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copyright ? mediatek inc. all rights reserved. MT6516 design notice v1.0 MT6516 design notice v1.0 2009 / april wcp/sa free datasheet http://www.datasheet-pdf.com/
copyright ? mediatek inc. all rights reserved. 2 change notice change notice ? 2009/05/11 initial document ? 2009/06/22 add iq 510ohm free datasheet http://www.datasheet-pdf.com/ copyright ? mediatek inc. all rights reserved. 3 outline outline ? MT6516 main features & package ? design notice ? MT6516 schematic design notice ? pmic mt6326 design notice ? audio part design notice ? speech part design notice ? camera design notice ? display design notice ? ddr memory layout rule ? usb 2.0 high speed design notice ? factory mode and engineer mode ? download and meta link ? MT6516 memory support plan ? appendix - peripherals design notice ? wifi/bt co-module application note ? mt3326 gps application note ? dtv part design note ? fm design notice free datasheet http://www.datasheet-pdf.com/ copyright ? mediatek inc. all rights reserved. 4 ? separate application (a rm9) and hard real-time modem (arm7) ? multi-cores with hw coprocessors soc ? application: arm926ejs 416mhz ? modem: arm7 (52mhz/104mhz) + 2 dsp(104mhz) ? ceva dsp (312mhz) for video and unpredictable multimedia application on smartphone ? 65nm process. ultra low power design. ? graphics, display, image, camera, video multimedia hardware accelerators . ? 2d graphics - support window mobile bitblt function ? 3d graphics - support opengl es 1.1 common/common lite profile ? 3d performance: fill rate = 32m, triangle rate = 3.7m ? wide range of resolution up to wvga size ? various display interface support ? 8080 host if (mipi dbi) ? 8/9/16/32-bit serial if ? rgb interface (mipi dpi) ? mipi dsi interface ? high performance memory controller @ 104mhz, support ? 32-bit / 16-bit lp-ddr sdram ? 4 chip selects : support up to 4 dram devices ? nand-boot supported ? nand data storage supported ? peripherals ?dual sim ? 3 x sdio, 3 x i2c, 1 x i2s, 4 x uart ? 1-wire interface, 7 x pwm ? 8 x 8 key matrix ? touch panel interface ? usb 2.0 high speed integrate with phy . MT6516 main feature MT6516 main feature free datasheet http://www.datasheet-pdf.com/ copyright ? mediatek inc. all rights reserved. 5 MT6516 design package building blocks MT6516 design package building blocks mcp memory 1g ddr 2g nand 2.8 6? lcd qvga camera 5mp autofocus t-flash card mt6140d+sky77344 edge transceiver mt5151 dtv receiver mt3326 gps receiver mt6611 & mt5921 wifi/bt co-module apps. processor arm926ejs 416mhz modem mcu arm7 104mhz multimedia asic ar1000 fm mt6326 pmic ti bq27500 smart battery (optional) sim interface (dual sim capable) uart sdio uart sdio bpi i2c i2c parallel camera i/f emi nfi i2c sdio lcm i/f 2d 3d 3d scaler mp3 h.264 jpeg codec internal memory free datasheet http://www.datasheet-pdf.com/ copyright ? mediatek inc. all rights reserved. 6 MT6516 package MT6516 package 0.26 0.21 1.2 0.3 0.378 / 0.535 564 15 15 c a1 a (max.) b e1 / e2 n e d substrate thk. stand off package thk. ball dia. ball pitch ball count body size table 1 definition of tfbga 15mm*15mm, 564-ba ll, 0.378 mm pitch package (unit: mm) free datasheet http://www.datasheet-pdf.com/ copyright ? mediatek inc. all rights reserved. design notice design notice - - mt6 mt6 516 schematic design notice 516 schematic design notice copyright ? mediatek inc. all rights reserved. free datasheet http://www.datasheet-pdf.com/ copyright ? mediatek inc. all rights reserved. 8 schematic notice (1/7): boot schematic notice (1/7): boot - - up selection up selection h( dvdd )l(gnd) ionejtag enable one jtag functio n disable iboot boot from external memo r boot from bootrom secu_en enable secure booting disable iadmux admux memory device ad-demux memory device icoresight coresight enable, coresight disable fsource burn efuse normal 1 j o ) = - MT6516 currently only support ddr memory, so this selection always choose gnd connect fsource to gnd by 0ohm, otherwise the uuid number will be unstable. free datasheet http://www.datasheet-pdf.com/ copyright ? mediatek inc. all rights reserved. 9 schematic notice (2/7) schematic notice (2/7) the avdd power must follow the connection show above to avoid the influence between afe, rfe and mbuf free datasheet http://www.datasheet-pdf.com/ copyright ? mediatek inc. all rights reserved. 10 schematic notice (3/7) schematic notice (3/7) connect au_vcm_no to gnd add 2 capacitors (1uf, 0.1uf) in avdd12_pll free datasheet http://www.datasheet-pdf.com/ copyright ? mediatek inc. all rights reserved. 11 c504 1u v t503 m1005c080mtacb v t505 m1005c080mtacb v t504 m1005c080mtacb v t506 m1005c080mtacb v t507 m1005c080mtacb r507 47k r502 47k r504 47k r503 47k r505 47k r506 47k v t501 m1005c080mtacb v t502 m1005c080mtacb mcda3 1 mcda1 1 mccm0 1 mcck 1 mcda0 1 mcda2 1 j501 sd_card_socket (skt sd/mmc standard ty tf_5015880801-a dat2 1 cd/dat3 2 cmd 3 vdd 4 clk 5 vss2 6 dat0 7 dat1 8 shield 11 shield 10 shield 12 shield 9 vdd ?for better interoperability and stability, please reserve 47k ohm in each memory card interface line. schematic notice (4/7) schematic notice (4/7) free datasheet http://www.datasheet-pdf.com/ copyright ? mediatek inc. all rights reserved. 12 schematic notice (5/7) schematic notice (5/7) add a diode between MT6516 pwr_key and mt6326 pwrkey MT6516 mt6326 pmic power key bottom add a diode and a eint to mt6326 pwrkey add a 1k resistor to avoid esd damage. free datasheet http://www.datasheet-pdf.com/ copyright ? mediatek inc. all rights reserved. 13 u100e tk65_18 MT6516-564/p0.53/b0.27(15x15)/iac jtrst_b ad34 jtck ad38 jtdi ab36 jtms ac33 jtdo ac35 jrtck ab34 j2trst_b am32 j2tck ak30 j2tdi an33 j2tms ap34 j2tdo ar35 j2rtck al31 ionejtag t38 jztrst_b 16 jztdo 16 jztms 16 jztdi 16 jztck 16 jtdi 16 jtdo 16 jtck 16 jzrtck 16 jtms 16 jrtck 16 jtrst_b 16 ionejtag 16 schematic notice (6/7) :debug port schematic notice (6/7) :debug port arm9 (ap side) jtag arm7 (modem side) jtag use only one jtag to cont rol ap and modem side mcu free datasheet http://www.datasheet-pdf.com/ copyright ? mediatek inc. all rights reserved. 14 schematic notice (7/7) : nfi interface schematic notice (7/7) : nfi interface ? to support 1.8 v nand mcp, you need to ? connect vdd33_lcd of bb part to 1.8 v ? check if lcm module io can support 1. 8v first. connect lcm io power pin (vddio) to 1.8 v (see lcm selection guide to 1.8 v lcm section) bb bb 1 1 lcm io lcm io 2 2 ? beware that nand flash , parallel lcm , and vdd33_nld must use same power domain ! free datasheet http://www.datasheet-pdf.com/ copyright ? mediatek inc. all rights reserved. 15 rf iq connection ( remember add 510ohm rf iq connection ( remember add 510ohm between baseband and mt6140d) between baseband and mt6140d) free datasheet http://www.datasheet-pdf.com/ copyright ? mediatek inc. all rights reserved. 16 reset button design suggestion reset button design suggestion 1. basically, the MT6516 phone don?t need reset button. (users remove battery when system hang) 2. there are two kinds of suggestion design of reset button. 1. only add a pull low button on sysrst_b pin 1. advantage : cost effective 2. disadvantage : user must press pwrkey to restart system 2. add a reset chip on pwrkey pin and sysrst_b pin. 1. advantage : user can press reset then direct restart the phone. 2. disadvantage : need a extra reset chip pwrkey sw702 ksw 1 2 sysrst_b reset chip reset chip that only generate one pulse sw702 ksw 1 2 sysrst_b free datasheet http://www.datasheet-pdf.com/ copyright ? mediatek inc. all rights reserved. 17 default uart dispatch notice default uart dispatch notice uart1 uart3 usb port copy here uart2 uart4 download bootloader , meta link, production line test point user define, de fault use for agps user define, de fault use for bluetooth data log for debugging, boot-up selection and setting. modem side meta link . download image bin file , active sync, mass storage, rndis free datasheet http://www.datasheet-pdf.com/ copyright ? mediatek inc. all rights reserved. 18 reference power distribution reference power distribution vdd33 vdd33_tracer vdd33_mipi/mipi_tx/mipi_rx vdd33_i2c (camera) vdd33_mc0/1/2 vdd33_nld vdd33_spi vdd33_emi (6 balls) avdd30_vsim avdd30_vsim2 avdd33_usb avdd12_usb vcore 1.3v vdd 2.8v vsdio vm 1.8v vsim vgp vusb 3.3v vcam_a vddk (52 balls) vdd33_camera ? mt6326 ? MT6516 core power usb core power general io etm io mipi power spi power nand/lcm power emi power (lpddr) camera i/o power scl1/sda1 power sim1 power sdio1/sdio2/sdio3 power sim2 power usb phy power free datasheet http://www.datasheet-pdf.com/ copyright ? mediatek inc. all rights reserved. 19 MT6516 reference phone pcb layer define MT6516 reference phone pcb layer define - b z f s / p / b n f ` % f g j o f . b u f s j b m 4 v h h f t u j p o % j f $ p o t v h h f t u u i j d l o f t t n j m 7 j b c c c soldermask soldermask c c 0.4 c c c add plating plating 1comp(l1) c 3 ' 5 s b d f copper foil 0.5 oz h oz+plating c 1.4 c c c c pp pp 1080 65% 4.3 2.82 2l2 c 4 j h o b m copper foil 1.0 oz 0.50 oz+plating c 1.3 c c c c core pp 1080 65% 4.3 2.82 3l3 c ( / % copper foil 1.0 oz copper 1.0 oz c 1.3 c c c c pp fr-4 core 4mil 4.3 4 4l4 c 3 ' 5 s b d f copper foil 1.0 oz copper 1.0 oz c 1.3 c c c c core pp 7628 50% 4.3 8.38 5l5 c ( / % copper foil 1.0 oz copper 1.0 oz c 1.3 c c c c pp fr-4 core 4mil 4.3 4 6l6 c 4 j h o b m copper foil 1.0 oz copper 1.0 oz c 1.3 c c c c core pp 1080 65% 4.3 2.82 7l7 c 4 j h o b m copper foil 1.0 oz 0.50 oz+plating c 1.3 c c c c pp pp 1080 65% 4.3 2.82 8sold(l8) c 3 ' 5 s b d f copper foil 0.5 oz c c c add plating plating h oz+plating c 1.4 c c c soldermask soldermask c c 0.4 board thickness =1.00mm +/- 10%mm c c c c c 39.06 free datasheet http://www.datasheet-pdf.com/ copyright ? mediatek inc. all rights reserved. mt6326 pmic design notice mt6326 pmic design notice copyright ? mediatek inc. all rights reserved. free datasheet http://www.datasheet-pdf.com/ copyright ? mediatek inc. all rights reserved. 21 mt6326 pmic mt6326 pmic base band processor 2g transceiver memory ram flash boost converter 1. back light 2. flash light 3. usb otg kp led driver (open drain) vibrator driver (open drain) class-d audio amplifier 1 wifi bluetooth camera sensor (af) audio switch charger controller reset generator i2c m 1 2 3 4 5 6 7 8 9 0 # lcm module usb device sim1 class-d audio amplifier 2 essential ldos va vio vrtc1 vrtc2 vsim1 vgp2 2 dc-dc (for vcore) dvfs dc-dc (for vmem) 2g transceiver ldos vrf, vtcxo basic feature ldos vusb, vbt vcam_d vcam_a extra ldos wifi general purpose vcore2 1.2(0.9_1.8v(1.5)/600ma vm 1.8_2.8v/600 ma vio_2.8v/150ma va_2.8v/150ma vrtc1_2.8v/2ma vusb 3.3v/100ma vbt 2.8_3v/100ma vcam_d 1.3_1.5_1.8_2.8v/100ma vcam_a 1.8_2.5_2.8v/250ma vrf 2.8v/250ma vtcxo 2.8v/50ma vrtc2_1.2_1.5v/0.1ma backup battery vwifi2v8 2.8_3_3.3v/150ma vwifi3v3 2.8_3_3.3v/300ma mt6326 control 3g transceiver ldos vpa 1.3~3.4v/600ma 3g pa analog switch sdio device vsdio 2.8_3.3v/350ma 3g transceiver v3grx 2.8_3_3.3v/100ma v3gtx 2.8_3_3.3v/200ma dc-dc (for 3g pa) pmos +rsense charger in current sink *8 (current sharing) (mux) vcore1 1.2(0.9_1.8v(1.5)/600ma 2-in-1 receiver vgp1 1.8/2.8/100ma sim2 vsim1 1.8_3v/100ma vsim2 1.8_3v/100ma free datasheet http://www.datasheet-pdf.com/ copyright ? mediatek inc. all rights reserved. 22 mt6326 pmic ldo mt6326 pmic ldo re gulator output voltage output curre nt output compone nts note s vcore 0.9~1.35 1.8 600 2.2uh + 4.7uf max. output current = 100ma when set to < 1.1v vcore 2 0.9~1.35 1.8 600 2.2uh + 4.7uf max. output current = 100ma when set to < 1.1v vm 1.8 2.8 600 2.2uh + 4.7uf max. output current = 450ma when set to 2.8v v3gpa 1.3~3.4 600 2.2uh + 4.7uf vbat should keep 600mv higher than v3gpa to keep good regulation. v3gtx 2.5/2.8/3/3.3 200 4.7uf v3grx 2.5/2.8/3/3.3 100 4.7uf vrf 2.8 250 4.7uf vtcxo 2.8 50 1uf va 2.8 150 4.7uf ' p s " 7 % % ' . q p x f s s f r v j s f n f o u vcama 1.5/1.8/2.5/2.8 250 4.7uf vwifi3v3 2.5/2.8/3/3.3 300 4.7uf vwifi2v8 2.5/2.8/3/3.3 150 4.7uf vio 2.8 150 1uf ' p s 7 % % b o e q f s j q i f s b m * 0 s f r v j s f n f o u vsim 1.8/3.0 100 1uf vusb 3.3 100 1uf vbt 1.3/1.5/1.8/2.5/2.8/3.0/3.3 100 1uf vcamd 1.3/1.5/1.8/2.5/2.8/3.0/3.3 100 1uf vsdio 2.8/3 300 4.7uf vgp1 1.3/1.5/1.8/2.5/2.8/3.0 100 1uf vgp2 1.3/1.5/ 1.8 /2.5 2.8/3.0 100 1uf vrtc 1.5/1.2 0.1 1uf bat_backup 2.8 2 1uf # b d l v q c b u u f s z free datasheet http://www.datasheet-pdf.com/ copyright ? mediatek inc. all rights reserved. 23 vbat input filter vbat input filter ? vbat input should reserve enough filt er to prevent interference to rf performance. ? all above component should be as close to mt6326 ic as possible in red frame , all co mponent should be in shielding case. free datasheet http://www.datasheet-pdf.com/ copyright ? mediatek inc. all rights reserved. 24 class class - - d audio amplifier output filter d audio amplifier output filter ? reserve 2 stage filter at output stage of class-d to prevent interference to rf performance. ? 1 st stage filter should be close to ic, 2 nd stage filter should be close to loud speaker. ? all the traces from ic to 2 nd stage filter should not exposed to prevent interference to rf performance. free datasheet http://www.datasheet-pdf.com/ copyright ? mediatek inc. all rights reserved. 25 class class - - d : 2 d : 2 - - in in - - 1 receiver function 1 receiver function ? mt6326 has 2 in 1 receiver function , when use external amplifier , must connect recin_p and recin_n. ? the typical value of r1 and r2 are 20 ohm each , and suggest r3 and r4 to be 4 ohm (32?20?8=4) ? due to value variation of r1 and r2 are higher , so maybe suffer audio volume. r1 r2 r3 r4 free datasheet http://www.datasheet-pdf.com/ copyright ? mediatek inc. all rights reserved. 26 class class - - d : audio amplifier power output d : audio amplifier power output ? although mt6326 class-d power output is 1w at 8 ? , because congenital power source limitation is 4.2v from vbat , but compare with other discrete amplifiers , mt6326 equal other amplifier in performance. ti poutput profile free datasheet http://www.datasheet-pdf.com/ copyright ? mediatek inc. all rights reserved. 27 boost1 for parallel backlight lcm or other 5v boost1 for parallel backlight lcm or other 5v requirement requirement ? reserve filter at input/output to prevent interference to rf performance. ? l200/l201/c205/c279 should be in shield case and close near mt6326 free datasheet http://www.datasheet-pdf.com/ copyright ? mediatek inc. all rights reserved. 28 boost2 for serial backlight lcm boost2 for serial backlight lcm ? reserve discrete b/l driver to prevent any improper design causing interference to rf performance. in this red frame, all components are reserved only. free datasheet http://www.datasheet-pdf.com/ copyright ? mediatek inc. all rights reserved. 29 ic protection: pwrkey and bat_on ic protection: pwrkey and bat_on please reserve 1k resist or on phone pcb to protect pwrkey no matter if pwrkey connect to any i/o connector or not. please reserve 1k resistor on phone pcb to protect bat_on pin if bat_on is used to detect battery. free datasheet http://www.datasheet-pdf.com/ copyright ? mediatek inc. all rights reserved. 30 ic protection: vbat ic protection: vbat i/o cable mt6326 power supply phone v- v+ gnd vbat reserve 1. 22uf capacitor 2. zener diode on phone. reserve 1000uf or above capacitor at the output of power supply, and at the end of connector cable. mt6326 has lower vbat voltage ra ting. (max. 4.3v.) some pro tection should reserve to prevent the damage by voltage surge. ?design notice in phone side: 1. at least 22uf capacitor. 2. add zener diode (5.1v) to pro tect the ic against low freq uency voltage s urge. put it between battery c onnector and mt6326. notice: if using io connector or test point to supply vbat for download, m anufacture, or repair, should let vbat trac e passing zener diode and 22uf capacitor bef ore entering ic. notice: using 5.1v zener will introduce some leakage when vbat = 4.2v. ?design notice in power supply side: add 1000uf (or above) capac itor at the output of the power supply to reduce the voltage bounce caused by long power cable. and the power cable s hould be as shor t as possible. also add 1000uf (or above) capacitor at the end of power cable (near phone side). free datasheet http://www.datasheet-pdf.com/ copyright ? mediatek inc. all rights reserved. 31 ic protection: chrin ic protection: chrin 7v 9v mt6223/35/38 /mt6326 6.8v 9v charger ovp point 30v 15v max. charger input external ovp/ocp mt6305 /mt6318 vchg r201 0 u202 bq24316 1 2 7 8 3 4 5 6 in vss ilim out nc /fault /ce vbat vbat to chrin c235 1u (16v 0805) chrin r202 220k r205 25k c205 1uf f201 fuse(1a 0603) external ovp/ocp: nc notice : you can get better ch arger protection by using external ovp/ocp device. ovp/ocp qualified vendor : 1. ti ? bq24314 free datasheet http://www.datasheet-pdf.com/ copyright ? mediatek inc. all rights reserved. 32 ic protection: ovp + charger ic protection: ovp + charger 7v 9v mt6223/35/38 /mt6326 6.17v(apl3206) 6.8v(apl3206a) 9v charger ovp point 30v 15v max. charger input external ovp/ocp mt6305 /mt6318 ovp/ocp + charger qualified vendor : 1. anpec - apl3206 qbi external ovp + charger : notice : you can get better ch arger protection by using external ovp/ocp device. free datasheet http://www.datasheet-pdf.com/ copyright ? mediatek inc. all rights reserved. 33 bypass capacitor: bypass capacitor: vcore vcore and vm and vm ? reserve enough bypass capacitors both at vcore and vm to obtain good system stability. free datasheet http://www.datasheet-pdf.com/ copyright ? mediatek inc. all rights reserved. 34 dvdd12_mipi power connection dvdd12_mipi power connection ? mt6326 vcore1 default is 1.3v , and mipi_1.2v power spec. is 1.1~1.3v , so if need to use mi pi could connect vcore2(if not used). besides , must add external ldo for mipi_1.2v. free datasheet http://www.datasheet-pdf.com/ copyright ? mediatek inc. all rights reserved. 35 bypass capacitor: bypass capacitor: layout rule for vcore ? due to MT6516 have many vcore ( vddk) balls , and these balls scatter around package of MT6516. please put bypass capacitor around MT6516 to increase system reliably. current source current source current source current source free datasheet http://www.datasheet-pdf.com/ copyright ? mediatek inc. all rights reserved. 36 bypass capacitor: avdd and vdd bypass capacitor: avdd and vdd ? reserve required input filter for abb as specified in left schematics. ? avdd28_mbuf suggest to connect to vtcxo. ? reserve 1uf for i/o power input. free datasheet http://www.datasheet-pdf.com/ copyright ? mediatek inc. all rights reserved. 37 layout notice: charging path layout notice: charging path ? charging related component (u204, rsense, r219) should be close to battery connector. ? minimum trace width are ma rked on the schematics above. ? isense and batsns should be connected as the figure above. ? the trace from rsense to battery c onnector (marked in red) should not share with other vbat traces. ? isense/batsns should be routed as differential traces which are away from noisy signals. f200 fuse(1a 0603) 40mil isense batsns chrin gatdrv vbat rsense 0.2 6mil r219 10k u204 apl3206 qbi acin 1 acin 2 out 7 out 8 gnd 3 vbat 4 gatdrv 5 chrin 6 ep 9 6mil vchg 6mil 6mil 6mil 40mil 40mil 40mil free datasheet http://www.datasheet-pdf.com/ copyright ? mediatek inc. all rights reserved. 38 ? the exposed pad of the charger ovp ic should connect to a large copper ground plane to get good thermal performance. ? the exposed pad should has at l east 6 gnd via connecting to inner layer. exposed pad to a large copper ground f200 fuse(1a 0603) 40mil isense batsns chrin gatdrv vbat rsense 0.2 6mil r219 10k u204 apl3206 qbi acin 1 acin 2 out 7 out 8 gnd 3 vbat 4 gatdrv 5 chrin 6 ep 9 6mil vchg 6mil 6mil 6mil 40mil 40mil 40mil layout notice: charger ovp ic layout notice: charger ovp ic free datasheet http://www.datasheet-pdf.com/ copyright ? mediatek inc. all rights reserved. 39 layout notice: vbat traces layout notice: vbat traces ? the vbat for the 5 blocks show a bove (class-d, buck converter, boost1, boost2 converter and analog ldos) should star-connect to the bulk capacitor near battery connector. class-d buck converter analog ldos boost1 converter boost2 converter free datasheet http://www.datasheet-pdf.com/ copyright ? mediatek inc. all rights reserved. 40 layout notice: vbat traces layout notice: vbat traces rf pa boost2 class-d amplifier charging path buck and boost converters bulk capacitor near battery connector analog ldos ? star-connect different vbat group to battery connector directly free datasheet http://www.datasheet-pdf.com/ copyright ? mediatek inc. all rights reserved. 41 class class - - d gnd d gnd ? the gnd for class-d should isolated carefully. l1 l2 l3 l4 l5 l6 l7 l8 gnd merge, other gnd (mark by black) should be isolate. free datasheet http://www.datasheet-pdf.com/ copyright ? mediatek inc. all rights reserved. 42 layout notice: gnd_vref traces layout notice: gnd_vref traces ? vref capacitor (1uf) should be close to ic. ? gnd_vref (gnd for vref) should isolate carefully. pin67 (gnd_vref) capacitor for vref the trace should connect to gnd of battery connector the trace should isolated and protected by gnd free datasheet http://www.datasheet-pdf.com/ copyright ? mediatek inc. all rights reserved. 43 ? the output trace (marked in above schematics) should be differential, and protected by gnd. ? 1 st filter should be as close to ic as possible. (as the left figure showed.) ? the trace width should be ? 8 ohm speaker: 25 mil. ? 4 ohm speaker: 40 mil. layout notice: class layout notice: class - - d output d output free datasheet http://www.datasheet-pdf.com/ copyright ? mediatek inc. all rights reserved. 44 ? components should be as close to ic as possible. ? l200/d200/l201/c205/d200/c208 should be close and parallel to each other. ? the direction of l200/d200 should arrange as the arrowhead in left figure. ? must add d204 to prevent feedback of vbus when turn off boost1. layout notice: boost1 layout notice: boost1 free datasheet http://www.datasheet-pdf.com/ copyright ? mediatek inc. all rights reserved. mt6 mt6 516 design notice (audio) 516 design notice (audio) copyright ? mediatek inc. all rights reserved. free datasheet http://www.datasheet-pdf.com/ copyright ? mediatek inc. all rights reserved. 46 outline outline ? analog gain setting ? rc value ? pcb layout ? audio feature ? mp3 decoder ? 3d surround effect ?eq 2.0 ? audio agc ? audio compensation filter ? for audio features, please refer to ? l1_audio_design_and_interface.pdf ? audio_post-processing_interface_v1.13.pdf ? audio customization v1.0.pdf free datasheet http://www.datasheet-pdf.com/ copyright ? mediatek inc. all rights reserved. 47 audio block diagram audio block diagram " 6 @ . 0 6 5 - " 6 @ . 0 6 5 3 " 6 @ 0 6 5 @ 1 " 6 @ 0 6 5 @ / " 6 @ ' . * / - " 6 @ ' . * / 3 . 6 9 . 6 9 4 u f s f p u p . p o p ' . " . s b e j p d i j q 7 p j d f 4 j h o b m " v e j p 4 j h o b m 7 p j d f " n q " v e j p " n q 3 " v e j p " n q - " 6 @ 7 * / @ 1 " 6 @ 7 * / @ / " 6 @ 7 * / @ / " 6 @ 7 * / @ 1 . 6 9 7 p j d f 4 j h o b m " v e j p - $ ) % " $ " v e j p 3 $ ) % " $ 7 p j d f % " $ 7 p j d f " % $ 1 ( " audio buffer voice buffer microphone pga free datasheet http://www.datasheet-pdf.com/ copyright ? mediatek inc. all rights reserved. 48 audio buffer gain audio buffer gain ? analog gain setting ? loudspk mode ? audio buffer ? 112= -1db ?positive gain results distortion ? external amplifier ?increasing external amplif ier gain for louder volume ? earphone mode ? audio buffer ? 112= -1db ?positive gain results distortion ? external rc trade-off w p j d f # v g g f s < |