open air resistor metal element current sense oar & oar-tp series power ratngs of 1, 3, & 5w @ 85c superior surge performance hot spot isolated from pcb material resistance wire tcr 20ppm/c tolerances to 1% pb-free version is rohs compliant general note irc reser v es the r ight to mak e changes in product speci? cation without notice or liability . all inf or mation is subject to irc? s o wn data and is considered accur ate at time of going to pr int. a subsidiar y of tt electronics plc ? 4222 south staples street ? cor pus chr isti t e xas 78411 usa wire and film t ec hnologies division t elephone: 361 992 7900 ? f acsimile: 361 992 3377 ? w ebsite: www .irctt.com ? tcr? s to 20ppm/c ? p o w er r atings of 1, 3, & 5w @ 85c ? resistance r ange from 2.5m? to 100m? ? open air design maximiz es ther mal perf or mance ? w elded copper leads minimiz e eff ects from solder wic king and pro vide tr ue 1% perf or mance electr ical data p ar t number p o wer rating @ 85c (watts) resistance rang e (m?) t olerance (%) wire tcr (ppm/c) inductance (nh) o ar-1 (tp) 1.0 3, 5, 10, *20, *25, 50 1, 21, 5 20 <10 o ar-3 (tp) 3.0 2.5, 5, 10, 15, 20, 25, *30, 50, 100 o ar-5 (tp) 5.0 3, 5, 10, *15, *20, *25, *50 notes: 1 2% toler ance a v ailab le <5m ? * denotes resistance v alues that ma y ha v e longer lead times than other v alues listed * please contact f actor y f or resistance v alues not listed load lif e (1000 hour s @ 25c) ?r/r <1% moisture (no load f or 1000 hour s) ?r/r <1% t emperature cyc ling (-40c to +125c f or 1000 c yc les) ?r/r <1% c 5 2 1 + o t c 0 4 - e r u t a r e p m e t g n i t a r e p o en vironmental data o ar open air resistor metal element current sense o ar ser ies issue j une 2011 sheet 1 of 3 resistors ma ke p ossibl e 07.14 general note tt electronics reserves the right to make changes in product specifcation without notice or liability. all information is subject to tt electronics own data and is considered accurate at time of going to print. ? tt electronics plc www.ttelectronicsresistors.com all pb-free parts comply with eu directve 2011/65/eu (rohs2)
open air resistor metal element current sense oar & oar-tp series ? 4222 south staples street ? cor pus chr isti t e xas 78411 usa wire and film t ec hnologies division t elephone: 361 992 7900 ? f acsimile: 361 992 3377 ? w ebsite: www .irctt.com ph ysical data dimensions (inc hes and (mm)) f e c b a e p y t c r i o ar-1 0.450 +0.040/-0.020 (11.43 +1.020/-0.508) 0.27 t yp 0.32 (8.12) max 0.125 0.030 (3.18 0.762) 0.065 +0.010/-0.005 (1.65 +0.254/-0.127) 0.040 0.002 (1.02 0.051) o ar-3 0.600 +0.040/-0.020 (15.24 +1.020/0.508) 0.65 t yp 0.92 (23.4) max 0.125 0.030 (3.18 0.762) 0.065 +0.010/-0.005 (1.65 +0.254/-0.127) 0.040 0.002 (1.02 0.051) o ar-5 0.800 +0.040/-0.020 (20.32 +1.020/-0.508) 0.65 t yp 0.88 (22.4) max 0.125 0.030 (3.18 0.762) 0.065 +0.010/-0.005 (1.65 +0.254/-0.127) 0.040 0.002 (1.02 0.051) b c a e f on lo w er r anges stand-off ma y be eliminated no te: contact f actor y f or : 1. v ar iations of ?a? dimension. 2. diff erent lead diameter . t est p oint (k elvin connection) the thermal images (not simulations) above are of the oar products at their respective power rating. notice the solder joint temperature is much lower than the hotspot. the unique construction of the oar isolates the tempera- ture of the hotspot from the circuit board material preventing damage to the circuit board. additionall y , the thermal energy is dissipated to the air instead of being conducted into the circuit board potentially causing a nearby power component to exceed its rating. the standard test circuit board consists of a four layer fr4 material with 2 ounce (70m) outer layers and 1 ounce (35m) inner layers, which is typical of many industry designs. the test conditions were in ambient temperature conditions, approximately 22 c with no forced ai r . contact tt electronics for more details or for other thermal image test data for specific resistance values and power levels. ther mal image data o ar-1 5 m? @ 1 w att hot spot: 87c solder joint: 45c o ar-3 5 m? @ 3 w att hot spot: 160c solder joint: 70c o ar-5 5 m? @ 5 w att hot spot: 230c solder joint: 96c o ar open air resistor metal element current sense o ar ser ies issue j une 2011 sheet 2 of 3 ? 4222 south staples street ? cor pus chr isti t e xas 78411 usa wire and film t ec hnologies division t elephone: 361 992 7900 ? f acsimile: 361 992 3377 ? w ebsite: www .irctt.com ph ysical data dimensions (inc hes and (mm)) f e c b a e p y t c r i o ar-1 0.450 +0.040/-0.020 (11.43 +1.020/-0.508) 0.27 t yp 0.32 (8.12) max 0.125 0.030 (3.18 0.762) 0.065 +0.010/-0.005 (1.65 +0.254/-0.127) 0.040 0.002 (1.02 0.051) o ar-3 0.600 +0.040/-0.020 (15.24 +1.020/0.508) 0.65 t yp 0.92 (23.4) max 0.125 0.030 (3.18 0.762) 0.065 +0.010/-0.005 (1.65 +0.254/-0.127) 0.040 0.002 (1.02 0.051) o ar-5 0.800 +0.040/-0.020 (20.32 +1.020/-0.508) 0.65 t yp 0.88 (22.4) max 0.125 0.030 (3.18 0.762) 0.065 +0.010/-0.005 (1.65 +0.254/-0.127) 0.040 0.002 (1.02 0.051) b c a e f on lo w er r anges stand-off ma y be eliminated no te: contact f actor y f or : 1. v ar iations of ?a? dimension. 2. diff erent lead diameter . t est p oint (k elvin connection) the thermal images (not simulations) above are of the oar products at their respective power rating. notice the solder joint temperature is much lower than the hotspot. the unique construction of the oar isolates the tempera- ture of the hotspot from the circuit board material preventing damage to the circuit board. additionall y , the thermal energy is dissipated to the air instead of being conducted into the circuit board potentially causing a nearby power component to exceed its rating. the standard test circuit board consists of a four layer fr4 material with 2 ounce (70m) outer layers and 1 ounce (35m) inner layers, which is typical of many industry designs. the test conditions were in ambient temperature conditions, approximately 22 c with no forced ai r . contact tt electronics for more details or for other thermal image test data for specific resistance values and power levels. ther mal image data o ar-1 5 m? @ 1 w att hot spot: 87c solder joint: 45c o ar-3 5 m? @ 3 w att hot spot: 160c solder joint: 70c o ar-5 5 m? @ 5 w att hot spot: 230c solder joint: 96c o ar open air resistor metal element current sense o ar ser ies issue j une 2011 sheet 2 of 3 physical data type a b max c e f oar1 0.45 +0.04/-0.02 (11.43 +1.02/-0.51 ) 0.32 (8.12) 0.125 0.03 (3.18 0.76 ) 0.065 +0.01/-0.005 (1.65 +0.25/-0.13 ) 0.04 0.002 (1.02 0.05 ) oar1tp 0.197 +0.04/-0.03 (5.0 +1.0/-0.8 ) 0.3 (7.8) oar3 0.60 +0.04/-0.02 (15.24 +1.02/-0.51 ) 0.92 (23.4) oar3tp open air resistor metal element current sense oar & oar-tp series ? 4222 south staples street ? cor pus chr isti t e xas 78411 usa wire and film t ec hnologies division t elephone: 361 992 7900 ? f acsimile: 361 992 3377 ? w ebsite: www .irctt.com sample p ar t no. irc style o ar p o wer rating in w atts 1 = 1w , 3 = 3w , 5 = 5w resistance rang e ?r? indicates decimal point location t olerance f = 1%, g = 2%, j = 5% rohs indicator lf indicates rohs compliance blank indicates sn/pb ter minal tinning; a v ailab le on special request order ing data o ar 1 r100 f lf the typical power derating curves are based on conservative design concepts that extend from ? lm based products. the oar is a solid metal alloy construction that can withstand comparably greater operating power levels than conservative design models permit. t ypically the resistive alloys can withstand temperatures in excess of 300c. therefore, system thermal design considerations are a more signi ? cant design parameter due to the heat limitations of solder joints and/or circuit board substrate materials. p o w er der ating pulse/surge char t @ 50 msec dur ation 0 10 20 30 40 50 60 70 80 90 100 700 600 500 400 300 200 resistance (milli-ohms) sur g e current (amps) 0 100 o ar-1(tp) 0 5 10 15 20 25 30 35 40 45 50 1400 1200 1000 800 600 400 resistance (milli-ohms) sur g e current (amps) 0 200 0 10 20 30 40 50 60 70 80 90 100 1400 1200 1000 800 600 400 resistance (milli-ohms) sur g e current (amps) 0 200 5(tp) - r a o 3(tp) - r a o the surge current charts are approximations of the capabilities of the oar product and should not be used to the exclusion of actual testing. the relative high surge currents depicted in the charts are as a result of the robust all metal welded construction and the heat carrying capability of metal. additionally the oar resistive wire provides large relative cross section for current ? ow as compared to other resistor technologies, such as thin ? lm, thick ? lm, or metal strip. o ar open air resistor metal element current sense o ar ser ies issue j une 2011 sheet 3 of 3 ma ke p ossibl e 07.14 tt electronics reserves the right to make changes in product specifcation without notice or liability. all information is subject to tt electronics own data and is considered accurate at time of going to print. ? tt electronics plc www.ttelectronicsresistors.com
? 4222 south staples street ? cor pus chr isti t e xas 78411 usa wire and film t ec hnologies division t elephone: 361 992 7900 ? f acsimile: 361 992 3377 ? w ebsite: www .irctt.com sample p ar t no. irc style o ar p o wer rating in w atts 1 = 1w , 3 = 3w , 5 = 5w resistance rang e ?r? indicates decimal point location t olerance f = 1%, g = 2%, j = 5% rohs indicator lf indicates rohs compliance blank indicates sn/pb ter minal tinning; a v ailab le on special request order ing data o ar 1 r100 f lf the typical power derating curves are based on conservative design concepts that extend from ? lm based products. the oar is a solid metal alloy construction that can withstand comparably greater operating power levels than conservative design models permit. t ypically the resistive alloys can withstand temperatures in excess of 300c. therefore, system thermal design considerations are a more signi ? cant design parameter due to the heat limitations of solder joints and/or circuit board substrate materials. p o w er der ating pulse/surge char t @ 50 msec dur ation 0 10 20 30 40 50 60 70 80 90 100 700 600 500 400 300 200 resistance (milli-ohms) sur g e current (amps) 0 100 o ar-1(tp) 0 5 10 15 20 25 30 35 40 45 50 1400 1200 1000 800 600 400 resistance (milli-ohms) sur g e current (amps) 0 200 0 10 20 30 40 50 60 70 80 90 100 1400 1200 1000 800 600 400 resistance (milli-ohms) sur g e current (amps) 0 200 5(tp) - r a o 3(tp) - r a o the surge current charts are approximations of the capabilities of the oar product and should not be used to the exclusion of actual testing. the relative high surge currents depicted in the charts are as a result of the robust all metal welded construction and the heat carrying capability of metal. additionally the oar resistive wire provides large relative cross section for current ? ow as compared to other resistor technologies, such as thin ? lm, thick ? lm, or metal strip. o ar open air resistor metal element current sense o ar ser ies issue j une 2011 sheet 3 of 3 ordering procedure this product has two valid part numbers: european (welwyn) part number : oar3 - r01ji ( oar3 , 10 milliohms 5 % , pb - free) o a r 3 - r 0 1 j i 1 2 3 4 5 usa (irc) part number: oar3r010jlf ( oar3, 10 milliohms 5 % , pb - free) o a r 3 r 0 1 0 j l f 1 2 3 4 5 1 2 3 4 5 type pitch value tolerance packing oar1 omit for standard 3 - 5 characters f = 1% i = bulk oar3 tp = tight pitch see electrical data g = 2 % oar5 r = ohms j = 5 % 1 2 3 4 5 type pitch value tolerance termination oar1 omit for standard 4/5 characters f = 1% omit for snpb oar3 tp = tight pitch see electrical data g = 2 % lf = pb - free oar5 r = ohms j = 5 % open air resistor metal element current sense oar & oar-tp series ma ke p ossibl e 07.14 general note tt electronics reserves the right to make changes in product specifcation without notice or liability. all information is subject to tt electronics own data and is considered accurate at time of going to print. www.ttelectronicsresistors.com
|
