, as exemplified be low. accordingly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any rohms products under any special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or conditions (as exemplified belo w), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be n ecessary: [a] use of our products in any types of liquid, including water, oils, chemicals, and organi c solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products are ex posed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing components , plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subject to radiation-proof design. 5. please verify and confirm characteristics of the final or mou nted products in using the products. 6. in particular, if a transient load (a large amount of load a pplied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board moun ting is strongly recommended. avoid applying power exceeding normal rated power; exceeding the power rating u nder steady-state loading condition may negatively affect product performance and reliability. 7. de -rate power dissipation (pd) depending on ambient temperature (ta). whe n used in sealed area, confirm the actual ambient temperature. 8. confirm that operation temperature is within the specified range described in the product specification. 9. rohm shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlorine, bromine, e tc.) flux is used, the residue of flux may negatively affect p roduct performance and reliability. 2. in principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method mus t be used on a through hole mount products. i f the flow soldering method is preferred on a surface-mount p roducts , please consult with the rohm representative in advance. for details, please refer to rohm mounting specification downloaded from: http:///
notice C ge rev.003 ? 2014 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the products and external components, incl uding transient characteristics, as well as static characteristics. 2. you agree that application notes, reference designs, and associated data and information contained in this docu ment are presented only as guidance for products use. therefore, i n case you use such information, you are solel y responsible for it and you must exercise your own independ ent verification and judgment in the use of such information contained in this document. rohm shall not be in any way respon sible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such informat ion. precaution for electrostatic this product is electrostatic sensitive product, which may b e damaged due to electrostatic discharge. please take pro per caution in your manufacturing process and storage so t hat voltage exceeding the products maximum rating will not be applied to products. please take special care under dry con dition (e.g. grounding of human body / equipment / solder iron , isolation from charged objects, setting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriorate if the products are stored in the places where: [a] the products are exposed to sea winds or corrosive gases, inc luding cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to direct sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage condition, solderab ility of products out of recommended storage time period may be degraded. it is strongly recommended to confirm so lderability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the correct direction, which is in dicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a c arton. 4. use products within the specified time after opening a hum idity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage tim e period. precaution for product label qr code printed on rohm products label is for rohm s internal use only. precaution for disposition when disposing products please dispose them properly usin g an authorized industry waste company. precaution for foreign exchange and foreign trade act since our products might fall under controlled goods prescr ibed by the applicable foreign exchange and foreign trade act, please consult with rohm representative in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to ap plication example contained in this document is for referen ce only. rohm does not warrant that foregoing information or da ta will not infringe any intellectual property rights or any other rights of a ny third party regarding such information or data. rohm shall not be in any way responsible or liable for infringement of any intellectual property rights or other d amages arising from use of such information or data.: 2. no license, expressly or implied, is granted hereby under any i ntellectual property rights or other rights of rohm or any third parties with respect to the information contained in this d ocument. other precaution 1. this document may not be reprinted or reproduced, in whole or in part, without prior written consent of rohm. 2. the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. in no event shall you use in any way whatsoever the products and the related technical information contained in the products or this document for any military purposes, includi ng but not limited to, the development of mass-destruction weapons. 4. the proper names of companies or products described i n this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties. downloaded from: http:///
datasheet datasheet notice C we rev.001 ? 2014 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. downloaded from: http:///

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