hlmb-k305-f00xx / HLMB-K505-f00xx 3mm auto insertable led lamps data sheet description the product is capable of withstanding automatic insertion and wave soldering processes. designed with a thick epoxy fange and soft leadframe material, it is ideal for clinch and cut operations. the product is suitable for lead-free application. package dimension features ? 3mm auto insertable package ? tinted and non-difused lens ? lead-free leadframe notes: 1. all dimensions are in millimeters (inches). 2. epoxy meniscus may extend about 1mm (0.040) down the leads.
absolute maximum rating ? ? a =25 c parameter hlmb-k305 (yellow) HLMB-K505 (green) units peak forward current 60 90 ma dc current 0 30 ma reverse voltage (i r =100 m a) 5 v operating temperature - 0 to +85 c storage temperature -30 to +85 c wave solder temperature 60 c for 5 seconds [1.6mm (0.060 in.) from body] optical and electrical characteristics at ? a =25 c symbol description part number minimum typical maximum units conditions iv luminous intensity hlmb-k305 HLMB-K505 9. 10.6 35 46 mcd i f =10ma l peak peak wavelength hlmb-k305 HLMB-K505 583 565 nm measurement at peak l d dominant wavelength hlmb-k305 HLMB-K505 585 571 nm dl ? spectral line halfwidth hlmb-k305 HLMB-K505 36 8 nm q ? viewing angle all 40 degree i f =10ma q j-pin thermal resistance all 90 c/w t s speed of respond hlmb-k305 HLMB-K505 90 500 ns c capacitance hlmb-k305 HLMB-K505 15 18 pf vf=0, f=1mhz v f forward voltage hlmb-k305 HLMB-K505 .0 .1 .6 .7 v i f =10ma i r reverse current all 100 ma v r = 5v note: 1. the dominant wavelength is derived from the cie chromaticity diagram and represents the single wavelength, which defnes the color of the devices.
3 figure 1. forward current vs. forward voltage figure 2. relative luminous intensity vs. dc forward current figure 3. ambient temperature vs. maximum dc forward current figure 4. radiation pattern figure 5. wavelength vs. relative intensity
? aping specifcations figure 6. taping specifcations dimension option ca (mm) h 18.0 1.0 f .5 +0.8/-0. w 18.0 +1.0/-0.5 w0 15.0 0.3 w1 9.0 +0.75/-0.5 w 0~.0 p 1.7 1.3 p0 1.7 1.3 p1 3.81 0.5 ? d0 4.0 0. d h1 0.00 1.0 d h 0.00 1.0 t 1. 0. recommended assembly condition a single-sided phenolic printed circuit board (pcb) is preferred. double-sided pcb and other materials may cause greater lead stress. recommended through-hole diameter is 0.93 to 1.03mm. lead length below the pcb should be 1.5 to 2.0mm, and the clinching angle (angle between the lead and pcb) should be 30 10 degrees. if smt devices and an adhesive are used on the same pcb as these lamps, the adhesive should be cured before the lamps are auto-inserted. if curing must be done after lamp insertion, the cure temperature and time should not exceed 140 c, 100 seconds. this is the temperature of the surface normal to the ir source. solder condition: preheat: temperature ramp rate of 2 to 4 c per second. do not exceed 150 c delta temperature between preheat and solder temperatures. the maximum time at preheat should not exceed 30 seconds. solder: 245 c 5 c, 3 seconds (1.6mm below seating plane). for product information and a complete list of distributors, please go to our web site: www.avagotech.com avago, avago technologies, and the a logo are trademarks of avago technologies, limited in the united states and other countries. data subject to change. copyright ? 007 avago technologies limited. all rights reserved. 5989-04 en - may 14, 007
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