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product structure silicon monolithic integrated circuit this product is not designed for protection against radioactive rays . 1/12 datasheet tsz02201-0r7r0g300080-1- 2 ? 2013 rohm co., ltd. all rights reserved. 22.may.2013 rev.004 tsz22111 ? 14 ? 001 www.rohm.com voltage detector ic series free delay time setting cmos voltage detector ic series bd52exxx series bd53exxx series general description rohm's bd52exxx and bd53exxx series are highly accurate, low current consumption voltage detector ics with a capacitor controlled time delay. the lin e up includes bd52exxx devices with n-channel open drain output and bd53exxx devices with cmos output. the devices are available for specific detection voltag es ranging from 2.3v to 6.0v in increments of 0.1v. features delay time controlled by external capacitor two output types (n-channel open drain and cmos output) ultra-low current consumption very small, lightweight and thin package package ssop5 is similar to sot-23-5(jedec) key specifications detection voltage: 2.3v to 6.0v (typ.) 0.1v steps high accuracy detection voltage: 1.0% ultra-low current consumption: 0.95a (typ.) package ssop5: 2.90mm x 2.80mm x 1.25mm applications circuits using microcontrollers or logic circuits t hat require a reset. typical application circuit connection diagram ssop5 pin descriptions ssop5 pin no. symbol function 1 v out reset output 2 v dd power supply voltage 3 gnd gnd 4 n.c. unconnected terminal 5 c t capacitor connection terminal for output delay time open drain output type bd52exxx series cmos output type bd53exxx series v dd1 bd52exxx v dd2 gnd c l (capacitor for noise filtering) c t r l r st micro controller v dd1 bd53exxx gnd c t c l (capacitor for noise filtering) r st micro controller top view v out v dd gnd n.c. c t lot. no marking downloaded from: http:///
d a t a s h e e t 2/12 bd52exxx series bd53exxx series tsz02201-0r7r0g300080-1- 2 ? 2013 rohm co., ltd. all rights reserved. 22.may.2013 rev.004 www.rohm.com tsz22111 ? 15 ? 001 ordering information lineup output type open drain cmos detection voltage marking part number marking part number 6.0v ph bd52e60 ud bd53e60 5.9v pg bd52e59 uc bd53e59 5.8v pf bd52e58 ub bd53e58 5.7v pe bd52e57 ua bd53e57 5.6v pd bd52e56 ry bd53e56 5.5v pc bd52e55 rr bd53e55 5.4v pb bd52e54 rp bd53e54 5.3v pa bd52e53 rn bd53e53 5.2v ny bd52e52 rm bd53e52 5.1v nr bd52e51 rk bd53e51 5.0v np bd52e50 rh bd53e50 4.9v nn bd52e49 rg bd53e49 4.8v nm bd52e48 rf bd53e48 4.7v nk bd52e47 re bd53e47 4.6v nh bd52e46 rd bd53e46 4.5v ng bd52e45 rc bd53e45 4.4v nf bd52e44 rb bd53e44 4.3v ne bd52e43 ra bd53e43 4.2v nd bd52e42 qy bd53e42 4.1v nc bd52e41 qr bd53e41 4.0v nb bd52e40 qp bd53e40 3.9v na bd52 e39 qn bd53e39 3.8v my bd52e38 qm bd53e38 3.7v mr bd52e37 qk bd53e37 3.6v mp bd52e36 qh bd53e36 3.5v mn bd52e35 qg bd53e35 3.4v mm bd52e34 qf bd53e34 3.3v mk bd52e33 qe bd53e33 3.2v mh bd52e32 qd bd53e32 3.1v mg bd52e31 qc bd53e31 3.0v mf bd52e30 qb bd53e30 2.9v me bd52e29 qa bd53e29 2.8v md bd52e28 py bd53e28 2.7v mc bd52e27 pr bd53e27 2.6v mb bd52e26 pp bd53e26 2.5v ma bd52e25 pn bd53e25 2.4v ly bd52e24 pm bd53e24 2.3v lr bd52e23 pk bd53e23 (unit : mm) ssop5 2.9 0.2 0.13 4 + 6 ? 4 1.6 2.8 0.2 1.1 0.05 0.05 0.05 + 0.2 ? 0.1 + 0.05 ? 0.03 0.42 + 0.05 ? 0.04 0.95 5 4 1 2 3 1.25max. 0.2min. 0.1 direction of feed reel ? order quantity needs to be multiple of the minimum quantity. embossed carrier tape tapequantity direction of feed th e direction i s t h e 1p in of p rod u ct i s a t t h e upper ri gh t wh en you hol d ree l on t h e l eft hand a nd you pull o u t t h e tape on t h e ri gh t hand 3000pcs tr ( ) 1pin t v v i : i : v g : i iii : v t : : v t downloaded from: http:///
a t a s h e e t 3/12 bd52exxx series bd53exxx series tsz02201-0r7r0g300080-1- 2 ? 2013 rohm co., ltd. all rights reserved. 22.may.2013 rev.004 www.rohm.com tsz22111 ? 15 ? 001 absolute maximum ratings parameter symbol limits unit power supply voltage v dd -gnd -0.3 to +10 v output voltage nch open drain output v out gnd-0.3 to +10 v cmos output gnd-0.3 to v dd +0.3 output current io 80 ma power dissipation ssop5 *1*2 pd 540 mw operating temperature topr -40 to +105 c ambient storage temperature tstg -55 to +125 c *1 reduced by 5.4mw/c when used over 25c. *2 when mounted on rohm standard circuit board ( 70mm70mm1.6mm, glass epoxy board). electrical characteristics (unless otherwise specifi ed ta=-40 to 105c) parameter symbol condition limit unit min. typ. max. detection voltage v det v dd =h l, r l =470k ? *1 v det (t) 0.99 v det (t) v det (t) 1.01 v vdet=2.5v ta=+25c 2.475 2.5 2.525 ta=-40c to 85c 2.418 - 2.584 ta=85c to 105c 2.404 - 2.597 vdet=3.0v ta=+25c 2.970 3.0 3.030 ta=-40c to 85c 2.901 - 3.100 ta=85c to 105c 2.885 - 3.117 vdet=3.3v ta=+25c 3.267 3.3 3.333 ta=-40c to 85c 3.191 - 3.410 ta=85c to 105c 3.173 - 3.428 vdet=4.2v ta=+25c 4.158 4.2 4.242 ta=-40c to 85c 4.061 - 4.341 ta=85c to 105c 4.039 - 4.364 vdet=4.8v ta=+25c 4.752 4.8 4.848 ta=-40c to 85c 4.641 - 4.961 ta=85c to 105c 4.616 - 4.987 circuit current when on i dd 1 v dd =v det -0.2v v det =2.3-3.1v - 0.80 2.40 a v det =3.2-4.2v - 0.85 2.55 v det =4.3-5.2v - 0.90 2.70 v det =5.3-6.0v - 0.95 2.85 circuit current when off i dd 2 v dd =v det +2.0v v det =2.3-3.1v - 0.75 2.25 a v det =3.2-4.2v - 0.80 2.40 v det =4.3-5.2v - 0.85 2.55 v det =5.3-6.0v - 0.90 2.70 operating voltage range v opl v ol 0.4v, ta=25 to 105c, r l =470k ? 0.95 - - v v ol 0.4v, ta=-40 to 25c, r l =470k ? 1.20 - - low output voltage (nch) v ol v dd = 1.5v , i sink = 0.4 ma, v det =2.3-6.0v - - 0.5 v v dd = 2.4v , i sink = 2.0 ma, v det =2.7-6.0v - - 0.5 high output voltage (pch) v oh v dd = 4.8v , i source = 0.7 ma , v det (2.3v to 4.2v) vdd-0.5 - - v v dd =6.0v, i source = 0.9 ma , v det (4.3v to 5.2v) vdd-0.5 - - v dd =8.0v, i source = 1.1 ma , v det (5.3v to 6.0v) vdd-0.5 - - v det (t) : standard detection voltage (2.3v to 6.0v, 0.1v step) r l : pull-up resistor to be connected between v out and power supply. design guarantee. (outgoing inspection is not done on all products.) *1 guarantee is ta=25c. downloaded from: http:///
a t a s h e e t 4/12 bd52exxx series bd53exxx series tsz02201-0r7r0g300080-1- 2 ? 2013 rohm co., ltd. all rights reserved. 22.may.2013 rev.004 www.rohm.com tsz22111 ? 15 ? 001 electrical characteristics (unless otherwise specifi ed ta=-40 to 105c) - continued parameter symbol condition limit unit min. typ. max. leak current when off i leak v dd =v ds =10v *1 - - 0.1 a c t pin threshold voltage v cth v dd =v det 1.1, v det =2.3-2.6v, r l =470k ? v dd 0.30 v dd 0.40 v dd 0.60 v v dd =v det 1.1, v det =2.7-4.2v, r l =470k ? v dd 0.30 v dd 0.45 v dd 0.60 v dd =v det 1.1, v det =4.3-5.2v, r l =470k ? v dd 0.35 v dd 0.50 v dd 0.60 v dd =v det 1.1, v det =5.3-6.0v, r l =470k ? v dd 0.40 v dd 0.50 v dd 0.60 output delay resistance r ct v dd =v det 1.1 v ct =0.5v *1 5.5 9 12.5 m ? c t pin output current i ct v ct =0.1v v dd =0.95v *1 15 40 - a v ct =0.5v v dd =1.5v 150 240 - detection voltage temperature coefficient v det / ? t ta=-40c to 105c - 100 360 ppm/c hysteresis voltage ? v det v dd =l h l, r l =470k ? v det 0.03 v det 0.05 v det 0.08 v v det (t) : standard detection voltage (2.3v to 6.0v, 0.1v step) r l : pull-up resistor to be connected between v out and power supply. design guarantee. (outgoing inspection is not done on all products.) *1 guarantee is ta=25c. downloaded from: http:///
a t a s h e e t 5/12 bd52exxx series bd53exxx series tsz02201-0r7r0g300080-1- 2 ? 2013 rohm co., ltd. all rights reserved. 22.may.2013 rev.004 www.rohm.com tsz22111 ? 15 ? 001 block diagrams vref v out v dd gnd ct vref v out v dd gnd ct figure.1 bd52exxx series figure.2 bd53exxx series downloaded from: http:///
a t a s h e e t 6/12 bd52exxx series bd53exxx series tsz02201-0r7r0g300080-1- 2 ? 2013 rohm co., ltd. all rights reserved. 22.may.2013 rev.004 www.rohm.com tsz22111 ? 15 ? 001 typical performance curves figure.3 circuit current 0.0 0.5 1.0 1.5 2.0 0 1 2 3 4 5 6 7 8 9 10 v dd supply voltage v dd [v] circuit current i dd [ a] bd5242g/fve 0 3 6 9 12 15 18 0.0 0.5 1.0 1.5 2.0 2.5 drain-source voltage v ds [v] "low" output current i ol [ma] bd5242g/fve v dd =2.4v v dd =1.2v figure.4 low output current 0 5 10 15 20 25 30 35 40 45 0 1 2 3 4 5 6 drain-source voltage v ds [v] "high" output current i oh [ma] bd5342g/fve v dd =8.0v v dd =6.0v v dd =4.8v figure.5 high output current figure.6 i/o characteristics 0 1 2 3 4 5 6 7 8 9 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5 v dd supply voltage v d d [v] output voltage v out [v] bd5242g/fve ta=25 ta=25 bd52e42g bd53e42g bd53e42g bd52e42g bd53e42g bd52e42g bd53e42g downloaded from: http:///
a t a s h e e t 7/12 bd52exxx series bd53exxx series tsz02201-0r7r0g300080-1- 2 ? 2013 rohm co., ltd. all rights reserved. 22.may.2013 rev.004 www.rohm.com tsz22111 ? 15 ? 001 typical performance curves C continued 0.0 0.2 0.4 0.6 0.8 1.0 0.0 0.5 1.0 1.5 2.0 2.5 v dd supply voltage v dd [v] output voltage v out [v] bd5242g/fve figure.7 operating limit voltage figure.8 ct terminal current 0 50 100 150 200 250 300 350 400 450 0 1 2 3 4 5 v dd supply voltage v dd [v] ct output current i ct [ a] bd5242g/fve 3.2 3.6 4.0 4.4 4.8 5.2 5.6 -40 0 40 80 temperature ta[ ] detection voltage v det [v] low to high(v det + v det ) high to low(v det ) bd5242g/fve figure.9 detection voltage release voltage 0.0 0.5 1.0 1.5 -40 -20 0 20 40 60 80 100 temperature ta[ ] circuit current when on i dd1 [ a] bd5242g/fve figure.10 circuit current when on bd52e42g bd53e42g bd52e42g bd53e42g bd52e42g bd53e42g bd52e42g bd53e42g downloaded from: http:///
a t a s h e e t 8/12 bd52exxx series bd53exxx series tsz02201-0r7r0g300080-1- 2 ? 2013 rohm co., ltd. all rights reserved. 22.may.2013 rev.004 www.rohm.com tsz22111 ? 15 ? 001 typical performance curves C continued 0.0 0.5 1.0 1.5 -40 -20 0 20 40 60 80 100 temperature ta[ ] circuit current when off i dd2 [ a] bd5242g/fve figure.11 circuit current when off 0.0 0.5 1.0 1.5 -40 -20 0 20 40 60 80 100 temperature ta[ ] minimum operating voltage v opl [v] bd5242g/fve figure.12 operating limit voltage 4 5 6 7 8 9 10 11 12 13 -40 -20 0 20 40 60 80 100 temperature ta[ ] resistance of c t r ct [m ? ] bd5242g/fve figure.13 c t terminal circuit resistance 0.1 1 10 100 1000 10000 0.0001 0.001 0.01 0.1 capacitance of c t c ct [ f] delay time t plh [ms] bd5242g/fve figure.14 delay time (t plh ) and c t terminal external capacitance bd52e42g bd53e42g bd52e42g bd53e42g bd52e42g bd53e42g bd52e42g bd53e42g downloaded from: http:///
a t a s h e e t 9/12 bd52exxx series bd53exxx series tsz02201-0r7r0g300080-1- 2 ? 2013 rohm co., ltd. all rights reserved. 22.may.2013 rev.004 www.rohm.com tsz22111 ? 15 ? 001 application information explanation of operation for both the open drain type (figure.15) and the cmo s output type (figure.16), the detection and releas e voltages are used as threshold voltages. when the voltage applie d to the v dd pins reaches the applicable threshold voltage, the v out terminal voltage switches from either high to low or from low to high. please refer to the timin g waveform and electrical characteristics for information on hyster esis. because the bd52exxx series uses an open drain output type, it is necessary to connect a pull up resistor to v dd or another power supply if needed [the output high voltage (v out ) in this case becomes v dd or the voltage of the other power supply]. figure.15 (bd52exxxtype internal block diagram) figur e.16 (bd53exxxtype internal block diagram) setting of detector delay time it is possible to set the delay time at the rise of vdd using a capacitor connected to the ct terminal. delay time at the rise of v dd t plh time until vout rises to 1/2 of v dd after v dd rises beyond the release voltage(v det + ? v det ) t plh = -c ct r ct ln c ct : c t pin external capacitance r ct : c t pin internal impedance please refer to electrical characteristics. v cth : c t pin threshold voltage please refer to electrical characteristics. ln : natural logarithm reference data of falling time (t phl ) output examples of falling time (t phl ) output part number t phl [s] -40c t phl [s] ,+25c t phl [s],+105c bd52e27g 30.8 30 28.8 bd53e27g 26.8 26 24.8 *this data is for reference only. the figures will vary with the application, so plea se confirm actual operating conditions before use. timing waveforms example: the following shows the relationship betwe en the input voltage v dd , the c t terminal voltage v ct and the output voltage v out when the input power supply voltage v dd is made to sweep up and sweep down (the circuits a re those in figure.15 and 16). 1 when the power supply is turned on, the output is unstable from after over the operating limit voltage (v opl ) until t phl . therefore it is possible that the reset signal is n ot outputted when the rise time of v dd is faster than t phl . 2 when v dd is greater than v opl but less than the reset release voltage (v det + ? v det ), the c t terminal (v ct ) and output (v out ) voltages will switch to l. 3 if v dd exceeds the reset release voltage (v det + ? v det ), then v out switches from l to h (with a delay due to the c t terminal). 4 if v dd drops below the detection voltage (v det ) when the power supply is powered down or when there is a pow er supply fluctuation, v out switches to l (with a delay of t phl ). 5 the potential difference between the detection volt age and the release voltage is known as the hysteresis width ( ? v det ). the system is designed such that the output does not to ggle with power supply fluctuations within this hysteresis wi dth, preventing malfunctions due to noise. vref v dd gnd ct r1 r2 r3 q3 q1 v out reset r l v dd vref v dd gnd ct r1 r2 r3 q3 q2 v out reset q1 v dd v dd -v cth v dd v dd v det + v det v det v opl 0v 1/2 v dd t phl t plh t phl t plh v ct v out figure.17 timing waveform downloaded from: http:///
a t a s h e e t 10/12 bd52exxx series bd53exxx series tsz02201-0r7r0g300080-1- 2 ? 2013 rohm co., ltd. all rights reserved. 22.may.2013 rev.004 www.rohm.com tsz22111 ? 15 ? 001 circuit applications 1) examples of a common power supply detection rese t circuit application examples of bd52exxx series (open drain output type) and bd53exxx series (cmos output type) are shown below. case1: power supply of the microcontroller (v dd2 ) differs from the power supply of the reset detectio n (v dd1 ). use an open drain output type (bd52exxx) with a load resistance r l attached as shown figure.18. case2: power supply of the microcontroller (v dd1 ) is the same as the power supply of the reset detection (v dd1 ). use a cmos output type (bd53exxx) device or open drain output type (bd52exxx) device with a pull up resistor attached between the output and v dd1 . when a capacitance c l for noise filtering is connected to the v out pin (the reset signal input terminal of the microcontroller), please take into account the wave form of the rise and fall of the output voltage (v out ). please refer to operational notes for recommendatio ns on resistor and capacitor values. 2) the following is an example of a circuit applica tion in which an or connection between two types of detection voltage resets the microcontroller. to reset the microcontroller when many independent power supplies are used in the system, or connect an open drain output type (bd52exxx series) to the microcontroller s input with pull-up resistor to the supply voltag e of the microcontroller (v dd3 ) as shown in fig. 20. by pulling-up to v dd3 , output high voltage of micro-controller power su pply is possible. v dd1 bd52exxx v dd2 gnd c l noise-filtering capacitor c t r l r st micro controller figure.18 open drain output type c l noise-filtering capacitor v dd1 bd53exxx c t gnd r st micro controller figure.19 cmos output type v dd1 v dd3 gnd r st microcontroller c t r l v dd2 c t bd52exxx no.1 bd52exxx no.2 fig.20 downloaded from: http:///
a t a s h e e t 11/12 bd52exxx series bd53exxx series tsz02201-0r7r0g300080-1- 2 ? 2013 rohm co., ltd. all rights reserved. 22.may.2013 rev.004 www.rohm.com tsz22111 ? 15 ? 001 3) examples of the power supply with resistor divid ers in applications wherein the power supply voltage of an ic comes from a resistor divider circuit, an in- rush current will flow into the circuit when the output level switches fro m high to low or vice versa. in-rush current is a sudden surge of current that flows from the power supply (vdd) to gro und (gnd) as the output logic changes its state. this current flow may cause malfunction in the systems operation such as output oscillations, etc. figure.21 when an in-rush current (i1) flows into the circuit (refer to fig. 21) at the time when output switches from low to high, a voltage drop of i1r2 (input resistor) will occur in the circuit causing the vdd supply voltage to decr ease. when the vdd voltage drops below the detection voltage, the outp ut will switch from high to low. while the outpu t voltage is at low condition, in-rush current will stop flowing and th e voltage drop will be reduced. as a result, the ou tput voltage will switches again from low to high which causes an in-rush c urrent and a voltage drop. this operation repeats a nd will result to oscillation. figure.22 idd peak current vs. power supply voltage * this data is for reference only. the figures will vary with the application, so pl ease confirm actual operating conditions before use . v out r2 v dd bd52exxx bd53exxx gnd r1 i1 v1 cin c l i dd v dd v det 0 through current v - i p eak urrent ta=25? 0.001 0.01 0.1 1 10 3 4 5 8 9 10 v [v ] i -peak[m a ] b 52exxx b 53exxx downloaded from: http:///
a t a s h e e t 12/12 bd52exxx series bd53exxx series tsz02201-0r7r0g300080-1- 2 ? 2013 rohm co., ltd. all rights reserved. 22.may.2013 rev.004 www.rohm.com tsz22111 ? 15 ? 001 operational notes 1) absolute maximum ratings operating the ic over the absolute maximum ratings m ay damage the ic. the damage can either be a short c ircuit between pins or an open circuit between pins. there fore, it is important to consider circuit protectio n measures, such as adding a fuse, in case the ic is operated over th e absolute maximum ratings. 2) ground voltage the voltage of the ground pin must be the lowest vo ltage of all pins of the ic at all operating conditi ons. ensure that no pins are at a voltage below the ground pin at any t ime, even during transient condition. 3) recommended operating conditions these conditions represent a range within which the expected characteristics of the ic can be approxim ately obtained. the electrical characteristics are guaranteed under the conditions of each parameter. 4) bypass capacitor for noise rejection to help reject noise, put a 1f capacitor between v dd pin and gnd and 1000pf capacitor between v out pin and gnd. be careful when using extremely big capacitor as tr ansient response will be affected. 5) short between pins and mounting errors be careful when mounting the ic on printed circuit b oards. the ic may be damaged if it is mounted in a w rong orientation or if pins are shorted together. short circuit may be caused by conductive particles caugh t between the pins. 6) operation under strong electromagnetic field operating the ic in the presence of a strong electro magnetic field may cause the ic to malfunction. 7) the v dd line impedance might cause oscillation because of the detection current. 8) a v dd to gnd capacitor (as close connection as possible) s hould be used in high v dd line impedance condition. 9) lower than the mininum input voltage puts the v out in high impedance state, and it must be v dd in pull up (v dd ) condition. 10) external parameters the recommended value of r l resistor is 50k ? to 1m ? . the recommended value of c t capacitor is over 100pf to 0.1f. there are many factors (board layout, etc) t hat can affect characteristics. please verify and c onfirm using practical applications. 11) power on reset operation please note that the power on reset output varies w ith the v dd rise time. please verify the behavior in the actua l operation. 12) testing on application boards when testing the ic on an application board, connect ing a capacitor directly to a low-impedance output pin may subject the ic to stress. always discharge capacitors comple tely after each process or step. the ics power sup ply should always be turned off completely before connecting o r removing it from the test setup during the inspec tion process. to prevent damage from static discharge, ground the ic during assembly and use similar precautions during transport and storage. 13) rush current when power is first supplied to the ic, rush current may flow instantaneously. it is possible that the charge current to the parasitic capacitance of internal photo diode o r the internal logic may be unstable. therefore, gi ve special consideration to power coupling capacitance, power wiring, width of gnd wiring, and routing of connectio ns. 14) c t pin discharge due to the capabilities of the c t pin discharge transistor, the c t pin may not completely discharge when a short inpu t pulse is applied, and in this case the delay time m ay not be controlled. please verify the actual oper ation. downloaded from: http:///
datasheet d a t a s h e e t notice - ge rev.002 ? 2014 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. our products are designed and manufac tured for application in ordinary elec tronic equipments (such as av equipment, oa equipment, telecommunication equipment, home electroni c appliances, amusement equipment, etc.). if you intend to use our products in devices requiring ex tremely high reliability (such as medical equipment (note 1) , transport equipment, traffic equipment, aircraft/spacecra ft, nuclear power controllers, fuel c ontrollers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (specific applications), please consult with the rohm sale s representative in advance. unless otherwise agreed in writing by rohm in advance, rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ro hms products for specific applications. (note1) medical equipment classification of the specific applications japan usa eu china class class class b class class | class 2. rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe desi gn against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditio ns, as exemplified below. accordin gly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of an y rohms products under any special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, incl uding water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products ar e exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing components, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (ev en if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subjec t to radiation-proof design. 5. please verify and confirm characteristics of the final or mounted products in using the products. 6. in particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse. is applied, confirmation of performance characteristics after on-boar d mounting is strongly recomm ended. avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading c ondition may negatively affect product performance and reliability. 7. de-rate power dissipation (pd) depending on ambient temper ature (ta). when used in seal ed area, confirm the actual ambient temperature. 8. confirm that operation temperat ure is within the specified range described in the product specification. 9. rohm shall not be in any way responsible or liable for fa ilure induced under deviant condi tion from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlori ne, bromine, etc.) flux is used, the resi due of flux may negatively affect product performance and reliability. 2. in principle, the reflow soldering method must be used; if flow soldering met hod is preferred, please consult with the rohm representative in advance. for details, please refer to rohm mounting specification downloaded from: http:///
datasheet d a t a s h e e t notice - ge rev.002 ? 2014 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, pl ease allow a sufficient margin considering variations of the characteristics of the products and external components, including transient characteri stics, as well as static characteristics. 2. you agree that application notes, re ference designs, and associated data and in formation contained in this document are presented only as guidance for products use. theref ore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take proper caution in your manufacturing process and storage so that voltage exceeding t he products maximum rating will not be applied to products. please take special care under dry condit ion (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, se tting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriora te if the products are stor ed in the places where: [a] the products are exposed to sea winds or corros ive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to di rect sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage c ondition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm sol derability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the co rrect direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. use products within the specified time after opening a humidity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage time period. precaution for product label qr code printed on rohm products label is for rohms internal use only. precaution for disposition when disposing products please dispose them proper ly using an authorized industry waste company. precaution for foreign exchange and foreign trade act since our products might fall under cont rolled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with rohm representative in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to application example contained in this document is for reference only. rohm does not warrant that foregoi ng information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. rohm shall not be in any way responsible or liable for infringement of any intellectual property rights or ot her damages arising from use of such information or data.: 2. no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the information contained in this document. other precaution 1. this document may not be reprinted or reproduced, in whol e or in part, without prior written consent of rohm. 2. the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. in no event shall you use in any wa y whatsoever the products and the related technical information contained in the products or this document for any military purposes, incl uding but not limited to, the development of mass-destruction weapons. 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties. downloaded from: http:///
datasheet datasheet notice C we rev.001 ? 2014 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. downloaded from: http:///

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