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CJ3401 01M16 HMC10 BY228G MIW5037 SC251N BC556BG SMCJ7
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To Download SD01509 Datasheet File

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  Datasheet File OCR Text:
  .175 .002 4.45 .05 .125 3.18 3.96 .05 .156 .002 .250 6.35 .218 5.54 .51 .020 .186 4.72 mounting hole .000050 min. nickel per qq-n-290 retaining ring: .000100 min. nickel per qq-n-290 notes: unless otherwise specified 1. for general specifications, see sd74-0000 2. material specifications: body: brass per astm b16 retaining ring: beryllium copper per astm b194 3. finish specification: body: .000030 min. gold per astm b488 over recommended catalog p/n: 01509 b jjn 03/31/10 rjw 03/31/10 wpm 09/17/10 dao 09/17/10 a rev of SD01509 .xxx [x.xx] .005 [0.13] .xxxx [x.xxx] .xxxx wallingford, connecticut 06492 wpm 62 barnes industrial road north 09/13/10 dao date appd by er27689 description b rev date approved date approved date approved date drawn revised per drawing customer winchester electronics corporation 1 sht 1 decimal: .xx [x.x] .01 [0.3] angles: 2 scale: 8:1 per asme y14.5m-1994 unless otherwise specified: dimensions are in inches [mm] tolerances: power snap pc board thru hole 40 amp (rohs)


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