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l features l outline ? reflector type (3.02.0mm, t=1.3mm) ? and luminous intensity to the front direction l size 1006 (0402) 1.00.6mm (t=0.2mm) l dimensions l recommended solder pattern l specifications typ. i f max. v r min.* 2 typ. max.* 2 i f min. typ. i f (v) (ma) ( m a) (v) (nm) (nm) (nm) (ma) (mcd) (mcd) (ma) sml-012vt(a) 2.0 626 636 35.5 71 sml-012v8t 2.2 625 635 25 63 sml-013ut 2.0 619 624 629 90 220 sml-012u8t 2.2 40 100 sml-012ut 36 100 sml-011ut 22 63 sml-012d8t 2.2 63 160 sml-012dt 36 100 sml-011dt 22 63 sml-012y8t 2.2 40 100 sml-013yt 2.1 100 250 SML-012YT 36 100 sml-011yt 22 63 sml-012m8t 569 572 575 16 40 sml-012p8t 557 563 2.5 6.3 sml-012pt(a) 2.1 558 564 9 18 * 1:duty1/10, 1khz * 2:reference 630 615 602 605 608 587 590 593 620 625 - 40 to +85 - 40 to +100 - 40 to + 100 2.0 2.0 2.0 2.2 - 40 to +85 - 40 to +100 - 40 to +85 - 40 to +100 - 40 to +100 - 40 to +85 - 30 to +85 - 40 to +85 - 40 to +100 54 75 75 54 75 60* 1 100* 1 5 30 20 30 20 30 20 20 30 30 25 20 10 5 20 aigainp on gaas red orange yellow 75 75 54 54 54 560 62 green part no. chip structure absolute maximum ratings (ta=25oc) electrical and optical characteristics (ta=25oc) emitting power forward peak forward reverse operating temp. storage temp. forward voltag v f reverse current i r dominant wavelength l d luminous intensity i v sml-01 series reflector improved the concentration of viewing angle yellowish green 20 color i fp (ma) current v r (v) voltage dissipation current p d (mw) i f (ma) topr(oc) tstg(oc) 20 (unit : mm) tolerance : ? 0.2 (unit : mm) 3020 (1208) 3.0 2.0mm (t=1.3mm) color type v u d y p m 1/10 2014.11 - rev.d data sheet www.rohm.com ? 2014 rohm co., ltd. all rights reserved. 1 . 6 2 . 0 3 . 0 2 . 3 1 . 7 1 . 6 1 . 3 0 . 5 0 . 3 2 - r 0 . 3 e l e c t r o d e + 0 . 2 - 0 . 1 t h r o u g h h o l e c a t h o d e i n d e x
sml-01 series l electrical characteristics curves 1 10 100 1.4 1.6 1.8 2.0 2.2 2.4 2.6 0.4 0.6 0.8 1 1.2 1.4 1.6 -40 -20 0 20 40 60 80 100 0.0 0.2 0.4 0.6 0.8 1.0 1.2 0 5 10 15 20 0 10 20 30 -40 -20 0 20 40 60 80 100 fig.1 forward current - forward voltage s forward current : i f [ma] forward voltage : v f [v] fig.2 luminous intensity - atmosphere temperature relative luminous intensity [a.u.] atmosphere temperature : ta [oc] fig.3 luminous intensity - forward current relative luminous intensity forward current : i f [ma] fig.4 derating maximum forward current : [ma] ambient temperature : ta [oc] ta=25 oc ta=25 oc i f = 20ma sml - 012v8t sml - 012u8t sml - 012d8t sml - 012y8t sml - 012m8t sml - 012p8t sml - 012v8t sml - 012u8t sml - 012d8t sml - 012y8t sml - 012m8t sml - 012p8t sml - 012v8t sml - 012u8t sml - 012d8t sml - 012y8t sml - 012m8t sml - 012p8t sml - 012v8t sml - 012u8t sml - 012d8t sml - 012y8t sml - 012m8t sml - 012p8t 2/10 2014.11 - rev.d www.rohm.com ? 2014 rohm co., ltd. all rights reserved. data sheet
sml-01 series l electrical characteristics curves 1 10 100 1.2 1.4 1.6 1.8 2.0 2.2 2.4 forward current if(ma) 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 -40 -20 0 20 40 60 80 100 0.0 0.4 0.8 1.2 1.6 0 5 10 15 20 25 30 0 10 20 30 40 -40 -20 0 20 40 60 80 100 fig.1 forward current - forward voltage s forward current : i f [ma] forward voltage : v f [v] fig.2 luminous intensity - atmosphere temperature relative luminous intensity [a.u.] atmosphere temperature : ta [oc] fig.3 luminous intensity - forward current relative luminous intensity forward current : i f [ma] fig.4 derating maximum forward current : [ma] ambient temperature : ta [oc] ta=25 oc ta=25 oc i f = 20ma sml - 012ut sml - 011ut sml - 012dt sml - 011dt sml - 012yt sml - 011yt sml - 012ut sml - 011ut sml - 012dt sml - 011dt sml - 012yt sml - 011yt sml - 012ut sml - 011ut sml - 012dt sml - 011dt sml - 012yt sml - 011yt sml - 012ut sml - 011ut sml - 012dt sml - 011dt sml - 012yt sml - 011yt 3/10 2014.11 - rev.d www.rohm.com ? 2014 rohm co., ltd. all rights reserved. data sheet
sml-01 series l electrical characteristics curves 1 10 100 1.4 1.6 1.8 2.0 2.2 2.4 2.6 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 -40 -20 0 20 40 60 80 100 0.0 0.4 0.8 1.2 1.6 0 5 10 15 20 25 30 0 10 20 30 40 -40 -20 0 20 40 60 80 100 fig.1 forward current - forward voltage s forward current : i f [ma] forward voltage : v f [v] fig.2 luminous intensity - atmosphere temperature relative luminous intensity [a.u.] atmosphere temperature : ta [oc] fig.3 luminous intensity - forward current relative luminous intensity forward current : i f [ma] fig.4 derating maximum forward current : [ma] ambient temperature : ta [oc] ta=25 oc ta=25 oc i f = 20ma sml - 013ut sml - 013yt sml - 013ut sml - 013yt sml - 013ut sml - 013yt sml - 013ut sml - 013yt 4/10 2014.11 - rev.d www.rohm.com ? 2014 rohm co., ltd. all rights reserved. data sheet
sml-01 series l electrical characteristics curves 1 10 100 1.2 1.4 1.6 1.8 2.0 2.2 2.4 2.6 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 -40 -20 0 20 40 60 80 100 0.0 0.4 0.8 1.2 1.6 0 5 10 15 20 25 30 0 10 20 30 40 -40 -20 0 20 40 60 80 100 fig.1 forward current - forward voltage s forward current : i f [ma] forward voltage : v f [v] fig.2 luminous intensity - atmosphere temperature relative luminous intensity [a.u.] atmosphere temperature : ta [oc] fig.3 luminous intensity - forward current relative luminous intensity forward current : i f [ma] fig.4 derating maximum forward current : [ma] ambient temperature : ta [oc] ta=25 oc ta=25 oc i f = 20ma sml - 012vt(a) sml - 012pt(a) sml - 012vt(a) sml - 012pt(a) sml - 012vt(a) sml - 012pt(a) sml - 012vt(a) sml - 012pt(a) 5/10 2014.11 - rev.d www.rohm.com ? 2014 rohm co., ltd. all rights reserved. data sheet
sml-01 series l viewing angle l rank reference of brightness sml - 01 series scanning angle (deg) relative intensity sames for both directions 6/10 2014.11 - rev.d www.rohm.com ? 2014 rohm co., ltd. all rights reserved. data sheet red(v,u) (ta=25oc, i f h 20ma) rank j k l m n p q r s t u v w x iv (mcd) 2.5 to 4.0 4.0 to 6.3 6.3 to 10 10 to 16 16 to 25 25 to 40 40 to 63 63 to 100 100 to 160 160 to 250 250 to 400 400 to 630 630 to 1000 1000 to 1600 sml-012v8t sml-013ut sml-012u8t sml-012ut sml-011ut brightness on specification sheet include tolerance of within r 10%. (ta=25oc, i f h 20ma) rank ag ah aj ak al am an ap aq ar as at au av aw ax ay az iv (mcd) 9.0 to 11.2 11.2 to 14 14 to 18 18 to 22.4 22.4 to 28 28 to 35.5 35.5 to 45 45 to 56 56 to 71 71 to 90 90 to 112 112 to 140 140 to 180 180 to 224 224 to 280 280 to 355 355 to 450 450 to 560 sml-012vt(a) please note that the brightness of some products may fall between ranks (half rank) orange(d) (ta=25oc, i f h 20ma) rank j k l m n p q r s t u v w x iv (mcd) 2.5 to 4.0 4.0 to 6.3 6.3 to 10 10 to 16 16 to 25 25 to 40 40 to 63 63 to 100 100 to 160 160 to 250 250 to 400 400 to 630 630 to 1000 1000 to 1600 sml-011dt sml-012d8t sml-012dt brightness on specification sheet include tolerance of within r 10%. yellow(y) (ta=25oc, i f h 20ma) rank j k l m n p q r s t u v w x iv (mcd) 2.5 to 4.0 4.0 to 6.3 6.3 to 10 10 to 16 16 to 25 25 to 40 40 to 63 63 to 100 100 to 160 160 to 250 250 to 400 400 to 630 630 to 1000 1000 to 1600 sml-011y t sml-012y 8t sml-012y t sml-013y t brightness on specification sheet include tolerance of within r 10%. green(m,p) (ta=25oc, i f h 20ma) rank j k l m n p q r s t u v w x iv (mcd) 2.5 to 4.0 4.0 to 6.3 6.3 to 10 10 to 16 16 to 25 25 to 40 40 to 63 63 to 100 100 to 160 160 to 250 250 to 400 400 to 630 630 to 1000 1000 to 1600 sml-012m8t sml-012p8t brightness on specification sheet include tolerance of within r 10%. (ta=25oc, i f h 20ma) rank ag ah aj ak al am an ap aq ar as at au av aw ax ay az iv (mcd) 9.0 to 11.2 11.2 to 14 14 to 18 18 to 22.4 22.4 to 28 28 to 35.5 35.5 to 45 45 to 56 56 to 71 71 to 90 90 to 112 112 to 140 140 to 180 180 to 224 224 to 280 280 to 355 355 to 450 450 to 560 sml-012pt(a) please note that the brightness of some products may fall between ranks (half rank)
sml-01 series l taping t86 t87 l part no. construction l packing specification rohm led products are being shipped with desiccant (silica gel) concluded in moisture-proof bags. pasting the moisture sensitive label on the outer surface of the moisture-proof bags or enclosing the humidity indication card inside the bag is available upon request.
please contact the nearest sales office or distributer if necessary. 7/10 2014.11 - rev.d www.rohm.com ? 2014 rohm co., ltd. all rights reserved. data sheet 8 . 0 1 . 7 5 3 . 5 5 . 5 0 8 . 0 1 . 7 5 3 . 5 5 . 5 0
8/10 1.storage if the product is heated during the reflow under the condition of hygroscopic state, it may vaporize and expand which will influence the performance of the product. therefore, the package is waterproof. please use the product following the conditions: ? using conditions classification temperature humidity expiration date remark 1 before using 5 to 30oc 30 to 70%rh within 1 year from receiving storage with waterproof package 2 after opening package 5 to 30oc below 70%rh within168h please storing in the airtight container with our desiccant (silica gel) ? baking bake the product in case of below: 1 the expiration date is passed. 2 the color of indicator (silica gel) turned from blue to colorless or from green to pink. (even if the product is within the expiration date.) ? baking conditions temperature time humidity 603oc 12 to 24h below 20%rh remark ? bake products in reel. ? reel and embossed tape are easy to be deformed when baking, so please try not to apply stress on it. ? recommend bake once. 2.application methods 2-1. precaution for drive system and off mode design the circuit without the electric load exceeding the absolute maximum rating that applies on the products. if drive by constant voltage, it may cause current deviation of the led and result in deviation of luminous intensity, so we recommend to drive by constant current. (deviation of vf value will cause deviation of current in led.) furthermore, for off mode, please do not apply voltage neither forward nor reverse. especially, for the products with the ag-paste used in the die bonding, theres high possibility to cause electro migration and result in function failure. 2-2. operation life span theres possibility for intensity of light drop according to working conditions and environments (applied current, surrounding temperature and humidity, corrosive gases), please call our sales staffs for inquiries about the concerned application below. 1 longtime intensity of light life 2 on mode all the time 2-3.applied stress on product the top of the led is very soft, which the silicon resin is used as sealing resin. therefore, please pay attention to the overstress on it which may influence its reliability. 2-4.usage the product is led. we are not responsible for the usage as the diode such as protection chip, rectifier, switching and so on. www.rohm.com ? 2014 rohm co., ltd. all rights reserved. data sheet sml-01 series 2014.11 - rev.d l precaution (surface mount device)
9/10 3. others 3-1. surrounding gas notice that if it is stored under the condition of acid gas (chlorine gas, sulfured gas) or alkali gas (ammonia), it may result in low soldering ability (caused by the change in quality of the plating surface ) or optical characteristics changes (light intensity, chrominance) and change in quality of die bonding (ag-paste) materials. all of the above will cause function failure of the products. therefore, please pay attention to the storage environment for mounted product (concern the generated gas of the surrounding parts of the products and the atmospheric environment). 3-2. electrostatic damage the product is part of semiconductor and electrostatic sensitive, theres high possibility to be damaged by the electrostatic discharge. please take appropriate measures to avoid the static electricity from human body and earthing of production equipment. the resistance values of electrostatic discharge (actual values) vary with products, therefore, please call our sales staffs for inquiries. 3-3. electromagnetic wave please concern the influence on led in case of application with strong electromagnetic wave such as ih (induction heating). 4.mounting 4-1. soldering ? no resin hardening agent such as filler is used in the sealing resin of the product. therefore, resin expansion and moisture absorption at humidity will cause heat stress during soldering process and finally has bad influence on the products reliability. ? the product is not for flow soldering. ? do not expose the product in the environment of high temperature (over 100oc) or rapid temperature shift (within 3oc of temperature gradient) during the flow soldering of surrounding parts. ? please set appropriate reflow temperature based on our product usage conditions and specification. ? the max for reflowing is 2 times, please finish the second flow soldering and flow soldering with other parts within the usage limitation after open the moistureproof package. ? compare with n2 reflow, during air reflow, because of the heat and surrounding conditions, it may cause the discoloration of the resin. ? for our product that has no solder resist, because of its solder amount and soldering conditions, one of its specific characteristics is that solder will penetrate into led. thus, there's high possibility that will influence its reliability. therefore, please be informed, concerning it before using it. 4-2. automatic mounting 4-2-1.silicon resin sealing product the sealing resin of led is very soft, so please select adsorption nozzle that would not apply stress directly on the sealing section. 4-2-2.mini package (smaller than 1608 size) vibration may result in low mounting rate since it will cause the static electricity of product and adhere to top cover tape. we recommend to ? set magnet on parts feeder cassette of the mounter to control the product stabilization ? set ionizer to prevent electrostatic charge 4-3. mounting location the stress like bending stress of circuit board dividing after mounting, may cause led package crack or damage of led internal junction, therefore, please concern the mounting direction and position to avoid bending or screwing with great stress of the circuit board. www.rohm.com ? 2014 rohm co., ltd. all rights reserved. data sheet sml-01 series 2014.11 - rev.d
10/10 4-5. soldering pattern for recommendation we recommend the soldering pattern that shows on the right. it will be different according to mounting situation of circuit board,therefore, please concern before designing. * the product has adopted the electrode structure that it should solder with back electrode of the product. thus, please be informed that the shape of electrode pin of solder fillet formation is not guaranteed. 4-6. reflow profile for reflow profile, please refer to the conditions below:( * ) ? meaning of marks, conditions mark meanings conditions ts max maximum of pre-heating temperature 180oc ts min minimum of pre-heating temperature 140oc ts time from ts min to ts max over 60sec. t l reference temperature 220 to 250oc t l retention time for t l within 40sec. t p peak temperature 250oc(max) t p time for peak temperature within 10sec. t r /t temperature rising rate under 3oc/sec. t d /t temperature decreasing rate over -3oc/sec. * above conditions are for reference. therefore, evaluate by customers own circuit boards and reflow furnaces before using, because stress from circuit boards and temperature variations of reflow furnaces vary by customers own conditions. 4-7. cleaning after soldering please follow the conditions below if the cleaning is necessary after soldering. solvent we recommend to use alcohols solvent such as, isopropyl alcohols temperature under 30oc within 3 minutes ultrasonic cleaning 15w / below 1 liter (capacity of tank) drying under 100oc within 3 minutes stress strength according to the mounting position: a>b>c>d (fig-1) 4-4. mechanical stress after mounting the mechanical stress may damage the led after circuit mounting, so please pay attention to the touch on product. www.rohm.com ? 2014 rohm co., ltd. all rights reserved. data sheet sml-01 series 2014.11 - rev.d
r1 102 a www .rohm.com ? 2014 rohm co., ltd. all rights reserved. notice rohm c u stomer support sys tem h ttp://w w w . r ohm .com/con tact/ thank you for your accessing to rohm pr oduct informations. mor e detail pr oduct informations and catalogs ar e available, please contact us. notes the inf or mation contained herein is subject to change without notic e . bef ore y ou use our p r o d u c t s , ple a s e c o n t a c t o u r s a l e s r e p r e s e n t a t i v e and v e r i f y the l a test specifica- tions : althoug h r o h m is c o n t i n uousl y w o r king t o impro ve p roduct r elia bility and quality , semicon- duc tors c an brea k do w n and mal f unction due to va r ious f actor s . the ref o r e , i n ord e r to p r e ve n t per sonal i n jur y or fire a r isin g f rom f a ilure , please tak e saf ety meas ure s suc h a s c o m plying wit h the der ating cha r a cte r istics , imple menting redundant and f ire p r e ve nti o n d e s i g n s , and u tilizing bac k ups a nd f ail- saf e p rocedures . r o hm shall h a ve no responsibility f or an y damages ar ising out of the use of our p oducts beyond the r ating specified b y r ohm. examples of application circuits , circuit constants and an y other inf or mation contained herein are pro vided only to illustr ate the standard usage and oper ations of the products . the per iphe r al conditions m ust be tak en into account when designing circuits f or mass production. the technical inf or mation specified herein is intended only to sho w the typical functions of and e xamples of application circuits f or the products . r ohm does not grant y ou, e xplicitly or implicitl y , an y license to use or e x ercise intellectual prope r ty or other r ights held b y r ohm or an y other par ties . r ohm shall ha v e no responsibility whatsoe v er f or an y dispute ar ising out of the use of such technical in f or mation. the products are intended f or use in gene r al electronic equipment (i.e . a v/o a de vices , comm uni- cation, consumer systems , gaming/ente r tainment sets) as w ell as the applications indicated in this document. the products specified in this document are not designed to be r adiation tole r ant. f or use of our products in applications requi r ing a high deg ree of reliability (as exemplified bel o w), please contact and consult with a r ohm representati v e : tr anspo r tation equipment (i.e . cars , ships , tr ains), pr imar y comm unication equipment, tr affic lights , fire/cr ime pre v ention, saf ety equipment, medical system s , ser v ers , solar cells , and po w er tr ansmission system s . do not use our products in applications requir ing e xtremely high reliabilit y , such as aerospace equipment, n uclear p o w er control systems , and submar ine repeater s . r ohm shall ha v e no responsibility f or an y damages or inju r y ar ising from non-compliance with the recommended usage conditions and specifications contained herein. r ohm has used reasona b le care to ensur the accur acy of the inf or mation contained in this document . ho w e v er , r ohm does not w arr ants that such inf or mation is error-free , and r ohm shall ha v e no responsibility f or an y damages ar ising from an y inaccu r acy or mispr int of such inf or mation. please use the products in accordance with an y applica b le en vironmental la ws and regulation s , such as the rohs directiv e . f or more details , including rohs compatibilit y , please contact a r ohm sales office . r ohm shall ha v e no responsibility f or an y damages or losses resulting non-compliance with a n y applica b le la ws or regulation s . when pro viding our products and technologies contained in this document to other countr ies , y ou m ust abide b y the procedures and pro visions stipulated in all applica b le e xpor t la ws and regulation s , including without limitation the us expor t administr ation regulations and the f oreign exchange and f oreign t r ade act. this document, in par t or in whol e , ma y not be repr inted or reproduced without pr ior consent of r ohm. 1) 2) 3) 4) 5) 6) 7) 8) 9) 10) 11) 12) 13) 14)

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