i n t e r n a l this is information on a product in full production. may 2012 doc id 023119 rev 1 1/10 10 internal internal ESDAVLC6-1BF4 single-line low capacitance transil?, transient surge voltage suppressor (tvs) datasheet ? production data features bidirectional device multiple esd strike sustainability very low capacitance: 7 pf max at 0 v low leakage current ultra small pcb area rohs compliant complies with the following standards iec 61000-4-2: ? 15 kv (air discharge) ? 8 kv (contact discharge) applications where transient over voltage protection in esd sensitive equipment is required, such as: portable multiplaye rs and accessories notebooks digital camera and camcorders communication systems cellular phone handsets and accessories description the ESDAVLC6-1BF4 is a bidirectional single line tvs diode designed to protect the data lines or other i/o ports against esd transients. the device is ideal for applications where both reduced line capacitance and board space saving are required. tm: transil is a trademar k of stmicroelectronics figure 1. functional diagram 0201 flip chip www.st.com
i n t e r n a l characteristics ESDAVLC6-1BF4 2/10 doc id 023119 rev 1 internal internal 1 characteristics figure 2. electrical characteristics (definitions) table 1. absolute maximum ratings (t amb = 25 c) symbol parameter value unit v pp (1) peak pulse voltage iec 61000-4-2 contact discharge iec 61000-4-2 air discharge 15 kv t op operating temperature range -30 to +85 c t stg storage temperature range - 55 to +150 c 1. for a surge greater than the maximum val ues, the diode will fail in short-circuit. v i v cl v cl v br v br v rm v rm i rm i pp slope: 1/r d symbol parameter v = breakdown voltage v = stand-off voltage v = clamping voltage i = peak pulse current br rm cl pp i = leakage current @ v rm rm = line capacitance c line table 2. electrical characteristics (values, t amb = 25 c) symbol parameter test conditions value unit min. typ. max. v br breakdown voltage i r = 1 ma 6 10 v i rm leakage current v rm = 3 v per line 100 na c line line capacitance v line = 0 v, f = 1 mhz,v ocs 30 mv 4 7 pf
i n t e r n a l ESDAVLC6-1BF4 characteristics internal internal doc id 023119 rev 1 3/10 figure 3. esd response to iec 61000-4-2 (typical values, +8 kv contact discharge) figure 4. esd response to iec 61000-4-2 (typical values, -8 kv contact discharge) 10 v/div 20 ns/div v : esd peak voltage v :clamping voltage @ 30 ns v :clamping voltage @ 60 ns pp cl cl v :clamping voltage @ 100 ns cl 1 2 3 4 71 v 41 v 25 v 20 v 1 2 4 3 10 v/div 20 ns/div -72 v -40 v -24 v -20 v 1 2 4 3 v : esd peak voltage v :clamping voltage @ 30 ns v :clamping voltage @ 60 ns pp cl cl v :clamping voltage @ 100 ns cl 1 2 3 4 figure 5. junction capacitance versus reverse applied voltage (typical values) figure 6. relative variation of peak pulse power versus initial junction temperature figure 7. peak pulse power versus exponential pulse duration figure 8. leakage current versus junction temperature (typical values) c (pf) 0 1 2 3 4 5 6 7 8 9 10 0123456 f=1 mhz v osc =30mv rms t j =25 c direct / reverse v r (v) p pp (w) 0.0 20.0 40.0 60.0 80.0 100.0 25 35 45 55 65 75 85 95 8/20s direct/reverse t j (c) p pp (w) 1.0 10.0 100.0 1000.0 10 100 1000 t p (s) t = 25 c j direct/reverse 0.01 0.10 1.00 10.00 100.00 25 35 45 55 65 75 85 t j (c) v=v = 3v direct/reverse rrm i r (na)
i n t e r n a l ordering information scheme ESDAVLC6-1BF4 4/10 doc id 023119 rev 1 internal internal 2 ordering information scheme figure 9. ordering information scheme esda vlc 6 - 1 b f4 esda protection device very low capactitance package f4 = 0201 flip chip 6 = 6 v b = b directional breakdown voltage number of lines directional i
i n t e r n a l ESDAVLC6-1BF4 package information internal internal doc id 023119 rev 1 5/10 3 package information in order to meet environmental requirements, st offers these devices in different grades of ecopack ? packages, depending on their level of environmental compliance. ecopack ? specifications, grade definitions and product status are available at: www.st.com . ecopack ? is an st trademark. figure 10. 0201 flip chip dimension definitions table 3. 0201 flip chip dimension values ref. dimensions millimeters inches min. typ. max. min. typ. max. a 0.28 0.30 0.32 0.0110 0.0118 0.0126 b 0.19 0.21 0.23 0.0075 0.0082 0.0091 b1 0.125 0.14 0.155 0.0049 0.0055 0.0061 b2 0.125 0.14 0.155 0.0049 0.0055 0.0061 d 0.57 0.60 0.63 0.0224 0.0236 0.0257 e 0.33 0.35 0.37 0.0130 0.0138 0.0146 e 0.27 0.30 0.33 0.0106 0.0118 0.0130 l1 0.175 0.19 0.205 0.0069 0.0075 0.0081 l2 0.175 0.19 0.205 0.0069 0.0075 0.0081 top view bottom view side view d e a l2 l1 b1 b b2 e
i n t e r n a l package information ESDAVLC6-1BF4 6/10 doc id 023119 rev 1 internal internal figure 11. tape and reel specification user direction of unreeling all dimensions in mm 4.0 0.1 2.0 0.05 8.0 +0.3 -0.01 2.0 0.05 1.75 0.1 3.5 - 0.05 ? 1.5 0.1 0.36 0.03 0.38 0.03 0.68 0.03
i n t e r n a l ESDAVLC6-1BF4 recommendation on pcb assembly internal internal doc id 023119 rev 1 7/10 4 recommendation on pcb assembly 4.1 stencil opening design 1. general recommendation on stencil opening design a) stencil opening dimensions: l (length), w (width), t (thickness). b) general design rule stencil thickness (t) = 75 ~ 125 m 2. reference design a) stencil opening thickness: 100 m b) stencil opening for leads: opening to footprint ratio is 60% to 75%. 4.2 solder paste 1. halide-free flux qualification rol0 according to ansi/j-std-004. 2. ?no clean? solder paste is recommended. 3. offers a high tack force to resist component movement during high speed 4. solder paste with fine particles: powder particle size is 20-45 m. l t w aspect ratio w t ----- 1.5 = aspect area lw 2t l w + () --------------------------- - 0.66 =
i n t e r n a l recommendation on pcb assembly ESDAVLC6-1BF4 8/10 doc id 023119 rev 1 internal internal 4.3 placement 1. manual positioning is not recommended. 2. it is recommended to use the lead recognition capabilities of the placemen t system, not the outline centering 3. standard tolerance of 0.05 mm is recommended. 4. 3.5 n placement force is recommended. too much placement force can lead to squeezed out solder paste and cause solder joints to short. too low placement force can lead to insufficient contact between package and solder paste that could cause open solder joints or badly centered packages. 5. to improve the package placement accuracy, a bottom side optical control should be performed with a high resolution tool. 6. for assembly, a perfect supporting of the pcb (all the more on flexible pcb) is recommended during solder paste printing, pick and place and reflow soldering by using optimized tools. 4.4 pcb design preference 1. to control the solder paste amount, the closed via is recommended instead of open vias. 2. the position of tracks and open vias in the solder area should be well balanced. the symmetrical layout is recommended, in case any tilt phenomena caused by asymmetrical solder paste amount due to the solder flow away. 4.5 reflow profile figure 12. st ecopack ? recommended soldering reflow profile for pcb mounting note: minimize air convection currents in the reflow oven to avoid component movement. 60 sec (90 max) 250 0 50 100 150 200 240 210 180 150 120 90 60 30 300 270 -2 c/s to -3 c/s -6 c/s max 240-245 c 2 - 3 c/s 0.9 c/s temperature (c) time (s)
i n t e r n a l ESDAVLC6-1BF4 ordering information internal internal doc id 023119 rev 1 9/10 5 ordering information 6 revision history table 4. ordering information order code marking package weight base qty delivery mode ESDAVLC6-1BF4 none 0201 flip chip 0.116 mg 15 000 tape and reel table 5. document revision history date revision changes 02-may-2012 1 first issue
i n t e r n a l ESDAVLC6-1BF4 10/10 doc id 023119 rev 1 internal internal please read carefully: information in this document is provided solely in connection with st products. stmicroelectronics nv and its subsidiaries (?st ?) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described he rein at any time, without notice. all st products are sold pursuant to st?s terms and conditions of sale. purchasers are solely responsible for the choice, selection and use of the st products and services described herein, and st as sumes no liability whatsoever relating to the choice, selection or use of the st products and services described herein. no license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. i f any part of this document refers to any third party products or services it shall not be deemed a license grant by st for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoev er of such third party products or services or any intellectual property contained therein. unless otherwise set forth in st?s terms and conditions of sale st disclaims any express or implied warranty with respect to the use and/or sale of st products including without limitation implied warranties of merchantability, fitness for a parti cular purpose (and their equivalents under the laws of any jurisdiction), or infringement of any patent, copyright or other intellectual property right. unless expressly approved in writing by two authorized st representatives, st products are not recommended, authorized or warranted for use in milita ry, air craft, space, life saving, or life sustaining applications, nor in products or systems where failure or malfunction may result in personal injury, death, or severe property or environmental damage. st products which are not specified as "automotive grade" may only be used in automotive applications at user?s own risk. resale of st products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by st for the st product or service described herein and shall not create or extend in any manner whatsoev er, any liability of st. st and the st logo are trademarks or registered trademarks of st in various countries. information in this document supersedes and replaces all information previously supplied. the st logo is a registered trademark of stmicroelectronics. all other names are the property of their respective owners. ? 2012 stmicroelectronics - all rights reserved stmicroelectronics group of companies australia - belgium - brazil - canada - china - czech republic - finland - france - germany - hong kong - india - israel - ital y - japan - malaysia - malta - morocco - philippines - singapore - spain - sweden - switzerland - united kingdom - united states of america www.st.com
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