products surface mount chip led type SMLD12HBC7W1 page 1. construction pink surface mount leds with reflector packaged featuring ingan on sic and phosphor technology. 2. usage source of light for display unit. 3. dimensions see figure.1 4. absolute maximum ratings (ta=25 ) power dissipation p d ???????????? 66mw forward current i f ???????????? 20ma peak forward current ifp ???????????? 100ma ( notes 1 ) reverse voltage v r ???????????? 5v operating temperature topr ???????????? 40 85 storage temperature tstg ???????????? 40 100 ( notes1 duty 1/10 1khz ) 5. electro characteristics ( ta=25 ) 6. luminous classification (ta=25 , if=5ma) rev. specification no. tentative(20091125) tsz22111?05?002 discription symbol conditio n min. typ. max. units forward voltage vf if=5ma * 1 2.9 3.3 v reverse current ir vr=5v 10 a luminous intensity iv if=5ma * 1 9.0 22 56 mcd x if=5ma * 1 0.47 chromaticity coordinates y if=5ma * 1 0.25 * 1 pulse width :30msec. symbol luminous classification range ?m? mcd ?n? mcd ?p? mcd ?q? mcd measurement tolerance : 10% if rank shift occur, we may ask for re-approval of new rank when necessary.
products surface mount chip led type SMLD12HBC7W1 page 7. chromaticity diagram 8. chromaticity coordimates (ta=25 , if=5ma) 9. product weight product weight per piece, approx 0.0013grm. rev. specification no. tentative(20091125) tsz22111?05?002 a b c x y x y x y 0.430 0.242 0.460 0.262 0.490 0.282 0.430 0.195 0.460 0.215 0.490 0.235 0.460 0.215 0.490 0.235 0.520 0.255 0.460 0.262 0.490 0.282 0.520 0.302 measurement tolerance : 0.02 0.18 0.20 0.22 0.24 0.26 0.28 0.30 0.32 0.40 0.42 0.44 0.46 0.48 0.50 0.52 0.54 cie x cie y a c b
products surface mount chip led type SMLD12HBC7W1 page figure 1 1.6 1.2 0.8 0.65 0.8 0.55 0.18 cathode index 1.5 0.5 r0.275 r0.15 electrode rev. specification no. tentative(20091125) tsz22111?05?002 cathode anode unit mm (note) tolerance is within 0.1mm unless otherwise specified.
products surface mount chip led type SMLD12HBC7W1 page taping : 1 8.0 1.75 3.5 5.5 00.5 1 2 1.9 180 60 13 0.1 0.05 1.5 0.1 0.1 +1 0 -3 0 0.05 0 0.73 4 unitmm) packing quantity 3000pcs/reel pull direction (note) tolerance is within 0.2mm unless otherwise specified 11.4 1 0.1 +0.1 -0.08 rev. specification no. tentative(20091125) tsz22111?05?002
products surface mount chip led type SMLD12HBC7W1 page structure ? material rev. specification no. tentative(20091125) tsz22111?05?002 no. appellation material 1 printed wiring board bt resin, glass fabric 2 die bond ag paste 3 chip algainp on gaas 4 bonding wire gold 5 resin epoxy resin 6 electrode bass plating : cu , nickel top plating : au
products surface mount chip led type SMLD12HBC7W1 page packaging requirements 1. packing (1) 3,000pcs are taped in one reel. (2) one reel is packed in aluminum bag. the size of aluminum bag is 240(a) 250(b)mm. the size up to zipper is 230(c)mm. (3) aluminum bag is sealed by pressure for all directions. 2. marking the following information shall be described in the label on the aluminum bag.: rohm type number, packing quantity, luminous intensity rank, and lot number etc. former label specification note) indicates bar code expressed by code 39. indicates pb-free products. example of lot no. marking rev. specification no. tentative(20091125) tsz22111?05?002 ??? ,?? for rohm only serial number of lot production week production year production facility sign (reference the manufactory list) luminous intensity rank type no. interoffice administration code customers part no. etc. country of origin ?f? means pb-free, quantity, then lot no. displayed. chromaticity coordinates rank
products surface mount chip led type SMLD12HBC7W1 page attention points in handling this product was developed as a surface mount le d especially suitable for reflow soldering. please take care of following points when using this device. 1. designing of pcb as for a recommendable solder pattern, please refer to fig-1. the size and direction of the pad pattern depend on the condition of the pcb, so, please investigate about the adjustment thoroughly before designing. (this product is structured with rear electrode to be soldered; i.e., the electrode shape is not subject to the formation of solder fillet.) 2. soldering ( sn-cu, sn-ag-cu, sn-ag-bi-cu ) led products do not contain reinforcement materials such as glass fillers. therefore, thermal stress by soldering greatly influences its reliability. the temperature conditions for reflow soldering should therefore be set up according to the characteristic of this product. (see fig-2) number of reflow process shall be max 2 times and these processes shall be performed in a row. cooling process to normal te mperature shall be required between the first and the s econd soldering process. 3. handling after mounting (fig.-3) as shown in the drawing on the ri ght, in case outside force of about 700g is given to the device, stress is concentrated to the jointed part between mold resin and substrate. therefore there is a possibility to breath the device or pcb. careful handing is needed as rohm cannot guarantee the falling of the device by outside force after mounting. 4. washing please note the following points when washing is required after soldering. 4-1) washing solvent isopropyl alcohol or other alcohol solvent is recommendable. 4-2) temperature below 30 , immersion time ; within 3 minutes. 4-3) ultra sonic washing below 15w/1 litter of solvent tub or less. 4-4) cooling below 100 within 3 minutes. 5. storage at reflow soldering, the reliability of this produc t is often influenced by moisture absorption; so that we apply the package with moisture proof for better condition for use. please also note that, 5-1) package : not to be opened before using. 5-2) after unpackaging : leds to be kept in our mois ture proof package with some desiccant (silica gel). leds to be baked in case the silica gel indicator its color from either blue to clear or green to pink. 5-3) please use leds within 168 hours afte r the package is open ed. (condition at 30 , max.70%rh.) in case they are not used within 168 ho urs, please put them b ack into the package. 5-4) baking (=moisture removal) please conduct baking under ?reel condition? at 60 , 12 24 hours (max.20%rh) after unpackaging. please be careful not to give any stress to the reel & the embossed tape while baking, as they are susceptible to be deformed during the baking. rev. specification no. tentative(20091125) tsz22111?05?002 0.85m m 0.8m m 0.8m m pcb bonding direction 0.8m m (fig-1) outside force pcb mold substrate soldering part emitting direction 0 50 100 150 200 250 300 max. 260 ,within 10sec 140 180 min.1 min 230 260 max. 40sec (fig-2) (fig-3)
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