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tb67h30 2 hg 2014- 04- 23 1 toshiba bicd integrated circuit silicon monolithic tb67h30 2 hg dual bridge driver ic for dc motor the tb67h30 2 hg is a dual bridge driver ic for dc motor adopting d mos in output transistor. high - power and high - efficient drive is possible by adopting dmos output driver with low - on resistance and pwm drive. features ? dual bridge driver ic for dc motor ? ron ( upper + lower ) = 0. 4 ( typ. ) ? cw/ccw/short brake/stop functions ? standby function ? pwm control (direct pwm or constant - current pwm drive) ? output withstand voltage : v cc = 5 0 v ? output current : i out = 5 .0 a ( absolute maximum ratings , peak ) i out = 4.5 a ( o perating range, maximum value ) ? package : h zip 25-p- 1.00f ? built - in input pull- down resistance : 1 00 k ( typ. ) ? output monitor pin ( monitor for tsd/isd ) : a lert 1 pin (i alert1 ( max ) = 1 ma) ? output monitor pin ( mon itor for uvlo ) : alert2 pin (i alert2 ( max ) = 1 ma) ? single power supply ? built - in thermal shutdown (tsd) circuit ? built - in under voltage lock out (uvlo) circuit ? built - in over - current detection (isd) circuit tb67h30 2 hg weight hzip25 - p - 1.00f: 7.7g ( typ. ) hzip25 - p - 1.00f
tb67h30 2 hg 2014- 04- 23 2 pin functions pin no. i/o symbol fu nctional description remark 1 output alert1 tsd / isd monitor pin pull - up by external resistance 2 D sgnd signal ground 3 input select select pin for constant - current pwm or direct pwm 4 input vrefa voltage input for 100% current level for ach 5 input vrefb voltage input for 100% current level for bch 6 input vcc power supply 7 input stby stan dby pin h; start, l; standby 8 input in1b control input pin 1 for bch 9 input in2b control input pin 2 for bch 10 output out2b bch output 2 11 D rsb bch output current detection 12 output out1b bch output 1 13 D pgndb power gnd 14 output out2a ach output 2 15 D rsa ach output current detection 16 output out1a ach output 1 17 D pgnda power gnd 18 input in1a control input pin 1 for ach 19 input in2a control input pin 2 for ach 20 input vcc power supply 21 input pwma pwm signal inp ut pin for a ch 22 input pwmb pwm signal input pin for b ch 23 D osc r esistor connection pin for internal oscillation setting 24 output vreg control side connection pin for power capacitor connecting capacitor to sgnd 25 output alert2 uvlo monitor pin pull - up by external resistance input pins (in1a, in2a, pwma, in1b, in2b, pwmb, stby, select) v dd 100 100k
tb67h30 2 hg 2014- 04- 23 3 block diagram stby in1a pwma in1b in2a osc 1/3 tsd / isd / uvlo alert2 h- bridge d river a out1a out2a rsa h- bridge d river b out1b rsb vrefb sgnd pgn db 12 15 14 16 6, 20 1 24 7 18 19 21 8 9 22 17 2 pre - drive pre - drive 11 osc 10 in2b 13 pgnda 23 5 vcc vreg reg ( 5v) 1/3 vrefa 4 3 pwmb input circuit select out2b alert1 25
tb67h30 2 hg 2014- 04- 23 4 f unctions i/o function s sele ct = l (direct pwm mode) input output sb in1 in2 pwm out1 out2 mode h h h h l l short brake l h l h h l h cw/ccw l l l short brake h h l h h l ccw/cw l l l short brake h l l h off (hi - z) stop l l h/l h/l h off (hi - z) standby l select = h (constant - current pwm mode) input output sb in1 in2 pwm out1 out2 mode h h h h l l short brake l h l h h l h constant - current pwm, cw (out2 out1) l l l short brake h h l h h l constant - current pwm, ccw (out1 out2) l l l short brake h l l h off (hi - z) stop l l h/l h/l h off (hi - z) standby l
tb67h30 2 hg 2014- 04- 23 5 selection of direct pwm and constant - current pwm select = l: operating direct pwm, select = h: operating constant - current pwm (1) in case of direct p wm: ? rsa should be connected to pgnd a . ? rsb should be connected to pgnd b . ? vref a and vref b should be connected to sgnd. (2) in case of constant - current pwm: ? rsa and rsb should be connected to current detection resistance (rnf a and rnfb ) each. ? configuration of output current is as follows; ach io = (1/3 vrefa) rnfa bch io = (1/3 vrefb) rnfb this system adopts peak current detection. average current is lower than setting current. set rnf a, rnf b, vref a a nd vref b as follows; 0. 11 rnf a 0.5 , 0. 11 rnf b 0.5 , 0.3v vref a 1.95v and 0.3v vref b 1.95v triangle wave is generated internally by cr oscillation by connecting external resistor to osc terminal. rosc should be from 30k to 120k . the re lation of rosc and fchop is shown in below table and figure . the values of fchop of the below tab le are design guarantee values. they are not tested for pre - shipment. rosc(k ) fchop(khz) min typ. max 30 - 60 - 51 - 40 - 120 - 20 -
tb67h30 2 hg 2014- 04- 23 6 direct pwm control the motor rotation speed is controllable by the pwm input sent through the pwm pin. it is also possible to control the motor rotation speed by sending in the pwm signal through not the pwm pin but the in1 and in2 pins. whe n the motor drive is controlled by the pwm input, the tb 67h30 2 hg repeats operating in normal operation mode and short brake mode alternately. for preventing the shoot - through current in the output circuit caused by the upper and lower power transistors bei ng turned on simultaneously, the dead time is internally generated at the time the upper and lower power transistors switches between on and off. this eliminates the need of inserting off time externally; thus the pwm control with synchronous rectification is enabled. note that inserting off time externally is not required on operation mode changes between cw and ccw, cw and short brake, and cw and short brake because of the dead time generated internally. pwm on t5 v cc m gnd out1 v cc m gnd pwm off t3 out1 v cc m gnd pwm on t1 out1 v cc m gnd pwm on off t2 out1 v cc m gnd pwm off on t4 out1 rsgnd v cc output voltage waveform (out1) t1 t2 t3 t5 t4
tb67h30 2 hg 2014- 04- 23 7 constant - current pwm control c onstant - current pwm control mode is set when select =h . the tb67h30 2 hg uses a peak current detection technique to keep the output current constant by applying constant voltage through the vref pin. the ratio 40% of the fast decay mode is always f ixed. charge - discharge cycles of pwm drive corresponds to 5 cycles of oscm. the current is decreasing in the last two osc cycles ; the f ast decay mode. the relation between the master clock frequency (fmclk), the oscm frequency (foscm) and the pwm frequency (fchop) is shown as follows: foscm = 1/20 fmclk fchop = 1/100 fmclk when rosc=51k , the master clock=4mhz, oscm=200khz, the frequency of pwm(fchop)=40khz . nf: point where output current reaches the setting current. mdt in the below figure indicates the point of mixed decay timming. osc m interna l waveform f chop nf 40 % fast decay mode mdt setting current charge mode nf: reach setting current slow mode m ixed decay timming fast mode current monitor (setting current > output current) charge mode
tb67h30 2 hg 2014- 04- 23 8 current waveform when setting current is changed by changing vref in the constant - current pwm control mode ? mixed decay timming ? nf poi nt ? output current of mixed decay mode > setting current it is charged instantaneously to confirm the current though output current is larger than setting current. nf nf osc m internal waveform i out f chop f chop setting current setting current 40 % fast decay mode mdt (mixed decay timming) change point of vref nf 40 % fast decay mode i out f chop f chop nf mdt (mixed decay timming) move to fast mode after charge setting current change point of vref nf nf i out f chop f chop f chop mdt (mixed decay timming) 40 % fast decay mode setting current setting current setting current change point of vref
tb67h30 2 hg 2014- 04- 23 9 thermal shut - down circuit (ts d) latch return tsd = 160c (typ.) (note) (1) when recovery signal is outputted after the temperature falls lower than recovery temperature (90 c (typ.) in the below figure (note)). the ope ration returns by programming the stby as h l h shown in above figure or turning on power supply and turning on uvlo function. (2) when recovery signal is outputted before the temperature falls lower than the recovery temperature ( 90c (typ.) in below f igure (note)). if stby is programmed h l h shown in the above figure before the temperature falls lower than the recovery temperature ( 90c (typ.) in the above figure (note)), the operation does not return . note: pre - shipment testing is not performed. stby = l: tsd is not enabled. 160 c (typ . ) output on output on stby input output state h l 90 c (typ.) alert 1 output h l 160 c (typ . ) h l 90 c (typ.) h l output off 0.2ms *: time of about 1.6 ms or more is necessary. corresponding to 40 dividi ng frequency of f osc 0. 010 ms (typ.), 0.1 ms (max) output state output on output off stby input alert 1 output junction temperature ( chip temperature) junction temperature ( chip temperature)
tb67h30 2 hg 2014- 04- 23 10 isd (over current detection) current that flows through output power mosfets are monitored individually. if over - current is detected in at least one of the eight output power mosfets, all output power mosfets are turned off . masking term of 1 s or more (typ. when rosc=51k ) (note) should be provided in order to protect detection error by noise. isd does not work during the masking term. the operation is not returned automatically. it is latched. this function is released by programming stby h lh. isd = 6.5 a (typ.) (note) latch return the operation returns by programming stby h l h shown in the above figure or powering on the supply again to drive uvlo. stby = l: isd is not ena bled. note: pre - shipment testing is not performed. stby input h l alert 1 output h l 6.5a (typ.) 0.2ms dmos power transistor current dead band 1 s (typ.) output state output on output off output on *: time of about 1.6 ms or more is necessary. corresponding to 40 dividing frequency of f osc 0. 010 ms (typ.), 0.1 ms (max)
tb67h30 2 hg 2014- 04- 23 11 alert output (1) alert 1 (pin no. 1) alert 1 terminal outputs in detecting either tsd or isd. alert 1 terminal is connected to power supply externally via pull - up resistance. spec. is shown below. v alert 1 = 0.5v (max ) at 1ma applied voltage to pull - up resistance is up to 5.5 v. and conducted current is up to 1 ma. the voltage of 5 v is recommended to be provided by connecting the external pull - up resistance to vreg pin. (2 ) alert 2 ( pin no. 25) alert 2 terminal outputs in detecting uvlo. alert 2 terminal is connected to power supply externally via pull - up resistance. spec. is shown below. v alert 2 = 0.5v (max ) at 1ma when vcc falls to 6.0v (typ.) and uvlo is enabled, output turns off and alert 2 outputs low. in case vcc falls below 6.0v (typ.), alert 2 outputs hi - z (high impedance). the operation returns from standby mode when vcc rises 6.5v (typ.) or more. applied voltage to pull - up resistance is up to 5.5 v. and conducted current is up to 1 ma. the voltage of 5 v is recommended to be provided by connecting the external pull - up resistance to vreg pin. voltage pull - up of alert 1 and alert 2 pins ? it is recommended to pull- up the voltage to vreg pin. ? in case of pulling up the voltage of except 5 v (for instance, 3.3 v etc.), it is recommended to use other power supply (ex. 3.3 v) while vcc output s within the operation range. when vcc decrease s low er than the operation range and vreg decreases from 5 v to 0 v under the condition that other power supply is used to pull - up voltage, the current continues to conduct from other power supply to the ic inside through the diode shown in the figure. though this phenomenon does not cause destruction and malfunction of the ic, please consider the set design not to continue such a state for a long time. ? as for the pull - up resistance for alert 1 and alert 2 pins, please select large resistance enough for the conducting current so as not to exceed the standard value of 1 ma. please use the resistance of 30 k or more in case of applying 5 v, and 20 k or mor e in case of applying 3.3 v. tsd isd alert 1 terminal under tsd detection under isd detection low normal under isd detection under tsd detection normal normal normal z uvlo alert 2 terminal under uvlo detection low normal z (to vreg in the ic) ( to pull - up resistance )
tb67h30 2 hg 2014- 04- 23 12 absolute maximum ratings ( ta = 25c ) characteristic symbol rating unit power supply voltage vcc 50 v output current (per 1 channel) i o (peak) 5.0 a drain current (alert1, alert2) i (alert1) 1 ma i (alert2) input volta ge v in 6 v power dissipation p d 3.2 (note 1 ) w 40 (note 2) operating temperature t opr ? 30 to 85 c storage temperature t stg ? 55 to 150 c note 1: ta = 25c, no heat sink note 2 : ta = 25c, with infinite heat sink the absolute maximum ratings of a semiconductor device are a set of ratings that must not be exceeded, even for a moment. do n ot exceed any of these absolute maximum ratings. exceedi ng the absolute maximum rating s may cause the device breakdown, damage or deterioration, and may result injury by explosion or combustion. please use the ic within the specified operating ranges. op erating range (ta = ? 30 to 85c) characteristic symbol test condition min typ. max unit power supply voltage vcc D 8.0 D 42 v output current i out D D D 4.5 a input voltage v in D 0 D 5.5 v v ref D 0.3 D 1.95 v pwm frequency (input in direct pwm drive) f pwm duty50% in1a , in2a , pwm a, in1b , in2b , pwm b D D 100 khz chopping frequency f chop in constant - current pwm mode refer to page 5. 20 40 60 khz note: same voltage should be applied to two vcc pins. the maximum current of the operating range can not be necessarily conducte d depending on various conditions becaus e output current is limited by the power dissipation p d . make sure to avoid using the ic in the condition that would cause the temperature to exceed tj (avg.) = 107c . the power supply voltage of 42 v and the output current of 4.5 a are the upper limit s of the operating range. therefore , make sure to have enough margins within th ese operating range s (derating design) by considering the power supply variation, the external resistance, and the electrical characteristic s of the ic. if either of the voltage or current exceeds the upper limit s of the operating range , the ic may not operate normally.
tb67h30 2 hg 2014- 04- 23 13 electrical characteristics (ta = 25c , vcc = 24v) characteristic symbol test condition min typ. max unit input voltage high v in (h) in1, in2, pwm , stby, select 2.0 D 5.5 v low v in (l) ?0.2 D 0.8 input hysteresis voltage v h D 400 D mv input current i in (h) v in = 5.0 v D 50 75 a i in (l) v in = 0 v D D 1 vcc supply current icc 1 stop mode D 3.2 7 ma icc 2 cw/ccw mode D 3.2 7 icc 3 short brake mode D 3.2 7 icc 4 standby mode D 1.9 4 vref input circuit current limit voltage v nf vref = 3.0v (note 1) 0.9 1.0 1.1 v input current i in( v ref) vref = 3.0v (note 1) D D 1 a divider ratio v ref /v nf maximum current: 100% D 3 D D minimum pulse width tw pwmh in1, in2 , pwm 5.0 D D s tw pwml output residual voltage in logic part v ol alert1 i ol = 1 m a D D 0.5 v v ol alert2 internal constant voltage vreg standby mode, external capacitor c = 0.1 f 4.5 5.0 5.5 v chopping frequency ( constant - current pwm) f ch op rosc = 51k 28 40 52 k hz note 1: though vref of the test condition for pre - shipment is 3.0v, make sure to configure vref within the operating range which is written in page 12 in driving the motor. electrical characteristics (ta = 25c, vcc = 24v) characteristic symbol test condition min typ. max unit out pin output on resistor ron u +ron l i out = 4 a D 0.4 0.6 output transistor switching characteristics t r v nf = 0 v, output open D 50 D ns t f D 500 D output leakage current upper side i lh v cc = 50 v D D 5 a lower side i ll D D 5
tb67h30 2 hg 2014- 04- 23 14 measurement waveform v cc gnd t r t f 10% 90% 90% 10% figure 1 timing waveforms and names tw pw m i n1 a , in2 a , pwm a, in1 b, in2 b, pwm b tw pwm tw pwm out 1b , out 2b out1a , out 2a , figure 2 timing waveforms and names
tb67h30 2 hg 2014- 04- 23 15 power dissipation tb67h30 2 hg p d C ta ambient temperature ta ( c) power dissipation p d (w) 25 0 150 0 80 75 40 100 20 60 50 125 infinite heat sink r j - c = 1 c /w heat sink ( r hs = 3.5 c /w) r j - c + r hs = 4.5 c /w ic only r j - a = 39c /w
tb67h30 2 hg 2014- 04- 23 16 application circuit (1) direct pwm set select l in direct pwm drive. r sa should be connected to pgnd a. rsb should be connected to pgndb . vref a and vrefb sho uld be connected to sgnd each . stby in1a pwma in1b in2a osc 1/3 tsd / isd / uvlo alert1 h- bridge d river b out1b vrefb sgnd pgnd b pre - drive osc in2b pgnda vcc vreg 1/3 vrefa pwmb select mcu f use rsb + out2b 24 v 0.1 f 0.1 f 47 f alert2 reg (5 v ) input circuit 51k h- bridge d river a out1a out2a pre - drive rsa
tb67h30 2 hg 2014- 04- 23 17 note 1: generally, some ics are highly sensitive to electrostatic discharge. when handling them, ensure that the environment is protected against electrostatic discharge. note 2: capacitors for the power supply lines sho uld be connected as close to the ic as possible. note 3 : pay attention for wire layout of pcb not to allow gnd line to have large common impedance. note 4 : external capacitor connecting to vreg should be 0. 1 f. pay attention for the wire between this cap acitor and vreg terminal and the wire between this capacitor and sgnd not to be influenced by noise. note 5 : the ic may not operate normally when large common impedance is existed in gnd line or the ic is easily influenced by noise. for example, if the ic operates continuously for a long time under the circumstance of large current and h igh voltage, the output according to the input control signal may be different from the i/o function table of this document. and so, the ic may not operate normally. to avo id this malfunction, make sure to conduct note.2 to note. 4 and evaluate the ic enough before using the ic. note 6 : as for a brush motor, the noise , which is generated from the brushes in the motor during the motor rotati o n, influences on the ic operation. for example, it may cause a malfunction of the isd circuit and then finally the ic may not work normally. in this case, connect a capacitor between the motor terminals in order to reduce the noise . t h e appropriate value of the capacitor depends on the mag nitude of the noise and the inductance of the motor coil. please determine the value according to each actual equipment and condition. the connecting position of the capacitor should be conformed because the effect of the capacitor is different depending o n the position of the capacitor which is near the ic or the motor.
tb67h30 2 hg 2014- 04- 23 18 (2) constant - current pwm set select h in constant - current pwm drive. rs a should be connected to pgnda via rnfa. rsb should be connected to p gndb via rnfb. output current is set as follows; ach io = (1/3 vrefa) rnfa bch io = (1/3 vrefb) rnfb set rnf a, rnf b, vref a and vref b as follows; 0. 11 rnf a 0.5 , 0. 11 rnf b 0.5 , 0.3v vref a 1.95v and 0 .3v vref b 1 .95v reg (5 v ) stby in1a pwma in1b in2a osc 1/3 tsd / isd / uvlo alert1 out1b vrefb sgnd pgnd b pre - drive osc in2b pgnda vcc vreg 1/3 vrefa pwmb select rsb + out2b 0.1 f f use 24 v 0.1 f 47 f alert2 mcu h- bridge d river a out1a out2a rsa h- bridge d river b 0.15 0.15 51k
tb67h30 2 hg 2014- 04- 23 19 note 1: generally, some ics are highly sensitive to electrostatic discharge. when handling them, ensure that the environment is protected against electrostatic discharge. note 2: capacitors for the power supply lines should be con nected as close to the ic as possible. note 3 : current detection resistance (rnf) should be connected as close as the ic as possible. note 4 : pay attention for wire layout of pcb not to allow gnd line to have large common impedance. note 5 : external capaci tor connecting to vreg should be 0. 1 f. pay attention for the wire between this capacitor and vreg terminal and the wire between this capacitor and sgnd not to be influenced by noise. note 6 : the ic may not operate normally when large common impedance is existed in gnd line or the ic is easi ly influenced by noise. for example, if the ic operates continuously for a long time under the circumstance of large current and high voltage, the output according to the input control signal may be different from the i/o function table of this document. a nd so, the ic may not operate normally. to avoid this malfunction, make sure to conduct note.2 to note. 5 and evaluate the ic enough before using the ic. note 7 : as for a brush motor, the noise, which is generated from the brushes in the motor during the mo tor rotation, influences on the ic operation. for example, it may cause a malfunction of the isd circuit and then finally the ic may not work normally. in this case, connect a capacitor between the motor terminals in order to reduce the noise. t h e appropri ate value of the capacitor depends on the magnitude of the noise and the inductance of the motor coil. please determine the value according to each actual equipment and condition. the connecting position of the capacitor should be conformed because the eff ect of the capacitor is different depending on the position of the capacitor which is near the ic or the motor.
tb67h30 2 hg 2014- 04- 23 20 package dimensions unit: mm weight: 7.7 g (typ.) note the se dimensions are measured from the surface of the heat sink . note
tb67h30 2 hg 2014- 04- 23 21 notes on contents 1. block diagrams some o f the functional blocks, circuits, or constants in the block diagram may be omitted or simplified for explanatory purposes. 2. equivalent circuits the equivalent circuit diagrams may be simplified or some parts of them may be omitted for explanatory purp oses. 3. timing charts timing charts may be simplified for explanatory purposes. 4. application circuits the application circuits shown in this document are provided for reference purposes only. thorough evaluation is required, especially at the mass pr oduction design stage. toshiba does not grant any license to any industrial property rights by providing these examples of application circuits. 5. test circuits components in the test circuits are used only to obtain and confirm the device characteristic s. these components and circuits are not guaranteed to prevent malfunction or failure from occurring in the application equipment. ic usage considerations notes on handling of ics [1] the absolute maximum ratings of a semiconductor device are a set of ra tings that must not be exceeded, even for a moment. do not exceed any of these ratings. exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result injury by explosion or combustion. [2] use an appropriate power supply fuse to ensure that a large current does not continuously flow in case of over current and/or ic failure. the ic will fully break down when used under conditions that exceed its absolute maximum ratings, when the wiring is routed improperly or when an abno rmal pulse noise occurs from the wiring or load, causing a large current to continuously flow and the breakdown can lead smoke or ignition. to minimize the effects of the flow of a large current in case of breakdown, appropriate settings, such as fuse capa city, fusing time and insertion circuit location, are required. [3] if your design includes an inductive load such as a motor coil, incorporate a protection circuit into the design to prevent device malfunction or breakdown caused by the current resultin g from the inrush current at power on or the negative current resulting from the back electromotive force at power off. ic breakdown may cause injury, smoke or ignition. use a stable power supply with ics with built - in protection functions. if the power s upply is unstable, the protection function may not operate, causing ic breakdown. ic breakdown may cause injury, smoke or ignition. [4] do not insert devices in the wrong orientation or incorrectly. make sure that the positive and negative terminals of p ower supplies are connected properly. otherwise, the current or power consumption may exceed the absolute maximum rating, and exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result injury by explosion or combustion. in addition, do not use any device that is applied the current with inserting in the wrong orientation or incorrectly even just one time.
tb67h30 2 hg 2014- 04- 23 22 points to remember on handling of ics (1) over current protection circuit over current protection circuits (referr ed to as current limiter circuits) do not necessarily protect ics under all circumstances. if the over current protection circuits operate against the over current, clear the over current status immediately. depending on the method of use and usage condit ions, such as exceeding absolute maximum ratings can cause the over current protection circuit to not operate properly or ic breakdown before operation. in addition, depending on the method of use and usage conditions, if over current continues to flow for a long time after operation, the ic may generate heat resulting in breakdown. (2) thermal shutdown circuit thermal shutdown circuits do not necessarily protect ics under all circumstances. if the thermal shutdown circuits operate against the over temper ature, clear the heat generation status immediately. depending on the method of use and usage conditions, such as exceeding absolute maximum ratings can cause the thermal shutdown circuit to not operate properly or ic breakdown before operation. (3) heat radiation design in using an ic with large current flow such as power amp, regulator or driver, please design the device so that heat is appropriately radiated, not to exceed the specified junction temperature (t j ) at any time and condition. these ics gene rate heat even during normal use. an inadequate ic heat radiation design can lead to decrease in ic life, deterioration of ic characteristics or ic breakdown. in addition, please design the device taking into considerate the effect of ic heat radiation wit h peripheral components. (4) back - emf when a motor rotates in the reverse direction, stops or slows down abruptly, a current flow back to the motors power supply due to the effect of back - emf. if the current sink capability of the power supply is small, the devices motor power supply and output pins might be exposed to conditions beyond absolute maximum ratings. to avoid this problem, take the effect of back - emf into consideration in system design. (5) s hort - circuiting between outputs, air contamination faults, faults due to improper grounding, short - circuiting between contiguous pins utmost care is necessary in the design of the power supply lines , gnd lines , and output lines since the ic may be destroyed by short - circuiting between outputs, air contamination faults, or faults due to improper grounding, or by short - circuiting between contiguous pins. the y may destroy not only the ic but also peripheral parts and may contribute to injuries for users. over current may continue to flow in the ic because of this destruction and cause smoke or ignition of the ic. expect the volume of this over current and add an appropriate power supply fuse in order to minimize the effects of the o ver current. capacity of the fuse, fusing time, and the inserting position in the circuit should be configured suitably.
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