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? semiconductor components industries, llc, 2006 july, 2006 ? rev. 1 1 publication order number: ncp5602/d ncp5602 high efficiency ultra small thinnest white led driver the ncp5602 product is a dual output led driver dedicated to the lcd display backlighting. the built?in dc?dc converter is based on a high efficient charge pump structure with operating mode 1x and 1.5x. it provides a peak 87% efficiency together with a 0.2% led to led matching. features ? 2.7 to 5.5 v input voltage range ? 87% peak efficiency with 1x and 1.5x mode ? icon function implemented ? built?in short circuit protection ? provides two independent led drives ? support i2c protocol ? smallest available package on the market ? tight 0.2% led to led matching ? this is a pb?free device typical applications ? portable back light ? digital cellular phone camera photo flash ? lcd and key board simultaneously drive vbat 1 f/6.3 v c3 gnd vbat i2c?scl 11 6 scl 4 iref 10 k r1 gnd 12 10 220 nf/10 v c1n c2n u1 ncp5602 vout 7 d1 lwy87sg figure 1. typical multiple white led driver i2c?sda 5 sda 1 gnd 9 8 220 nf/10 v c1p c2p c4 1 f/10 v led1 lwy87sg d2 led/icon 2 3 gnd llga12 (2x2 mm) mu suffix case 513aa pin connections http://onsemi.com marking diagram 1 scl c1p 1 vbat iref led2 c2n 3 4 5 10 9 8 7 za m za = specific device code m = date code = pb?free package (note: microdot may be in either location) 2 12 11 6 led1 sda c2p vout (top view) device package shipping ? ordering information ncp5602mutbg llga12 (pb?free) 3000 tape & ree l ?for information on tape and reel specifications, including part orientation and tape sizes, please refer to our tape and reel packaging specification brochure, brd801 1/d. gnd c1n
ncp5602 http://onsemi.com 2 1 f/6.3 v c3 gnd vbat 11 charge pump dc?dc converter 12 10 c2 9 8 c1 7 vout lwt67c d1 d2 gnd 1 f/6.3 v c4 2 3 q1 q2 overvoltage current control vbat digital control 6 scl analog control gnd 4 100 k r1 1 gnd overtemperature figure 2. simplified block diagram 220 nf 220 nf 5 sda vbat lwt67c gnd icon
ncp5602 http://onsemi.com 3 pin function description pin no. symbol function description 1 gnd power this pin is the ground signal for the analog and digital blocks and must be connected to the system ground. this pin is the ground reference for the dc?dc converter and the output current control. the pin must be connected to the system ground, a ground plane being strongly recommended. 2 led1 input, power this pin sinks to ground and monitors the current flowing into the first led, intended to be used in backlight application. the current is limited to 30 ma maximum (see note 2). when the icon bit of the led?reg register is high, the led2 fulfills the icon function. in this case, led1 is deactivated. 3 led2 input, power this pin sinks to ground and monitors the current flowing into the second led, intended to be used in backlight application. the current is limited to 30 ma maximum (see note 2). when the icon bit of the led?reg register is high, the led2 fulfills the icon function. in this case, led1 is deactivated. the icon current is 600 a typical. 4 i ref input, analog this pin provides the reference current, based on the internal bandgap voltage reference, to control the output current flowing in the led. a 1% tolerance, or better, resistor shall be used to get the highest accuracy of the led biases. an external current source can be used to bias this pin to dim the light coming out of the led. in no case shall the voltage at pin 4 be forced either higher or lower than the 600 mv provided by the internal reference. 5 sda input, digital this pin carries the data provided by the i2c protocol. the content of the sda byte is used to program the mode of operation and to set up the output current (see t able 2). 6 scl input, digital this pin carries the i2c clock to control the dc?dc converter and to set up the output current. the scl clock is associated with the sda signal. 7 vout output, power this pin provides the output voltage supplied by the dc?dc converter. the vout pin must be bypassed by 1.0 f ceramic capacitor located as close as possible to the pin to properly bypass the output voltage to ground. the circuit shall not operate without such bypass capacitor properly connected to the vout pin. the output voltage is internally clamped to 5.5 v maximum in the event of no load situation. on the other hand, the output current is limited to 40 ma (typical) in the event of a short circuit to ground. 8 c2p power one side of the external charge pump capacitor (c fly ) is connected to this pin, associated with c2n (see note 1). 9 c2n power one side of the external charge pump capacitor (c fly ) is connected to this pin, associated with c2p (see note 1). 10 c1p power one side of the external charge pump capacitor (c fly ) is connected to this pin, associated with c1n, pin 11 (see note 1). 11 vbat input, power input battery voltage to supply the analog and digital blocks. the pin must be decoupled to ground by a 1.0 f ceramic capacitor. 12 c1n power one side of the external charge pump capacitor (c fly ) is connected to this pin, associated with c1p, pin 10 (see note 1). 1. using low esr ceramic capacitor is mandatory to optimize the charge pump ef ficiency. 2. total dc?dc output current is limited to 60 ma.
ncp5602 http://onsemi.com 4 maximum ratings rating symbol value unit power supply v bat ?0.3 ncp5602 http://onsemi.com 5 power supply section (typical values are referenced to t a = +25 c, min & max values are referenced ?40 c to +85 c ambient temperature, operating conditions 2.85 v < vbat < 5.5 v, unless otherwise noted.) rating pin symbol min typ max unit power supply 11 v bat 2.7 ? 5.5 v continuous dc current in the load @ vf = 3.0 v, icon = l @ 3.2 v < vbat < 5.5 v @ 3.0 v < vbat < 5.5 v 7 i out 60 45 ? ? ? ? ma output icon current (icon = h) @ t j = + 25 c, vf = 2.8 v, vbat = 3.6 v 7 i icontrol ? 600 850 a continuous output short circuit current 7 isch ? 45 150 ma output voltage compliance (ovp) 7 vout 4.8 ? 5.7 v dc?dc start time (cout = 1.0 f) 3.0 v < vbat = nominal < 5.5 v from last ack bit to full load operation 12 tstart ? 150 ? s output voltage turn off time from last ack bit to vout = 5% 12 to ff ? 300 ? s standby current, vbat = 3.6 v, iout = 0 ma, icon = l @ scl = sda = l @ scl = sda = h (no port activity) 11 i stdb ? ? 6.0 12 a operating current, @ iout = 0 ma, icon = h, vbat = 3.6 v 11 i op ? 750 ? a output led to led current matching, @ 3.0 v < vbat < 4.2 v, i led = 10 ma, led1 & led2 are identical ?25 c < ta < 85 c 2, 3 i mat 1.0 0.2 1.0 % output current tolerance @ vbat = 3.6 v, i led = 10 ma ?25 c < ta < 85 c 2, 3 i tol ? 3.0 ? % charge pump operating frequency ?40 c < ta < 85 c ? fpwr ? 1.0 ? mhz thermal shutdown protection ? t sd ? 160 ? c thermal shutdown protection hysteresis ? t sdh ? 30 ? c efficiency ? led1 = led2 = 10 ma, vf = 3.2 v, vbat = 3.2 v (total = 20 ma) ? led1 = led2 = 30 ma, vf = 3.4 v, vbat = 3.75 v (total = 60 ma) ? ? e pwr ? ? 87 84 ? ? % analog section (typical values are referenced to t a = +25 c, min & max values are referenced ?40 c to +85 c ambient temperature, operating conditions 2.85 v < vbat < 5.5 v, unless otherwise noted.) rating pin symbol min typ max unit reference current @ vref = 600 mv (note 7) 4 i ref 1.0 ? 60 a reference voltage (note 7) 4 v ref ?3% 600 +3% mv reference current (iref) current ratio (see table 2) ? i ledr ? 16 ? ? 6. the overall output current tolerance depends upon the accuracy of the external resistor. using 1% or better resistor is recom mended. 7. the external circuit must not force the i ref pin voltage either higher or lower than the 600 mv specified. the limits represent the min/max values one can force to run the normal operation. digital parameters section (typical values are referenced to t a = +25 c, min & max values are referenced ?40 c to +85 c ambient temperature, operating conditions 2.85 v < vbat < 5.5 v, unless otherwise noted.) note: digital inputs undershoot < ? 0 .30 v to ground, digital inputs overshoot < 0.30 v to v bat . rating pin symbol min typ max unit inputi2c clock frequency (note 8) 6 f sck ? ? 400 khz positive going input high voltage threshold, scl, sda signals 5, 6 v ih 1.3 ? v bat v negative going input high voltage threshold, scl, sda signals 5, 6 v il 0 ? 0.4 v 8. parameter not tested in production, guaranteed by design.
ncp5602 http://onsemi.com 6 application information dc?dc operation the converter is based on a charge pump technique to generate a dc voltage capable to supply the white led load. the system regulates the current flowing into each led by means of internal current mirrors associated with the white diodes. consequently, the output voltage will be equal to the vf of the led, plus the drop voltage (ranging from 200 mv to 400 mv, depending upon the output current) developed across the internal nmos mirror. typically, assuming a standard white led forward biased at 10 ma, the output voltage will be 3.8 v. the built?in ovp circuit continuously monitor each output and stops the converter when the voltage is above 5.0 v. the converter resumes to normal operation when the voltage drops below 5.0 v (no latchup mechanism). consequently, the chip can operate with no load during any test procedures. load current calculation the load current is derived from the 600 mv reference voltage provided by the internal bandgap associated to the external resistor connected across i ref pin and ground (see figure 3). in any case, no voltage shall be forced at i ref pin, either downward or upward. the reference current is multiplied by the constant k = 250 to yield the output load current. since the reference voltage is based on a temperature compensated bandgap, a tight tolerance resistor will provide a very accurate load current. the resistor is calculated from the ohm?s law (r bias = vref/i ref ) and a more practical equation can be arranged to define the resistor value for a given output current: r bias (vref * k) iout (eq. 1) r bias (0.6 * 250) iout r bias 150 iout (eq. 2) consequently, the resistor value will range between r bias = 150/30 ma = 5000 and r bias = 150/0.5 ma = 300 k . obviously, the tolerance of such a resistor must be 1% or better, with a 100 ppm thermal coefficient, to get the expected overall tolerance. vbandgap pin 2 & 3 + ? 600mv pin 4 gnd i ref figure 3. basic reference current source note: the i ref pin must never be biased by an external voltage. gnd led return r1 load connection the ncp5602 chip is capable to drive the two led simultaneously, as depicted in figure 1, but the load can be arranged to accommodate one or two led if necessary in the application (see figure 4). in this case, the two current mirrors can be connected in parallel to drive a single power full led , thus yielding 60 ma current capability in a single led. ncp5602 7 3 2 d1 lwy8sg gnd c4 1 f/6.3 v figure 4. typical single and double led connections ncp5602 7 3 2 d1 lwy8sg gnd c4 1 f/6.3 v d2 lwy8sg
ncp5602 http://onsemi.com 7 finally, an external network can be connected across vout and ground , but the current through such network will not be regulated by the ncp5602 chip (see figure 5). on top of that, the total current out of the vout pin shall be limited to 60 ma. figure 5. extra load connected to vout ncp5602 7 3 2 gnd d1 lwy8sg d2 d3 d4 220r r1 220r r2 gnd c4 1 f/6.3 v 20 ma lwy8sg 20 ma lwy8sg 5 ma lwy8sg 5 ma i2c protocol the standard i2c protocol is used to transfer the data from the mcu to the ncp5602. leaving aside the acknowledge bit, the ncp5602 does not return data back to the mcu. figure 6. basic i2c timings start a7 a6 a5 a4 a3 a2 a1 r/w ack msb lsb 7 bits slave address start condition sent by master sent by slave figure 7. peripheral address identification b7 b6 b5 b4 b3 b2 b1 ack stop sent by slave figure 8. basic data transfer from mcu to peripheral b0 sent by master
ncp5602 http://onsemi.com 8 the physical address of the ncp5602 is 1001 111x, the x being the read/write identifier as defined by the i2c specification. since the ncp5602 does not return data, the first byte of the i2c frame shall be 1001 1110 ($9e) as depicted in table 2. table 1. ncp5602 physical i2c address b7 b6 b5 b4 b3 b2 b1 b0 1 0 0 1 1 1 1 0 to set up a new output current value, a full frame shall be sent by the mcu. the frame contains three consecutive bytes and shall fulfill the i2c specifications: first byte : i2c address $9e second byte : internal register address $01 third byte : output current value $00 to $1e (0 ma to 30 ma, assuming rext = 10 k ) the waveforms given in figure 9 illustrate a typical output current update. figure 9. typical ncp5602 i2c startup sequence dimming the built?in i2c interface provides a simple way to accurately control the output current flowing in the two led. such dimming is active under the normal mode only and the led2 current cannot be adjusted when the icon mode is active. the internal register led?reg[0..7] is set up by the content of the sda byte sent by the external mcu as depicted in table 2. for typical application, the 60 a reference current forced by the external resistor is multiply by 16 to get a 1.0 ma/step in the output led. the waveforms given figure 10 illustrate a normal programming sequence. table 2. led?reg[0..7] internal register bits assignment b7 b6 b5 b4 b3 b2 b1 b0 rfu rfu icon iref*16*16 iref*16*8 iref*16*4 iref*16*2 iref*16 [b7,b6] = rfu:bits reserved for future use b5 = icon:control the normal/icon mode of operation: icon = low normal mode takes place, the two led are activated and the current can be adjusted from 0 ma to 30 ma maximum per led. icon = high icon mode takes place, led#1 is deactivated, the current to led#2 being setup to 450 a. it is not possible to adjust this current. [b4..b0]= output led current. the content of these bits is latched to the current reference on the 8 th sck clock pulse. the dc?dc converter is switched off and the two led are disconnected when led?reg=$00.
ncp5602 http://onsemi.com 9 when the icon mode is activated, the dc?dc converter is switched off, led#1 is deactivated from the vout and 450 a are forced into led#2. the waveforms, given figure 11, illustrate the programming sequence to activate the icon. figure 10. output current i2c programming sequence figure 11. icon programming sequence vbat 4.7 f/10 v c3 gnd vcc 11 6 scl 4 iref gnd 12 10 220 nf/63 v c1n c2n vout 7 d1 lwy8s 5 sda 1 gnd 9 8 220 nf/63 v c1p c2p c4 4.7 f/16 v led1 led/icon 2 3 vout led1 led2 d2 lwy8s u1 ncp5602 z1 gnd 10 k r3 irefbk 10 9 g nd control port 8 6 4 2 7 5 3 1 j1 2 1 power j2 gnd vcc 10 k r2 10 k r1 tp1 scl scl tp2 sda vcc sda figure 12. demo board schematic diagram c1 c2 gnd
ncp5602 http://onsemi.com 10 figure 13. led current matching figure 14. efficiency as a function of v f , v bat
ncp5602 http://onsemi.com 11 figure 15. ncp5602 demo board
ncp5602 http://onsemi.com 12 package dimensions llga12 mu suffix case 513aa?01 issue o notes: 1. dimensioning and tolerancing per asme y14.5m, 1994 . 2. controlling dimension: millimeters. 3. dimension b applies to plated terminal and is measured between 0.15 and 0.20 mm from terminal. 4. coplanarity applies to the exposed pad as well as the terminals. ???? ???? ???? ???? a d e b c 0.10 pin one 2 x reference 2 x top view side view bottom view a l d2 e2 c c 0.10 c 0.10 c 0.08 12x a1 seating plane e/2 e 11x k note 3 b 12x 0.10 c 0.05 c a b b dim min max millimeters a 0.50 0.60 a1 0.00 0.05 b 0.15 0.25 d 2.00 bsc d2 0.80 1.00 e 2.00 bsc e2 0.55 0.65 e 0.40 bsc k 0.25 ??? l 0.30 0.50 2 6 11 7 l1 0.40 0.60 1 12 l1 9x *for additional information on our pb?free strategy and soldering details, please download the on semiconductor soldering and mounting t echniques reference manual, solderrm/d. soldering footprint* dimensions: millimeters 12x 0.23 2.30 0.40 pitch 0.93 0.63 0.56 11x 0.66 0.91 1 2.06 on semiconductor and are registered trademarks of semiconductor components industries, llc (scillc). scillc reserves the right to mak e changes without further notice to any products herein. scillc makes no warranty, representation or guarantee regarding the suitability of its products for an y particular purpose, nor does scillc assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, in cluding without limitation special, consequential or incidental damages. ?typical? parameters which may be provided in scillc data sheets and/or specifications can and do vary in different a pplications and actual performance may vary over time. all operating parameters, including ?typicals? must be validated for each customer application by customer?s technical e xperts. scillc does not convey any license under its patent rights nor the rights of others. scillc products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the scillc prod uct could create a situation where personal injury or death may occur. should buyer purchase or use scillc products for any such unintended or unauthorized application, buyer shall indem nify and hold scillc and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney f ees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that scillc was neglig ent regarding the design or manufacture of the part. scillc is an equal opportunity/affirmative action employer. this literature is subject to all applicable copyright laws and is not for resale in any manner. publication ordering information n. american technical support : 800?282?9855 toll free usa/canada europe, middle east and africa technical support: phone: 421 33 790 2910 japan customer focus center phone: 81?3?5773?3850 ncp5602/d literature fulfillment : literature distribution center for on semiconductor p.o. box 5163, denver, colorado 80217 usa phone : 303?675?2175 or 800?344?3860 toll free usa/canada fax : 303?675?2176 or 800?344?3867 toll free usa/canada email : orderlit@onsemi.com on semiconductor website : www.onsemi.com order literature : http://www.onsemi.com/orderlit for additional information, please contact your local sales representative

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