98 7 mlo tm inductors the multilayer organic inductor is a low profile organic based inductor that can support mobile communications, satellite applications, gps, matching networks, and collision avoidance. the mlo tm inductor series of components are based on avxs patented multilayer organic technology (us patent 6,987,307). mlo tm inductors incorporate very low loss organ- ic materials which allow for high q and high stability over frequency. mlo tm inductors are surface mountable and are expansion matched to fr4 printed wiring boards. mlo tm inductors utilize fine line high density interconnect technology thereby allowing for tight tolerance control and high repeatability. reliability testing is performed to jedec and mil stan- dards. finishes are available in rohs compliant sn. hl02 style x tolerance t termination sn100 tr packaging tape & reel applications ? mobile communications ? satellite applications ? gps ? collision avoidance ? wireless lans features ? high q ? high srf ? high frequency ? high withstanding voltage ? low dc resistance ? expansion matched to pcb ? surface mountable ? 0402 case size ? rohs compliant finishes ? available in tape and reel surface mount advantages ? inherent low profile ? excellent solderability ? low parasitics ? better heat dissipation how to order dimensions quality inspection finished parts are 100% tested for electrical parameters and visual characteristics. termination immersion sn finishes. operating temperature -55oc to +125oc mm (inches) lwtr 1.000.10 0.580.075 0.350.10 0.0080.002 (0.0390.004) (0.0230.003) (0.0140.004) (0.0230.051) w l r t xxx inductance expressed in nh (2 significant digits + number of zeros) for values <10nh, letter r denotes decimal point. example: 22nh = 220 4.7nh = 4r7
99 7 mlo tm inductors 0402 electrical specifications 450 mhz 900 mhz 1900 mhz 2400 mhz test frequency test frequency test frequency test frequency available inductance tolerance srf min rdc max idc max l (nh) a = 0.05nh, b = 0.1nh q l (nh) q l (nh) q l (nh) q (ghz) () (ma) 450 mhz c = 0.2nh, d = 0.5nh 450 mhz 900 mhz 900 mhz 1900 mhz 1900 mhz 2400 mhz 2400 mhz g = 2%, h = 3% j = 5%, k = 10% 1.0 a, b, c, d 25 0.994 34 0.984 45 0.981 50 18.3 0.095 346 1.1 24 1.088 33 1.077 43 1.074 48 17.45 0.099 345 1.2 24 1.188 33 1.177 44 1.174 48 16.35 0.107 343 1.3 25 1.291 34 1.279 44 1.276 49 15.55 0.113 342 1.5 25 1.499 35 1.487 45 1.484 50 14 0.128 340 1.6 25 1.599 35 1.587 45 1.586 49 13.4 0.137 339 1.8 25 1.792 35 1.782 45 1.782 49 12.1 0.154 337 2.0 26 2.000 35 2.033 45 2.063 49 10.85 0.168 335 2.2 27 2.188 36 2.187 46 2.196 50 10.15 0.178 334 2.4 27 2.396 37 2.401 47 2.416 50 9.4 0.192 330 2.7 27 2.707 36 2.723 46 2.748 48 8.55 0.219 327 3.0 27 2.988 36 3.017 44 3.054 46 7.9 0.245 324 3.3 27 3.287 36 3.335 44 3.389 46 7.35 0.265 321 3.6 27 3.607 37 3.679 45 3.754 46 6.85 0.28 311 3.9 28 3.926 38 4.025 46 4.123 47 6.5 0.294 314 4.7 b, c, d 29 4.711 39 4.894 45 5.069 44 5.65 0.342 294 5.6 30 5.655 40 5.976 44 6.282 42 5.08 0.394 295 6.8 30 6.895 39 7.463 41 8.015 37 4.45 0.47 274 8.2 29 8.374 37 9.362 37 10.371 31 3.95 0.57 255 10 g, h, j, k 30 10.253 38 11.982 35 13.882 27 3.53 0.674 235 12 32 12.509 40 15.715 31 19.792 19 3.08 0.756 210 15 32 15.919 38 22.349 24 13.037 9 2.68 0.904 200 18 28 19.397 32 31.06 15 59.996 0.3 2.38 1.213 190 22 30 24.033 34 44.693 11 n/a n/a 2.2 1.317 180 27 29 30.48 30 n/a n/a n/a n/a 1.94 1.621 160 32 28 37.742 27 n/a n/a n/a n/a 1.73 1.935 150 specifications based on performance of component assembled properly on printed circuit board with 50 nominal impedance.
100 7 mlo tm inductors mlo tm inductor simulations 0402 case size 0 frequency (ghz) 2 10 8 6 412 0 10 20 30 40 50 60 -50 -40 -10 -20 -30 0 30 20 10 40 50 q inductance (nh) inductance (nh) inductance @ 450mhz 2.0nh 0 frequency (ghz) 210 8 6 4 12 0 25 30 35 40 45 50 -100 -80 -20 -40 -60 0 60 40 20 80 100 q inductance @ 450mhz 4.7nh 120 20 15 10 5 srf 5.65 srf 10.85 max q 53 0 frequency (ghz) 0.5 3.5 3 2.5 14 0 25 30 35 40 45 -400 -300 -100 -200 0 300 200 100 q inductance (nh) inductance @ 450mhz 18.2nh 400 20 15 10 5 2 1.5 srf 2.38 max q 32 max q 45 typical performance: 4.7nh typical performance: 2.0nh typical performance: 18.2nh
101 7 mlo tm inductors automated smt assembly smt reflow profile the following section describes the guidelines for automated smt assembly of mlo tm rf devices which are typically land grid array (lga) packages or side termination smt packages. control of solder and solder paste volume is critical for surface mount assembly of mlo tm rf devices onto the pcb. stencil thickness and aperture openings should be adjusted according to the optimal solder volume. the following are general recommendations for smt mounting of mlo tm devices onto the pcb. common ir or convection reflow smt processes shall be used for the assembly. standard smt reflow profiles, for eutectic and pb free solders, can be used to surface mount the mlo tm devices onto the pcb. in all cases, a temperature gradient of 3c/sec, or less, should be maintained to prevent warpage of the package and to ensure that all joints reflow properly. additional soak time and slower preheating time may be required to improve the out-gassing of solder paste. in addition, the reflow profile depends on the pcb density and the type of solder paste used. standard no-clean solder paste is generally recommended. if another type of flux is used, complete removal of flux residual may be necessary. example of a typical lead free reflow profile is shown below. profile parameter pb free, convection, ir/convection ramp-up rate (tsmax to tp 3oc/second max. preheat temperature (ts min to ts max) 150oc to 200oc preheat time (ts) 60 C 180 seconds time above t l , 217oc (t l ) 60 C 120 seconds peak temperature (tp) 260c time within 5oc of peak temperature (tp) 10 C 20 seconds ramp-down rate 4oc/second max. time 25oc to peak temperature 6 minutes max. critical zone t l to tp ramp-down ramp-up ts max 25 t 25? to peak ts min ts preheat tp tp t l t l time temperature figure a. typical lead free profile and parameters
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