sdm1l30csp document number: ds35649 rev. 5 - 2 1 of 5 www.diodes.com march 2014 ? diodes incorporated sdm1l30csp new product new product 1a schottky barrier di ode chip scale package product summary v rrm (v) i o (a) v f(max) (v) @ +25c i r(max) (ma) @ +25c 30 1.0 0.40 1.0 description and applications the sdm1l30csp is a 30-volt 1a schottky barrier diode that is optimized for low forward voltage and soft switching characteristics to meet the needs of wireless charging applications. it is housed in a compact chip scale package (csp) that occupies only 2 mm 2 board- space. it is ideally suited for use in portable applications. features and benefits ? 2 mm 2 footprint ? 67% smaller than powerdi123 ? off board profile of 0.3mm ? 70% thinner than powerdi123 ? low forward voltage drop reduces power dissipation ? soft switching characteristic ensures that emi and efi are minimised ? guard ring die constructi on for transient protection ? totally lead-free & fully rohs compliant (notes 1 & 2) ? halogen and antimony free. ?green? device (note 3) mechanical data ? case: x2-wlb2010-2 ? moisture sensitivity: level 1 per j-std-020 ? terminals: solderable per mil-std-202, method 208 ? polarity: cathode dot ? weight: 0.15mg ordering information (note 4) part number case packaging SDM1L30CSP-7 x2-wlb2010-2 3,000/tape & reel notes: 1. no purposely added lead. fully eu directiv e 2002/95/ec (rohs) & 2011/6 5/eu (rohs 2) compliant. 2. see http://www.diodes.com/quality/lead_free.html for more in formation about diodes incorporated?s definitions of halogen- a nd antimony-free, "green" and lead-free. ? 3. halogen- and antimony-free "green? products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm t otal br + cl) and <1000ppm antimony compounds. 4. for packaging details, go to our website at http://www.diodes.com/p roducts/packages.html. marking information date code key year 2014 2015 2016 2017 2018 2019 2020 code b c d e f g h month jan feb mar apr may jun jul aug sep oct nov dec code 1 2 3 4 5 6 7 8 9 o n d x4 = product type marking code ym = date code marking y = year (ex: b = 2014) m = month (ex: 9 = september) dot denotes cathode pin
sdm1l30csp document number: ds35649 rev. 5 - 2 2 of 5 www.diodes.com march 2014 ? diodes incorporated sdm1l30csp new product new product maximum ratings (@t a = +25c, unless otherwise specified.) single phase, half wave, 60hz, re sistive or inductive load. for capacitance load, derate current by 20%. characteristic symbol value unit peak repetitive reverse voltage v rrm 30 v average rectified output current i o 1.0 a non-repetitive peak forward surge current 8.3ms single half sine-wave superimposed on rated load i fsm 25 a thermal characteristics characteristic symbol value unit typical thermal resistance junction to ambient (note 5) r ja 130 c/w operating and storage temperature range t j , t stg -55 to +150 c electrical characteristics (@t a = +25c, unless otherwise specified.) characteristic symbol min typ max unit test condition forward voltage drop v f ? 0.35 0.40 v i f = 1.0a, t j = +25c ? 0.29 ? i f = 1.0a, t j = +85c leakage current (note 6) i r ? 0.47 1.0 ma v r = 30v, t j = +25c ? 17 ? ma v r = 30v, t j = +85c total capacitance c t ? 150 ? pf v r = 5v, f = 1.0 mhz notes: 5. device mounted on fr-4 substrate pc board, with minimu m recommended pad layout per ht tp://www.diodes.c om/datsheets/ap 02001.pdf. 6. short duration pulse test used to minimize self-heating effect.
sdm1l30csp document number: ds35649 rev. 5 - 2 3 of 5 www.diodes.com march 2014 ? diodes incorporated sdm1l30csp new product new product typical electrical characteristics i average rectified output current (a) figure 1 forward power dissipation o p , p o we r dissi p a t i o n (w) d 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 0 0.5 1 1.5 2 2.5 note 5 v , instantaneous forward voltage (v) f figure 2 typical forward characteristics i, i n s t a n t a n e o u s f o r wa r d c u r r e n t (a) f 0.0001 0.001 0.01 0.1 1 10 0 100 200 300 400 500 600 t = 25c a t = 85c a t = 125c a t = 150c a t = -55c a note 5 i, i n s t a n t a n e o u s r eve r se c u r r e n t (a) r v , instantaneous reverse voltage (v) r figure 3 typical reverse characteristics 1 10 100 1000 10000 100000 1000000 0 5 10 15 20 25 30 t = 25c a t = 85c a t = 125c a t = 150c a t = -55c a v , dc reverse voltage (v) r figure 4 total capacitance vs. reverse voltage c , t o t al c a p a c i t an c e (pf) t 10 100 1000 0 10203040 0 25 50 75 100 125 150 v , dc reverse voltage (v) r figure 5 operating temperature derating t , de r a t ed ambie n t t em p e r a t u r e ( c ) a 0 5 10 15 20 25 30
sdm1l30csp document number: ds35649 rev. 5 - 2 4 of 5 www.diodes.com march 2014 ? diodes incorporated sdm1l30csp new product new product package outline dimensions please see ap02002 at http://www.diodes.com/ datasheets/ap02002.pdf for latest version. suggested pad layout please see ap02001 at http://www.diodes.com/dat asheets/ap02001.pdf for the latest version. x2-wlb2010-2 dim min max typ a ? 0.305 0.290 a1 ? 0.02 0.011 b ? ? 0.48 d 1.950 2.050 2.000 e 0.950 1.050 1.000 k ? ? 0.972 l ? ? 0.932 all dimensions in mm dimensions value (in mm) g 0.872 x 0.580 x1 2.032 y 1.032 d e l b 2 x k r 0 . 1 0 0 a a 1 s e a t i n g p l a n e c a t h o d e n o t c h x y x 1 g
sdm1l30csp document number: ds35649 rev. 5 - 2 5 of 5 www.diodes.com march 2014 ? diodes incorporated sdm1l30csp new product new product important notice diodes incorporated makes no warranty of any kind, express or implied, with regards to this document, including, but not limited to, the implied warranties of merchantability and fitness for a particular purpose (and their equivalents under the laws of any jurisdiction). diodes incorporated and its subsidiaries rese rve the right to make modifications, enhanc ements, improvements, corrections or ot her changes without further notice to this document and any product descri bed herein. diodes incorporated does not assume any liability ari sing out of the application or use of this document or any product described herein; neither does diodes incorporated convey any license under its patent or trademark rights, nor the rights of others. any customer or user of this document or products described herein in such applica tions shall assume all risks of such use and will agree to hold diodes incorporated and all the companies whose products are represented on diodes incorporated website, harmless against all damages. diodes incorporated does not warrant or accept any liability w hatsoever in respect of any products purchased through unauthoriz ed sales channel. should customers purchase or use diodes inco rporated products for any unintended or una uthorized application, customers shall i ndemnify and hold diodes incorporated and its representativ es harmless against all claims, damages, expenses, and attorney fees arising out of, directly or indirectly, any claim of personal injury or death a ssociated with such unintended or unauthorized application. products described herein may be covered by one or more united states, international or foreign patents pending. product names and markings noted herein may also be covered by one or more united states, international or foreign trademarks. this document is written in english but may be translated into multiple languages for reference. only the english version of t his document is the final and determinative format released by diodes incorporated. life support diodes incorporated products are specifically not authorized for use as critical com ponents in life support devices or systems without the express written approval of the chief executive offi cer of diodes incorporated. as used herein: a. life support devices or syst ems are devices or systems which: 1. are intended to implant into the body, or 2. support or sustain life and whose failure to perform when proper ly used in accordance with instructions for use provided in the labeling can be reasonably expected to result in significant injury to the user. b. a critical component is any component in a life support devic e or system whose failure to perform can be reasonably expect ed to cause the failure of the life support device or to affect its safety or effectiveness. customers represent that they have all necessary expertise in the safety and regulatory ramifi cations of their life support dev ices or systems, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-rel ated requirements concerning the ir products and any use of diodes incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or s ystems-related information or support that may be provided by diodes incorporated. further, customers must fully indemnify diodes incorporate d and its representatives against any damages arisi ng out of the use of diodes incorporated pr oducts in such safety-critical, life suppor t devices or systems. copyright ? 2014, diodes incorporated www.diodes.com
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