advanced power n-channel enhancement mode electronics corp. power mosfet low gate charge bv dss 60v simple drive requirement r ds(on) 12m surface mount package i d 68a rohs compliant & halogen-free description absolute maximum ratings symbol units v ds v v gs v i d @t c =25 a i d @t c =100 a i dm a p d @t c =25 w t stg t j symbol value units rthj-c maixmum thermal resistance, junction-case 1.2 /w rthj-a 62.5 /w data and specifications subject to change without notice halogen-free product 1 ap9974agh-hf 201310074 parameter rating drain-source voltage 60 gate-source voltage + 20 continuous drain current, v gs @ 10v 68 continuous drain current, v gs @ 10v 43 pulsed drain current 1 272 operating junction temperature range -55 to 150 storage temperature range total power dissipation 104 -55 to 150 thermal data parameter maximum thermal resistance, junction-ambient (pcb mount) 3 advanced power mosfets from apec provide the designe r with the best combination of fast switching, ruggedized device design, low on-resistance and cost-effectiveness. the to-252 package is widely preferred for commercial- industrial surface mount applications and suited for low voltage applications such as dc/dc converters. g d s g d s to-252(h)
electrical characteristics@t j =25 o c(unless otherwise specified) symbol parameter test conditions min. typ. max. units bv dss drain-source breakdown voltage v gs =0v, i d =250ua 60 - - v r ds(on) static drain-source on-resistance 2 v gs =10v, i d =45a - - 12 m v gs =4.5v, i d =30a - - 15 m v gs(th) gate threshold voltage v ds =v gs , i d =250ua 1 - 3 v g fs forward transconductance v ds =10v, i d =30a - 71 - s i dss drain-source leakage current v ds =60v, v gs =0v - - 10 ua drain-source leakage current (t j =125 o c) v ds =48v ,v gs =0v - - 250 ua i gss gate-source leakage v gs =+ 20v, v ds =0v - - + 100 na q g total gate charge 2 i d =30a - 33 45 nc q gs gate-source charge v ds =48v - 5 - nc q gd gate-drain ("miller") charge v gs =4.5v - 21 - nc t d(on) turn-on delay time 2 v ds =30v - 10 - ns t r rise time i d =30a - 43 - ns t d(off) turn-off delay time r g =3.3 -47- ns t f fall time v gs =10v - 80 - ns c iss input capacitance v gs =0v - 2680 3300 pf c oss output capacitance v ds =25v - 260 - pf c rss reverse transfer capacitance f=1.0mhz - 180 - pf source-drain diode symbol parameter test conditions min. typ. max. units v sd forward on voltage 2 i s =45a, v gs =0v - - 1.3 v t rr reverse recovery time 2 i s =10a, v gs =0 v , - 30 - ns q rr reverse recovery charge di/dt=100a/s - 18 - nc notes: 1.pulse width limited by max. junction temperature. 2.pulse test 3.surface mounted on 1 in 2 copper pad of fr4 board this product is sensitive to electrostatic discharge, please handle with caution. use of this product as a critical component in life support or other similar systems is not authorized. apec does not assume any liability arising out of the application or use of any product or circuit described herein; neither does it convey any license under its patent rights, nor the rights of others. apec reserves the right to make changes without further notice to any products herein to improve reliability, function or design. 2 ap9974agh-hf
a p9974agh-h f fig 1. typical output characteristics fig 2. typical output characteristics fig 3. on-resistance v.s. gate voltage fig 4. normalized on-resistance v.s. junction temperature fi g 5. forward characteristic o f fig 6. gate threshold voltage v.s. reverse diode junction temperature 3 0 40 80 120 160 200 024681012 v ds , drain-to-source voltage (v) i d , drain current (a) t c =25 o c 10v 7.0v 5.0v 4.5v v g =3.0v 0 20 40 60 80 100 0123456 v ds , drain-to-source voltage (v) i d , drain current (a) t c = 150 o c 10v 7.0v 5.0v 4.5v v g =3.0v 8 10 12 14 16 246810 v gs , gate-to-source voltage (v) r ds(on) (m ) i d =30a t c =25 o c 0.4 0.8 1.2 1.6 2.0 -50 0 50 100 150 t j , junction temperature ( o c) normalized r ds(on) i d =45a v g =10v 0 10 20 30 40 0 0.2 0.4 0.6 0.8 1 1.2 v sd , source-to-drain voltage (v) i s (a) t j =25 o c t j =150 o c 0.3 0.7 1.1 1.5 -50 0 50 100 150 t j , junction temperature ( o c) normalized v gs(th)
ap9974agh-h f fig 7. gate charge characteristics fig 8. typical capacitance characteristics fig 9. maximum safe operating area fig 10. effective transient thermal impedance fig 11. transfer characteristics fig 12. gate charge waveform 4 q v g 4.5v q gs q gd q g charge 0 1000 2000 3000 4000 1 21416181 v ds , drain-to-source voltage (v) c (pf) f =1.0mh z c iss c oss c rss 0 1 2 3 4 5 6 0 102030405060 q g , total gate charge (nc) v gs , gate to source voltage (v) i d =30a v ds =48v 0.01 0.1 1 0.00001 0.0001 0.001 0.01 0.1 1 t , pulse width (s) normalized thermal response (r thjc ) p dm duty factor = t/t peak t j = p dm x r thjc + t c t t 0.02 0.01 0.05 0.1 0.2 duty factor=0.5 single pulse 0.1 1 10 100 1000 0.1 1 10 100 1000 v ds , drain-to-source voltage (v) i d (a) t c =25 o c single pulse 100us 1ms 10ms 100ms dc 0 20 40 60 80 100 02468 v gs , gate-to-source voltage (v) i d , drain current (a) t j =150 o c t j =25 o c v ds =5v operation in this area limited by r ds(on)
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