l features l outline ? side view white leds ? high brightness l size 1006 (0402) 1.00.6mm (t=0.2mm) l dimensions l recommended solder pattern l specifications typ. i f max. v r i f min. typ. i f (v) (ma) ( m a) (v) (ma) (mcd) (mcd) (ma) CSL0406WBCW 3.2 20 50 5 20 1400 2200 20 *1:duty1/10, 1khz ( ) :reference l thermal resistance rj-s 190oc/w * rj-a 350oc/w * * cu foil 50mm25mm t=0.07mm cathode
tjmax 120oc pcb fr4 t=1.6mm CSL0406WBCW series electrical and optical characteristics (ta=25oc) chromaticity (x, y) forward voltag v f reverse current i r luminous intensity i v color part no. voltage dissipation current p d (mw) i f (ma) ingan 30 100* 1 chip structure absolute maximum ratings (ta=25oc) emitting power forward peak forward reverse operating temp. storage temp. - 40 to + 100 white i fp (ma) current 117 5 (0.30, 0.28) - 40 to + 85 topr(oc) tstg(oc) v r (v) 2812 2.8 1.2mm (t=0.8mm) color type wb tolerance : ? 0.1 (unit : mm) (unit : mm) reference 1/7 2014.07 - rev.a data sheet www.rohm.com ? 2014 rohm co., ltd. all rights reserved.
CSL0406WBCW series l electrical characteristics curves 0 10 20 30 40 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 100 1 10 100 2.0 2.5 3.0 3.5 4.0 0.4 0.6 0.8 1 1.2 1.4 1.6 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 100 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 0 5 10 15 20 25 30 fig.1 forward current - forward voltage s forward current : i f [ma] forward voltage : v f [v] fig.2 luminous intensity - atmosphere temperature relative luminous intensity [a.u.] atmosphere temperature : ta [oc] fig.3 luminous intensity - forward current relative luminous intensity [a.u.] forward current : i f [ma] fig.4 derating maximum forward current : [ma] ambient temperature : ta [oc] ta=25 oc ta=25 oc i f = 20ma *cu foil 50mm 25mm t=0.07mm cathode pcb fr4 t=1.6mm CSL0406WBCW CSL0406WBCW CSL0406WBCW CSL0406WBCW 2/7 2014.07 - rev.a www.rohm.com ? 2014 rohm co., ltd. all rights reserved. data sheet
CSL0406WBCW series l viewing angle l rank reference of brightness l chromaticity diagram [chromaticity coordimates] (ta=25oc, i f 20ma) measurement tolerance : ? 0.01 CSL0406WBCW 0 1 2 4 3 5 scanning angle (deg) relative intensity scanning angle (deg) relative intensity scanning direction scanning direction 3/7 2014.07 - rev.a www.rohm.com ? 2014 rohm co., ltd. all rights reserved. data sheet x y x y x y 0.286 0.244 0.280 0.252 0.296 0.259 0.280 0.252 0.273 0.261 0.291 0.268 0.291 0.268 0.285 0.279 0.310 0.297 0.296 0.259 0.291 0.268 0.313 0.284 x y x y x y 0.291 0.268 0.313 0.284 0.310 0.297 0.285 0.279 0.310 0.297 0.307 0.312 0.307 0.312 0.330 0.330 0.330 0.347 0.310 0.297 0.330 0.310 0.330 0.330 0 1 2 3 4 5 white(wb) (ta=25oc, i f h 20ma) rank x1 x2 y1 y2 z1 z2 iv (mcd) 900 to 1100 1100 to 1400 1400 to 1800 1800 to 2200 2200 to 2800 2800 to 3600 CSL0406WBCW
CSL0406WBCW series l taping (csl0406 series) l part no. construction l packing specification rohm led products are being shipped with desiccant (silica gel) concluded in moisture-proof bags. pasting the moisture sensitive label on the outer surface of the moisture-proof bags or enclosing the humidity indication card inside the bag is available upon request.
please contact the nearest sales office or distributer if necessary. (unit : mm) (note ) tolerance is within ? 0. 1 mm, unless otherwise specified. packing quantity 2000pcs/reel pull direction + 1 0 4/7 2014.07 - rev.a www.rohm.com ? 2014 rohm co., ltd. all rights reserved. data sheet 1 8 0 6 0 1 3 1 1 . 4 1 + 1 0 0 - 3 2 0 . 0 5 1 . 5 + 0 . 1 0 1 . 7 5 0 . 1 4 0 . 1 0 . 9 5 0 . 1 4 0 . 1 3 . 5 0 . 0 5 3 0 . 1 8 0 . 2 0 . 1
CSL0406WBCW series l precaution (surface mount device) 1.storage if the product is heated during the reflow under the condition of hygroscopic state, it may vaporize and expand which will influence the performance of the product. therefore, the package is waterproof. please use the product following the conditions: ? using conditions temperature humidity expiration date remark 5 to 30oc 30 to 70%rh within 1 year storage with waterproof package 5 to 30oc below 70%rh within 72h please storing in the airtight container with our desiccant (silica gel) ? baking bake the product in case of below: the expiration date is passed. the color of indicator (silica gel) turned from blue to colorless or from green to pink. (even if the product is within the expiration date.) ? baking conditions humidity below 20%rh 2.application methods 2-1. precaution for drive system and off mode 2-2. operation life span longtime intensity of light life on mode all the time 2-3.applied stress on product 2-4.usage design the circuit without the electric load exceeding the absolute maximum rating that applies on the products. if drive by constant voltage, it may cause current deviation of the led and result in deviation of luminous intensity, so we recommend to drive by constant current. (deviation of vf value will cause deviation of current in led.) furthermore, for off mode, please do not apply voltage neither forward nor reverse. especially, for the products with the ag-paste used in the die bonding, theres high possibility to cause electro migration and result in function failure. theres possibility for intensity of light drop according to working conditions and environments (applied current, surrounding temperature and humidity, corrosive gases), please call our sales staffs for inquiries about the concerned application below. the top of the led is very soft, which the silicon resin is used as sealing resin. therefore, please pay attention to the overstress on it which may influence its reliability. the product is led. we are not responsible for the usage as the diode such as protection chip, rectifier, switching and so on. classification before using after opening package ? reel and embossed tape are easy to be deformed when baking, so please try not to apply stress on it. ? recommend bake once. ? bake products in reel. remark time 40 to 48h temperature 603oc 5/7 2014.07 - rev.a www.rohm.com ? 2014 rohm co., ltd. all rights reserved. data sheet
CSL0406WBCW series 3. others 3-1. surrounding gas 3-2. electrostatic damage 3-3. electromagnetic wave 4.mounting 4-1. soldering ? ? the product is not for flow soldering. ? ? please set appropriate reflow temperature based on our product usage conditions and specification. ? ? ? 4-2. automatic mounting 4-2-1.silicon resin sealing product 4-2-2.mini package (smaller than 1608 size) ? set magnet on parts feeder cassette of the mounter to control the product stabilization ? set ionizer to prevent electrostatic charge 4-3. mounting location ? vibration may result in low mounting rate since it will cause the static electricity of product and adhere to top cover tape. we recommend to the stress like bending stress of circuit board dividing after mounting, may cause led package crack or damage of led internal junction, therefore, please concern the mounting direction and position to avoid bending or screwing with great stress of the circuit board. no resin hardening agent such as filler is used in the sealing resin of the product. therefore, resin expansion and moisture absorption at humidity will cause heat stress during soldering process and finally has bad influence on the products reliability. do not expose the product in the environment of high temperature (over 100oc) or rapid temperature shift (within 6oc of temperature gradient) during the flow soldering of surrounding parts. the max for reflowing is 2 times, please finish the second flow soldering and flow soldering with other parts within the usage limitation after open the moistureproof package. compare with n2 reflow, during air reflow, because of the heat and surrounding conditions, it may cause the discoloration of the resin. for our product that has no solder resist, because of its solder amount and soldering conditions, one of its specific characteristics is that solder will penetrate into led. thus, there's high possibility that will influence its reliability. therefore, please be informed, concerning it before using it. notice that if it is stored under the condition of acid gas (chlorine gas, sulfured gas) or alkali gas (ammonia), it may result in low soldering ability (caused by the change in quality of the plating surface ) or optical characteristics changes (light intensity, chrominance) and change in quality of die bonding (ag- paste) materials. all of the above will cause function failure of the products. please concern the influence on led in case of application with strong electromagnetic wave such as ih (induction heating). therefore, please pay attention to the storage environment for mounted product (concern the generated gas of the surrounding parts of the products and the atmospheric environment). the product is part of semiconductor and electrostatic sensitive, theres high possibility to be damaged by the electrostatic discharge. please take appropriate measures to avoid the static electricity from human body and earthing of production equipment. the resistance values of electrostatic discharge (actual values) vary with products, therefore, please call our sales staffs for inquiries. the sealing resin of led is very soft, so please select adsorption nozzle that would not apply stress directly on the sealing section. 6/7 2014.07 - rev.a www.rohm.com ? 2014 rohm co., ltd. all rights reserved. data sheet
CSL0406WBCW series 4-4. mechanical stress after mounting ? 4-5. soldering pattern for recommendation 4-6. reflow profile for reflow profile, please refer to the conditions below:( * ) ? meaning of marks, conditions conditions 180oc 140oc over 60sec. 230 to 250oc within 40sec. 250oc(max) within 10sec. under 3oc/sec. over -3oc/sec. * 4-7. cleaning after soldering the mechanical stress may damage the led after circuit mounting, so please pay attention to the touch on product. mark ts max ts min ts above conditions are for reference. therefore, evaluate by customers own circuit boards and reflow furnaces before using, because stress from circuit boards and temperature variations of reflow furnaces vary by customers own conditions. please follow the conditions below if the cleaning is necessary after soldering. solvent we recommend to use alcohols solvent such as, isopropyl alcohols we recommend the soldering pattern that shows on the right. it will be different according to mounting situation of circuit board, therefore, please concern before designing. * the product has adopted the electrode structure that it should solder with back electrode of the product. thus, please be informed that the shape of electrode pin of solder fillet formation is not guaranteed. t l t l t p t p t r /t t d /t under 30oc within 3 minutes 15w below 1 liter (capacity of tank) under 100oc within 3 minutes meanings maximum of pre-heating temperature minimum of pre-heating temperature time from ts min to ts max reference temperature retention time for t l peak temperature time for peak temperature temperature rising rate temperature decreasing rate temperature ultrasonic cleaning drying stress strength according to the mounting position: a b c d emitting direction 7/7 2014.07 - rev.a www.rohm.com ? 2014 rohm co., ltd. all rights reserved. data sheet
r1 102 a www .rohm.com ? 2014 rohm co., ltd. all rights reserved. notice rohm c u stomer support sys tem h ttp://w w w . r ohm .com/con tact/ thank you for your accessing to rohm pr oduct informations. mor e detail pr oduct informations and catalogs ar e available, please contact us. notes the inf or mation contained herein is subject to change without notic e . bef ore y ou use our p r o d u c t s , ple a s e c o n t a c t o u r s a l e s r e p r e s e n t a t i v e and v e r i f y the l a test specifica- tions : althoug h r o h m is c o n t i n uousl y w o r king t o impro ve p roduct r elia bility and quality , semicon- duc tors c an brea k do w n and mal f unction due to va r ious f actor s . the ref o r e , i n ord e r to p r e ve n t per sonal i n jur y or fire a r isin g f rom f a ilure , please tak e saf ety meas ure s suc h a s c o m plying wit h the der ating cha r a cte r istics , imple menting redundant and f ire p r e ve nti o n d e s i g n s , and u tilizing bac k ups a nd f ail- saf e p rocedures . r o hm shall h a ve no responsibility f or an y damages ar ising out of the use of our p oducts beyond the r ating specified b y r ohm. examples of application circuits , circuit constants and an y other inf or mation contained herein are pro vided only to illustr ate the standard usage and oper ations of the products . the per iphe r al conditions m ust be tak en into account when designing circuits f or mass production. the technical inf or mation specified herein is intended only to sho w the typical functions of and e xamples of application circuits f or the products . r ohm does not grant y ou, e xplicitly or implicitl y , an y license to use or e x ercise intellectual prope r ty or other r ights held b y r ohm or an y other par ties . r ohm shall ha v e no responsibility whatsoe v er f or an y dispute ar ising out of the use of such technical in f or mation. the products are intended f or use in gene r al electronic equipment (i.e . a v/o a de vices , comm uni- cation, consumer systems , gaming/ente r tainment sets) as w ell as the applications indicated in this document. the products specified in this document are not designed to be r adiation tole r ant. f or use of our products in applications requi r ing a high deg ree of reliability (as exemplified bel o w), please contact and consult with a r ohm representati v e : tr anspo r tation equipment (i.e . cars , ships , tr ains), pr imar y comm unication equipment, tr affic lights , fire/cr ime pre v ention, saf ety equipment, medical system s , ser v ers , solar cells , and po w er tr ansmission system s . do not use our products in applications requir ing e xtremely high reliabilit y , such as aerospace equipment, n uclear p o w er control systems , and submar ine repeater s . r ohm shall ha v e no responsibility f or an y damages or inju r y ar ising from non-compliance with the recommended usage conditions and specifications contained herein. r ohm has used reasona b le care to ensur the accur acy of the inf or mation contained in this document . ho w e v er , r ohm does not w arr ants that such inf or mation is error-free , and r ohm shall ha v e no responsibility f or an y damages ar ising from an y inaccu r acy or mispr int of such inf or mation. please use the products in accordance with an y applica b le en vironmental la ws and regulation s , such as the rohs directiv e . f or more details , including rohs compatibilit y , please contact a r ohm sales office . r ohm shall ha v e no responsibility f or an y damages or losses resulting non-compliance with a n y applica b le la ws or regulation s . when pro viding our products and technologies contained in this document to other countr ies , y ou m ust abide b y the procedures and pro visions stipulated in all applica b le e xpor t la ws and regulation s , including without limitation the us expor t administr ation regulations and the f oreign exchange and f oreign t r ade act. this document, in par t or in whol e , ma y not be repr inted or reproduced without pr ior consent of r ohm. 1) 2) 3) 4) 5) 6) 7) 8) 9) 10) 11) 12) 13) 14)
|
