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TB6612FNG 2012-11-01 1 toshiba bi-cd integrated ci rcuit silicon monolithic TB6612FNG driver ic for dual dc motor TB6612FNG is a driver ic for dc motor with output transistor in ld mos structure with low on-res istor. two input signals, in1 and in2, can choose one of four modes such as cw, ccw, short brake, and stop mode. features ? power supply voltage: vm = 15 v(max) ? output current: i out = 1.2 a(ave)/3.2 a (peak) ? output low on resistor: 0.5 ? (upper+lower typ. @ vm 5 v) ? standby (power save) system ? cw/ccw/short brake/stop function modes ? built-in thermal shutdown circuit and low voltage detecting circuit ? small faced package(ssop24: 0.65 mm lead pitch) * this product has a mos structure and is sensitive to electrostatic discha rge. when handling this product, ensure that the environment is protec ted against electrostatic discharge by using an earth strap, a conductive mat and an ionizer. ensure also that the ambient temperature and relative humidity are maintained at reasonable levels. weight: 0.14 g (typ.)
TB6612FNG 2012-11-01 2 block diagram pin functions no. pin name i/o function 1 ao1 2 ao1 o ch a output 1 3 pgnd1 4 pgnd1 D power gnd 1 5 ao2 6 ao2 o ch a output 2 7 bo2 8 bo2 o ch b output 2 9 pgnd2 10 pgnd2 D power gnd 2 11 bo1 12 bo1 o ch b output 1 13 vm2 14 vm3 D motor supply 15 pwmb i ch b pwm input/200 k ? pull-down at internal 16 bin2 i ch b input 2/200 k ? pull-down at internal 17 bin1 i ch b input 1/200 k ? pull-down at internal 18 gnd D small signal gnd 19 stby i ?l? = standby/200 k ? pull-down at internal 20 vcc D small signal supply 21 ain1 i ch a input 1/200 k ? pull-down at internal 22 ain2 i ch a input 2/200 k ? pull-down at internal 23 pwma i ch a pwm input/200 k ? pull-down at internal 24 vm1 D motor supply
TB6612FNG 2012-11-01 3 absolute maximum ratings (ta = 25c) operating range (ta = -20 to 85c) characteristics symbol rating unit remarks vm 15 supply voltage v cc 6 v input voltage v in -0.2 to 6 v in1,in2,stby,pwm pins output voltage v out 15 v o1,o2 pins i out 1.2 per 1 ch 2 tw = 20 ms continuous pulse, duty 20% output current i out (peak) 3.2 a tw = 10 ms single pulse 0.78 ic only 0.89 50 mm 50 mm t = 1.6 mm cu 40% in pcb mounting power dissipation p d 1.36 w 76.2 mm 114.3 mm t = 1.6 mm cu 30% in pcb monting operating temperature t opr -20 to 85 c storage temperature t stg -55 to 150 c characteristics symbol min typ. max unit remarks v cc 2.7 3 5.5 v supply voltage vm 2.5 5 13.5 v D D 1.0 vm 4.5 v output current (h-sw) i out D D 0.4 a 4.5 v > vm 2.5 v without pwm operation switching frequency f pwm D D 100 khz ; in1,in2,pwm,stby vcc gnd input internal circuit 200k ; o1,o2 vm pgnd o1 o2 input pin: output pin: o1, o2 o1 o2 vm
TB6612FNG 2012-11-01 4 h-sw control function input output in1 in2 pwm stby out1 out2 mode h h h/l h l l short brake h h l h ccw l h l h l l short brake h h h l cw h l l h l l short brake l l h h off (high impedance) stop h/l h/l h/l l off (high impedance) standby h-sw operating description ? to prevent penetrating current, dead time t2 and t4 is provided in switching to each mode in the ic. vm vm vm m vm gnd t5 m vm gnd t4 m gnd m gnd t3 m gnd t2 t1 out2 out1 out1 out1 out1 out1 out2 out2 out2 out2 gnd vm out1 voltage wave t1 t2 t3 t5 t4
TB6612FNG 2012-11-01 5 electrical characteristics (unless otherwise specified, ta = 25c, vcc = 3 v, vm = 5 v) characteristics symbol test condition min typ. max unit i cc (3 v) stby = vcc = 3 v, vm = 5 v D 1.1 1.8 i cc (5.5 v) stby = vcc = 5.5 v, vm = 5 v D 1.5 2.2 ma i cc(stb) D D 1 supply current i m(stb) stby = 0 v D D 1 a v ih vcc0.7 D vcc+0.2 control input voltage v il D -0.2 D vcc0.3 v i ih v in = 3 v 5 15 25 control input current i il v in = 0 v D D 1 a v ih(stb) vcc0.7 D vcc+0.2 standby input voltage v il(stb) D -0.2 D vcc0.3 v i ih(stb) v in = 3 v 5 15 25 standby input current i il(stb) v in = 0 v D D 1 a v sat(u+l)1 i o = 1 a, vcc = vm = 5 v D 0.5 0.7 output saturating voltage v sat(u+l)2 i o = 0.3 a, vcc = vm = 5 v D 0.15 0.21 v i l(u ) vm = v out = 15 v D D 1 output leakage current i l(l) vm = 15 v, v out = 0 v -1 D D a v f(u) D 1 1.1 regenerative diode vf v f(l) i f = 1a D 1 1.1 v low voltage detecting voltage uvld D 1.9 D recovering voltage uvlc (design target only) D 2.2 D v t r D 24 D t f (design target only D 41 D h to l D 50 D response speed dead time l to h penetration protect time (design target only) D 230 D ns thermal shutdown circuit operating temperature tsd D 175 D thermal shutdown hysteresis ? tsd (design target only) D 20 D c
TB6612FNG 2012-11-01 6 target characteristics pd - ta 0.00 0.50 1.00 1.50 0 50 100 150 ta () (w) icgj-a=160/w ?g?r pcbe 50501.6mm cueR40% ?g?r pcbe 76.2114.31.6mm cueR30% ic only j ? a = 160c/w in boarding pcb area 50 mm50 mm1.6 mm cu area 40% in boarding pcb area 76.2 mm114.3 mm1.6 mm cu area 30% power dissipation p d p d - ta ta = 25c, ic only 1 ch driving 2 ch driving iout - duty 0.0 0.5 1.0 1.5 2.0 2.5 0% 20% 40% 60% 80% 100% duty (a) 2chr 1chr ta=25,icg output current i out i out - duty dual-channel operation single-channel operation ta = 25c, ic only
TB6612FNG 2012-11-01 7 typical application diagram note: condensers for noise absorption (c1, c2, c3, and c4) should be connected as close as possible to the ic. +4.5v 13.5v + c1 10uf c2 0.1uf m mcu stby ain1 ain2 pwma h-sw driver a 18 tsd vcc gnd 2 ao1 24 vm1 control logic a 20 21 22 23 19 3 pgnd1 bin1 bin2 pwmb control logic b 17 16 15 stby uvlo 4 pgnd1 1 ao1 6 ao2 5 ao2 h-sw driver b 11 bo1 13 vm2 9 pgnd2 10 pgnd2 12 bo1 7 bo2 8 bo2 14 vm3 m +2.7v 5.5v + c3 10uf c4 0.1uf +2.7 v to 5.5 v +4.5 v to 13.5 v
TB6612FNG 2012-11-01 8 package dimennsions weght: 0.14 g (typ) detail of a terminal
TB6612FNG 2012-11-01 9 notes on contents 1. block diagrams some of the functional blocks, circuits, or constants in the block diagram may be omitted or simplified for explanatory purposes. 2. equivalent circuits the equivalent circuit diagrams may be simplified or some parts of them may be omitted for explanatory purposes. 3. timing charts timing charts may be simplified for explanatory purposes. 4. application circuits the application circuits shown in this document are provided for reference purposes only. thorough evaluation is required, especially at the mass production design stage. toshiba does not grant any license to any industrial property rights by providing these examples of application circuits. 5. test circuits components in the test circuits are used only to obtain and confirm the device characteristics. these components and circuits are not guaranteed to prevent malfunction or failure from occurring in the application equipment. ic usage considerations notes on handling of ics [1] the absolute maximum rating s of a semiconductor device are a set of ratings that must not be exceeded, even for a moment. do not exceed any of these ratings. exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result injury by explosion or combustion. [2] use an appropriate power supply fuse to ensure that a large current does not continuously flow in case of over current and/or ic fa ilure. the ic will fully break down when used under conditions that exceed its absolute maximum ratings, when the wiring is routed improperly or when an abnormal pulse noise occurs from the wiring or load, caus ing a large current to continuously flow and the breakdown can lead smoke or ignition. to minimize the effects of the flow of a large current in case of breakdown, appropriate settings, such as fuse ca pacity, fusing time and in sertion circuit location, are required. [3] if your design includes an inductive load such as a motor coil, incorporate a protection circuit into the design to prevent device malfunction or breakdown caused by the current resulting from the inrush current at power on or the negative current resulting from the back electromotive force at power off. ic breakdown may cause injury, smoke or ignition. use a stable power supply with ics with built-in protection functions. if the power supply is unstable, the protection function may not operate, causing ic breakdown. ic breakdown may cause injury, smoke or ignition. [4] do not insert devices in the wrong orientation or incorrectly. make sure that the positive and negative terminals of power supplies are connected properly. otherwise, the current or power consumption may exceed the absolute maximum rating, and exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result injury by explosion or combustion. in addition, do not use any device that is applied the current with inserting in the wrong orientation or incorrectly even just one time.
TB6612FNG 2012-11-01 10 points to remember on handling of ics (1) thermal shutdown circuit thermal shutdown circuits do not necessarily prot ect ics under all circumstances. if the thermal shutdown circuits operate against the over temperature, clear the heat generation status immediately. depending on the method of use and usage conditions, such as exceeding absolute maximum ratings can cause the thermal shutdown circuit to not operate properly or ic breakdown before operation. (2) heat radiation design in using an ic with large current flow such as power amp, regulator or dr iver, please design the device so that heat is appropriately radiated, not to exceed the specified junction temperature (tj) at any time and condition. these ics generate heat ev en during normal use. an inadequate ic heat radiation design can lead to decrease in ic life, de terioration of ic characteristics or ic breakdown. in addition, please design the device taking into considerate the effect of ic heat radiation with peripheral components. (3) back-emf when a motor rotates in the reverse direction, stop s or slows down abruptly, a current flow back to the motor?s power supply due to the effect of back-emf. if the current sink capability of the power supply is small, the device?s motor power supply and output pins might be exposed to conditions beyond absolute maximum ratings. to avoid this problem, take the effect of back-emf into consideration in system design.
TB6612FNG 2012-11-01 11 restrictions on product use ? toshiba corporation, and its subsidiaries and affiliates (collect ively "toshiba"), reserve the right to make changes to the in formation in this document, and related hardware, software and systems (collectively "product") without notice. ? this document and any information herein may not be reproduc ed without prior written permission from toshiba. even with toshiba's written permission, reproduc tion is permissible only if reproduction is without alteration/omission. ? though toshiba works continually to improve product's quality and reliability, product can malfunction or fail. customers are responsible for complying with safety standards and for prov iding adequate designs and safeguards for their hardware, software and systems which minimize risk and avoid situations in which a ma lfunction or failure of product could cause loss of human life, b odily injury or damage to property, including data loss or corruption. before customers use the product, create designs including the product, or incorporate the product into their own applications, cu stomers must also refer to and comply with (a) the latest versions of all relevant toshiba information, including without limitation, this document, the specifications, the data sheets and application notes for product and the precautions and condi tions set forth in the "toshiba semiconductor reliability handbook" and (b) the instructions for the application with which the product will be us ed with or for. customers are solely responsible for all aspe cts of their own product design or applications, including but not limited to (a) determining the appropriateness of the use of this product in such design or applications; (b) eval uating and determining the applicability of any info rmation contained in this document, or in c harts, diagrams, programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operatin g parameters for such designs and applications. toshiba assumes no liability for customers' product design or applications. ? product is neither intended nor warranted fo r use in equipments or systems that require extraordinarily high levels of quality and/or reliability, and/or a malfunction or failure of which may cause loss of human life, bodily injury, serious property damage and/or serious public impact ( " unintended use " ). except for specific appl ications as expressly stated in this document, unintended use includes, without limitation, equipment used in nuclear facilities, equipment used in the aerospace industry, medical equipment, equipment used f or automobiles, trains, ships and other transportation, traffic si gnaling equipment, equipment used to control combustions or expl osions, safety devices, elevators and escalators, devices related to electric power, and equipment used in finance-related fields. if you use product for unintended use, toshiba assumes no liability for product. for details, please contact your toshiba sales representative. ? do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy product, whether in whole or in part. ? product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any applicable laws or regulations. ? the information contained herein is pres ented only as guidance for product use. no re sponsibility is assumed by toshiba for an y infringement of patents or any other intellectual property rights of third parties that may result from the use of product. no license to any intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise. ? absent a written signed agreement, except as provid ed in the relevant terms and conditions of sale for product, and to the maximum extent allowable by law, toshiba (1) assumes no liability whatsoever, including without limitation, indirect, co nse quential, special, or incidental damages or loss, including without limitation, loss of profit s, loss of opportunities, business interruption and loss of data, and (2) disclaims any and all express or implied warranties and conditions related to sale, use of product, or information, including warranties or conditions of merchantability, fitness for a particular purpose, accuracy of information, or noninfringement. ? do not use or otherwise make available product or related so ftware or technology for any military purposes, including without limitation, for the design, development, use, stockpiling or m anufacturing of nuclear, chemical , or biological weapons or missi le technology products (mass destruction w eapons). product and related software and technology may be controlled under the applicable export laws and regulations including, without limitat ion, the japanese foreign exchange and foreign trade law and t he u.s. export administration regulations. export and re-export of pr oduct or related software or technology are strictly prohibit ed except in compliance with all appl icable export laws and regulations. ? please contact your toshiba sales representative for details as to environmental matters such as the rohs compatibility of pro duct. please use product in compliance with all applicable laws and regula tions that regulate the inclusion or use of controlled subs tances, including without limitation, the eu rohs directive. toshiba assumes no liability for damages or losses occurring as a result of noncompliance with applicable laws and regulations.

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