1. 2. 3. material content data sheet sales product name esd102-u1-02els e6327 issued 29. august 2013 ma# MA001059610 package pg-tsslp-2-3 weight* 0.21 mg construction element material group substances cas# if applicable weight [mg] average mass [%] sum [%] average mass [ppm] sum [ppm] chip non noble metal tin 7440-31-5 0.000 0.17 1670 noble metal gold 7440-57-5 0.001 0.65 6469 inorganic material silicon 7440-21-3 0.010 4.79 5.61 47945 56084 leadframe non noble metal nickel 7440-02-0 0.108 51.71 51.71 517148 517148 wire non noble metal copper 7440-50-8 0.001 0.68 0.68 6770 6770 encapsulation organic material carbon black 1333-86-4 0.000 0.19 1885 plastics epoxy resin - 0.011 5.46 54600 inorganic material silicondioxide 60676-86-0 0.067 32.01 37.66 320071 376556 leadfinish noble metal gold 7440-57-5 0.004 1.76 1.76 17645 17645 plating noble metal palladium 7440-05-3 0.001 0.61 6119 noble metal gold 7440-57-5 0.004 1.97 2.58 19678 25797 *deviation < 10% sum in total: 100,00 1000000 important remarks: infineon technologies ag provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. infineon technologies ag and infineon technologies ag suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. all statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. company infineon technologies ag address 81726 mnchen internet www.infineon.com
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