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electronic components group x ',, / /d / $5 sharp corporation 777 . i specification opto-electronic devices division .wrza* f device specification for emitting diode model no. GL5ZS44 1. these specification sheets include materials protected under the copyright of sharp corporation (?sharp?). please do not reproduce or cause anyone to reproduce them without sharp?s consent. 2. when using this product, please observe the absolute maximum ratings and the instructions for use outlined in these specification sheets, as well as the precautions mentioned below. sharp assumes no responsibility for any damage resulting from use of the product which does not comply with the absolute maximum ratings and the instructions included in these specification sheets, and the precautions mentioned below. (precautions) (1) this products is designed for use in the following application areas: l * oa equipment * audio visual equipment * home appliance * telecommunication equipment (?terminal) * measuring equipment * tooling machines * computers i if the use of the product in the above application areas is for equipment listed in paragraphs (2) or (3). please be sure to observe the precautions given in those respective paragraphs. (2) appropriate measures, such as fail-safe design and redundant design considering the safety design of the overall system and equipment, should be taken to ensure reliability and safety when this product is used for equipment which demands high reliability and safety in function and precision, such as ; [ * transportation control and safety equipment (aircraft, train, automobile etc.) * traffic signals * gas leakage sensor breakers * rescue and security equipment * other safety equipment i (3) please do not use this product for equipment which require extremely high reliability and safety in function and precision, such as ; c * space equipment * telecommunication equipment (for trunk lines) * nuclear power control equipment * medical equipment (4) piease contact and consult with a sharp sales representative if there are any questions regarding interpretation of the above three paragraphs. 3. please contact and consult with a sharp sales representative for any questions about this product. customer?s approval ?date: by: date: presented by: m.katoh, department general manager of engineering deptjii - opto-electronic devices division electronic components group sharp corporation
dg996041 juni16/9!i model no. page GL5ZS44 l/10 GL5ZS44 snecification 1. application this specification applies to the light emitting diode device model no. GL5ZS44. [algainp (dicing or m-ii/brake type) sunset-orange led device] 2. outline dimensions and pin comedons . . . . . . . . . . . . . . . . . . . . . . . . . . . . refer to the attached sheet page 2. 3. ratings and characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . refer to the attached sheet page 3-4. 3- 1. absolute maximum ratings 3-2. electra-optical characteristics 3-3. derating curve 3-4. characteristics diagram 4. reliability . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . refer to the attached sheet page 5. 4- 1. test items and test conditions 4-2. measurement items and failure judgement criteria 5. incoming inspection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . refer to the attached sheet page 6. 5- 1. applied standard 5-2. sampling method and level 5-3. test items, judgement criteria and classifrca of defect 5-4. test items the surface is be applied for flat type, judgement criteria and clakfica of defect 6. supplement . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . refer to the attached sheet page 7-8. 6-l. packing 6-2. luminous intensity rank 6-3. dominant wavelength rank 6-4. environment 7. precautions for use . . . . . . . ..*..................................... refer to the attached sheet page g-10. 7-l. lead forming method 7-2. notice of installation 7-3. soldering conditions ,7-k for cleaning
dg996041 jun/16/99 model no. page GL5ZS44 2ilo colotless ttrnsp8reney ?i vote) unspecified tol. to be co.2mm k vote) coldxolled steel leads are plated with but the tie-bar cut portions ha\, no plating do not sol&r this part of the product unit mm material lead : (fe) cold rolled steel package : epoxy resin finish lead : so plated or wave soldering drawing no. 51106022
dg99604 i jun116/99 model no. page i GL5ZS44 3. ratings and characteristics (note 1) duty ratio=l/lo,pulse width=o. lms (note 2) at the position of 1.6mm from the bottom resin package i 3110 3-2. electra-optical characteristics (ta=25?c) i parameter forward voltage r luminous intensity (note 3) peak emission wavelength symbol vf conditions iv j.p if=2oma min. typ. h&4x. unit - 2.1 2.6 v - mcd run dominant wavelength ! 1.d 1 spectrum radiation bandwidth a ;1 reverse current ir terminal capacitance ct viewing angle 281/2 vr4v v=ov,f=lmhz rf=2oma (note 3) refer to the suplement item 6. regarding the standard of rank classification. 3-3. derating curve peak forward current derating curve forward current derating curve 120 a 9 e 100 s 80 z 2 60 7 g 40 2 : 20 2 a 0 -25 0 25 50 75 a51oo 125 60 50 40 30 20 10 0 -25 0 25 50 7585100 125 ambient temperature ta("c) ambient temperature ta("c)
dc5996041 model no. GL5ZS44 junl16/!w page 4110 peak forward current vs. duty ratio (ta=2573 1000 f 2 10 l/100 l/10 1 10 duty raito dr 3-4. characteristics diagram&p) (note 1) forward current vs.forward voltage relative luminous intensity vs. ambient temperature (ta=25"c) ( i f=2oma) ii ii ii (i! i,, i iai , , , i i i i i i i 1 1.21.41.61.8 2 2.22.42.6 forward voltage vf(v) relative luminour intensity vs. frorard voltage (takz@c) 1000 5. y z 100 2 10 2 ea .- v 5 1 -i : .- 0. 1 : 2 0. 01 2 100 oh .r e 3 ii? i i//i? -j--ji i 1 ! i ! ! ?-60 -40 -20 0 20 40 60 80 100 120 ambient temprature tarc) 0. 1 1 10 100 forward current ifha) (note 1) above characteristic data are typical data and not a smttced data.
4. reliability the reliability of products shall be satisfied with items listed below. 4-l. test items and test conditions confidence level: 909 test items test conditions samples (n) ltpd defective (c) (%i solderability 23025c. 5s prior disposition : dip in rosin flux n=l l? c=o 20 soldering 20 temperature 26025c. 5s n=ll. c=o mechanical shock 15 ooom/s2, 0.5ms. 3times / kx,*y,kz direction n=ll, c=o 20 variable frequency 2oom/s2, 100 to 2 ooo to loohz/sweep for 4mi.n. vibration ,4times/fx,lty,fz direction n=ll, c=o 20 terminal strength (tension) weight:lon, s/each terminal n=ll, c=o 20 terminal strength weight:sn, 0? : 90? + 0% -90? -0? (bending) /each terminal n=ll, c=o 20 temperature cycling -4o?c(3omin)~+loo?c(3omirt).3o cycles n=22. c=o 10 high temp. and high humidity storage ta=+6o?c, 9o%rh. t=loooh n=22, c=o 10 high temperature storage ta=loo?c, t=loooh n=22. c=o 10 low temperature storage ta=-qo?c , t=loooh n=22, c=o 10 operation life ta=25?c, irmax, t=loooh *3 n=22, c=o 10 4-2. measurement items and failure judgement criteria * 1 measurement symbol failure judgement criteria *2 forward voltage vf vf > u.sl. x 1.2 reverse current ir ir > u.s.l. x 2.0 luminous intensity iv iv > the first stage value x 2.0 or the first stage value x 0.5 > iv % solderability : solder shall be adhere at the area of 95% or more of dipped portion. % terminal strength : package is not destroyed, and terminal is not slack. *l: measuring condition is in accordance with specification. *2: u.s .l. is shown by upper specification limit. *3: if w.is shown by forward current of absolute maxirnum ratings. dg99604 1 jud16/99 model no. page GL5ZS44 5110
5. incoming inspection 5-1. applied standard : is0 2859-l 5-2. sampling method and level : a single sampling plan,normal inspection level ii : aql major defect : 0.065% minor defect : 0.4% 5-3. test items, judgement criteria and classifica of defect no. test items i judgement criteria 1 disconnection not emit light 2 position of cutting off rim different from dimension 3 reverse terminal different from dimension 4 outline dimensions not satisfy outline specification 5 characteristics over the limit value of specification at vr. ir, and iv 6 cut off the rim exceed -0.2rnm .white point : exceed q 0.3mm (on top view) 7 foreign substance black point : exceed 4 0.3rnm (on top view) shim form : exceed 3.omm (on too view) 8 scratch exceed $i 0.3mm or o.lmm x l.omm (on top view) 9 void exceed @ 0.3mm (on top view) 10 uneven density of material for scattering extremely uneven density 11 unbalanced center exceed m.25nun from package center 12 burr exceed +0.2mm againstprovided dimension i i 13 insertion position of .--:--l i insertion position of terminal :lassifica of defec major defect minor defect 5-4. test items the surface is be applied for flat type, judgement criteria and classifica of defect no. test items judgement criteria classifica of defec 14 chapped the surface the surface chapped is striking for see the lamp top minor defect 15 hollow the surface the surface hollow is striking for see the lamp top
dg996041 model no. junh6/99 page GL5ZS44 1 7110 6. supplement 6-1. packing 6-l-l. inner package put 25opcs the same luminous intensity rank products into pack and put following label by pack. product weight : 0.28g (one product,typ.) (indication label sample) shipment table part no. glszs44 - model numher quantity 250 - quantity of products *cl cl 00000 - --- lot no. ka99b19 + lot number * 0? 0 qoq @-cl t- luminous intensity rank sharp? dominant wavelength rank made in japan + production country 0 production plant code(to he indicated alphabetically) @ support code @ year of production(the last two figures of the year) @ month of production (to he indicated alphabetically with january corresponding to a) @ date of production(ol-31) 6-l-2. outer package put 8 packs (the same luminous intensity rank) into outer package. (approximately 670g per one outer package) 6- 1-3. outer package out line dimension width: 14omm. depth : 225mm, hight : 9omm 6-2luminous intensity rank (note 1) (ta=25?c ) ci (note 1) tolerance:~ls% in regard to luminous intensity , the following ranking shall be carried out. however the quantity of each rank shall not he pre scribed. in case of the distribution of the luminous intensity shift to high, at that point new upper rank is prescribed and lower rank is delete. 6-3.dominant wavelength rank (note 2) rank dominant wavelength unit 0 598.5 y- 602.0 p 601.0 - 604.5 q 603.5 - 607.0 run r 606.0 - 609.5 s 608.5 - 612.0 (note 2) the condition of measurement : the measurement oft :ta=25?c ) condition if2ctna i slightemission from the front side of lamp. this rank value is the setting value of when that classifies it the rank and be not a guarantee value. also i shall not ask the delivery ratio of each rank.
dg996041 jun/16/!39 model no. page i GL5ZS44 g/10 6-4. environment 6-4-l. ozonosphere destmctive chemicals. (1) the device doesn?t contain following substance. (2) the device doesn?t have a production line whose process requires following substance. restricted part: cfcs,halones,ccl,,,trichloroethane(methychloroform) 642. bromic non-burning mate&s the &vice doesn?t contain bromic non-burning materials(pbbos,pbbs)
ix996041 jun/16/99 model no. page GL5ZS44 9/10 7 - 1. lead forming method avoid forming a lead pin with the lead pin base as a fulcrum:be sure to hold a lead pin firmly when forming. lead pins should be formed before soldering 7 - 2. notice of installation 7-z-l installation on a p wb !jhen mounting an led lamp on a pyb, do not apply physical stress to the lead pins. . the lead pin pitch should match the pwb pin-hole pitch:absolutely avoid widening or narrowing the lead pins. . lhen positioning an led lamp,basically employ an led with tie-bar cut or use a spacer. 7-2-2 when an led 1 is mounted directly on a pwb if the bottom face of an led lamp is mounted directly on single-sided p?r the base of the lead pins may be subjected to physical stress due to pwb warp,cutting or clinching of lead pins.prior to use.be sure to check that no disconnection inside of the resin or damage to resin etc., is found. when an led lamp is mounted on a double-sided pw.the heat during soldering affects the resin;therefore,keep the led lamp more that 1.6mm afloat above the p?jb. 7-2-3 installation using a holder during an led lamp posiiioning,when a holder is used,a holder should be designed not to subject lead pins to any undue stress. (note)pay attention to the thermal expansion coefficient of the material used for the holder.since the holder expands and contracts due to preheat and soldering heat, mechanical stress may be applied to the lead pins, resulting in disconnection. 7-2-4 installation to the case do not fix part c with adhesives when fixed to the case as shown in figure..\ hole of the case should be designed not to subject the inside of resin to any undue stress. good
dg996041 judl6/!39 modelno. page i GL5ZS44 1 lo/lo 7 - 3. s oldering conditions solder the lead pins under the following conditions type of soldering conditions 1. manual soldering 295c +5?c, within 3 seconds 2. wave soldering 260?ct5?c. within 5 seconds 3. auto soldering preheating 70c to 8o?c, within 30 seconds soldering 245?ck5?c, within 5 seconds (note) avoid dipping resin into soldering bath. avoid applying stress to lead pins while they are heated.for example , when the led lamp is moved with the heat applied to the lead pins during manual soldering or solder repair,disconnection may occur. soldering iron 7 - 4. for cleaning (1) solvent cleaning : solvent telsperature 45c or less immersion for 3 min or less ( 2 > ultrasonic cleaning : the effect to device by ultrasonic cleaning differs by cleaning bath size.ultrasonic power output,cleaning time,pyb size or device mounting condition etc. please test it in actual using condition and confirm that doesn?t occur any defect before starting the ultrasonic cleaning ( 3 > applicable solvent : ethyl alcohol, methyl alcohol, isopropyl alcohol in case when the other solvent is us&there are cases that the packaging resin is eroded. please use the other solvent after thorough confirmation is performed in actual using condition.

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