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product structure silicon monolithic integrated circuit this product has not designed protection against radioactive r ays . 1/ 23 tsz02201-0e3e0h300310-1-2 ? 2013 rohm co., ltd. all rights reserved. 21.aug.2014 rev.002 tsz22111 ? 14 ? 001 www.rohm.com 1 channel compact high side switch ics 0.75a current limit high side switch ics bd2246g bd2247g general description bd2246g and bd2247g are low on-resistance high -side power switches n-channel mosfets for universal serial bus (usb) applications. these ics have built- in over-current protection, thermal shutdown, under -voltage lockout and soft-start. features ? built-in low on-resistance (typ 110m) n-channel mosfet ? over-current detection ? thermal shutdown ? open-drain fault flag output ? flag output delay ? under-voltage lockout ? soft-start circuit ? output discharge function ? reverse current protection w hen power switch o ff ? control input logic ? active-high: bd2246g ? active- low : bd2247g applications usb hub in consumer appliances, pc, pc peripheral equipment, and so forth key specifications ? input voltage range: 2.7v to 5.5v ? on -resistance: 11 0m (typ) ? over-current threshold: 0.63a (min), 0.9a (m ax ) ? standby current: 0.01 a ( typ) ? operating temperature range: - 40 c to +85c package w(typ) d(typ) h (max) typical application circuit lineup over-current threshold control input logic package orderable part number min typ max 0.63 a 0.765 a 0.9a high ssop5 reel of 3000 bd2246g-g tr 0.63 a 0.765 a 0.9 2a low ssop5 reel of 3000 bd2247g-g tr ssop5 2.90mm x 2.80mm x 1.25mm 10k to 100k c l c in in gnd en out /oc 5v (typ) + - 3.3v datashee t downloaded from: http:///
bd2246g bd2247g 2/ 23 tsz02201-0e3e0h300310-1-2 ? 2013 rohm co., ltd. all rights reserved. 21.aug.2014 rev.002 www.rohm.com tsz22111 ? 15 ? 001 block diagram pin configurations pin description pin no. symbol i/o functi on 1 in - switch input and the supply voltage for the ic 2 gnd - ground 3 en, /en i enable input en: high level input turns on the switch. (bd2246g) /en: low level input turns on the switch. (bd2247g) 4 /oc o over-current detection terminal. low level output during over-current or over-temperature conditi on open-drain fault flag output 5 out o switch output in out bd22 46 g top view bd22 47 g top view in gnd en 1 2 3 4 5 /oc out in gnd /en 1 2 3 4 5 /oc out downloaded from: http:///
bd2246g bd2247g 3/ 23 tsz02201-0e3e0h300310-1-2 ? 2013 rohm co., ltd. all rights reserved. 21.aug.2014 rev.002 www.rohm.com tsz22111 ? 15 ? 001 absolute maximum ratings (ta= 25 c) parameter symbol rating unit in supply voltage v in -0.3 to +6.0 v en(/en) input voltage v en , v /en -0.3 to +6.0 v /oc voltage v /oc -0.3 to +6.0 v /oc sink current i /oc 5 ma out voltage v out -0.3 to +6.0 v storage temperature tstg - 55 to + 150 c power dissipation pd 0.67 (note 1) w (note 1) mounted on 70mm x 70mm x 1.6mm glass epoxy board. reduce 5.4m w per 1c above 25c caution: operating the ic over the absolute maximum ratings may damage t he ic. the damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. therefore, it is important to co nsider circuit protection measures, such as adding a fuse, in case th e ic is operated over the absolute maximum ratings. recommended operating conditions parameter symbol rating unit min typ max in operating voltage v in 2.7 5.0 5.5 v operating temperature t opr -40 - + 85 c electrical characteristics bd2246g (v in = 5v, ta= 25c, unless otherwise specified.) dc characteristics parameter symbol limit unit conditions min typ max operating current i dd - 110 160 a v in = v en = 5v, v out = open - 75 110 v in = v en = 3.3v, v out = open standby current i stb - 0.01 5 a v en = 0v, v out = open en input voltage v en h 2.0 - - v high input, v in = 3.3v to 5v v en l - - 0.8 v low input, v in = 5v - - 0.6 v low input, v in = 3.3v en input leakage i en -1 +0.01 +1 a v en = 0v or 5v on -resistance r on - 110 155 m i out = 500ma. v in = 5v - 130 180 i out = 500ma. v in = 3.3v reverse leak current i rev - - 1.0 a v out = 5.0v, v in = 0v over-current threshold i th 630 765 900 ma v in = 5v 600 740 890 v in = 3.3v short circuit output current i sc 350 500 650 ma v out = 0v, rms, v in = 3.3v to 5v output discharge resistance r disc 30 60 120 i disc = 1ma, v in = 5v 50 100 200 i disc = 1ma, v in = 3.3v /oc output low voltage v /oc - - 0.4 v i /oc = 0.5ma, v in = 3.3v to 5v uvlo threshold v tuvh 2.1 2.3 2.5 v v in increasing v tuvl 2.0 2.2 2.4 v in decreasing ac characteristics parameter symbol limit unit conditions min typ max output rise time t on1 - 1 6 ms r l = 20 , v in =3.3v to 5v output turn on time t on2 - 1.5 10 ms r l = 20 , v in =3.3v to 5v output fall time t off1 - 1 20 s r l = 20 , v in =3.3v to 5v output turn off time t off2 - 3 40 s r l = 20 , v in =3.3v to 5v /oc delay time t /oc 10 15 20 ms v in = 5v 11 16 21 v in = 3.3v downloaded from: http:///
bd2246g bd2247g 4/ 23 tsz02201-0e3e0h300310-1-2 ? 2013 rohm co., ltd. all rights reserved. 21.aug.2014 rev.002 www.rohm.com tsz22111 ? 15 ? 001 electrical characteristics - continued bd2247g (v in = 5v, ta= 25c, unless otherwise specified.) dc characteristics parameter symbol limit unit conditions min typ max operating current i dd - 110 160 a v in = 5v, v /en =0, v out = open - 75 110 v in = 3.3v, v /en =0, v out = open standby current i stb - 0.01 5 a v /en = 5v, v out = open /en input voltage v /e nh 2.0 - - v high input, v in = 3.3v to 5v v /e nl - - 0.8 v low input, v in = 5v - - 0.6 v low input, v in = 3.3v /en input leakage i /en -1 +0.01 +1 a v /en = 0v or 5v on -resistance r on - 110 155 m i out = 500ma. v in = 5v - 130 180 i out = 500ma. v in = 3.3v reverse leak current i rev - - 1.0 a v out = 5.0v, v in = 0v over-current threshold i th 630 765 900 ma v in = 5v 600 740 890 v in = 3.3v short circuit output current i sc 350 500 650 ma v out = 0v, rms, v in = 3.3v to 5v output discharge resistance r disc 30 60 120 i disc = 1ma, v in = 5v 50 100 200 i disc = 1ma, v in = 3.3v /oc output low voltage v /oc - - 0.4 v i /oc = 0.5ma, v in = 3.3v to 5v uvlo threshold v tuvh 2.1 2.3 2.5 v v in increas ing v tuvl 2.0 2.2 2.4 v in decreasing ac characteristics parameter symbol limit unit conditions min typ max output rise time t on1 - 1 6 ms r l = 20 , v in =3.3v to 5v output turn on time t on2 - 1.5 10 ms r l = 20 , v in =3.3v to 5v output fall time t off1 - 1 20 s r l = 20 , v in =3.3v to 5v output turn off time t off2 - 3 40 s r l = 20 , v in =3.3v to 5v /oc delay time t /oc 10 15 20 ms v in = 5v 11 16 21 v in = 3.3v downloaded from: http:///
bd2246g bd2247g 5/ 23 tsz02201-0e3e0h300310-1-2 ? 2013 rohm co., ltd. all rights reserved. 21.aug.2014 rev.002 www.rohm.com tsz22111 ? 15 ? 001 measurement circuit in gnd en(/en) out /oc v in v en(/en) a 1f in gnd en(/en) out /oc v in v en(/en) a 1f r l a. operating current b. en, /en input voltage, output rise / fall time in gnd en(/en) out /oc v in v en(/en) a 1f i out 10k in gnd en(/en) out /oc v in v en(/en) a 1f i oc c. on-resistance, over-current detection d. /oc output low voltage figure 1. measurement circuit timing diagram t on1 t off1 90% 10% 10% t on2 t off2 v enh v enl 90% v en v out t on1 t off1 90% 10% 10% t on2 t off2 v /enl v /enh 90% v /en v out figure 2. output rise / fall time (bd2246g) figure 3. output rise / fall time (bd2247g) downloaded from: http:///
bd2246g bd2247g 6/ 23 tsz02201-0e3e0h300310-1-2 ? 2013 rohm co., ltd. all rights reserved. 21.aug.2014 rev.002 www.rohm.com tsz22111 ? 15 ? 001 typical performance curves figure 4. operating current vs supply voltage (en, /en enable) figure 5. operating current vs ambient temperature (en, /en enable) figure 6. standby current vs supply voltage (en, /en disable) figure 7. standby current vs ambient temperature (en, /en disable) 0 20 40 60 80 100 120 140 2 3 4 5 6 supply voltage : v in [v] operating current : i dd [a] ta=25c supply voltage : v in [v] operating current : i dd [ a] 0 20 40 60 80 100 120 140 -50 0 50 100 ambient temperature : ta[ ] operating current : i dd [a] v in =5.0v ambient temperature : ta[ c] operating current : i dd [ a] 0.0 0.2 0.4 0.6 0.8 1.0 2 3 4 5 6 supply voltage : v in [v] standby current : i stb [a] ta=25c supply voltage : v in [v] standby current : i stb [ a] 0.0 0.2 0.4 0.6 0.8 1.0 -50 0 50 100 ambient temperature : ta[ ] standby current : i stb [a] v in =5.0v ambient temperature : ta[ c] standby current : i stb [ a] downloaded from: http:///
bd2246g bd2247g 7/ 23 tsz02201-0e3e0h300310-1-2 ? 2013 rohm co., ltd. all rights reserved. 21.aug.2014 rev.002 www.rohm.com tsz22111 ? 15 ? 001 typical performance curves - continued figure 8. en, /en input voltage vs supply voltage (v enh , v enl , v /enh , v /enl ) figure 9. en, /en input voltage vs ambient temperature (v enh , v enl , v /enh , v /enl ) figure 10. on-resistance vs supply voltage figure 11. on-resistance vs ambient temperature 0.0 0.5 1.0 1.5 2.0 2 3 4 5 6 supply voltage : v in [v] enable input voltage : v en [v] ta=25c low to high high to low supply voltage : v in [v] enable input voltage : v en , v /en [v] 0.0 0.5 1.0 1.5 2.0 -50 0 50 100 ambient temperature : ta[ ] enable input voltage : v en [v] v in =5.0v low to high high to low ambient temperature : ta[ c] enable input voltage : v en , v /en [v] 0 50 100 150 200 2 3 4 5 6 supply voltage : v in [v] on resistance : r on [m] ta=25c supply voltage : v in [v] on -resistance : r on [m ] 0 50 100 150 200 -50 0 50 100 ambient temperature : ta[ ] on resistance : r on [m] v in =5.0v ambient temperature : ta[ c] on -resistance : r on [m ] downloaded from: http:///
bd2246g bd2247g 8/ 23 tsz02201-0e3e0h300310-1-2 ? 2013 rohm co., ltd. all rights reserved. 21.aug.2014 rev.002 www.rohm.com tsz22111 ? 15 ? 001 typical performance curve s - continued figure 13. over-current threshold vs ambient temperature figure 12. over-current threshold vs supply voltage 0.4 0.5 0.6 0.7 0.8 0.9 1.0 2 3 4 5 6 supply voltage : v in [v] o ver current thresho ld:i th [a] ta=25c su pply voltage : v in [v] over-current threshold: i th [a] 0.4 0.5 0.6 0.7 0.8 0.9 1.0 -50 0 50 100 ambient temperature : ta[ ] over current threshold:i th [a] v in =5.0v ambient temperature : ta[ c] over-current threshold: i th [a] figure 14. short circuit output current vs supply voltage figure 15. short circuit output curre nt vs ambient temperature 0.3 0.4 0.5 0.6 0.7 0.8 0.9 2 3 4 5 6 supply voltage : v in [v] short circuit output current: i sc [a] ta=25c 0.3 0.4 0.5 0.6 0.7 0.8 0.9 -50 0 50 100 ambient temperature : ta[ ] short circuit output cuurent: i sc [a] v in =5.0v downloaded from: http:///
bd2246g bd2247g 9/ 23 tsz02201-0e3e0h300310-1-2 ? 2013 rohm co., ltd. all rights reserved. 21.aug.2014 rev.002 www.rohm.com tsz22111 ? 15 ? 001 typical performance curves - continued figure 16. /oc output low voltage vs supply voltage figure 17. /oc output low voltage vs ambient temperature 0 20 40 60 80 100 2 3 4 5 6 supply voltage : v in [v] /oc output low voltage:v /oc [mv] ta=25c supply voltage : v in [v] /oc output low voltage: v /oc [m v] 0 20 40 60 80 100 -50 0 50 100 ambient temperature : ta[ ] /oc output low voltage:v /oc [mv] v in =5.0v ambient temperature : ta[ c] /oc output low voltage: v /oc [m v] figure 18. uvlo threshold voltage vs ambient temperature figure 19. uvlo hysteresis voltage vs ambient temperature 2.0 2.1 2.2 2.3 2.4 2.5 -50 0 50 100 ambient temperature : ta[ ] uvlo threshold : v tuvh , v tuvl [v] v tuvh v tuvl ambient temperature: ta [ c] uvlo threshold: v tuvh, v tuvl [v] 0.0 0.2 0.4 0.6 0.8 1.0 -50 0 50 100 ambient temperature : ta[ ] uvlo hysteresis voltage:v hsy [v] ambient temperature: ta [ c] uvlo hysteresis voltage: v h ys [v] downloaded from: http:///
bd2246g bd2247g 10 / 23 tsz02201-0e3e0h300310-1-2 ? 2013 rohm co., ltd. all rights reserved. 21.aug.2014 rev.002 www.rohm.com tsz22111 ? 15 ? 001 typical performance curves - continued figure 20. output rise time vs supply voltage figure 21. output rise time vs ambient temperature 0.0 1.0 2.0 3.0 4.0 5.0 2 3 4 5 6 supply voltage : v in [v] rise time : t on1 [ms] ta=25c output rise time : t on1 [m s] supply voltage: v in [v] 0.0 1.0 2.0 3.0 4.0 5.0 -50 0 50 100 ambient temperature : ta[ ] rise time : t on1 [ms] v in =5.0v output rise time : t o n1 [m s] ambient temperature: ta [ c] figure 22. output turn o n time vs supply voltage figure 23. output turn o n time vs ambient temperature 0.0 1.0 2.0 3.0 4.0 5.0 2 3 4 5 6 supply voltage : v in [v] turn on time : t on2 [ms] ta=25c supply voltage : v in [v] output turn on time : t on2 [m s] 0.0 1.0 2.0 3.0 4.0 5.0 -50 0 50 100 ambient temperature : ta[ ] turn on time : t on2 [ms] v in =5.0v ambient temperature : ta[ c] output turn on time : t on2 [m s] downloaded from: http:///
bd2246g bd2247g 11 / 23 tsz02201-0e3e0h300310-1-2 ? 2013 rohm co., ltd. all rights reserved. 21.aug.2014 rev.002 www.rohm.com tsz22111 ? 15 ? 001 typical performance curves - continued figure 24. output fall time vs supply voltage figure 25. output fall time vs ambient temperature 0.0 1.0 2.0 3.0 4.0 5.0 2 3 4 5 6 supply voltage : v in [v] fall time : t off1 [s] ta=25c supply voltage : v in [ v] output fall time : t off1 [ s ] 0.0 1.0 2.0 3.0 4.0 5.0 -50 0 50 100 ambient temperature : ta[ ] fall time : t off1 [s] v in =5.0v ambient temperature : ta[ c] output fall time : t off1 [ s ] figure 26. output turn o ff time vs supply voltage figure 27. output turn o ff time vs ambient temperature 0.0 1.0 2.0 3.0 4.0 5.0 6.0 2 3 4 5 6 supply voltage : v in [v] turn off time : t off2 [s] ta=25c supply voltage : v in [v] output turn off time : t off2 [ s ] 0.0 1.0 2.0 3.0 4.0 5.0 6.0 -50 0 50 100 ambient temperature : ta[ ] turn off time : t off2 [s] v in =5.0v ambient temperature : ta[ c] output turn off time : t off2 [ s ] downloaded from: http:///
bd2246g bd2247g 12 / 23 tsz02201-0e3e0h300310-1-2 ? 2013 rohm co., ltd. all rights reserved. 21.aug.2014 rev.002 www.rohm.com tsz22111 ? 15 ? 001 typical performance curves - continued figure 28. /oc delay time vs supply voltage figure 29. /oc delay time vs ambient temperature 10 12 14 16 18 20 2 3 4 5 6 supply voltage : v in [v] /oc ddlay time : t /oc [ms] ta=25c /oc delay time : t /oc [ms] /oc delay time: t /oc [m s] supply voltage: v in [v] 10 12 14 16 18 20 -50 0 50 100 ambient temperature : ta[ ] /oc ddlay time : t /oc [ms] v in =5.0v /oc delay time : t /oc [ms] /oc delay time: t /oc [m s] ambient temperature: ta [ c] figure 30. output discharge resistance vs supply voltage figure 31. output discharge resistance vs ambient temperature 0 50 100 150 200 2 3 4 5 6 supply voltage : v in [v] disc on resistance : r disc [ ] ta=25c supply voltage: v in [v] output discharge resistance : r disc [ ] 0 50 100 150 200 -50 0 50 100 ambient temperature : ta[ ] disc on resistance : r disc [] v in =5.0v ambient temperature: ta [ c] output discharge resistance : r disc [ ] downloaded from: http:///
bd2246g bd2247g 13 / 23 tsz02201-0e3e0h300310-1-2 ? 2013 rohm co., ltd. all rights reserved. 21.aug.2014 rev.002 www.rohm.com tsz22111 ? 15 ? 001 typical wave forms (bd2246g) time(1ms/div.) figure 32. output rise characteristic time(1 s/div.) figure 33. output fall characteristic time ( 1m s/div.) figure 34. inrush current response time (5ms/div.) figure 35. over-current response ramp ed load v en (5v/div.) v in =5v r l =20 v /oc (5v/div.) v out (5v/div.) i out (0.5a/div.) v en (5v/div.) v /oc (5v/div.) v out (5v/div.) i o ut (0.5a/div.) v in =5v r l =20 (5v/div.) v en i out (0.2a/div.) v /oc (5v/div.) cl=100 f cl=220 f v in =5v r l =20 v /oc (5v/div.) v out (5v/div.) i out (0.5a/div.) v in =5v downloaded from: http:///
bd2246g bd2247g 14 / 23 tsz02201-0e3e0h300310-1-2 ? 2013 rohm co., ltd. all rights reserved. 21.aug.2014 rev.002 www.rohm.com tsz22111 ? 15 ? 001 typical wave forms C continued time (5ms/div.) figure 36. over-current response enable to short circuit time (100ms/div.) figure 37. over-current response enable to short circuit time (5ms/div .) figure 38. over-current response 1 load connected at en time (10ms/div.) figure 39. uvlo response when increasing v in v en (5v/div.) v /oc (5v/div.) v out (5v/div.) i out (0.5a/div.) v in =5v v en (5v/div.) v /oc (5v/div.) v out (5v/div.) i out (0.5a/div.) v in =5v v /oc (5v/div.) v ou t (5v/div.) i out (1a/div.) v in =5v v in (5v/div.) v out (5v/div.) i out (0.2a/div.) r l =20 downloaded from: http:///
bd2246g bd2247g 15 / 23 tsz02201-0e3e0h300310-1-2 ? 2013 rohm co., ltd. all rights reserved. 21.aug.2014 rev.002 www.rohm.com tsz22111 ? 15 ? 001 typical wave forms C continued time (10ms/div.) figure 40. uvlo response when decreasing v in v in (5v/div.) v out (5v/div.) i out (0.2a/div.) r l =20 downloaded from: http:///
bd2246g bd2247g 16 / 23 tsz02201-0e3e0h300310-1-2 ? 2013 rohm co., ltd. all rights reserved. 21.aug.2014 rev.002 www.rohm.com tsz22111 ? 15 ? 001 typical application circuit controller 10k to 100k c l c in in gnd en(/en) out /oc 5v (typ) + - application information when excessive current flows due to output short-circuit o r so, ringing occurs by inductance of power source line and ic. this may cause bad effects on ic operations. in order to av oid this case, a bypass capacitor (c in ) should be connected across the in terminal and gnd terminal of ic. a 1f or higher value is recom mended. moreover, in order to decrease voltage fluctuations of power source line and ic, connect a low esr capacitor in parallel with c in. a 10 f to 100 f or higher is effective. pull up /oc output by resistance 10k to 100k. set up values for c l which satisfies the application. this application circuit does not guarantee its operati on . when using the circuit with changes to the external circu it constants, make sure to leave an adequate margin for e xternal components including ac/dc characteristics as well as dispersio n of the ic. functional description 1. switch operation in terminal and out terminal are connected to the drain and the source of switch mosfet respectively. the in terminal is also used as power source input to internal control circuit. when the switch is turned on from en (/en) control input, the in and out terminals are connected by a 110m (typ) switch. in on status, the switch is bidirectional. therefore, when the potential of out terminal is higher than that of in terminal, current flows from out to in terminal. on the other hand, when the switch is turned off, it is pos sible to prevent current from flowing reversely from out to in terminal since a parasitic diode between the drain and the sourc e of switch mosfet is not present. 2. thermal shutdow n circuit (tsd) if over-current would continue, the temperature of the ic would inc rease drastically. if the junction temperature goes beyond 135c (typ) in the condition of over-current detectio n, thermal shutdown circuit operates and turns power switch o ff , causing the ic to output a fault flag (/oc). then, when the ju nction temperature decreases lower than 115c (typ), the power switch is turned on and fault flag (/oc) is cancelle d. this operation repeats, unless the increase of chips temperature is removed or the output of power switch is turned off. the thermal shutdown circuit operates when the switch is on (en(/en) signal is active). 3. over-current detection (ocd) the over-current detection circuit limits current (i sc ) and outputs fault flag (/oc) when current flowing in each swi tch mosfet exceeds a specified value. the over-current detection circuit works when the switch is on ( en (/en) signal is active). there are three types of response against over-current : (1) when the switch is turned on while the output is in shortcirc uit status when the switch is turned on while the output is in short circuit status or so, the switch gets in current limit statu s immediately. (2) when the output shortcircuits while the switch is on when the output shortcircuits or high- cu rrent load is connected while the switch is on, very larg e current will flow until the over-current limit circuit reacts. when the current detection and limit circuit works, current limitation is carried out. (3) when the output current increases gradually when the output current increases gradually, current limita tion does not work until the output current exceeds the over-current detection value. when it exceeds the detection val ue, current limitation is carried out. 4. under-voltage lockout (uvlo) uvlo circuit prevents the switch from turning on until the v in exceeds 2.3v(typ). if v in drops below 2.2v(typ) while the switch is still on, then uvlo shuts off the power switch. uvl o has a hysteresis of 100mv(typ). under-voltage lockout circuit operates when the switch is on ( en (/en) signal is active). out downloaded from: http:///
bd2246g bd2247g 17 / 23 tsz02201-0e3e0h300310-1-2 ? 2013 rohm co., ltd. all rights reserved. 21.aug.2014 rev.002 www.rohm.com tsz22111 ? 15 ? 001 5. fault flag (/oc) output fault flag output is n-mos open drain output. during detection o f over-current and/or thermal shutdown, the output level will turn low. over-current detection has delay filter. this delay filter pre vents current detection flags from being sent during instantaneous events such as in rush current at switch on or during hot plug. . if fault flag output is unused, /oc pin should be connected to open or ground line. 6. output discharge function when the switch is turned o ff from disable control input or uvlo function, the 6 0 (typ.) discharge circuit between out and gnd turns on. by turning on this switch, electric charge at capacitive load is discha rged. but when the voltage of in declines extremely, then the out pin becomes hi-z without uvlo function. figure 41. over-current detection v en v out i out v /oc output short circuit thermal shutdown /oc delay time figure 42. over-current detection, thermal shutdown timing (bd2246g) v /en v out i out v /oc output short circuit thermal shutdown /oc delay time figure 43. over-current detection, thermal shutdown timing (bd2247g) v out i out v /oc t /oc over current detection i sc over current load removed i th downloaded from: http:///
bd2246g bd2247g 18 / 23 tsz02201-0e3e0h300310-1-2 ? 2013 rohm co., ltd. all rights reserved. 21.aug.2014 rev.002 www.rohm.com tsz22111 ? 15 ? 001 power dissipation (ssop5 package) figure 44. power dissipation curve (pd -ta curve) i/o equivalence circuit symbol pin no. equivalen ce circuit en (/en) 3 en (/en) out 5 out /oc 4 /oc 70mm x 70mm x 1.6mm glass epoxy board 85 0 100 200 300 400 500 600 700 0 25 50 75 100 125 150 ambient temperature : ta [ ] power dissipation : pd [mw] power dissipation : p d [ mw ] ambient temperature : ta[c] downloaded from: http:///
bd2246g bd2247g 19 / 23 tsz02201-0e3e0h300310-1-2 ? 2013 rohm co., ltd. all rights reserved. 21.aug.2014 rev.002 www.rohm.com tsz22111 ? 15 ? 001 operational notes 1. reverse connection of power supply connecting the power supply in reverse polarity can damage the ic. take precautions against reverse polarity when connecting the power supply, such as mounting an extern al diode between the power supply and the ic s power supply pins. 2. power supply lines design the pcb layout pattern to provide low impedance sup ply lines. separate the ground and supply lines of the digital and analog blocks to prevent noise in the grou nd and supply lines of the digital block from affecting the analog block. furthermore, connect a capacitor to ground at all pow er supply pins . consider the effect of temperature and aging on the capacitance value when using electrolytic capa citors. 3. ground voltage ensure that no pins are at a voltage below that of the ground pi n at any time, even during transient condition. 4. ground wiring pattern when using both small-signal and large-current ground traces, th e two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small-s ignal ground caused by large currents. also ensure that the ground traces of external components do not cause variations on the ground voltage. the ground lines must be as short an d thick as possible to reduce line impedance. 5. thermal consideration should by any chance the power dissipation rating be exc eeded the rise in temperature of the chip may result in deterioration of the properties of the chip. the absolute ma ximum rating of the pd stated in this specification is whe n the ic is mounted on a 70mm x 70mm x 1.6mm glass epoxy b oard. in case of exceeding this absolute maximum rating, increase the board size and copper area to prevent excee ding the pd rating. 6. recommended operating conditions these conditions represent a range within which the expe cted characteristics of the ic can be approximately obtained . the electrical characteristics are guaranteed under the condi tions of each parameter. 7. in r ush current when power is first supplied to the ic, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and del ays, especially if the ic has more than one power supply. therefore, give special consideration to power c oupling capacitance, power wiring, width of ground wiring, and routing of connections. 8. operation under strong electromagnetic field operating the ic in the presence of a strong electromagnetic field ma y cause the ic to malfunction. 9. testing on application boards when testing the ic on an application board, connecting a capacitor directly to a low-impedance output pin may subject the ic to stress. always discharge capacitors comple tely after each process or step. the ics power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. to prevent damage from static discharge, ground the ic during assembly and use similar precautions during transport and stora ge. 10. inter-pin short and mounting errors ensure that the direction and position are correct when mountin g the ic on the pcb. incorrect mounting may result in damaging the ic. avoid nearby pins being shorted to each other especially to ground, power supply and output pin . inter-pin shorts could be due to many reasons such as met al particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins du ring assembly to name a few. downloaded from: http:///
bd2246g bd2247g 20 / 23 tsz02201-0e3e0h300310-1-2 ? 2013 rohm co., ltd. all rights reserved. 21.aug.2014 rev.002 www.rohm.com tsz22111 ? 15 ? 001 operational notes - continued 11. unused input pins input pins of an ic are often connected to the gate of a mos tran sistor. the gate has extremely high impedance and extremely low capacitance. if left unconnected, the elec tric field from the outside can easily charge it. the smal l charge acquired in this way is enough to produce a signi ficant effect on the conduction through the transistor and cause unexpected operation of the ic. so unless otherwise spec ified, unused input pins should be connected to the power supply or ground line. 12. regarding the input pin of the ic this monolithic ic contains p+ isolation and p substrate la yers between adjacent elements in order to keep them isolated. p-n junctions are formed at the intersection of th e p layers with the n layers of other elements, creating a parasitic diode or transistor. for example (refer to figure below): when gnd > pin a and gnd > pin b, the p-n junction operates as a parasi tic diode. when gnd > pin b, the p-n junction operates as a parasitic transistor. parasitic diodes inevitably occ ur in the structure of the ic. the operation of parasitic diode s can result in mutual interference among circuits, operational faults, or physic al damage. therefore, conditions that cause these diodes to operate, such as applying a voltage lower than the gnd vo ltage to an input pin (and thus to the p substrate) should be avoided. figure 45. example of monolithic ic structure 13. ceramic capacitor when using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with temperature and the decrease in nominal capacitance due to dc bias a nd others. 14. thermal shutdown circuit(tsd) this ic has a built-in thermal shutdown circuit that prevent s heat damage to the ic. normal operation should always be within the ics power dissipat ion rating. if however the rating is exceeded for a continue d period, the junction temperature (tj) will rise which will activate the tsd circuit t hat will turn off all output pins. when the tj falls below the tsd threshold, the circuits are automatically restored to normal operation. note that the tsd circuit operates in a situation that exceeds th e absolute maximum ratings and therefore, under no circumstances, should the tsd circuit be used in a set des ign or for any purpose other than protecting the ic from heat damage. 15. thermal design perform thermal design in which there are adequate margins by taking into account the power dissipation (pd) in actual states of use. n n p + p n n p + p substrate gnd n p + n n p + n p p substrate gnd gnd parasitic elements pin a pin a pin b pin b b c e parasitic elements gnd parasitic elements c be transistor (npn) resistor n region close-by parasitic elements downloaded from: http:///
bd2246g bd2247g 21 / 23 tsz02201-0e3e0h300310-1-2 ? 2013 rohm co., ltd. all rights reserved. 21.aug.2014 rev.002 www.rohm.com tsz22111 ? 15 ? 001 ordering information b d 2 2 4 6 g - g t r part number package g: ssop5 packaging and forming specification g: halogen free tr: embossed tape and reel b d 2 2 4 7 g - g t r part number package g: ssop5 packaging and forming specification g: halogen free tr: embossed tape and reel marking diagram part number part number marking bd 2246g j5 bd 2247g j6 part number marking ssop5 (top view) lot number downloaded from: http:///
bd2246g bd2247g 22 / 23 tsz02201-0e3e0h300310-1-2 ? 2013 rohm co., ltd. all rights reserved. 21.aug.2014 rev.002 www.rohm.com tsz22111 ? 15 ? 001 physical dimension, tape and reel information package name ssop5 downloaded from: http:///
bd2246g bd2247g 23 / 23 tsz02201-0e3e0h300310-1-2 ? 2013 rohm co., ltd. all rights reserved. 21.aug.2014 rev.002 www.rohm.com tsz22111 ? 15 ? 001 revision history date revision changes 11.mar.2013 001 new release 21 . au g.2014 00 2 applied the rohm standard style and improved understandabili ty. improved symbol name. the title of figure 36 changed. improved regarding input pins of the ic in operational notes. add figure 14 and 15. add output discharge function explanation at page17. ordering information is revised. downloaded from: http:///
datasheet datasheet notice C ge rev.002 ? 2013 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. our products are designed and manufac tured for application in ordinary elec tronic equipments (such as av equipment, oa equipment, telecommunication equipment, home electroni c appliances, amusement equipment, etc.). if you intend to use our products in devices requiring ex tremely high reliability (such as medical equipment (note 1) , transport equipment, traffic equipment, aircraft/spacecra ft, nuclear power controllers, fuel c ontrollers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (specific applications), please consult with the rohm sale s representative in advance. unless otherwise agreed in writing by rohm in advance, rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ro hms products for specific applications. (note1) medical equipment classification of the specific applications japan usa eu china class class class b class class | class 2. rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe desi gn against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditio ns, as exemplified below. accordin gly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of an y rohms products under any special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, incl uding water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products ar e exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing components, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (ev en if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subjec t to radiation-proof design. 5. please verify and confirm characteristics of the final or mounted products in using the products. 6. in particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse. is applied, confirmation of performance characteristics after on-boar d mounting is strongly recomm ended. avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading c ondition may negatively affect product performance and reliability. 7. de-rate power dissipation (pd) depending on ambient temper ature (ta). when used in seal ed area, confirm the actual ambient temperature. 8. confirm that operation temperat ure is within the specified range described in the product specification. 9. rohm shall not be in any way responsible or liable for fa ilure induced under deviant condi tion from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlori ne, bromine, etc.) flux is used, the resi due of flux may negatively affect product performance and reliability. 2. in principle, the reflow soldering method must be used; if flow soldering met hod is preferred, please consult with the rohm representative in advance. for details, please refer to rohm mounting specification downloaded from: http:///
datasheet datasheet notice C ge rev.002 ? 2013 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, pl ease allow a sufficient margin considering variations of the characteristics of the products and external components, including transient characteri stics, as well as static characteristics. 2. you agree that application notes, re ference designs, and associated data and in formation contained in this document are presented only as guidance for products use. theref ore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take proper caution in your manufacturing process and storage so that voltage exceeding t he products maximum rating will not be applied to products. please take special care under dry condit ion (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, se tting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriora te if the products are stor ed in the places where: [a] the products are exposed to sea winds or corros ive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to di rect sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage c ondition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm sol derability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the co rrect direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. use products within the specified time after opening a humidity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage time period. precaution for product label qr code printed on rohm products label is for rohms internal use only. precaution for disposition when disposing products please dispose them proper ly using an authorized industry waste company. precaution for foreign exchange and foreign trade act since our products might fall under cont rolled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with rohm representative in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to application example contained in this document is for reference only. rohm does not warrant that foregoi ng information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. rohm shall not be in any way responsible or liable for infringement of any intellectual property rights or ot her damages arising from use of such information or data.: 2. no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the information contained in this document. other precaution 1. this document may not be reprinted or reproduced, in whol e or in part, without prior written consent of rohm. 2. the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. in no event shall you use in any wa y whatsoever the products and the related technical information contained in the products or this document for any military purposes, incl uding but not limited to, the development of mass-destruction weapons. 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties. downloaded from: http:///
datasheet datasheet notice C we rev.001 ? 2014 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. downloaded from: http:///

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