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| ? 2009 microchip technology inc. ds21733j-page 1 mcp6001/1r/1u/2/4 features ? available in sc-70-5 and sot-23-5 packages ? gain bandwidth product: 1 mhz (typical) ? rail-to-rail input/output ? supply voltage: 1.8v to 6.0v ? supply current: i q = 100 a (typical) ? phase margin: 90 (typical) ? temperature range: - industrial: -40c to +85c - extended: -40c to +125c ? available in single, dual and quad packages applications ? automotive ? portable equipment ? photodiode amplifier ? analog filters ? notebooks and pdas ? battery-powered systems design aids ? spice macro models ? filterlab ? software ? mindi? circuit designer & simulator ? microchip advanced part selector (maps) ? analog demonstration and evaluation boards ? application notes typical application description the microchip technology inc. mcp6001/2/4 family of operational amplifiers (op amps) is specifically designed for general-purpose applications. this family has a 1 mhz gain bandwidth product (gbwp) and 90 phase margin (typical). it also maintains 45 phase margin (typical) with a 500 pf capacitive load. this family operates from a single supply voltage as low as 1.8v, while drawing 100 a (typical) quiescent current. additionally, the mcp6001/2/ 4 supports rail-to-rail input and output swing, with a common mode input voltage range of v dd + 300 mv to v ss ? 300 mv. this family of op amps is designed with microchip?s advanced cmos process. the mcp6001/2/4 family is available in the industrial and extended temperature ranges, with a power supply range of 1.8v to 6.0v. package types r 1 v out r 2 v in v dd + ? gain 1 r 1 r 2 ----- - + = non-inverting amplifier mcp6001 v ref v ss 4 5 4 5 4 mcp6001 1 2 3 - + 5 v dd v in ? v out v ss v in + sc70-5, sot-23-5 mcp6002 pdip, soic, msop mcp6004 v ina + v ina ? v ss 1 2 3 4 14 13 12 11 - v outa + - + v dd v outd v ind ? v ind + 10 9 8 5 6 7 v outb v inb ? v inb +v inc + v inc ? v outc + - - + pdip, soic, tssop v ina + v ina ? v ss 1 2 3 4 8 7 6 5 - v outa + - + v dd v outb v inb ? v inb + 4 1 2 3 - + 5 v dd v out v ss mcp6001r sot-23-5 1 2 3 - + v ss v in ? v out v dd v in + mcp6001u sot-23-5 1 2 3 - + v dd v out v in + v ss v in ? mcp6002 v ina + v ina ? v ss v outb v inb ? 1 2 3 4 8 7 6 5 v inb + v outa ep 9 v dd 2x3 dfn * * includes exposed thermal pad (ep); see ta b l e 3 - 1 . 1 mhz, low-power op amp
mcp6001/1r/1u/2/4 ds21733j-page 2 ? 2009 microchip technology inc. notes: ? 2009 microchip technology inc. ds21733j-page 3 mcp6001/1r/1u/2/4 1.0 electrical characteristics absolute maximum ratings ? v dd ?v ss ........................................................................7.0v current at analog input pins (v in +, v in ?).....................2 ma analog inputs (v in +, v in ?) ?? ........ v ss ?1.0vtov dd +1.0v all other inputs and outputs ......... v ss ? 0.3v to v dd +0.3v difference input voltage ...................................... |v dd ?v ss | output short circuit current ................................ continuous current at output and supply pins ............................30 ma storage temperature ................................... ?65c to +150c maximum junction temperature (t j )......................... .+150c esd protection on all pins (hbm; mm) .............. 4 kv; 200v ? notice: stresses above those listed under ?absolute maximum ratings? may cause permanent damage to the device. this is a stress rati ng only and functional operation of the device at those or any other conditions above those indicated in the operational listi ngs of this specification is not implied. exposure to maximu m rating conditions for extended periods may affect device reliability. ?? see section 4.1.2 ?input voltage and current limits? . dc electrical specifications electrical characteristics : unless otherwise indicated, t a = +25c, v dd = +1.8v to +5.5v, v ss = gnd, v cm = v dd /2, v l = v dd /2, r l = 10 k to v l , and v out v dd /2 (refer to figure 1-1 ). parameters sym min typ max units conditions input offset input offset voltage v os -4.5 ? +4.5 mv v cm = v ss (note 1) input offset drift with temperature v os / t a ?2.0?v/ct a = -40c to +125c, v cm = v ss power supply rejection ratio psrr ? 86 ? db v cm = v ss input bias current and impedance input bias current: i b ? 1.0 ? pa industrial temperature i b ?19?pat a = +85c extended temperature i b ? 1100 ? pa t a = +125c input offset current i os ? 1.0 ? pa common mode input impedance z cm ?10 13 ||6 ? ||pf differential input impedance z diff ?10 13 ||3 ? ||pf common mode common mode input range v cmr v ss ? 0.3 ? v dd + 0.3 v common mode rejection ratio cmrr 60 76 ? db v cm = -0.3v to 5.3v, v dd = 5v open-loop gain dc open-loop gain (large signal) a ol 88 112 ? db v out = 0.3v to v dd ? 0.3v, v cm =v ss output maximum output voltage swing v ol , v oh v ss + 25 ? v dd ? 25 mv v dd = 5.5v, 0.5v input overdrive output short circuit current i sc ?6?mav dd = 1.8v ?23?mav dd = 5.5v power supply supply voltage v dd 1.8 ? 6.0 v note 2 quiescent current per amplifier i q 50 100 170 a i o = 0, v dd = 5.5v, v cm = 5v note 1: mcp6001/1r/1u/2/4 parts with date codes prior to decem ber 2004 (week code 49) were tested to 7 mv minimum/ maximum limits. 2: all parts with date codes november 2007 and la ter have been screened to ensure operation at v dd = 6.0v. however, the other minimum and maximum specifications are measured at 1.8v and 5.5v. mcp6001/1r/1u/2/4 ds21733j-page 4 ? 2009 microchip technology inc. ac electrical specifications temperature specifications electrical characteristics: unless otherwise indicated, t a = +25c, v dd = +1.8 to 5.5v, v ss = gnd, v cm = v dd /2, v l = v dd /2, v out v dd /2, r l = 10 k to v l , and c l = 60 pf (refer to figure 1-1 ). parameters sym min typ max units conditions ac response gain bandwidth product gbwp ? 1.0 ? mhz phase margin pm ? 90 ? g = +1 v/v slew rate sr ? 0.6 ? v/s noise input noise voltage e ni ? 6.1 ? vp-p f = 0.1 hz to 10 hz input noise voltage density e ni ?28?nv/ hz f = 1 khz input noise current density i ni ?0.6?fa/ hz f = 1 khz electrical characteristics: unless otherwise indicated, v dd = +1.8v to +5.5v and v ss = gnd. parameters sym min typ max units conditions temperature ranges industrial temperature range t a -40 ? +85 c extended temperature range t a -40 ? +125 c operating temperature range t a -40 ? +125 c note storage temperature range t a -65 ? +150 c thermal package resistances thermal resistance, 5l-sc70 ja ? 331 ? c/w thermal resistance, 5l-sot-23 ja ? 256 ? c/w thermal resistance, 8l-pdip ja ?85?c/w thermal resistance, 8l-soic (150 mil) ja ?163?c/w thermal resistance, 8l-msop ja ?206?c/w thermal resistance, 8l-dfn (2x3) ja ?68?c/w thermal resistance, 14l-pdip ja ? 70 ? c/w thermal resistance, 14l-soic ja ? 120 ? c/w thermal resistance, 14l-tssop ja ? 100 ? c/w note: the industrial temperature devices operate over this extended temperature range, but with reduced performance. in any case, the internal junction temperature (t j ) must not exceed th e absolute maximum specification of +150c. ? 2009 microchip technology inc. ds21733j-page 5 mcp6001/1r/1u/2/4 1.1 test circuits the circuit used for most dc and ac tests is shown in figure 1-1 . this circuit can independently set v cm and v out ; see equation 1-1 . note that v cm is not the circuit?s common mode voltage ((v p +v m )/2), and that v ost includes v os plus the effects (on the input offset error, v ost ) of temperature, cmrr, psrr and a ol . equation 1-1: figure 1-1: ac and dc test circuit for most specifications. g dm r f r g ? = v cm v p v dd 2 ? + () 2 ? = v out v dd 2 ? () v p v m ? () v ost 1g dm + () ++ = where: g dm = differential mode gain (v/v) v cm = op amp?s common mode input voltage (v) v ost = op amp?s total input offset voltage (mv) v ost v in? v in+ ? = v dd r g r f v out v m c b2 c l r l v l c b1 100 k 100 k r g r f v dd /2 v p 100 k 100 k 60 pf 10 k 1f 100 nf v in? v in+ c f 6.8 pf c f 6.8 pf mcp600x mcp6001/1r/1u/2/4 ds21733j-page 6 ? 2009 microchip technology inc. notes: ? 2009 microchip technology inc. ds21733j-page 7 mcp6001/1r/1u/2/4 2.0 typical performance curves note: unless otherwise indicated, t a = +25c, v dd = +1.8v to +5.5v, v ss = gnd, v cm = v dd /2, v out v dd /2, v l = v dd /2, r l = 10 k to v l , and c l = 60 pf. figure 2-1: input offset voltage. figure 2-2: input offset voltage drift. figure 2-3: input offset quadratic temp. co. figure 2-4: input offset voltage vs. common mode input voltage at v dd = 1.8v. figure 2-5: input offset voltage vs. common mode input voltage at v dd = 5.5v. figure 2-6: input offset voltage vs. output voltage. note: the graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purpose s only. the performance characteristics listed herein are not tested or guaranteed. in so me graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power suppl y range) and therefore outs ide the warranted range. 0% 2% 4% 6% 8% 10% 12% 14% 16% 18% 20% 5-4-3-2-1012345 input offset voltage (mv) percentage of occurrences 64,695 samples v cm = v ss 0% 2% 4% 6% 8% 10% 12% 14% 16% 18% -12 -10 -8 -6 -4 -2 0 2 4 6 8 10 12 input offset voltage drift; tc 1 (v/c) percentage of occurrences 2453 samples t a = -40c to +125c v cm = v ss 0% 5% 10% 15% 20% 25% 30% 35% 40% 45% -0.02 -0.01 0.00 0.01 0.02 0.03 0.04 0.05 0.06 0.07 input offset quadratic temp. co.; tc 2 (v/c 2 ) percentage of occurrences 2453 samples t a = -40c to +125c v cm = v ss -700 -600 -500 -400 -300 -200 -100 0 -0.4 -0.2 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 common mode input voltage (v) input offset voltage (v) v dd = 1.8v t a = -40c t a = +25c t a = +85c t a = +125c -700 -600 -500 -400 -300 -200 -100 0 -0.5 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 common mode input voltage (v) input offset voltage (v) v dd = 5.5v t a = -40c t a = +25c t a = +85c t a = +125c -200 -150 -100 -50 0 50 100 150 200 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 output voltage (v) input offset voltage (v) v dd = 1.8v v cm = v ss v dd = 5.5v mcp6001/1r/1u/2/4 ds21733j-page 8 ? 2009 microchip technology inc. note: unless otherwise indicated, t a = +25c, v dd = +1.8v to +5.5v, v ss = gnd, v cm = v dd /2, v out v dd /2, v l = v dd /2, r l = 10 k to v l , and c l = 60 pf. figure 2-7: input bias current at +85c. figure 2-8: input bias current at +125c. figure 2-9: cmrr, psrr vs. ambient temperature. figure 2-10: psrr, cmrr vs. frequency. figure 2-11: open-loop gain, phase vs. frequency. figure 2-12: input noise voltage density vs. frequency. 0% 2% 4% 6% 8% 10% 12% 14% 0 3 6 9 12 15 18 21 24 27 30 input bias current (pa) percentage of occurrences 1230 samples v dd = 5.5v v cm = v dd t a = +85c 0% 5% 10% 15% 20% 25% 30% 35% 40% 45% 50% 55% 0 150 300 450 600 750 900 1050 1200 1350 1500 input bias current (pa) percentage of occurrences 605 samples v dd = 5.5v v cm = v dd t a = +125c 70 75 80 85 90 95 100 -50 -25 0 25 50 75 100 125 ambient temperature (c) psrr, cmrr (db) psrr (v cm = v ss ) cmrr (v cm = -0.3v to +5.3v) v dd = 5.0v 20 30 40 50 60 70 80 90 100 1.e+01 1.e+02 1.e+03 1.e+04 1.e+05 frequency (hz) psrr, cmrr (db) psrr+ cmrr psrr? v cm = v ss 10 100 1k 10k 100k -20 0 20 40 60 80 100 120 1.e- 01 1.e+ 00 1.e+ 01 1.e+ 02 1.e+ 03 1.e+ 04 1.e+ 05 1.e+ 06 1.e+ 07 frequency (hz) open-loop gain (db) -210 -180 -150 -120 -90 -60 -30 0 open-loop phase () 0.1 1 10 100 10k 100k 1m 10m phase gain 1k v cm = v ss 10 100 1,000 1.e-01 1.e+0 0 1.e+0 1 1.e+0 2 1.e+0 3 1.e+0 4 1.e+0 5 frequency (hz) input noise voltage density (nv/ hz) 0.1 10 1 100 10k 1k 100k ? 2009 microchip technology inc. ds21733j-page 9 mcp6001/1r/1u/2/4 note: unless otherwise indicated, t a = +25c, v dd = +1.8v to +5.5v, v ss = gnd, v cm = v dd /2, v out v dd /2, v l = v dd /2, r l = 10 k to v l , and c l = 60 pf. figure 2-13: output short circuit current vs. power supply voltage. figure 2-14: output voltage headroom vs. output current magnitude. figure 2-15: quiescent current vs. power supply voltage. figure 2-16: small-signal, non-inverting pulse response. figure 2-17: large-signal, non-inverting pulse response. figure 2-18: slew rate vs. ambient temperature. 0 5 10 15 20 25 30 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 power supply voltage (v) short circuit current magnitude (ma) t a = -40c t a = +25c t a = +85c t a = +125c 1 10 100 1,000 1.e-05 1.e-04 1.e-03 1.e-02 output current magnitude (a) output voltage headroom (mv) v dd ? v oh 10 10m 1m 100 v ol ? v ss 0 20 40 60 80 100 120 140 160 180 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 power supply voltage (v) quiescent current per amplifier (a) v cm = v dd - 0.5v t a = +125c t a = +85c t a = +25c t a = -40c -0.08 -0.06 -0.04 -0.02 0.00 0.02 0.04 0.06 0.08 0.e+00 1.e-06 2.e-06 3.e-06 4.e-06 5.e-06 6.e-06 7.e-06 8.e-06 9.e-06 1.e-05 time (1 s/div) output voltage (20 mv/div) g = +1 v/v 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 0.e+00 1.e-05 2.e-05 3.e-05 4.e-05 5.e-05 6.e-05 7.e-05 8.e-05 9.e-05 1.e-04 time (10 s/div) output voltage (v) g = +1 v/v v dd = 5.0v 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 -50 -25 0 25 50 75 100 125 ambient temperature (c) slew rate (v/s) v dd = 5.5v v dd = 1.8v rising edge falling edge mcp6001/1r/1u/2/4 ds21733j-page 10 ? 2009 microchip technology inc. note: unless otherwise indicated, t a = +25c, v dd = +1.8v to +5.5v, v ss = gnd, v cm = v dd /2, v out v dd /2, v l = v dd /2, r l = 10 k to v l , and c l = 60 pf. figure 2-19: output voltage swing vs. frequency. figure 2-20: measured input current vs. input voltage (below v ss ). figure 2-21: the mcp6001/2/4 show no phase reversal. 0.1 1 10 1.e+03 1.e+04 1.e+05 1.e+06 frequency (hz) output voltage swing (v p-p ) v dd = 5.5v 1k 10k 100k 1m v dd = 1.8v 1.e-12 1.e-11 1.e-10 1.e-09 1.e-08 1.e-07 1.e-06 1.e-05 1.e-04 1.e-03 1.e-02 -1.0 -0.9 -0.8 -0.7 -0.6 -0.5 -0.4 -0.3 -0.2 -0.1 0.0 input voltage (v) input current magnitude (a) +125c +85c +25c -40c 10m 1m 100 10 1 100n 10n 1n 100p 10p 1p -1 0 1 2 3 4 5 6 0.e+00 1.e-05 2.e-05 3.e-05 4.e-05 5.e-05 6.e-05 7.e-05 8.e-05 9.e-05 1.e-04 time (10 s/div) input, output voltages (v) v dd = 5.0v g = +2 v/v v in v out ? 2009 microchip technology inc. ds21733j-page 11 mcp6001/1r/1u/2/4 3.0 pin descriptions descriptions of the pins are listed in table 3-1 . table 3-1: pin function table 3.1 analog outputs the output pins are low-im pedance voltage sources. 3.2 analog inputs the non-inverting and inverting inputs are high-impedance cmos inputs with low bias currents. 3.3 power supply pins the positive power supply (v dd ) is 1.8v to 6.0v higher than the negative power supply (v ss ). for normal operation, the other pins are at voltages between v ss and v dd . typically, these parts are used in a single (positive) supply configuration. in this case, v ss is connected to ground and v dd is connected to the supply. v dd will need bypass capacitors. 3.4 exposed thermal pad (ep) there is an internal electrical connection between the exposed thermal pad (ep) and the v ss pin; they must be connected to the same potential on the printed circuit board (pcb). mcp6001 mcp6001r mcp6001u mcp6002 mcp6004 symbol description sc70-5, sot-23-5 sot-23-5 sot-23-5 msop, pdip, soic dfn 2x3 pdip, soic, tssop 11 4111v out , v outa analog output (op amp a) 44 3222v in ?, v ina ? inverting input (op amp a) 33 1333v in +, v ina + non-inverting input (op amp a) 52 5884v dd positive power supply ?? ?555v inb + non-inverting input (op amp b) ?? ?666 v inb ? inverting input (op amp b) ?? ?777v outb analog output (op amp b) ?? ???8v outc analog output (op amp c) ?? ???9v inc ? inverting input (op amp c) ?? ???10v inc + non-inverting input (op amp c) 25 24411v ss negative power supply ?? ???12v ind + non-inverting input (op amp d) ?? ???13v ind ? inverting input (op amp d) ?? ???14v outd analog output (op amp d) ? ? ? ? 9 ? ep exposed thermal pad (ep); must be connected to vss. mcp6001/1r/1u/2/4 ds21733j-page 12 ? 2009 microchip technology inc. notes: ? 2009 microchip technology inc. ds21733j-page 13 mcp6001/1r/1u/2/4 4.0 application information the mcp6001/2/4 family of op amps is manufactured using microchip?s state-of-the-art cmos process and is specifically designed for low-cost, low-power and general-purpose applications. the low supply voltage, low quiescent current and wide bandwidth makes the mcp6001/2/4 ideal for battery-powered applications. this device has high phase margin, which makes it stable for larger capacitive load applications. 4.1 rail-to-rail inputs 4.1.1 phase reversal the mcp6001/1r/1u/2/4 op amp is designed to prevent phase reversal when the input pins exceed the supply voltages. figure 2-21 shows the input voltage exceeding the supply voltage without any phase reversal . 4.1.2 input voltage and current limits the esd protection on the inputs can be depicted as shown in figure 4-1 . this structure was chosen to protect the input transistors, and to minimize input bias current (i b ). the input esd diodes clamp the inputs when they try to go more than one diode drop below v ss . they also clamp any voltages that go too far above v dd ; their breakdown voltage is high enough to allow normal operation, and low enough to bypass quick esd events within the specified limits. figure 4-1: simplified analog input esd structures. in order to prevent damage and/or improper operation of these op amps, the circuit they are in must limit the currents and voltages at the v in + and v in ? pins (see absolute maxi mum ratings ? at the beginning of section 1.0 ?electri cal characteristics? ). figure 4-2 shows the recommended approach to protecting these inputs. the internal esd diodes prevent the input pins (v in + and v in ?) from going too far below ground, and the resistors r 1 and r 2 limit the possible current drawn out of the input pins. diodes d 1 and d 2 prevent the input pins (v in + and v in ?) from going too far above v dd , and dump any currents onto v dd . when implemented as shown, resistors r 1 and r 2 also limit the current through d 1 and d 2 . figure 4-2: protecting the analog inputs. it is also possible to connect the diodes to the left of resistors r 1 and r 2 . in this case, current through the diodes d 1 and d 2 needs to be limited by some other mechanism. the resistors th en serve as in-rush current limiters; the dc current into the input pins (v in + and v in ?) should be very small. a significant amount of current can flow out of the inputs when the common mode voltage (v cm ) is below ground (v ss ); see figure 2-20 . applications that are high impedance may need to limit the usable voltage range. 4.1.3 normal operation the input stage of the mc p6001/1r/1u/2/4 op amps use two differential cmos input stages in parallel. one operates at low common mode input voltage (v cm ), while the other operates at high v cm . with this topology, the device operates with v cm up to 0.3v above v dd and 0.3v below v ss . the transition between the two input stages occurs when v cm = v dd ? 1.1v. for the best distortion and gain linearity, with non-invert ing gains, avoid this region of operation. 4.2 rail-to-rail output the output voltage range of the mcp6001/2/4 op amps is v dd ? 25 mv (minimum) and v ss +25mv (maximum) when r l =10k is connected to v dd /2 and v dd = 5.5v. refer to figure 2-14 for more information. bond pad bond pad bond pad v dd v in + v ss input stage bond pad v in ? v 1 mcp600x r 1 v dd d 1 r 1 > v ss ? (minimum expected v 1 ) 2ma r 2 > v ss ? (minimum expected v 2 ) 2ma v 2 r 2 d 2 r 3 mcp6001/1r/1u/2/4 ds21733j-page 14 ? 2009 microchip technology inc. 4.3 capacitive loads driving large capacitive loads can cause stability problems for voltage feedback op amps. as the load capacitance increases, the feedback loop?s phase margin decreases and the closed-loop bandwidth is reduced. this produces ga in peaking in the frequency response, with overshoot and ringing in the step response. while a unity-gain buffer (g = +1) is the most sensitive to capacitive loads, all gains show the same general behavior. when driving large capacitive loads with these op amps (e.g., > 100 pf when g = +1), a small series resistor at the output (r iso in figure 4-3 ) improves the feedback loop?s phase margin (stability) by making the output load resistive at higher frequencies. the bandwidth will be generally lower than the bandwidth with no capacitance load. figure 4-3: output resistor, r iso stabilizes large capacitive loads. figure 4-4 gives recommended r iso values for different capacitive loads and gains. the x-axis is the normalized load capacitance (c l /g n ), where g n is the circuit's noise gain. for non-inverting gains, g n and the signal gain are equal. for inverting gains, g n is 1+|signal gain| (e.g., -1 v/v gives g n = +2 v/v). figure 4-4: recommended r iso values for capacitive loads. after selecting r iso for your circuit, double-check the resulting frequency response peaking and step response overshoot. modify r iso ?s value until the response is reasonable. bench evaluation and simulations with the mcp6001/1r/1u/2/4 spice macro model are very helpful. 4.4 supply bypass with this family of operat ional amplifiers, the power supply pin (v dd for single-supply) should have a local bypass capacitor (i.e., 0.01 f to 0.1 f) within 2 mm for good high-frequency performance. it also needs a bulk capacitor (i.e., 1 f or larger) within 100 mm to provide large, slow currents. this bulk capacitor can be shared with nearby analog parts. 4.5 unused op amps an unused op amp in a quad package (mcp6004) should be configured as shown in figure 4-5 . these circuits prevent the output from toggling and causing crosstalk. circuits a sets the op amp at its minimum noise gain. the resistor divider produces any desired reference voltage within the output voltage range of the op amp; the op amp buffers that reference voltage. circuit b uses the minimum number of components and operates as a comparator, but it may draw more current. figure 4-5: unused op amps. 4.6 pcb surface leakage in applications where low input bias current is critical, printed circuit board (pcb) surface leakage effects need to be considered. surf ace leakage is caused by humidity, dust or other contamination on the board. under low humidity conditions, a typical resistance between nearby traces is 10 12 . a 5v difference would cause 5 pa of current to flow; which is greater than the mcp6001/1r/1u/2/4 family?s bi as current at 25c (typ- ically 1 pa). the easiest way to reduce surface leakage is to use a guard ring around sensitive pins (or traces). the guard ring is biased at the same voltage as the sensitive pin. an example of this type of layout is shown in figure 4-6 . v in r iso v out mcp600x c l ? + 10 100 1000 1.e-11 1.e-10 1.e-09 1.e-08 normalized load capacitance; c l /g n (f) recommended r iso ( ? ) g n = 1 g n 2 10p 10n 100p v dd = 5.0v r l = 100 k 1n v dd v dd ? mcp6004 (a) ? mcp6004 (b) r 1 r 2 v dd v ref v ref v dd r 2 r 1 r 2 + ------------------ ? = ? 2009 microchip technology inc. ds21733j-page 15 mcp6001/1r/1u/2/4 figure 4-6: example guard ring layout for inverting gain. 1. non-inverting gain and unity-gain buffer: a. connect the non-inverting pin (v in +) to the input with a wire that does not touch the pcb surface. b. connect the guard ring to the inverting input pin (v in ?). this biases the guard ring to the common mode input voltage. 2. inverting gain and transimpedance gain amplifiers (convert current to voltage, such as photo detectors): a. connect the guard ring to the non-inverting input pin (v in +). this biases the guard ring to the same reference voltage as the op amp (e.g., v dd /2 or ground). b. connect the inverting pin (v in ?) to the input with a wire that does not touch the pcb surface. 4.7 application circuits 4.7.1 unity-gain buffer the rail-to-rail input and output capability of the mcp6001/2/4 op amp is ideal for unity-gain buffer applications. the low quiescent current and wide bandwidth makes the device suitable for a buffer configuration in an instrum entation amplifier circuit, as shown in figure 4-7 . figure 4-7: instrumentation amplifier with unity-gain buffer inputs. 4.7.2 active low-pass filter the mcp6001/2/4 op amp?s low input bias current makes it possible for the designer to use larger resistors and smaller capacitors for active low-pass filter applications. however, as the resistance increases, the noise generated also increases. parasitic capacitances and the large value resistors could also modify the frequency response. these trade-offs need to be considered when selecting circuit elements. usually, the op amp bandwidth is 100x the filter cutoff frequency (or higher) for good performance. it is possible to have the op amp bandwidth 10x higher than the cutoff frequency, t hus having a design that is more sensitive to component tolerances. figure 4-8 shows a second-order butterworth filter with 100 khz cutoff frequency and a gain of +1 v/v; the op amp bandwidth is only 10x higher than the cutoff frequency. the component values were selected using microchip?s filterlab ? software. figure 4-8: active second-order low-pass filter. guard ring v ss v in -v in + v in1 r 2 mcp6002 v in2 r 2 mcp6002 v ref mcp6001 v out r 1 r 1 ? + ? + ? + 1/2 1/2 v out v in 2 v in 1 ? () r 1 r 2 ----- - ? v ref + = r 1 = 20 k r 2 = 10 k 14.3 k mcp6002 v out 53.6 k 100 pf v in 33 pf + ? mcp6001/1r/1u/2/4 ds21733j-page 16 ? 2009 microchip technology inc. 4.7.3 peak detector the mcp6001/2/4 op amp has a high input impedance, rail-to-rail input/output and low input bias current, which makes this device suitable for peak detector applications. figure 4-9 shows a peak detector circuit with clear and sample switches. the peak-detection cycle uses a clock (clk), as shown in figure 4-9 . at the rising edge of clk, sample switch closes to begin sampling. the peak voltage stored on c 1 is sampled to c 2 for a sample time defined by t samp . at the end of the sample time (falling edge of sample signal), clear signal goes high and closes the clear switch. when the clear switch closes, c 1 discharges through r 1 for a time defined by t clear . at the end of the clear time (falling edge of clear signal), op amp a begins to store the peak value of v in on c 1 for a time defined by t detect . in order to define t samp and t clear , it is necessary to determine the capacitor charging and discharging period. the capacitor charging time is limited by the amplifier source current, while the discharging time ( ) is defined using r 1 ( = r 1 c 1 ). t detect is the time that the input signal is sampled on c 1 and is dependent on the input voltage change frequency. the op amp output current limit, and the size of the storage capacitors (both c 1 and c 2 ), could create slewing limitations as the input voltage (v in ) increases. current through a capacitor is dependent on the size of the capacitor and the rate of voltage change. from this relationship, the rate of voltage change or the slew rate can be determined. for example, with an op amp short circuit current of i sc = 25 ma and a load capacitor of c 1 = 0.1 f, then: equation 4-1: this voltage rate of change is less than the mcp6001/2/4 slew rate of 0.6 v/s. when the input voltage swings below the voltage across c 1 , d 1 becomes reverse- biased. this opens the feedback loop and rails the amplifier. when the input voltage increases, the amplifier recovers at its slew rate. ba sed on the rate of voltage change shown in the above equation, it takes an extended period of time to charge a 0.1 f capacitor. the capacitors need to be selected so that the circuit is not limited by the amplifier slew rate. therefore, the capacitors should be less than 40 f and a stabilizing resistor (r iso ) needs to be properly selected. (refer to section 4.3 ?capacitive loads? ). figure 4-9: peak detector with clear and sample cmos analog switches. dv c 1 dt ------------ - i sc c 1 ------- - = 25 ma 0.1 f -------------- - = dv c 1 dt ------------ - 250 mv s ? = i sc c 1 dv c 1 dt ------------ - = v in mcp6002 v c1 mcp6002 d 1 op amp a op amp b v out mcp6001 op amp c c 2 sample signal clear signal clear r iso sample ? + ? + ? + clk t samp t clear t detect switch switch 1/2 1/2 r 1 r iso v c2 c 1 ? 2009 microchip technology inc. ds21733j-page 17 mcp6001/1r/1u/2/4 5.0 design aids microchip provides the basic design tools needed for the mcp6001/1r/1u/2/4 family of op amps. 5.1 spice macro model the latest spice macro model for the mcp6001/1r/ 1u/2/4 op amps is available on the microchip web site at www.microchip.com. the model was written and tested in official orcad (cadence) owned pspice. for the other simulators, it may require translation. the model covers a wide aspect of the op amp's electrical specifications. not only does the model cover voltage, current, and resistance of the op amp, but it also covers the temperature and noise effects on the behavior of the op amp. the model has not been verified outside of the specification range listed in the op amp data sheet. the model behaviors under these conditions can not be guaran teed that it will match the actual op amp performance. moreover, the model is intended to be an initial design tool. bench testing is a very important part of any design and cannot be replaced with simulations. also, simulation results using this macro model need to be validated by comparing them to the data sheet specifications and characteristic curves. 5.2 filterlab ? software microchip?s filterlab ? software is an innovative software tool that simplifies analog active filter (using op amps) design. available at no cost from the microchip web site at www.m icrochip.com/filterlab, the filterlab design tool prov ides full schematic diagrams of the filter circuit with component values. it also outputs the filter circuit in spice format, which can be used with the macro model to simulate actual filter performance. 5.3 mindi? circuit designer & simulator microchip?s mindi? circuit designer & simulator aids in the design of various circuits useful for active filter, amplifier and power-management applications. it is a free online circuit designer & simulator available from the microchip web site at www.microchip.com/mindi. this interactive circuit designer & simulator enables designers to quickly generate circuit diagrams, simulate circuits. circuits developed using the mindi circuit designer & simulator can be downloaded to a personal computer or workstation. 5.4 microchip advanced part selector (maps) maps is a software tool that helps semiconductor professionals efficiently identify microchip devices that fit a particular design require ment. available at no cost from the microchip web site at www.microchip.com/ maps, the maps is an overall selection tool for microchip?s product portfolio that includes analog, memory, mcus and dscs. using this tool you can define a filter to sort featur es for a parametric search of devices and export side-by-side technical comparison reports. helpful links are also provided for data sheets, purchase, and sampling of microchip parts. 5.5 analog demonstration and evaluation boards microchip offers a broad spectrum of analog demonstration and evaluat ion boards that are designed to help you achieve faster time to market. for a complete listing of these boards and their corresponding user?s guides and technical information, visit the microchip web si te at www.microchip.com/ analogtools. some boards that are especially useful are: ? mcp6xxx amplifier evaluation board 1 ? mcp6xxx amplifier evaluation board 2 ? mcp6xxx amplifier evaluation board 3 ? mcp6xxx amplifier evaluation board 4 ? active filter demo board kit ? 5/6-pin sot-23 evaluation board, p/n vsupev2 ? 8-pin soic/msop/tssop/ dip evaluation board, p/n soic8ev ? 14-pin soic/tssop/dip evaluation board, p/n soic14ev mcp6001/1r/1u/2/4 ds21733j-page 18 ? 2009 microchip technology inc. 5.6 application notes the following microchip analog design note and application notes are available on the microchip web site at www.microchip. com/appnotes and are recommended as supplemental reference resources. ? adn003: ?select the right operational amplifier for your filtering circuits?, ds21821 ? an722: ?operational amplifier topologies and dc specifications?, ds00722 ? an723: ?operational amplifier ac specifications and applications?, ds00723 ? an884: ?driving capacitive loads with op amps?, ds00884 ? an990: ?analog sensor conditioning circuits ? an overview?, ds00990 ? an1177: ?op amp precision design: dc errors?, ds01177 ? an1228: ?op amp precision design: random noise?, ds01228 ? an1297 : "microchip 's op amp spice macro models" these application notes and others are listed in the design guide: ? ?signal chain design guide?, ds21825 ? 2009 microchip technology inc. ds21733j-page 19 mcp6001/1r/1u/2/4 6.0 packaging information 6.1 package marking information xxxxxxxx xxxxxnnn yyww 8-lead pdip (300 mil) example: mcp6002 i/p256 0432 5-lead sc-70 ( mcp6001 ) example: (i-temp) 1 23 5 4 5-lead sot-23 ( mcp6001/1r/1u ) example: (e-temp) xxnn 1 23 5 4 cd25 xxn (front) yww (back) aa7 (front) 432 (back) device i-temp code e-temp code mcp6001 aann cdnn mcp6001r adnn cenn mcp6001u afnn cfnn note: applies to 5-lead sot-23. device i-temp code e-temp code mcp6001 aan cdn note: applies to 5-lead sc-70. or or xxnn aa74 device i-temp code e-temp code mcp6001 aann cdnn note: applies to 5-lead sc-70. legend: xx...x customer-specific information y year code (last digit of calendar year) yy year code (last 2 digits of calendar year) ww week code (week of january 1 is week ?01?) nnn alphanumeric traceability code pb-free jedec designator for matte tin (sn) * this package is pb-free. the pb -free jedec designator ( ) can be found on the outer packaging for this package. note : in the event the full microchip part num ber cannot be marked on one line, it will be carried over to the next line, th us limiting the number of available characters for custom er-specific information. 3 e 3 e mcp6002 i/p^^256 0746 or 3 e 8-lead dfn (2 x 3) xxx yww nn example: aby 944 25 mcp6001/1r/1u/2/4 ds21733j-page 20 ? 2009 microchip technology inc. package marking information (continued) 14-lead pdip (300 mil) ( mcp6004 ) example: 14-lead tssop ( mcp6004 ) example: 14-lead soic (150 mil) ( mcp6004 ) example: xxxxxxxxxxxxxx xxxxxxxxxxxxxx yywwnnn xxxxxxxxxx yywwnnn xxxxxx yyww nnn mcp6004 0432256 6004 st 0432 256 xxxxxxxxxx mcp6004 isl 0432256 8-lead msop example: xxxxxx ywwnnn 6002i 432256 8-lead soic (150 mil) example: xxxxxxxx xxxxyyww nnn mcp6002i sn0432 256 or or or or mcp6002i sn^^0746 256 mcp6004 0746256 mcp6004 0746256 6004 ste 0432 256 3 e e/p^^ 3 e e/sl^^ 3 e i/p^^ 3 e ? 2009 microchip technology inc. ds21733j-page 21 mcp6001/1r/1u/2/4 !" ! #$! !% # $ !% # $ #&! ! !# "' ( )*+ ) # & #, $ --# $## . # #$ # / ! - 0 # 1 / % # #! # ## +22--- 2 / 3# 44" " 4 # 5 56 7 5$ 8 %1 5 ( 1# 9()* 6, : # ; < !!1 / / ; < # ! %% < 6, =!# " ; !!1 / =!# " ( ( ( 6, 4# ; ( . #4# 4 9 4 ! / ; < 9 4 !=!# 8 ( < d b 1 2 3 e1 e 4 5 ee c l a1 aa2 - *9 ) mcp6001/1r/1u/2/4 ds21733j-page 22 ? 2009 microchip technology inc. . # #$ # / ! - 0 # 1 / % # #! # ## +22--- 2 / ? 2009 microchip technology inc. ds21733j-page 23 mcp6001/1r/1u/2/4 ! !" ! #$! !% # $ !% # $ #&! ! !# "' ( )*+ ) # & #, $ --# $## . # #$ # / ! - 0 # 1 / % # #! # ## +22--- 2 / 3# 44" " 4 # 5 56 7 5$ 8 %1 5 ( 4 !1# ()* 6$# !4 !1# )* 6, : # < ( !!1 / / ; < # ! %% < ( 6, =!# " < !!1 / =!# " < ; 6, 4# < . #4# 4 < 9 . # # 4 ( < ; . # > < > 4 ! / ; < 9 4 !=!# 8 < ( n b e e1 d 1 2 3 e e1 a a1 a2 c l l1 - * ) mcp6001/1r/1u/2/4 ds21733j-page 24 ? 2009 microchip technology inc. " # $ % &'() *!* +,-.#$ 1 , $ !&% #$ , 08$# $ #8 #!-# # # ! 1 / , & !#8 #! 1 / - $ #! !# "' ( )*+ ) # & #, $ --# $## ".+ % 0$ $ -# $## 0% % # $ . # #$ # / ! - 0 # 1 / % # #! # ## +22--- 2 / 3# 44" " 4 # 5 56 7 5$ 8 %1 5 ; 1# ()* 6, : # ; # ! %% ( * # # / ". 6, 4# )* 6, =!# " )* "& !1 !4# < (( "& !1 !=!# " ( < ( * # #=!# 8 ( * # #4# 4 ( * # ## "& !1 ! ? < < d n e note 1 1 2 exposed pad note 1 2 1 d2 k l e2 n e b a3 a1 a note 2 bottom view top view - * * ? 2009 microchip technology inc. ds21733j-page 25 mcp6001/1r/1u/2/4 " # $ % &'() *!* +,-.#$ . # #$ # / ! - 0 # 1 / % # #! # ## +22--- 2 / mcp6001/1r/1u/2/4 ds21733j-page 26 ? 2009 microchip technology inc. " # / )! -. #/ 1 , $ !&% #$ , 08$# $ #8 #!-# # # ! @% #* # # !" ! #$! !% # $ !% # $ #&! a ! !# "' ( )*+) # & #, $ --# $## . # #$ # / ! - 0 # 1 / % # #! # ## +22--- 2 / 3# 5*:" 4 # 5 56 7 5$ 8 %1 5 ; 1# )* # #1 < < !!1 / / ( ( ) # #1 ( < < $! # $! =!# " ( !!1 / =!# " ( ; 6, 4# ; 9( # #1 4 ( ( 4 ! / ; ( 3 4 !=!# 8 9 4 - 4 !=!# 8 ; 6, - @ ) < < n e1 note 1 d 12 3 a a1 a2 l b1 b e e eb c - * ;) ? 2009 microchip technology inc. ds21733j-page 27 mcp6001/1r/1u/2/4 " ) 0%!+, -./ 1 , $ !&% #$ , 08$# $ #8 #!-# # # ! @% #* # # !" ! #$! !% # $ !% # $ #&! ( ! !# "' ( )*+ ) # & #, $ --# $## ".+ % 0$ $ -# $## 0% % # $ . # #$ # / ! - 0 # 1 / % # #! # ## +22--- 2 / 3# 44" " 4 # 5 56 7 5$ 8 %1 5 ; 1# )* 6, : # < < ( !!1 / / ( < < # ! %% @ < ( 6, =!# " 9)* !!1 / =!# " )* 6, 4# )* * % b # c ( < ( . #4# 4 < . # # 4 ". . # > < ;> 4 ! / < ( 4 !=!# 8 < ( ! %# (> < (> ! %#) ## (> < (> d n e e e1 note 1 12 3 b a a1 a2 l l1 c h h - *() mcp6001/1r/1u/2/4 ds21733j-page 28 ? 2009 microchip technology inc. " ) 0%!+, -./ . # #$ # / ! - 0 # 1 / % # #! # ## +22--- 2 / ? 2009 microchip technology inc. ds21733j-page 29 mcp6001/1r/1u/2/4 " ( &'(( 1 , $ !&% #$ , 08$# $ #8 #!-# # # ! !" ! #$! !% # $ !% # $ #&! ( ! !# "' ( )*+ ) # & #, $ --# $## ".+ % 0$ $ -# $## 0% % # $ . # #$ # / ! - 0 # 1 / % # #! # ## +22--- 2 / 3# 44" " 4 # 5 56 7 5$ 8 %1 5 ; 1# 9()* 6, : # < < !!1 / / ( ;( ( # ! %% < ( 6, =!# " )* !!1 / =!# " )* 6, 4# )* . #4# 4 9 ; . # # 4 (". . # > < ;> 4 ! / ; < 4 !=!# 8 < d n e e1 note 1 1 2 e b a a1 a2 c l1 l - * ) mcp6001/1r/1u/2/4 ds21733j-page 30 ? 2009 microchip technology inc. note: for the most current package drawings, please see the microchip packaging specification located at http://www.microchip.com/packaging ? 2009 microchip technology inc. ds21733j-page 31 mcp6001/1r/1u/2/4 12 # / )! -. #/ 1 , $ !&% #$ , 08$# $ #8 #!-# # # ! @% #* # # !" ! #$! !% # $ !% # $ #&! a ! !# "' ( )*+) # & #, $ --# $## . # #$ # / ! - 0 # 1 / % # #! # ## +22--- 2 / 3# 5*:" 4 # 5 56 7 5$ 8 %1 5 1# )* # #1 < < !!1 / / ( ( ) # #1 ( < < $! # $! =!# " ( !!1 / =!# " ( ; 6, 4# ( ( ( # #1 4 ( ( 4 ! / ; ( 3 4 !=!# 8 ( 9 4 - 4 !=!# 8 ; 6, - @ ) < < n e1 d note 1 12 3 e c eb a2 l a a1 b1 be - *() mcp6001/1r/1u/2/4 ds21733j-page 32 ? 2009 microchip technology inc. 12 ) 0%!+, -./ 1 , $ !&% #$ , 08$# $ #8 #!-# # # ! @% #* # # !" ! #$! !% # $ !% # $ #&! ( ! !# "' ( )*+ ) # & #, $ --# $## ".+ % 0$ $ -# $## 0% % # $ . # #$ # / ! - 0 # 1 / % # #! # ## +22--- 2 / 3# 44" " 4 # 5 56 7 5$ 8 %1 5 1# )* 6, : # < < ( !!1 / / ( < < # ! %%@ < ( 6, =!# " 9)* !!1 / =!# " )* 6, 4# ;9()* * % b # c ( < ( . #4# 4 < . # # 4 ". . # > < ;> 4 ! / < ( 4 !=!# 8 < ( ! %# (> < (> ! %#) ## (> < (> note 1 n d e e1 1 23 b e a a1 a2 l l1 c h h - *9() ? 2009 microchip technology inc. ds21733j-page 33 mcp6001/1r/1u/2/4 . # #$ # / ! - 0 # 1 / % # #! # ## +22--- 2 / mcp6001/1r/1u/2/4 ds21733j-page 34 ? 2009 microchip technology inc. 12 3 3 & )2+2-. 1 , $ !&% #$ , 08$# $ #8 #!-# # # ! !" ! #$! !% # $ !% # $ #&! ( ! !# "' ( )*+ ) # & #, $ --# $## ".+ % 0$ $ -# $## 0% % # $ . # #$ # / ! - 0 # 1 / % # #! # ## +22--- 2 / 3# 44" " 4 # 5 56 7 5$ 8 %1 5 1# 9()* 6, : # < < !!1 / / ; ( # ! %% ( < ( 6, =!# " 9)* !!1 / =!# " ( !!1 / 4# ( ( . #4# 4 ( 9 ( . # # 4 ". . # > < ;> 4 ! / < 4 !=!# 8 < note 1 d n e e1 1 2 e b c a a1 a2 l1 l - *;) ? 2009 microchip technology inc. ds21733j-page 35 mcp6001/1r/1u/2/4 note: for the most current package drawings, please see the microchip packaging specification located at http://www.microchip.com/packaging mcp6001/1r/1u/2/4 ds21733j-page 36 ? 2009 microchip technology inc. notes: ? 2009 microchip technology inc. ds21733j-page 35 mcp6001/1r/1u/2/4 appendix a: revision history revision j (november 2009) the following is the list of modifications: 1. added new 2x3 dfn 8-lead package on page 1. 2. updated the temperatur e specifications table with 2x3 dfn thermal resistance information. 3. updated section 1.1 ?test circuits? . 4. updated figure 2-15 . 5. added the 2x3 dfn column to table 3-1 . 6. added new section 3.4 ?exposed thermal pad (ep)? . 7. updated section 5.1 ?spice macro model? . 8. updated section 5.5 ?analog demonstration and evaluation boards? . 9. updated section 5.6 ?application notes? . 10. updated section 6.1 ?package marking information? with the new 2x3 dfn package marking information. 11. updated the package drawings. 12. updated the product identification system section with new 2x3 dfn package information. revision h (may 2008) the following is the list of modifications: 1. design aids: name change for mindi simulation tool. 2. package types: correct device labeling error. 3. section 1.0 ?electrica l characteristics?, dc electrical specifications: changed ?maximum output voltage swing? condition from 0.9v input overdrive to 0.5v input overdrive. 4. section 1.0 ?electrical characteristics?, ac electrical specifications: changed phase margin condition from g = +1 to g= +1 v/v. 5. section 5.0 ?design aids? : name change for mindi simulation tool. revision g (november 2007) the following is the list of modifications: 1. updated notes to section 1.0 ?electrical characteristics? . 2. increased absolute maximum voltage range at input pins. 3. increased maximum operating supply voltage (v dd ). 4. added test circuits. 5. added figure 2-3 and figure 2-20 . 6. added section 4.1.1 ?phase reversal? , section 4.1.2 ?input voltage and current limits? , section 4.1.3 ?normal operation? and section 4.5 ?unused op amps? . 7. updated section 5.0 ?design aids? , 8. updated section 6.0 ?packaging information? 9. updated package outline drawings. revision f (march 2005) the following is the list of modifications: 1. updated section 6.0 ?packaging information? to include old and new packaging examples. revision e (december 2004) the following is the list of modifications: 1. v os specification reduced to 4.5 mv from 7.0 mv for parts starting with date code yyww = 0449 2. corrected package markings in section 6.0 ?packaging information? . 3. added appendix a: revision history. revision d (may 2003) ? undocumented changes. revision c (december 2002) ? undocumented changes. revision b (october 2002) ? undocumented changes. revision a (june 2002) ? original data sheet release. mcp6001/1r/1u/2/4 ds21733j-page 36 ? 2009 microchip technology inc. notes: ? 2009 microchip technology inc. ds21733j-page 37 mcp6001/1r/1u/2/4 product identification system to order or obtain information, e.g., on pricing or de livery, refer to the factory or the listed sales office . device: mcp6001t: single op amp (tape and reel) (sc-70, sot-23) mcp6001rt: single op amp (tape and reel) (sot-23) mcp6001ut: single op amp (tape and reel) (sot-23) mcp6002: dual op amp mcp6002t: dual op amp (tape and reel) (soic, msop) mcp6004: quad op amp mcp6004t: quad op amp (tape and reel) (soic, msop) temperature range: i = -40c to +85c e = -40c to +125c package: lt = plastic package (sc-70), 5-lead (mcp6001 only) ot = plastic small outline transistor (sot-23), 5-lead (mcp6001, mcp6001r, mcp6001u) ms = plastic msop, 8-lead mc = plastic dfn, 8-lead p = plastic dip (300 mil body), 8-lead, 14-lead sn = plastic soic, (3.99 mm body), 8-lead sl = plastic soic (3.99 body), 14-lead st = plastic tssop (4.4mm body), 14-lead part no. x /xx package temperature range device examples: a) mcp6001t-i/lt: tape and reel, industrial temperature, 5ld sc-70 package b) mcp6001t-i/ot: tape and reel, industrial temperature, 5ld sot-23 package. c) mcp6001rt-i/ot: tape and reel, industrial temperature, 5ld sot-23 package. d) mcp6001ut-e/ot: tape and reel, extended temperature, 5ld sot-23 package. a) mcp6002-i/ms: industrial temperature, 8ld msop package. b) mcp6002-i/p: industrial temperature, 8ld pdip package. c) mcp6002-e/p: extended temperature, 8ld pdip package. d) mcp6002-e/mc: extended temperature, 8ld dfn package. e) mcp6002-i/sn: industrial temperature, 8ld soic package. f) mcp6002t-i/ms: tape and reel, industrial temperature, 8ld msop package. g) mcp6002t-e/mc: tape and reel, extended temperature, 8ld dfn package. a) mcp6004-i/p: industrial temperature, 14ld pdip package. b) mcp6004-i/sl: industrial temperature, 14ld soic package. c) mcp6004-e/sl: extended temperature, 14ld soic package. d) mcp6004-i/st: industrial temperature, 14ld tssop package. e) mcp6004t-i/sl: tape and reel, industrial temperature, 14ld soic package. f) mcp6004t-i/st: tape and reel, industrial temperature, 14ld tssop package. mcp6001/1r/1u/2/4 ds21733j-page 38 ? 2009 microchip technology inc. notes: ? 2009 microchip technology inc. ds21733j-page 39 information contained in this publication regarding device applications and the like is prov ided only for your convenience and may be superseded by updates. it is your responsibility to ensure that your application me ets with your specifications. microchip makes no representations or warranties of any kind whether express or implied, written or oral, statutory or otherwise, related to the information, including but not limited to its condition, quality, performance, merchantability or fitness for purpose . microchip disclaims all liability arising from this information and its use. use of microchip devices in life support and/or safe ty applications is entirely at the buyer?s risk, and the buyer agrees to defend, indemnify and hold harmless microchip from any and all damages, claims, suits, or expenses resulting fr om such use. no licenses are conveyed, implicitly or ot herwise, under any microchip intellectual property rights. trademarks the microchip name and logo, th e microchip logo, dspic, k ee l oq , k ee l oq logo, mplab, pic, picmicro, picstart, rfpic and uni/o are registered trademarks of microchip technology incorporated in the u.s.a. and other countries. filterlab, hampshire, hi-tech c, linear active thermistor, mxdev, mxlab, seeval and the embedded control solutions company are register ed trademarks of microchip technology incorporated in the u.s.a. analog-for-the-digital age, a pplication maestro, codeguard, dspicdem, dspicdem.net, dspicworks, dsspeak, ecan, economonitor, fansense, hi-tide, in-circuit serial programming, icsp, mindi, miwi, mpasm, mplab certified logo, mplib, mplink, mtouch, octopus, omniscient code generation, picc, picc-18, picdem, picdem.net, pickit, pictail, pic 32 logo, real ice, rflab, select mode, total endurance, tsharc, uniwindr iver, wiperlock and zena are trademarks of microchip te chnology incorporated in the u.s.a. and other countries. sqtp is a service mark of mi crochip technology incorporated in the u.s.a. all other trademarks mentioned herein are property of their respective companies. ? 2009, microchip technology incorporated, printed in the u.s.a., all rights reserved. printed on recycled paper. note the following details of the code protection feature on microchip devices: ? microchip products meet the specification cont ained in their particular microchip data sheet. ? microchip believes that its family of products is one of the mo st secure families of its kind on the market today, when used i n the intended manner and under normal conditions. ? there are dishonest and possibly illegal meth ods used to breach the code protection fe ature. all of these methods, to our knowledge, require using the microchip pr oducts in a manner outside the operating specif ications contained in microchip?s data sheets. most likely, the person doing so is engaged in theft of intellectual property. ? microchip is willing to work with the customer who is concerned about the integrity of their code. ? neither microchip nor any other semiconduc tor manufacturer can guarantee the security of their code. code protection does not mean that we are guaranteeing the product as ?unbreakable.? code protection is constantly evolving. we at microchip are committed to continuously improving the code protection features of our products. attempts to break microchip?s c ode protection feature may be a violation of the digital millennium copyright act. if such acts allow unauthorized access to your softwa re or other copyrighted work, you may have a right to sue for relief under that act. microchip received iso/ts-16949:2002 certification for its worldwide headquarters, design and wafer fabrication facilities in chandler and tempe, arizona; gresham, oregon and design centers in california and india. the company?s quality system processes and procedures are for its pic ? mcus and dspic ? dscs, k ee l oq ? code hopping devices, serial eeproms, microperi pherals, nonvolatile memory and analog products. in addition, microchip?s quality system for the design and manufacture of development systems is iso 9001:2000 certified. ds21733j-page 40 ? 2009 microchip technology inc. americas corporate office 2355 west chandler blvd. chandler, az 85224-6199 tel: 480-792-7200 fax: 480-792-7277 technical support: http://support.microchip.com web address: www.microchip.com atlanta duluth, ga tel: 678-957-9614 fax: 678-957-1455 boston westborough, ma tel: 774-760-0087 fax: 774-760-0088 chicago itasca, il tel: 630-285-0071 fax: 630-285-0075 cleveland independence, oh tel: 216-447-0464 fax: 216-447-0643 dallas addison, tx tel: 972-818-7423 fax: 972-818-2924 detroit farmington hills, mi tel: 248-538-2250 fax: 248-538-2260 kokomo kokomo, in tel: 765-864-8360 fax: 765-864-8387 los angeles mission viejo, ca tel: 949-462-9523 fax: 949-462-9608 santa clara santa clara, ca tel: 408-961-6444 fax: 408-961-6445 toronto mississauga, ontario, canada tel: 905-673-0699 fax: 905-673-6509 asia/pacific asia pacific office suites 3707-14, 37th floor tower 6, the gateway harbour city, kowloon hong kong tel: 852-2401-1200 fax: 852-2401-3431 australia - sydney tel: 61-2-9868-6733 fax: 61-2-9868-6755 china - beijing tel: 86-10-8528-2100 fax: 86-10-8528-2104 china - chengdu tel: 86-28-8665-5511 fax: 86-28-8665-7889 china - hong kong sar tel: 852-2401-1200 fax: 852-2401-3431 china - nanjing tel: 86-25-8473-2460 fax: 86-25-8473-2470 china - qingdao tel: 86-532-8502-7355 fax: 86-532-8502-7205 china - shanghai tel: 86-21-5407-5533 fax: 86-21-5407-5066 china - shenyang tel: 86-24-2334-2829 fax: 86-24-2334-2393 china - shenzhen tel: 86-755-8203-2660 fax: 86-755-8203-1760 china - wuhan tel: 86-27-5980-5300 fax: 86-27-5980-5118 china - xiamen tel: 86-592-2388138 fax: 86-592-2388130 china - xian tel: 86-29-8833-7252 fax: 86-29-8833-7256 china - zhuhai tel: 86-756-3210040 fax: 86-756-3210049 asia/pacific india - bangalore tel: 91-80-3090-4444 fax: 91-80-3090-4080 india - new delhi tel: 91-11-4160-8631 fax: 91-11-4160-8632 india - pune tel: 91-20-2566-1512 fax: 91-20-2566-1513 japan - yokohama tel: 81-45-471- 6166 fax: 81-45-471-6122 korea - daegu tel: 82-53-744-4301 fax: 82-53-744-4302 korea - seoul tel: 82-2-554-7200 fax: 82-2-558-5932 or 82-2-558-5934 malaysia - kuala lumpur tel: 60-3-6201-9857 fax: 60-3-6201-9859 malaysia - penang tel: 60-4-227-8870 fax: 60-4-227-4068 philippines - manila tel: 63-2-634-9065 fax: 63-2-634-9069 singapore tel: 65-6334-8870 fax: 65-6334-8850 taiwan - hsin chu tel: 886-3-6578-300 fax: 886-3-6578-370 taiwan - kaohsiung tel: 886-7-536-4818 fax: 886-7-536-4803 taiwan - taipei tel: 886-2-2500-6610 fax: 886-2-2508-0102 thailand - bangkok tel: 66-2-694-1351 fax: 66-2-694-1350 europe austria - wels tel: 43-7242-2244-39 fax: 43-7242-2244-393 denmark - copenhagen tel: 45-4450-2828 fax: 45-4485-2829 france - paris tel: 33-1-69-53-63-20 fax: 33-1-69-30-90-79 germany - munich tel: 49-89-627-144-0 fax: 49-89-627-144-44 italy - milan tel: 39-0331-742611 fax: 39-0331-466781 netherlands - drunen tel: 31-416-690399 fax: 31-416-690340 spain - madrid tel: 34-91-708-08-90 fax: 34-91-708-08-91 uk - wokingham tel: 44-118-921-5869 fax: 44-118-921-5820 w orldwide s ales and s ervice 03/26/09 |
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