creat by art - glass passivated chip junction - ideal for automated placement - low forward voltage drop - high surge current capability - halogen-free according to iec 61249-2-21 definition molding compound, ul flammability classification rating 94v-0 base p/n with suffix "g" on packing code - green compound (halogen-free) base p/n with prefix "h" on packing code - aec-q101 qualified terminal: matte tin plated leads, solderable per jesd22-b102 meet jesd 201 class 1a whisker test with prefix "h" on packing code meet jesd 201 class 2 whisker test v rrm 50 100 200 400 600 800 1000 v v rms 35 70 140 280 420 560 700 v v dc 50 100 200 400 600 800 1000 v i f(av) a trr s cj pf r jl o c/w t j o c t stg o c document number: ds_d1405060 version: h14 - 55 to +150 taiwan semiconductor 1.15 10 250 typical junction capacitance (note 3) 40 operating junction temperature range storage temperature range - 55 to +150 note 2: reverse recovery test conditions: i f =0.5a, i r =1.0a, i rr =0.25a note 3: measured at 1 mhz and applied reverse voltage of 4.0v d.c. typical reverse recovery time (note 2) 1.5 note 1: pulse test with pw=300 s, 1% duty cycle typical thermal resistance 10 v maximum reverse current @ rated vr t j =25 t j =125 i r a maximum instantaneous forward voltage (note 1) @ 3 a v f maximum average forward rectified current 3 peak forward surge current, 8.3 ms single half sine-wave superimposed on rated load i fsm 80 a maximum repetitive peak reverse voltage maximum rms voltage maximum dc blocking voltage maximum ratings and electrical characteristics (t a =25 unless otherwise noted) parameter symbol s3 ab s3 bb case: do-214aa (smb) do-214aa (smb) polarity: indicated by cathode band weight: 0.09 g (approximately) s3 mb unit s3ab thru s3mb surface mount rectifiers features - moisture sensitivity level: level 1, per j-std-020 s3 db s3 gb s3 jb s3 kb - compliant to rohs directive 2011/65/eu and in accordance to weee 2002/96/ec mechanical data
part no. part no. s3mb s3mb s3mb (ta=25 unless otherwise noted) document number: ds_d1405060 version: h14 s3mbhr5 h r5 aec-q101 qualified ratings and characteristics curves s3mb r5 r5 s3mb r5g r5 g green compound 3,000 / 13" plastic reel note 1: "x" defines voltage from 50v (s3ab) to 1000v (s3mb) example preferred p/n aec-q101 qualified packing code green compound code description s3xb (note 1) prefix "h" r5 suffix "g" smb 850 / 7" plastic reel r4 smb 3,000 / 13" paper reel m4 smb s3ab thru s3mb ordering information aec-q101 qualified packing code green compound code package packing taiwan semiconductor 0 0.5 1 1.5 2 2.5 3 3.5 0 20406080100120140160 average forward current (a) lead temperature ( o c) fig.1 forward current derating curve resistive or inductive load 10 100 1 10 100 peak forward surge urrent (a) number of cycles at 60 hz fig. 3 maximum non-repetitive forward surge current 8.3ms single half sine wave 0.1 1 10 100 0 20 40 60 80 100 120 140 instantaneous reverse current ( a) percent of rated peak reverse voltage (%) fig. 2 typical reverse characteristics tj=25 tj=125 0.1 1 10 100 0.6 0.7 0.8 0.9 1 1.1 1.2 1.3 1.4 1.5 1.6 instantaneous forward current (a) forward voltage (v) fig. 4 typical forward characteristics pulse width=300 s 1% duty cycle
min max min max a 1.95 2.10 0.077 0.083 b 4.25 4.75 0.167 0.187 c 3.48 3.73 0.137 0.147 d 1.99 2.61 0.078 0.103 e 0.90 1.41 0.035 0.056 f 5.10 5.30 0.201 0.209 g 0.10 0.20 0.004 0.008 h 0.15 0.31 0.006 0.012 p/n = specific device code g = green compound yw = date code f = factory code document number: ds_d1405060 version: h14 marking diagram d 1.8 0.071 e 6.8 0.268 b 2.5 0.098 c 4.3 0.169 suggested pad layout symbol unit (mm) unit (inch) a 2.3 0.091 s3ab thru s3mb taiwan semiconductor package outline dimensions dim. unit (mm) unit (inch) 1 10 100 1 10 100 capacitance (pf) reverse voltage (v) fig. 5 typical junction capacitance f=1.0mhz vsig=50mvp-p
creat by art assumes no responsibility or liability for any errors inaccuracies. information contained herein is intended to provide a product description only. no license, express or implied,to any intellectual property rights is granted by this document. except as provided in tsc's terms and conditions of sale for such products, tsc assumes no liability whatsoever, and disclaims any express or implied warranty, relating to sale and/or use of tsc products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright, or other intellectual property right. the products shown herein are not designed for use in medical, life-saving, or life-sustaining applications. customers using or seling these products for use in such applications do so at their own risk and agree to fully indemnify tsc for any damages resulting from such improper use or sale. document number: ds_d1405060 version: h14 s3ab thru s3mb taiwan semiconductor notice specifications of the products displayed herein are subject to change without notice. tsc or anyone on its behalf,
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