View TPS859_8381149.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

TPS859 2008-05-13 1 toshiba photo ic silicon epitaxial planar TPS859 flat panel displays mobile phones notebook pcs, pdas video cameras, digital still cameras other equipment requiring luminosity adjustment the TPS859 is an ultra-compact surface-mount photo-ic for illuminance sensors which incorporat es a photodiode and current amp circuit in a single chip.the sensit ivity is superior to that of a phototransistor, and exhibits little variation. it has spectral sensitivity closer to luminous efficiency and excellent output linearity. with its ultra-compact surface-mount package, this photo-ic can be used as the power-saving control for domestic appliances or for backlighting for displays in cellula r phones, this device enables low power consumption to be achieved. ? ultra-compact and light surface-mount package : 1.6 mm 1.6 mm 0.55 mm ? excellent output linearity of illuminance ? little fluctuation in light curren t and high level of sensitivity : i l = 230 a (typ.) @e v = 100 lx using fluorescent light : light current variation width: 1.67 ( when light current classification is specified.) : little temperature fluctuation ? built-in luminous-efficiency correction function, reduced sensitivity variations due to various light sources : i l (using incandescent light)/i l (using fluorescent light) = 1.0 (typ.) ? low supply voltage, making device suit able for battery-powered equipment: v cc = 1.8 v to 5.5 v absolute maximum ratings (ta = 25c) characteristics symbol rating unit supply voltage v cc ? 0.5 to 6 v output voltage v out v cc v light current i l 4 ma permissible power dissipation p 30 mw power dissipation derating (ta > 25c) p/c ?0.4 mw/c operating temperature range t opr ? 30 to 85 c storage temperature range t stg ? 40 to 100 c soldering temperature range (note 1) t sol 260 c note: using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operat ing temperature/current/voltage, etc. ) are within the absolute maximum ratings and the operating ranges. please design the appropriate reliability upon reviewing the toshiba semiconductor reliability handbook (?handling precautions?/?derating concept and methods?) and individual reliability data (i.e. reliability test report and estimated failure rate, etc). note 1: the reflow time and the recommended temperatur e profile are shown in t he section entitled handling precautions. toshiba 0-2e1b weight: 0.003 g (typ.)
TPS859 2008-05-13 2 operation ranges characteristics symbol min typ. max unit supply voltage v cc 1.8 ? 5.5 v operating temperature t opr -30 ? 85 c electrical and opti cal characteristics (ta = 25c) characteristics symbol test condition min typ. max unit supply voltage v cc ? 1.8 ? 5.5 v supply current i cc (1) v cc = 3 v, e v = 1000 lx r l = 1 k (note 2) (note 5) ? 2300 ? a light current (1) i l (1) v cc = 3 v, e v = 100 lx (note 2), (note 4) ? 230 ? a light current (2) i l (2) v cc = 3 v, e v = 10 lx (note 3), (note 4) 16 23 32 a ? 160 230 320 light current (3) i l (3) a rank v cc = 3 v, e v = 100 lx (note 3), (note 4) 180 230 300 a light current ratio (3) l i (1) l i ? ? 1.0 ? ? dark current i leak v cc = 3 v, e v = 0 ? ? 0.2 a saturation output voltage v o v cc = 3 v, r l = 75 k , e v = 100 lx (note 3) 2.2 2.35 2.6 v rise time t r ? 150 ? fall time t f ? 300 ? delay time t d ? 180 ? switching time storage time t s v cc = 3 v, r l = 5 k , v out = 1.5 v (note 6) ? 8 ? s note 2: cie standard a light sour ce is used (color temperature = 2856k, approximated incandescence light). note 3: f10 of fluorescence light is us ed as light source. (color temperature = 5000k) however, white led is substituted in a mass-production process. note 4: light current measurement circuit note 5: supply current measurement circuit v cc i l TPS859 light source out a v cc i cc TPS859 light source a r l out e v
TPS859 2008-05-13 3 note 6: switching time measurement method white led pulse drive v cc TPS859 t r t f i f 1.5 v 90% 10% t d t s i f r l v out gnd v out
TPS859 2008-05-13 4 package dimensions weight: 0.003 g (typ.) block diagram equivalent circuit in output part unit: mm tolerance: ? 0.1 ( ): reference value pin connection 1. v cc 2. gnd 3. gnd 4. gnd 5. gnd 6. out 1.20 1.60 0.50 0.50 0.20 0.3typ. 1.60 0.20 5 0.10 0.55 5 5 0.10 max0.2 max0.2 (0.8) 0.20 1. vcc 2. gnd 3. gnd 4. gnd 5. gnd pd_0 6. out pd_1 2. gnd 3. gnd 4. gnd 5. gnd 1. vcc 6. out 0-2e1b
TPS859 2008-05-13 5 handling precautions insert a bypass condenser of up to 0.1 f between v cc and gnd near the device to stabilize the power supply line. select a road resistor (r l ) that the light current (i l ) doesn?t exceed the absolute maximum rating. calculation example of minimum road resistor: r l =(v cc -vsat)/i l (absolute maximum rating)=(v cc - 0.4v)/4ma vsat:(supply voltage(vcc)) - (maximum value of saturati on output voltage)=0.4v vsat is constant regardless of the supply voltage. when vcc is turned on it takes at least 200 ms for the in ternal circuit to stabilize. during this time the output signal is unstable. please do not use th e unstable signal as the output signal. moisture-proof packing to avoid moisture absorption by the re sin, the product is packed in an aluminum envelope with silica gel. since the optical characterist ics of the device can be affected duri ng soldering by vaporization resulting from prior absorption of moisture and they should therefore be stor ed under the following conditions: 1. if the aluminum bag has been stored unopened temperature: 5 to 30 c relative humidity: 90% rh (max) time: 6 months 2. if the aluminum bag has been opened temperature: 5 to 30 c relative humidity: 70% rh (max) time: 168 h 3. baking should be conducted within 72 h after the humidity indicator shows > 30% or the bag seal date is over 6 months. the number of baking should be once. if the baking is conducted repeatedly, it may affect the peel-back force and cause a problem for mounting. baking condition: 60 5 c, 12 to 24 h storage period: 6 months from the seal date on the label 4. when the photointerrupter is baked, pr otect it from electrostatic discharge. 5. do not toss or drop to avoid damaging the moisture-proof bag. mounting precautions TPS859 uses a clear resin, and delicate handling is necessary for it. the characteristic change or the product might be damaged by the handling method of mounting. please note the following and handle the product. (1) do not apply stress to the resin at high temperat ure. time until the product returns at the normal temperature after mounting of the reflow is different according to the mounting substrate and the environment. please do not give the stre ss with heat remained in the product. (2) the resin part is easily scratched, so avoid friction with hard materials. (3) when installing the assembly boar d in equipment, ensure that th is product does not come into contact with other components. (4) please confirm the heat contraction of the substr ate of the reflow mounting doesn't influence the product. the load is given to the product by mo unting that the heat contraction is large on the substrate and the installation positi on of the substrate. please note that the characteristic changes or the product might be damaged.
TPS859 2008-05-13 6 mounting methods (1) example of reflow soldering ? please perform the first reflow soldering within 168 h after opening the package with reference to the above temperature profile. ? second reflow soldering in case of second reflow soldering, it should be performed within 168 h after first reflow under the above conditions. storage conditions before second reflow soldering: 30c, 70% rh or lower ? do not perform flow soldering. ? make any necessary soldering correction manually. (do not do this more than once for any given pin.) temperature: no more than 350c (25 w for soldering iron) time: within 5 s (2) recommended soldering pattern (3) cleaning conditions when cleaning is required after soldering chemicals: ak225 alcohol temperature and time: 50c 30 s or 30c 3 min ultrasonic cleaning: 300 w or less 30 s to 50 s heating part time (s) 60 s to 120 s temperature (c) 260c max (*) 230c 190c 180c preheatin g p art 10s max (*) 4c/s max (*) 4c/s max (*) unit: mm 0.5 1.35 0.5 0.3 0.45 1.0 ( * ) the product is evaluated using above reflow solder ing conditions. no additional test is performed exceed the condition (i.e. the condition mo re than max values) as an evaluation. please perform reflow soldering under the above co nditions. perform reflow soldering no more than twice.
TPS859 2008-05-13 7 packing specification (1) packing quantity reel (minimum packing quantity) 3,000 devices carton 5 reels (15,000 devices) (2) packing format an aluminum envelope containing silica gel and reels is deaerated and sealed. pack shock-absorbent materials around the alumi num envelopes in the cartons to cushion them. ? carton specification carton dimensions (w) 81 mm (l) 280 mm (h) 280 mm label
TPS859 2008-05-13 8 tape packing specifications (3) reel dimensions reel material: plastic 180 -1.0 60 -0 11.4 1.0 9.0 0.3 unit: mm 5.0 enlarged view of reel center 5.0 120 13 0.2 2 0.5 21 0.8 +1.0 +0
TPS859 2008-05-13 9 (4) tape dimensions tape material: plastic (anti-electrostatic) product direction unit: mm 1.750.1 1.5 + 0.1 ? 0 4.00.1 2.00.05 4.00.1 1.10.1 3.50.1 (2.75) 8.00.2 a a' a a' b b' b b' max 6 1.7 0.1 max 6 0.25 0.05 0.85 0.1 1.8 0.1 max 6 max 6
TPS859 2008-05-13 10 reel label the label markings may include produc t number, quantity and seal date. p/n type TPS859 addc q?ty 3,000 pcs. note leader and trailer sections of tape note 1 : the leader portion shell consist of cover tape minimum length of 300 mm and a piece of carrier tape with empty portion of 100 mm minimum. note 2 : the trailer portion shall consist of empty carrier of more than 10 cavities. position of label sensor hole
TPS859 2008-05-13 11 relative light current ambient temperature ta (c) p ? ta power dissipation p (mw) luminance e v (lx) i l ? e v (typ) light current i l ( a) supply voltage v cc (v) relative i l ? v cc (typ) 0 0 40 20 40 60 80 100 30 20 10 5 35 25 15 ta = 25c ev= 100 lx using fluorescent light 0.8 1 1.2 6 2 3 4 5 1.1 1.0 0.9 ta = 25c v cc = 3 v 10000 1000 100 10 1 1 10 100 1000 10000 relative light current ambient temperature ta (c) relative i l ? ta (typ) v cc = 3 v ev= 100 lx using fluorescent light 0.8 1.2 1.1 1.0 0.9 luminance e v (lx) i cc ? e v (typ) consumption current i cc ( a) 10000 1000 100 10 1 1 10 100 1000 10000 ambient temperature ta (c) i leak ? ta (typ) dark current i leak ( a) 1 0.001 20 v cc = 3 v 0.1 0.01 40 60 80 100 ta = 25c v cc = 3 v r l = 1 k r l = 5 k r l = 25 k ? 40 ? 20 0 20 40 60 80 100
TPS859 2008-05-13 12 wavelength (nm) spectral response (typ.) relative sensitivity 60 0 200 400 600 1000 1200 800 20 40 80 100 ta = 25c load resistance r l (k ) ta = 25c v cc = 3 v r l = 1 k r l = 5 k r l = 25 k luminance e v (lx) v out ? e v (typ) output voltage v out (v) 1 10 1 0.1 0.01 10 100 1000 10000 0.001 switching time ( s) 1 10 100 1000 t f t d t r ta = 25c v cc = 3 v v out = 1.5 v using white led switching characteristics (non-saturating operation) (typ.) load resistance r l (k ) 0.1 0.1 1 10 t s 0.1 1 10 100 t f td t r ta = 25c v cc = 3 v v out > 2.3 v using white led switching characteristics (saturating operation) (typ.) 0.01 0.1 1 10 t s switching time ( s) radiation pattern (typ) luminosity angle 30 0 60 90 90 30 60 1.0 0.8 0.6 0.4 0.2 0 80 70 50 40 20 10 70 80 50 40 20 10 ta = 25c
TPS859 2008-05-13 13 restrictions on product use ? toshiba corporation, and its subsidiaries and affiliates (collect ively ?toshiba?), reserve the right to make changes to the in formation in this document, and related hardware, software an d systems (collectively ?product?) without notice. ? this document and any information herein may not be reproduc ed without prior written permission from toshiba. even with toshiba?s written permission, reproduc tion is permissible only if reproducti on is without alteration/omission. ? though toshiba works continually to improve product?s quality a nd reliability, product can malfunction or fail. customers are responsible for complying with safety standards and for prov iding adequate designs and safeguards for their hardware, software and systems which minimize risk and avoid situat ions in which a malfunction or failure of product could cause loss of human life, b odily injury or damage to property, including data loss or corruption. before creating and producing des igns and using, customers mus t also refer to and comply with (a) the latest versions of all re levant toshiba information, including without limitation, this d ocument, the specifications, the data sheets and applic ation notes for product and the precautions and conditions set forth in the ?tosh iba semiconductor reliability h andbook? and (b) the instructions for the applicati on that product will be used with or for. custome rs are solely responsible for all aspects of t heir own product design or applications, incl uding but not limited to (a) determining th e appropriateness of the use of this product in such design or app lications; (b) evaluating and deter mining the applicability of any information contained in this document, or in charts, diagrams, programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operating parameters for such designs and applications. toshiba assumes no liability for customers? product design or applications. ? product is intended for use in general el ectronics applications (e.g., computers, personal equipment, office equipment, measur ing equipment, industrial robots and home electroni cs appliances) or for specif ic applications as expre ssly stated in this document . product is neither intended nor warranted for use in equipment or systems that require extraordinarily high levels of quality a nd/or reliability and/or a malfunction or failure of which may cause loss of human life, bodily injury, serious property damage or se rious public impact (?unintended use?). unintended use includes, without limitation, equipment used in nuclear facilities, equipment used in the aerospace industry, medical equipment, equipment used for automobiles, trains, ships and other transportation, traffic s ignaling equipment, equipment used to control combustions or explosions, safety devices, elevat ors and escalators, devices related to el ectric power, and equipment used in finance-related fields. do not use product for unintended use unless specifically permitted in thi s document. ? do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy product, whether in whole or in part. ? product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any applicable laws or regulations. ? the information contained herein is presented only as guidance for product use. no resp onsibility is assumed by toshiba for an y infringement of patents or any other intellectual property rights of third parties that may result from the use of product. no license to any intellectual property right is granted by this documen t, whether express or implied, by estoppel or otherwise. ? absent a written signed agreement, except as provid ed in the relevant terms and conditions of sale for product, and to the maximum extent allowable by law, toshiba (1) assumes no liability whatsoever, including without limitation, indirect, co nsequential, special, or incidental damages or loss, including without limitation, loss of profit s, loss of opportunities, business interruption and loss of data, and (2) disclaims any and all express or implied warranties and conditions related to sale, use of product, or information, including warranties or conditions of merchantability, fitness for a particular purpose, accuracy of information, or noninfringement. ? do not use or otherwise make available product or related soft ware or technology for any military purposes, including without limitation, for the design, development, use, stockpiling or manufacturing of nuclear, chemical , or biological weapons or missi le technology products (mass destruction weapons). product and re lated software and technology may be controlled under the japanese foreign exchange and foreign trade law and the u.s. expor t administration regulations. ex port and re-export of product or related software or technology are strictly prohibited exc ept in compliance with all applicable export laws and regulations. ? please contact your toshiba sales representative for details as to environmental matters such as the rohs compatibility of pro duct. please use product in compliance with all applicable laws and regula tions that regulate the inclusion or use of controlled subs tances, including without limitation, the eu rohs directive. toshiba assumes no liability for damages or losses occurring as a result o f noncompliance with applicable laws and regulations.

▲Up To Search▲

Price & Availability of TPS859

	To Download TPS859 Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .