1. 2. 3. material content data sheet sales product name ipb010n06n issued 29. august 2013 ma# MA000965712 package pg-to263-7-3 weight* 1568.02 mg construction element material group substances cas# if applicable weight [mg] average mass [%] sum [%] average mass [ppm] sum [ppm] chip inorganic material silicon 7440-21-3 51.083 3.26 3.26 32578 32578 leadframe non noble metal iron 7439-89-6 0.803 0.05 512 inorganic material phosphorus 7723-14-0 0.241 0.02 154 non noble metal copper 7440-50-8 801.714 51.13 51.20 511292 511958 wire non noble metal aluminium 7429-90-5 14.459 0.92 0.92 9221 9221 encapsulation organic material carbon black 1333-86-4 8.009 0.51 5107 plastics epoxy resin - 88.095 5.62 56182 inorganic material silicondioxide 60676-86-0 437.804 27.92 34.05 279210 340499 leadfinish non noble metal tin 7440-31-5 12.317 0.79 0.79 7855 7855 plating non noble metal nickel 7440-02-0 0.269 0.02 172 inorganic material phosphorus 7723-14-0 0.001 0.00 0.02 0 172 solder noble metal silver 7440-22-4 1.172 0.07 747 non noble metal tin 7440-31-5 0.937 0.06 598 non noble metal lead 7439-92-1 44.764 2.85 2.98 28549 29894 heatspreader inorganic material phosphorus 7723-14-0 0.032 0.00 20 non noble metal iron 7439-89-6 0.106 0.01 68 non noble metal copper 7440-50-8 106.210 6.77 6.78 67735 67823 *deviation < 10% sum in total: 100,00 1000000 important remarks: infineon technologies ag provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. infineon technologies ag and infineon technologies ag suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. all statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. company infineon technologies ag address 81726 mnchen internet www.infineon.com
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