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page 1 of 13 swlp.2450.12.4.b.02 specifcation part no. swlp.2450.12.4.b.02 product name 12mm*12mm*4mm 2.4ghz smd patch antenna feature for wi-fi/wlan/ism/zigbee industrial applications rohs compliant high gain 2dbi bottom to p spe-13-8-007/a/ss |
page 2 of 13 this 12mm*12mm*4mm high gain 2.4ghz patch antenna is ideally suited for high performance industrial applications in wi-f, ism, zigbee bands. this product has highest gain in the xz (azimuth) plane direction, most suitable for fxed wireless applications where transmission and reception is focused to one hemisphere of the device, for example a wireless meter on a reinforced concrete wall. it can also be placed anywhere on the device ground-plane, unlike most chip or loop antennas which need to be edge mounted. 1. introduction 2. key antenna performance indicators* no. parameter specifcation 1 range of receiving frequency 2400 mhz to 2500 mhz 2 bandwidth 100 mhz @ -7db 3 polarization linear vswr 3.0 max @ center frequency peak gain +2 dbi typ. impedance 50 ohms 4 dimensions 12mm x 12mm x 4mm 5 operating temperature -40 to +85 6 storage temperature -40 to +85 termination ag (environmentally friendly pb free) original patch specifcation measured on evb 50*50mm, actual value depends on ground-plane and housing spe-13-8-007/a/ss |
page 3 of 13 ch1 rfl log 3 db / ref 0 db 1: - 9.6848 db 2 450 . 000 000 mhz 3. mechanical specifcations 3.1 return loss 17 dec 2009 15 : 32 : 22 2.45 ghz 3 2 1 4 tp * c > center 2 450.000 000 mh z span 300.000 000 mh z with 5050mm 2 evaluation board ch1 markers bw: 105.198138 mhz cent: 2452.887929 mhz q: 23.317 1 loss: -9.6848 db spe-13-8-007/a/ss |
page 4 of 13 3.2 defnition of x-y-z plane spec no. sp03ab24501-0010 issued date 2012.09.19 published by product name sma 2450a version 03 page 5/12 this document is held by cirocomm, cannot be reproduced without permission . 11. typical electrical characteristics ith 5050 2 cirocomm evaluation board definition of x-y-z plane z -x -y spe-13-8-007/a/ss |
90 deg 270 deg 180 deg 0 deg -3.30159 legend e total db(db) page 5 of 13 3.3 radiation patterns xy plane 6.00db 5.00db 0.00db 5.00db 10.00db 15.00db 20.00db 25.00db 30.00db spe-13-8-007/a/ss |
90 deg 270 deg 180 deg 0 deg 6.00db 5.00db 0.00db 5.00db 10.00db 15.00db 20.00db 25.00db 30.00db 4.72532 legend e total db(db) page 6 of 13 xz plane 3.3 radiation patterns spe-13-8-007/a/ss |
90 deg 270 deg 180 deg 0 deg 6.00db 5.00db 0.00db 5.00db 10.00db 15.00db 20.00db 25.00db 30.00db 4.72413 legend e total db(db) page 7 of 13 3.3 radiation patterns yz plane spe-13-8-007/a/ss |
page 8 of 13 3.4 effciency chart 2100.00 2200.00 2300.00 2400.00 2500.00 2600.00 2700.00 2800.00 2900.00 3000.00 0.90 -0.10 0.801201 legend effciency( ) 0.801201 2450mhz frequency 900e-3 800e-3 700e-3 600e-3 500e-3 400e-3 300e-3 200e-3 100e-3 0 -100e-3 spe-13-8-007/a/ss |
page 9 of 13 3.5 average gain 2100.00 2200.00 2300.00 2400.00 2500.00 2600.00 2700.00 2800.00 2900.00 3000.00 0.00 -26.00 -0.901775 legend e total. db(db) 2450mhz frequency 0 -5 -10 -15 -20 -25 -0.901775 spe-13-8-007/a/ss |
page 10 of 13 4. shape and dimensions name material finish qty 1 4-11bdi fsbd mfbs 1 2 .bdippofobbdps fsbd white 3 note: 1. silver area 2. 4pmesnbtl 3. sbupctpmese 4. feed area 5. mbsbodbsb 6. .budipnpooubbdups 7. 6orvenotpoohbddpseohupzpvs1oevdupsboedbbdupsbmvtbddpseohupzpvstdded 8. notpotpg0in18eoeoupooeevbmcpbse 9. matching circuit capacitor and inductor values dependent on individual environment spe-13-8-007/a/ss |
page 11 of 13 evaluation board dimension soldering pads copper ar ea t op b o t t om t op b o t t om soldering pads copper ar ea shop c opper shop c opper spe-13-8-007/a/ss |
page 12 of 13 5. packaging s= 2 sw lp -1 2 sw lp -1 2 sw lp -1 2 spe-13-8-007/a/ss |
page 13 of 13 6. recommended refow temperature profle temp(c) 240 c 230 c 180 c 0 c 60-120sec 10-30sec time (s) 5 sec (peak 245 c) 6.1 flux, solder 6.2 refow soldering conditions 6.3 reworking with soldering iron ? use rosin-based fux. dont use highly acidic fux with halide content exceeding 0.2wt%(chlorine conversion value). ? use sn solder. ? pre-heating should be in such a way that the temperature difference between solder and product surface is limited to 150 max. cooling into solvent after soldering also should be in such a way that temperatur e difference is limited to 100 max. unwrought pre-heating may cause cracks on the product, resulting in the deterioration of products quality. pre-heating 150, 1 min tip temperature 290 max soldering iron output 30w max soldering time 3 second max ? the following conditions must be strictly followed when using a soldering ir on spe-13-8-007/a/ss |

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