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datasheet product structure silicon monolithic integrated circuit this product has no designed protec tion against radioactive rays . 1/23 tsz02201-0f1f0c300030-1-2 2013.10.07 rev.001 ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 14? 001 www.rohm.com ac/dc driver for general lighting led driver ic with pwm and linear dimming BD552JLFv / f general description the quasi-resonant controller type led driver ic BD552JLFv/f supports an optimum system of led lighting equipments. it is an led driver which integrates an ac/dc st ep-down type switching controller with a constant current driver. owing to the quasi- resonant operation, the soft switching is achieved, and th is contributes to the low emi noise. and due to the switching mosfet and the resistor for current sensing, which are externally found, it is possible to achieve a high degree of freedom for the power supply design. this ic supports both isolated and non-isolated topology. especially, in case of isolated topology, wherein led current control is possible with an photocoupler-less applicati on. this provides an optimum circuit for reducing the components. moreover, this ic supports both pwm dimming mode and linear dimming mode allowing it to be used on various applications. finally, with burst operation in case of the dimming rate of lower than 20%, a deeper dimming level can be achieved. features ? input voltage range: vcc 8.5v to 25.5v ? current consumption: uvlo detected 20ua (typ) operating 2.2 ma (typ) ? operating temperature range: -40c to +105c key specifications ? step-down ac/dc converter with high efficiency ? primary side control no feedback circuit ? pwm ? linear dimming control ? supports non-isolated(buck) topology ? supports photocoupler-less isolated(fly-back) topology ? built-in regulator for internal power supply ? low emi noise by soft-switching function ? led open detection function[shut down] ? soft start function ? zt trigger mask function ? zt ovp function [shut down] ? uvlo detection function [self-reset] ? output overload protection [self-reset] ? isns open protection circuit [shut down] packages ssop-b14 : 5.00mm x 6.40mm x 1.15mm (0.65mm pitch) sop14 : 6.20mm x 8.70mm x 1.50mm (1.27mm pitch) a pplications led lightings with pwm/linear dimmer downlight, spotlight, tube-typed led etc. typical application circuit vhv vcc dimsel vi dim vdd zt out isns gnd gnd isosel osc bstdc mode setting flt led + led - ac input pulse input 1khz 0%- 100% figure1. typical application circuit non-isolated / pwm dimming type
2/23 datasheet datasheet BD552JLFv/f tsz02201-0f1f0c300030-1-2 2013.10.07 rev.001 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15? 001 absolute maximum ratings ta=25 parameters symbol ratings unit comments voltage range 1 v max1 -0.3 to 30 v v cc voltage range 2 v max2 -0.3 to 4.5 v v dd , isosel, bstdc, dimsel, dim voltage range 3 v max3 -0.3 to 6.5 v isns, osc voltage range 4 v max4 -0.3 to 8.5 v zt voltage range 5 v max5 -0.3 to 15 v out, vi, vhv zt pin current i zt 3.00 ma maximum power dissipation pd ssop-b14500 (note1) sop14562 (note2) mw operating temperature range topr -40 to +105 c maximum junction temperature tjmax 150 c storage temperature range tstr -55 to +150 c (note1) 70701.6 ? mounted on glass epoxy substrate , derate by 4.0mw/ when operating above ta=25 . (note2) 70701.6 ? mounted on glass epoxy substrate , derate by 4.5mw/ when operating above ta=25 . recommended operating range ta=25 parameters symbol limits unit comments supply voltage range 1 v cc 8.5 to 25.5 v vcc pin supply voltage range 2 v zt 6.5 v zt pin electrical characteristics (unless otherwise specified, ta=25 , vcc=15v) parameters symbol limits unit comments min typ max circuit current circuit current (off) i off - 20 40 ua vcc=12vuvlo state circuit current (on)1 i on1 - 2.80 4.80 ma dimsel=h,dim=h (while out keep switching ) circuit current (on)2 i on2 - 2.60 4.60 ma dimsel=h,dim=l (while out switching off) vcc pin vcc uvlo release voltage v uvlo1 12.50 13.50 14.50 v while vcc rising up vcc uvlo trigger voltage v uvlo2 6.10 6.50 7.00 v while vcc falling down vcc uvlo hysteresis voltage v uvlo3 6.0 7.0 8.0 v v uvlo3= v uvlo1- v uvlo2 vcc ovp trigger voltage v ovp 25.0 27.5 30.0 v while vcc rising up vcc ovp hysteresis voltage v ovp_hys 2.2 4.0 5.7 v [ reg block ] vdd output voltage v dd 3.20 3.30 3.40 v vdd output current i vdd 20 - - ma vdd uvlo release voltage v dduvlo 2.50 2.80 3.10 v while vdd rising up [ dcdc turn off block isns ] average current sense voltage visns 475 500 525 mv maximum switching frequency fsw_max 170 200 230 khz minimum switching frequency fsw_min 18 20 22 khz osc=gnd [ dcdc turn on block : zt ] zt converter 1 vzt1 40 100 160 mv while zt voltage is increasing zt converter 2 vzt2 120 200 280 mv while zt voltage is decreasing timeout switching frequency f_to 80 100 120 khz osc=open [ out pin ] out pin h voltage v outh 10.5 12.0 13.5 v io_out=-2ma, vcc=15v out pin l voltage v outl - - 0.30 v io_ out =+2ma, vcc=15v out pin pull-down resistance r pdout 75 100 125 k out pin high on resistance rvouth 6.0 12.0 24.0 out =2ma source out pin low on resistance rvoutl 1.5 3.0 6.0 out =2ma sink
3/23 datasheet datasheet BD552JLFv/f tsz02201-0f1f0c300030-1-2 2013.10.07 rev.001 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15? 001 electrical characteristics (unless otherwise specified, ta=25 , vcc=15v) parameters symbol limits unit comments min typ max [ dc/dc protection function ] switching max duty dmax 85.0 87.5 90.0 % osc=gnd current sensing time tisns t 160 200 240 nsec isns ovp trigger voltage vovp 2.25 2.50 2.75 v zt ovp voltage v ztl 2.80 3.00 3.20 v latch release voltage (vdd_uvlo) v latch 2.40 2.65 2.90 v while vdd is decreasing latch mask time t latch 60 100 140 usec [ dimming control ] dimsel pin h input voltage vdimselh 0.7vdd - vdd+0.3 v dimsel pin m input voltage vdimselm 1.20 1.45 1.70 v dimsel pin l input voltage vdimsell -0.3 - 0.3 v dim pin pwm h input voltage vdimh 0.7vdd - vdd+0.3 v dimsel=vdd (pwm dimming) dim pin pwm l input voltage vdiml -0.3 - 0.3vdd v dimsel=vdd (pwm dimming) dim pin start input voltage (linear dimming mode) vdimlin - - 0.4 v dimsel=1.45v (linear dimming) [ vhv input control block] vhv input duty h voltage detph 150 250 350 mv while vhv is increasing vhv input duty l voltage detpl 75 125 175 mv while vhv is decreasing vi_on setting vhv input voltage detstrg 560 625 690 mv vhv pin input voltage range vvhv -0.3 - 9.0 v vhvovp trigger voltage v_ vhvovp1 4.50 5.00 5.50 v vi pin on resistance ronvi - 10 100 ? i_vi=2ma sink vi pin off leakage current ileakvi - - 1.0 ua vi=10v [ state setting input block] isosel pin h input voltage visoh 0.7vdd - vdd+0.3 v isosel pin l input voltage visol -0.3 - 0.3vdd v bstdc pin h input voltage vbsth 0.7vdd - vdd+0.3 v bstdc pin l input voltage vbstl -0.3 - 0.3vdd v
4/23 datasheet datasheet BD552JLFv/f tsz02201-0f1f0c300030-1-2 2013.10.07 rev.001 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15? 001 pin configuration table 1. i/o pin functions no. pin name i/o function esd protection system vcc vdd gnd 1 vcc i supply voltage 2 vi o phase angle detection 3 dimsel i dimming mode selection 4 dim i dimming signal 5 gnd i gnd pin 6 vhv i phase angle detection 7 osc o switching frequency 8 isosel i non-isolated/isolated control selection l : buck / h : fly-back 9 gnd i gnd pin 10 bstdc o output mode selection while dimming l : dc output / h : dc + burst output 11 isns i feedback signal 12 out o gate driver pin of switching mos 13 zt i zero current detection 14 vdd o regulator output / internal power supply 3.3v
5/23 datasheet datasheet BD552JLFv/f tsz02201-0f1f0c300030-1-2 2013.10.07 rev.001 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15? 001 i/o equivalent circuit diagram 2 vi 3 dimsel 4 dim vi 100 m dimsel vdd 10k 1m vdd dim vref 6 vhv 7 osc 8 / 10 isosel/bstdc 100k 100k 500k 500k 200k vhv osc 250 200k vdd 10k 1m vdd isosel pfcen bstdc 11 isns 12 out 13 zt 10k isns m vref vref out vcc 100k 100 500k 500k zt 50 14 vdd vdd 1003k vcc figure 2. i/o equivale nt circuit diagram
6/23 datasheet datasheet BD552JLFv/f tsz02201-0f1f0c300030-1-2 2013.10.07 rev.001 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15? 001 block diagram r3 r5 logic isns(11) 10bit dac 10bit adc out(12) s r q led+ led- leb 200ns qr control 12.5v mn1 r4 c1 d1 t1 fmax=200khz reg internal power supply reg zt(13) 100mv/200mv zt_c osc iset r1 r2 c4 r6 osc(7) timeout 2.0v/1.85v 1.05v/0.85v 1.90v/ 1.50v 10bit adc dimsel dim vhv (3) (4) (6) 3.0v 5.0v led current caluculation vdd r7 r8 ac vcc(1) power supply d2 c2 pwm dimming pwm dimming log linear dimming 1 2 3 dimming control vdd(14) gnd(5) 3.3v protection logic leb 200ns ocp ocp ztovp vhvovp reguvlo vccuvlo vccovp vccuvlo vccovp reguvlo 13.5v/6.5v 27.5v/23.5v 2.80v/2.65v 250mv/125mv 2.5v swon swon ? ? ?ro vcc uvlo 6.5v 13.5v ?? vcc_ovp 2 7.5v 23.5v ?? zt zt_ovp 3.50v vdd<2.6v 100us ?`? isns open - - min on rg short - - max duty ocp 2.50v vdd<2.6v 100us ?`? vhv vhv_ovp 5.0v > < 5.0v ?? tsd 175 155 ?? current average calculation non-isolation current average calculation isolation vi (2) isosel(8) bstdc(10) output cueernt burst mode setting 625mv figure 3. bd552jl block diagram
7/23 datasheet datasheet BD552JLFv/f tsz02201-0f1f0c300030-1-2 2013.10.07 rev.001 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15? 001 block descriptions ( 1 ) bootstrap circuit ( 1 -1) start sequence the details for each block are described in following sections. soft start burst mode a switching stop vcc=13.5v vcc=7.5v vcc=7.0v vcc vhv vdd out i_led c bdef figure 4. start sequence a : vcc pin voltage 1pin increases, when vcc vuvlo1 typ =13.5v . the ic starts to work. when the protection function is no rmal, the switching begins. in this case, due to the power consumption of vcc pin, the voltag e of vcc has to be decreased. while the power supply circuit, wh ich is composed by the transistor auxiliary winding of the dcdc section, is set, the power supply to vcc is possible by the switching operation. b : due to the built-in soft start f unction, the voltage of isns pin 11pin can be adjusted without an excessive voltage or increase in current. (soft start time : typ =100ms) c : while the switching begins, the led turns on. d : when reducing the led current to a low dimming rate, the led is turned on by burst operation. bstdc=h e : vcc pin voltage (1pin) decreases, when the vcc pin voltage 1pin vuvlo1 typ =13.5v , the switching operat ion restarts, and the charging is proceeded by the auxiliary wi nding of the transistor. then, chargi ng from the bootstrap circuit stops.
8/23 datasheet datasheet BD552JLFv/f tsz02201-0f1f0c300030-1-2 2013.10.07 rev.001 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15? 001 (2) dc/dc driver the control mode used in this ic is pfm (pulse freque ncy modulation) mode. by monitoring the isns pin (11pin) and zt pin (13pin), it supports an optimum system as dc/dc. the on duty (turn off) of the switching mosfet is controlled by isns pin(11pin), and the off duty (turn on) is controlled by zt pin 13pin . the details are explained as follows. (refer to figure 5) figure 5. dcdc block diagram
9/23 datasheet datasheet BD552JLFv/f tsz02201-0f1f0c300030-1-2 2013.10.07 rev.001 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15? 001 (2-1) on duty operation turn off of the led current control by monitoring the coil current through the isns pin during the on phase of the switching, the sw itching controller controls the average current in the coil to keep the value to what is set by the r3 resistor. in the example of the application circuit show n in figure 6, while the mn1 is off, the current flows through the regenerative diode. figure 6. current control section application circuit the setting of the led current is determined by controlling the average current in the coil. the average led current iled_ave can be set by the resistor r3 which is connected to the isns pin. the set current can be calculated by the formula below, and visns which is the voltage for the av erage current setting is 500mv(typ). buck converter non-isolated topology isosel=l iled_ave = visns r3 fly-back converter isolated topology isosel=h iled_ave = visns r3 lp ls while using the fly-back topology, lp, ls means the l value of the primary side and the secondary side of t1 respectively. led current setting by r3 buck or fly-back lp:ls=1:1 in case of fly-back topology, due to the dispersion of the transistor turn ratio of the primary and secondary side, and the pow er supply to the auxiliary winding, there may be a difference betw een the theoretical value and t he true value of the led current. in this case, the value of the r3 has to be adjusted. r3 average led current 5.10? 98ma 2.00? 250ma 1.50? 333ma 1.00? 500ma 0.75? 667ma 0.68? 735ma vdd zt out isns d1 d2 t1 c1 c2 c3 r1 r2 r3 r4 d3 mn1 led+ led-
10/23 datasheet datasheet BD552JLFv/f tsz02201-0f1f0c300030-1-2 2013.10.07 rev.001 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15? 001 (2-2) leb leading edge blanking function while the switching mosfet turns on, surge current is produced due to parasitic capacitance and drive current causing the voltage of isns pin(11pin) to increase for a moment which ma y result to a false detection in circuit current limit. for prevent ing the isns pin from false detection, after out pin (5pin) l->h, a blanking function, wh ich masks the isns pin for t leb typ=200ns time is built in. owing to this blanking function, the noise filter can be reduced. isns i_l out l.e.b, t_leb=200ns figure 7. leb operation while isns detected (2-3) off duty operations turn on the off duty control is proceeded by the zt pin (13pin).during the off phase of t he switching, secondary output capacitor is charged by the electric power which is stored in the coil. when the charging is over, the current in the secondary side becomes zero, triggering the resonance operation to start. t he resonance operation is caused by the capacitance between the transistor and the vds of the mosfet. this resonance waveform is divided by r1 and r2, and the resulting voltage is serves as an input to zt pin (13pin). when this voltage level is lower than v zt (typ=100mv), the bottom is triggered by the zt comparator. the real bottom and the trigger time of the compar ator can be adjusted by the time constant decided by c4, r1 and r2 which are set around the zt pin (13pin). isns i_l out 100mv zt drain zt isns out 100mv figure 8. zero-cross trigger by zt pin otherwise, a zt trigger mask function instructed in 2-4 and a zt timeout function instructed in 2-5 are built in.
11/23 datasheet datasheet BD552JLFv/f tsz02201-0f1f0c300030-1-2 2013.10.07 rev.001 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15? 001 2-4 zt trigger mask function during the switching from on to off, the noise may occur at zt pin (13pin). in this case, to prevent the zt pin from malfunctioning, the function of zt pin is masked for a t ztmask time typ=600ns . figure 9. zt trigger mask function a: dc/dc off=>on b: dc/dc on=>off c: due to the noise that may occur at zt pin, the function of zt pin is masked for a t ztmask time. (2-5) zt timeout function after the signal is triggered by zt converter and the next tr igger does not occur at a given time (timeout time), the switchi ng turns on forcibly. while the secondary output voltage is low such as when the ic starts, the auxiliary winding voltage va becomes low too, and the voltage of zt pin (1pin) is lower than v zt2 (typ =100mv). in this case, the zt timeout function make s the switching turning on forcibly. figure 10. zt timeout function a: zt v zt1 , out turns on by the bottom trigger. b: dc/dc on=>off and zt>vzt2, the timeout function does not work. c: the noise occurs at zt pin, due to the t ztmask , zt comparator does not work. d: zt< vzt1, out turns on by the bottom trigger. e: dc/dc on=>off and zton forcibly. timeout operation
12/23 datasheet datasheet BD552JLFv/f tsz02201-0f1f0c300030-1-2 2013.10.07 rev.001 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15? 001 r6 osc(7) time out riset r5 isns(11) out(12) s r q leb 200ns d3 mn1 r4 ztcomp figure 11. osc pin setting timeout time can be set by the resistance which is connected to the osc pin 7pin , and when there is no bottom trigger by zt, the switching operation follows the timeout operating frequency showed in table 2 below. when the timeout frequency is set to be too high, due to the out put of the out pin becomes h before the boundary conduction mode works, if there is no limit on the minimum operating frequency, please set the timeout operating frequency to 20khz by shorting the osc pin to the gnd. table 2. osc pin resistance and timeout operating frequency osc pin resistance r6 timeout operating frequency open 100khz 300k 28khz 150k 50khz 68k 120khz 27k 300khz gnd 20khz
13/23 datasheet datasheet BD552JLFv/f tsz02201-0f1f0c300030-1-2 2013.10.07 rev.001 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15? 001 (3) conversion of non-isolated topology / isolated topology this ic can support applications of both non-isolated (bu ck converter) and isolated (fly-back) topology by setting the isosel pin. item symbol min typ max unit settings isosel pin h input voltage v iso_enh 0.7 vdd - vdd+0.3 v isolated driver selection isosel pin l input voltage v iso_enl -0.3 - 0.3 vdd v non-isolated driver selection (3-1) non-isolated topolo gy (buck converter) an application with non-isolated buck converter can be selected by shorting the isosel pin to the gnd pin to gain a low level. by this setting, the circuit inside the ic for calcul ating the led current is based on buck topology. the basic applicat ion circuit is shown in figure 12. zt out isns d1 d2 t1 c1 r1 r2 r3 r4 d3 mn1 led+ led- isosel vdd vin figure 12. non-isolated buck converter circuit (3-2) isolated topology (fly-back converter) an application with isolated fly-back topology can be selected by shorting the isosel pin to the vdd pin to gain a high level. monitoring the current in the coil by the isns pin, an isolated application with a high current control precision can be achieved even without the photocoupler. zt out isns d1 d2 t1 c1 r1 r2 r3 r4 d3 mn1 led+ led- isosel vdd vin figure 13. isolated fly-back converter circuit
14/23 datasheet datasheet BD552JLFv/f tsz02201-0f1f0c300030-1-2 2013.10.07 rev.001 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15? 001 ( 4 ) dimming operations (4-1) dimming modes this ic supports dimming modes of both the on duty of the pulse signal and t he dc signal level. the shift between pwm dimming mode and the linear dimming mode can be achieved by setting dimsel pin 3pin . the block diagram of the dimming settings is shown in figure 14. in addition, the selection of the dimming modes which is decided by the dimsel 3pin voltage is shown in the table below. figure 14. dimming mode setting using dimsel pin item symbol min typ max unit settings dimsel pin h input voltage v iso_enh 0.7vdd vdd vdd+0.3 v dim pin input : pwm dimming dimsel pin m input voltage v iso_enl 1.20 1.45 1.70 v dim pin input : linear dimming dimsel pin l input voltage v iso_enl -0.3 - 0.3 v vhv pin input : pwm dimming the dimsel pin settings are shown in figure 15. pwm dimming mode setting by shorting dimsel pin to vdd pin, linear dimming mode setting by shorting dimsel pin to the vdd voltage divider r7 and r8 recommended : r7=56k ? r8=43k ?. for the dimming signal to input to dim pin, please refer to the table below. vdd dimsel dim reg vhv pulse input 1khz 0%- 100% select pwm dim dimming control vdd dimsel dim reg vhv 10bit adc select linear dim dimming control r7 r8 dc input 0v- 2.4v(fullscale) circuit example for pin settings of pwm dimming mode circuit example for pin settings of linear dimming mode figure 15. dimsel pin settings and dimming inputs dimsel=hpwm dimming settings item symbol min typ max unit settings dim pin h input voltage vdimh 0.7vdd - vdd+0.3 v dimsel=vdd (pwm dimming) dim pin l input voltage vdiml -0.3 - 0.3vdd v dimsel=vdd (pwm dimming) dim pin pwm dimming frequency range fdim 0.08 - 4.1 khz dimsel=vdd (pwm dimming) dimsel=mlinear dimming settings dim pin linear dimming input voltage range vdimh 0.3 - 2.4 v dimsel=1.45v (linear dimming)
15/23 datasheet datasheet BD552JLFv/f tsz02201-0f1f0c300030-1-2 2013.10.07 rev.001 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15? 001 (4-2) led current output mode in each dimming mode, when a low dimming rate of less than 20% of led current is needed, the burst mode for led output current can be selected. by setting bstdc=h, the led output driver enters burst operation. hence, a deep dimming operation can be achieved. the settings for bstdc pin are shown in the table below. item symbol min typ max unit settings bstdc pin h input voltage v bstdch 0.7 vdd - vdd+0.3 v dcburst output setting bstdc pin l input voltage v bstdcl -0.3 - 0.3 vdd v dc output setting out isns f_dim 20% 100% figure 16. dimming by burst output when the dimming rate is lower than 20%, the burst mode operates, as shown in figure 16, with burst frequency pf 900hz typ , the led current reduces with a decrease of the output time of the out pin which follows the decrease in the dimming proportion.
16/23 datasheet datasheet BD552JLFv/f tsz02201-0f1f0c300030-1-2 2013.10.07 rev.001 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15? 001 (4-3) led dimming curve the characteristic curves which show the proportion of t he output current in each dimming mode are shown in figure 17. 0.0 ? 10.0 ? 20.0 ? 30.0 ? 40.0 ? 50.0 ? 60.0 ? 70.0 ? 80.0 ? 90.0 ? 100.0 ? 0 20 40 60 80 100 output ? led ? current ? ratio ? [%] input ? duty ? [%] ? 0.0 ? 10.0 ? 20.0 ? 30.0 ? 40.0 ? 50.0 ? 60.0 ? 70.0 ? 80.0 ? 90.0 ? 100.0 ? 0.00 ? 0.50 ? 1.00 ? 1.50 ? 2.00 ? 2.50 ? output ? current ? ratio[%] dim ? input ? voltage ? [v] pwm dimming characteristic linear dimming characteristic figure 17. dimming characteristic curves ( 5 ) protection functions (5-1) vcc uvlo vcc uvlo function is achieved by a se lf-reset comparator which has a voltage hysteresis. the operation of this function is shown in figure 18. figure 18. vcc uvlo time chart (5-2) zt pin (13pin) ovp(over voltage protection) ovp (over voltage protection) function is built in zt pin (13pin). the protection mode for ovp protection is latch. zt ovp function supports a dc trigger to zt pin. to prevent zt ovp from malfunctioning, t latch typ=100us timer is built in.
17/23 datasheet datasheet BD552JLFv/f tsz02201-0f1f0c300030-1-2 2013.10.07 rev.001 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15? 001 (5-3) isns pin (11pin) open protection when the isns pin 11pin is open, to prevent the out pin 12pin from malfunctioning caused by noise, an open protection circuit for isns pin is built in. the switching of the out pin 12pin stops. (100us timer latch protection) when the isns pin (11pin) is open. nout leading edge blanking 5 out cs rs 3 pre driver pout current sense (v-v change) normal : 1.0 fbolp_oh sq r vref(4v) 1m vccovp and and timeout or bottom det figure 19. isns pin open protection circuit (5-4) out pin 12pin clamp function to protect the external mosfet, the h level of the out pin is clamped at v outh typ=12.5v . this function prevents the damaging the mosfet which is caused by the rising of the voltage of vcc pin 1pin .the out pin 12pin is pulled down by r pdout (typ=100k ? ) internally. figure 20. out pin 12pin schematic nout 12 out pre driver pout 12v clamp circuit 1 vcc rs isns 11 r pdout
18/23 datasheet datasheet BD552JLFv/f tsz02201-0f1f0c300030-1-2 2013.10.07 rev.001 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15? 001 operation modes of protection circuit all operation modes of the different protection circuits are shown in table 4. table 4. operation modes of protection circuit anomaly detection trigger release protecting operation while triggered vcc uvlo 6.5v 13.5v self-reset vcc_ovp 27.5v 23.5v self-reset zt zt_ovp 3.00v vdd<2.6v 100us timer latch isns open - - min on time operation short - - max duty operation ocp 2.50v vdd<2.6v 100us timer latch vhv vhv_ovp 5.0v > < 5.0v self-reset tsd 175 155 self-reset power dissipation according to the thermal design, please observe the conditions below when using this ic. (the temperatures shown below are guaranteed temperatures, please consider the margin during application.) 1. the ambient temperature ta must be 105 or less. 2. the consumption of the ic must be within the allowable dissipation p d . the thermal dissipation characteristics are as follows. (pcb: 70 mm 70mm 1.6 mm, mounted on glass epoxy substrate) figure 21-1. ssop-b14 thermal dissipation characteristics figure 21-2. sop14 thermal dissipation characteristics 0 100 200 300 400 500 600 0 102030405060708090100110120130140150160 power disspation : pd [mw] temperature : ta [] 0 100 200 300 400 500 600 0 10 20 30 40 50 60 70 80 90 100 110 120 130 140 150 160 power disspation : pd [mw] temperature : ta []
19/23 datasheet datasheet BD552JLFv/f tsz02201-0f1f0c300030-1-2 2013.10.07 rev.001 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15? 001 operational notes 1. reverse connection of power supply connecting the power supply in reverse polarity can damage the ic. take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the ic?s power supply terminals. 2. power supply lines design the pcb layout pattern to provide low impedance s upply lines. separate the ground and supply lines of the digital and analog blocks to prevent noise in the ground and supply lines of the digital bl ock from affecting the analog block. furthermore, connect a capacitor to ground at all po wer supply pins. consider t he effect of temperature and aging on the capacitance value when using electrolytic capacitors . 3. ground voltage ensure that no pins are at a voltage below that of t he ground pin at any time, even during transient condition. 4. ground wiring pattern when using both small-signal and large-current ground traces , the two ground traces should be routed separately but connected to a single ground at the refer ence point of the application board to av oid fluctuations in the small-signal ground caused by large currents. also ensure that the grou nd traces of external components do not cause variations on the ground voltage. the ground lines must be as s hort and thick as possible to reduce line impedance. 5. thermal consideration should by any chance the power dissipation rating be exceed ed the rise in temperature of the chip may result in deterioration of the properties of the ch ip. the absolute maximum rating of the pd stated in this specification is when the ic is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. in case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the pd rating. 6. recommended operating conditions these conditions represent a range within which the expected characteristics of the ic can be approximately obtained. the electrical characteristics are guaranteed under the conditions of each parameter. 7. inrush current when power is first supplied to the ic, it is possible that th e internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the ic has more than one power supply. therefore, give special consider ation to power coupling capacitance, power wiring, width of ground wiring, and routing of connections. 8. operation under strong electromagnetic field operating the ic in the presence of a strong electromagnetic field may cause the ic to malfunction. 9. testing on application boards when testing the ic on an application board, connecting a capacitor directly to a low-impedance output pin may subject the ic to stress. always discharge capacitors comp letely after each process or step. the ic?s power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. to prevent damage from static discharge, ground the ic during assembly and use similar precautions during transport and storage. 10. inter-pin short and mounting errors ensure that the direction and position are correct when mounting the ic on the pc b. incorrect mounting may result in damaging the ic. avoid nearby pins being shorted to each ot her especially to ground, power supply and output pin. inter-pin shorts could be due to many reasons such as meta l particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few.
20/23 datasheet datasheet BD552JLFv/f tsz02201-0f1f0c300030-1-2 2013.10.07 rev.001 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15? 001 operational notes ? continued 11. unused input terminals input terminals of an ic are often connected to the gate of a mos transistor. the gate has extremely high impedance and extremely low capacitance. if left unc onnected, the electric fiel d from the outside can easily charge it. the small charge acquired in this way is enough to produce a signifi cant effect on the conducti on through the transistor and cause unexpected operation of the ic. so unless otherwise specified, unused input terminals should be connected to the power supply or ground line. 12. regarding the input pin of the ic this monolithic ic contains p+ isolation and p substrat e layers between adjacent elements in order to keep them isolated. p-n junctions are formed at the intersection of the p layers with the n layers of other elements, creating a parasitic diode or transistor. for example (refer to figure below): when gnd > pin a and gnd > pin b, the p-n j unction operates as a parasitic diode. when gnd > pin b, the p-n junction operates as a parasitic transistor. parasitic diodes inevitably occur in the structure of the ic. the operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical dam age. therefore, conditions that cause these diodes to operate, such as applying a voltage lower than the gnd voltage to an input pin (and thus to the p substrate) should be avoided. figure xx. example of monolithic ic structure 13. ceramic capacitor when using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with temperature and the decrease in nominal capacitance due to dc bias and others. 14. area of safe operation (aso) operate the ic such that the output voltage, output current, and power dissipation are all within the area of safe operation (aso). 15. thermal shutdown circuit(tsd) this ic has a built-in thermal shutdown circuit that prev ents heat damage to the ic. normal operation should always be within the ic?s power dissipation rating. if however the rating is exceeded for a continued period, the junction temperature (tj) will rise which will activate the tsd circui t that will turn off all output pins. when the tj falls below the tsd threshold, the circuits are automatically restored to normal operation. note that the tsd circuit operates in a situation that exceeds the absolut e maximum ratings and therefore, under no circumstances, should the tsd circuit be used in a set design or for any purpose other t han protecting the ic from heat damage. 16. over current protection circuit (ocp) this ic incorporates an integrated over current protection circuit that is acti vated when the load is shorted. this protection circuit is effective in preventing damage due to sudden and unexpected incidents. however, the ic should not be used in applications characterized by continuous operation or transit ioning of the protection circuit.
21/23 datasheet datasheet BD552JLFv/f tsz02201-0f1f0c300030-1-2 2013.10.07 rev.001 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15? 001 physical dimension, tape and reel information package name ssop-b14 ? order quantity needs to be multiple of the minimum quantity. embossed carrier tape tape quantity direction of feed the direction is the 1pin of product is at the upper left when you hold reel on the left hand and you pull out the tape on the right hand 2500pcs e2 () direction of feed reel 1pin
22/23 datasheet datasheet BD552JLFv/f tsz02201-0f1f0c300030-1-2 2013.10.07 rev.001 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15? 001 package name sop14 ? order quantity needs to be multiple of the minimum quantity. embossed carrier tape tape quantity direction of feed the direction is the 1pin of product is at the upper left when you hold reel on the left hand and you pull out the tape on the right hand 2500pcs e2 () direction of feed reel 1pin
23/23 datasheet datasheet BD552JLFv/f tsz02201-0f1f0c300030-1-2 2013.10.07 rev.001 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15? 001 ordering information b d 5 5 2 j l x x - e2 part no. package fv:ssop-b14 f:sop14 packaging and forming specification e2: embossed tape and reel none: tray, tube marking diagram -22-1 ssop-b14 package view -22-2 sop14 package view 1pin mark product name BD552JLF lot no. 1pin mark 552jl product name lot no.
datasheet d a t a s h e e t notice - ge rev.002 ? 2014 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. our products are designed and manufac tured for application in ordinary elec tronic equipments (such as av equipment, oa equipment, telecommunication equipment, home electroni c appliances, amusement equipment, etc.). if you intend to use our products in devices requiring ex tremely high reliability (such as medical equipment (note 1) , transport equipment, traffic equipment, aircraft/spacecra ft, nuclear power controllers, fuel c ontrollers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (?specific applications?), please consult with the rohm sale s representative in advance. unless otherwise agreed in writing by rohm in advance, ro hm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ro hm?s products for specific applications. (note1) medical equipment classification of the specific applications japan usa eu china class class class b class class class 2. rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe desi gn against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditio ns, as exemplified below. accordin gly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of an y rohm?s products under any special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or conditions (as exemplified bel ow), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, incl uding water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products ar e exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing components, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (ev en if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subjec t to radiation-proof design. 5. please verify and confirm characteristics of the final or mounted products in using the products. 6. in particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse. is applied, confirmation of performance characteristics after on-boar d mounting is strongly recomm ended. avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading c ondition may negatively affect product performance and reliability. 7. de-rate power dissipation (pd) depending on ambient temper ature (ta). when used in seal ed area, confirm the actual ambient temperature. 8. confirm that operation temperat ure is within the specified range descr ibed in the product specification. 9. rohm shall not be in any way responsible or liable for fa ilure induced under deviant condi tion from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlori ne, bromine, etc.) flux is used, the resi due of flux may negatively affect product performance and reliability. 2. in principle, the reflow soldering method must be used; if flow soldering met hod is preferred, please consult with the rohm representative in advance. for details, please refer to rohm mounting specification
datasheet d a t a s h e e t notice - ge rev.002 ? 2014 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, pl ease allow a sufficient margin c onsidering variations of the characteristics of the products and external components, including transient characteri stics, as well as static characteristics. 2. you agree that application notes, re ference designs, and associated data and in formation contained in this document are presented only as guidance for products use. theref ore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take proper caution in your manufacturing process and storage so that voltage exceeding t he products maximum rating will not be applied to products. please take special care under dry condit ion (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, se tting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriora te if the products are stor ed in the places where: [a] the products are exposed to sea winds or corros ive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to di rect sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage c ondition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm sol derability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the co rrect direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. use products within the specified time after opening a hum idity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage time period. precaution for product label qr code printed on rohm products label is for rohm?s internal use only. precaution for disposition when disposing products please dispose them proper ly using an authorized industry waste company. precaution for foreign exchange and foreign trade act since our products might fall under cont rolled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with rohm representative in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to application example contain ed in this document is for reference only. rohm does not warrant that foregoi ng information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. rohm shall not be in any way responsible or liable for infringement of any intellectual property rights or ot her damages arising from use of such information or data.: 2. no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the information contained in this document. other precaution 1. this document may not be reprinted or reproduced, in whol e or in part, without prior written consent of rohm. 2. the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. in no event shall you use in any wa y whatsoever the products and the related technical information contained in the products or this document for any military purposes, incl uding but not limited to, the development of mass-destruction weapons. 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties.
datasheet datasheet notice ? we rev.001 ? 2014 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information.

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