to complete part number insert tolerance designator: k=10%, j=5%, g=2% CHQ05 ceramic core high q chip induct ors features electrical tolerance: 2.5nh-12nh available in 10% & 5%, 16nh-51nh available in 10%, 5%, and 2% test frequency: at specified frequency with test osc @ 200mv. operating temp: -40oc ~ 125oc irms: based on 15oc temperature rise @ 25oc ambient. resistance to soldering heat test equipment physical rohs allied components interna tional 714-665-1 140 www.a lli edcom pon en ts .com all specif icat ions subject t o change wit hout not ice. 1600 1600 1500 1400 1400 1300 1200 1200 1000 irms (ma) CHQ05-2n5_-rc CHQ05-5n6_-rc CHQ05-16n_-rc CHQ05-18n_-rc CHQ05-20n_-rc CHQ05-27n_-rc CHQ05-30n_-rc CHQ05-48n_-rc CHQ05-51n_-rc allied part number i nduct ance (nh) t oler an ce (%) min. srf min. (mhz) dcr max. (?) 2.5 5.6 16 18 20 27 30 48 51 250/1500 250/1500 250/500 250/500 250/500 250/500 250/500 250/500 250/500 80 98 72 75 70 75 65 65 65 6000 6000 2950 2550 2050 2000 1950 1400 1400 0.02 .035 0.06 0.06 .055 0.70 .095 0.11 0.12 l/q test freq. (mhz) 10, 5 10, 5 10, 5, 2 10, 5, 2 10, 5, 2 10, 5, 2 10, 5, 2 10, 5, 2 10, 5, 2 1100 CHQ05-39n_-rc 39 250/500 65 1600 .095 10, 5, 2 1600 1600 CHQ05-6n2_-rc CHQ05-12n_-rc 6.2 12 250/1000 250/1000 88 80 4750 3000 .035 .045 10, 5 10, 5 q ? 0805 size suitable for pick and place ? exceptional high q values at high frequencies ? ceramic core provides high self resonant ? low dc resistance ideal for mobile applications ? high current and low loss excellent for rf applications inductance range: 2.5nh to 51nh test method:reflow solder the device onto peak temp: 260oc 5oc for 10 sec. solder composition: sn/ag3.0/cu0.5 total test time: 6 minutes (l/q): hp4286a / hp4287a / agilent e4491a (srf): hp8753d / agilent e4991 (rdc): chen hwa 502bc (irms): hp4284a + hp42841a / hp4285a + hp42841a +hp4284a + hp42841a packaging: 2000 pieces per 7 inch reel marking: single dot color code system revised 06/01/11 max. dimensions: inches (mm) automation frequencies ? non-magnetic core assures excellent thermal stability and batch consistency pcb
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