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[ak8975/c] ak8975/AK8975C 3-axis electronic compass 1. features 1. features a 3-axis electronic compass ic with high sensitive hall sensor technology. best adapted to pedestrian city navigation use for cell phone and other portable appliance. functions: ? 3-axis magnetometer device suitable for compass application ? built-in a to d converter for magnetometer data out ? 13 bit data out for each 3 axis magnetic components - sensitivity: 0.3 t / lsb typ. ? serial interface - i 2 c bus interface. standard mode and fast mode compliant with philips i 2 c specification ver.2.1 - 4-wire spi ? operation mode: power-down mode, single measurement mode, self test mode and fuse access mode. ? drdy function for measurement data ready ? magnetic sensor overflow monitor function ? built-in oscillator for internal clock source ? power on reset circuit ? self test function with built-in internal magnetic source operating temperatures: ? -30c to +85c operating supply voltage: ? analog power supply +2.4v to +3.6v ? digital interface supply +1.65v to analog power supply voltage. current consumption: ? power-down: 10 a max. ? measurement: - average power consumption at 8 hz repetition rate: 350 a typ. package: ak8975 16-pin qfn package: 4.0 mm 4.0 mm 0.75 mm AK8975C 14-pin wl-csp (bga): 2.0 mm 2.0 mm 0.6 mm ms1187-e-02 - 1 - 2010/05
[ak8975/c] 2. overview ak8975/c is 3-axis electronic compass ic with high sensitive hall sensor technology. small package of ak8975/c incorporates magnetic sensors for detecting terrestrial magnetism in the x-axis, y-axis, and z-axis, a sensor driving circuit, signal amplifier chain, and an arithmetic circuit for processing the signal from each sensor. self test function is also inco rporated. from its compact foot print and thin package feature, it is suitable for map heading up purpose in gps-equipped cell phone to realize pedestrian navigation function. ak8975/c has the following features: (1) silicon monolithic hall-effect magnetic sensor with magnetic concentrator realizes 3-axis magnetometer on a silicon chip. analog circuit, digital logic, power block and interface block are also integrated on a chip. (2) wide dynamic measurement range and high resolution with lower current consumption. output data resolution: 13 bit (0.3 t / lsb) measurement range: 1200 t average power consumption at 8hz repetition rate: 350 a typ. (3) digital serial interface - i 2 c bus interface to control ak8975/c functions and to read out the measured data by external cpu. a dedicated power supply for i 2 c bus interface can work in low-voltage apply as low as 1.65v. - 4-wire spi is also supported. a dedicated power supply for spi can work in low-voltage apply as low as 1.65v. (4) drdy pin and register inform to system that measurem ent is end and set of data in registers are ready to be read. (5) device is worked by on-chip oscillator so no external clock source is necessary. (6) self test function with internal magnetic source to confirm magnetic sensor operation on end products. ms1187-e-02 - 2 - 2010/05 [ak8975/c] 3. table of contents 1. features ....................................................................................................................................1 2. overview ...................................................................................................................................2 3. table of contents ......................................................................................................................3 4. circuit configuration ..................................................................................................................5 4.1. block diagram ....................................................................................................................5 4.2. block function ....................................................................................................................5 4.3. pin function .......................................................................................................................6 5. overall characteristics ..............................................................................................................7 5.1. absolute maximum ratings ................................................................................................7 5.2. recommended operating conditions ................................................................................7 5.3. electrical characteristics ....................................................................................................7 5.3.1. dc characteristics ......................................................................................................7 5.3.2. ac characteristics ......................................................................................................8 5.3.3. analog circuit characteristics .....................................................................................8 5.3.4. 4-wire spi ...................................................................................................................9 5.3.5. i 2 c bus interface .......................................................................................................10 6. functional explanation ............................................................................................................ 11 6.1. power states .................................................................................................................... 11 6.2. reset functions ............................................................................................................... 11 6.3. operation modes ..............................................................................................................12 6.4. description of each operation mode ................................................................................13 6.4.1. power-down mode ....................................................................................................13 6.4.2. single measurement mode .......................................................................................13 6.4.2.1. data ready ........................................................................................................13 6.4.2.2. data error ..........................................................................................................14 6.4.2.3. magnetic sensor overflow .................................................................................14 6.4.3. self-test mode ...........................................................................................................15 6.4.4. fuse rom access mode ..........................................................................................15 7. serial interface ........................................................................................................................16 7.1. 4-wire spi .........................................................................................................................16 7.1.1. writing data ..............................................................................................................16 7.1.2. reading data ............................................................................................................17 7.2. i 2 c bus interface ..............................................................................................................18 7.2.1. data transfer ............................................................................................................18 7.2.1.1. change of data ..................................................................................................18 7.2.1.2. start/stop condition ...........................................................................................18 7.2.1.3. acknowledge ......................................................................................................19 7.2.1.4. slave address ....................................................................................................19 7.2.2. write instruction .....................................................................................................20 7.2.3. read instruction .......................................................................................................21 7.2.3.1. one byte read .................................................................................................21 7.2.3.2. multiple byte read ...........................................................................................21 8. registers ............................................................................................................................... ..22 8.1. description of registers ...................................................................................................22 8.2. register map ....................................................................................................................23 8.3. detailed description of registers .....................................................................................24 8.3.1. wia: device id ..........................................................................................................24 8.3.2. info: information ......................................................................................................24 8.3.3. st1: status 1 .............................................................................................................24 8.3.4. hxl to hzh: measurement data ...............................................................................25 8.3.5. st2: status 2 .............................................................................................................26 8.3.6. cntl: control ...........................................................................................................26 8.3.7. rsv: reserved .........................................................................................................27 8.3.8. astc: self test control ............................................................................................27 8.3.9. ts1, ts2: test 1, 2 ...................................................................................................27 8.3.10. i2cdis: i 2 c disable ...................................................................................................27 8.3.11. asax, asay, asaz: sensitivity adjustment values ...................................................28 ms1187-e-02 - 3 - 2010/05 [ak8975/c] 9. example of recommended external connection ....................................................................29 9.1. i 2 c bus interface ..............................................................................................................29 9.2. 4-wire spi .........................................................................................................................30 10. package ............................................................................................................................... ...31 10.1. marking ............................................................................................................................31 10.2. pin assignment ................................................................................................................31 10.3. outline dimensions ..........................................................................................................32 10.4. recommended foot print pattern ....................................................................................33 11. relationship between the magnet ic field and output code ....................................................34 ms1187-e-02 - 4 - 2010/05 [ak8975/c] 4. circuit configuration 4.1. block diagram 3-axis hall sensor mux sda/si drdy chopper sw he-drive pre- amp integrator adc interface, logic & register scl/sk vd d voltage reference timin g control vid so osc1 csb magnetic source cad0 vss por fuse rom cad1 ts t1 tst2 rsv ts t6 4.2. block function block function 3-axis hall sensor monolithic hall elements. mux multiplexer for sele cting hall elements. chopper sw performs chopping. he-drive magnetic sensor drive circuit for co nstant-current driving of sensor pre-amp variable-gain differential amplifier used to amplify the magnetic sensor signal. integrator & adc integrates and amplifies pre-amp output and performs analog-to-digital conversion. osc1 generates an operating clock for sensor measurement. 6.144mhz(typ.) por power on reset circuit. generates reset signal on rising edge of vdd. interface logic exchanges data with an external cpu. drdy pin indicates sensor measurement end and data is ready to be read. i 2 c bus interface using two pins, namely, scl and sda. standard mode and fast mode are supported. the low-voltage specification can be supported by applying 1.65v to the vid pin. 4-wire spi is also supported by sk, si, so and csb pins. 4-wire spi works in vid pin voltage down to 1.65v, too. timing control generates a timing signal required for internal operation from a clock generated by the osc1. magnetic source generates magnetic field for self test of magnetic sensor. fuse rom fuse for adjustment ms1187-e-02 - 5 - 2010/05 [ak8975/c] 4.3. pin function pin no. 75 75c pin name i/o power supply system type function 1 a1 tst1 o vdd analog test pin. hi-z output. keep this pin electrically nonconnected. 2 a2 csb i vid cmos chip select pin for 4-wire spi. ?l? active. connect to vid when selecting i 2 c bus interface. 3 a4 rsv i vid cmos reserved pin. keep this pin electrically nonconnected or connect to vss. scl when the i 2 c bus interface is selected (csb pin is connected to vid) scl: control data clock input pin input: schmidt trigger 4 a3 sk i vid cmos when the 4-wire spi is selected sk: serial clock input pin sda i/o when the i 2 c bus interface is selected (csb pin is connected to vid) sda: control data input/output pin input: schmidt trigger, output: open drain 5 d4 si i vid cmos when the 4-wire spi is selected si: serial data input pin when the i 2 c bus interface is selected (csb pin is connected to vid) hi-z output. keep this pin electrically nonconnected. 6 b4 so o vid cmos when the 4-wire spi is selected serial data output pin 7 c4 vid - - power digital interface positive power supply pin. 8 - nc1 non-contact pin. keep this pin electrically nonconnected. 9 b3 tst6 o vid cmos test pin. vss output. keep this pin electric ally nonconnected or connect to vss.. 10 c3 drdy o vid cmos data ready signal output pin. active ?h?. informs measurement ended and data is ready to be read. when the i 2 c bus interface is selected (csb pin is connected to vid) cad1: slave address 1 input pin connect to vss or vdd. 11 d2 cad1 i vdd cmos when the 4-wire serial interface is selected connect to vss. 12 - nc2 non-contact pin. keep this pin electrically nonconnected. when the i 2 c bus interface is selected (csb pin is connected to vid) cad0: slave address 0 input pin connect to vss or vdd. 13 d1 cad0 i vdd cmos when the 4-wire serial interface is selected connect to vss. 14 c2 tst2 o vdd analog test pin. hi-z output. keep this pin electrically nonconnected. 15 c1 vss - - power ground pin. 16 b1 vdd - - power analog power supply pin. ms1187-e-02 - 6 - 2010/05 [ak8975/c] 5. overall characteristics 5.1. absolute maximum ratings vss=0v parameter symbol min. max. unit power supply voltage (vdd, vid) v+ -0.3 +6.5 v input voltage vin -0.3 (v+)+0.3 v input current iin - 10 ma storage temperature tst -40 +125 c (note 1) if the device is used in conditions exceeding these values, the device may be destroyed. normal operations are not guaranteed in such exceeding conditions. 5.2. recommended operating conditions vss=0v parameter remark symbol min. typ. max. unit operating temperature ta -30 +85 c vdd pin voltage vdd 2.4 3.0 3.6 v power supply voltage vid pin voltage vid 1.65 vdd v 5.3. electrical characteristics the following conditions apply unless otherwise noted: vdd=2.4v to 3.6v, vid=1.65v to vdd, temperature range=-30 c to 85 c 5.3.1. dc characteristics parameter symbol pin condition min. typ. max. unit high level input voltage 1 vih1 70%vid v low level input voltage 1 vil1 csb sk si 30%vid v high level input voltage 2 vih2 70%vid v low level input voltage 2 vil2 scl sda 30%vid v high level input voltage 3 vih3 70%vdd v low level input voltage 3 vil3 cad0 cad1 30%vdd v input current iin scl sk sda si csb vin=vss or vid -10 +10 a vid 2v 5%vid v hysteresis input voltage (note 2) vhs scl sda vid<2v 10%vid v high level output voltage 1 voh1 ioh -100a (note 5) 80%vid v low level output voltage 1 vol1 so drdy iol +100a (note 5) 20%vid v iol 3ma vid 2v 0.4 v low level output voltage 2 (note 3) (note 4) vol2 sda iol 3ma vid<2v 20%vid v idd1 power-down mode vdd=vid=3.0v 3 10 a idd2 when magnetic sensor is driven 6 10 ma current consumption idd3 (note 6) vdd vid self-test mode 10.3 15 ma (note 2) schmitt trigger input (reference value for design) (note 3) maximum load capacitance: 400pf (capacitive load of each bus line applied to the i 2 c bus interface) (note 4) output is open-drain. connect a pull-up resistor externally. (note 5) load capacitance: 20pf (note 6) reference value for design. ms1187-e-02 - 7 - 2010/05 [ak8975/c] 5.3.2. ac characteristics parameter symbol pin condition min. typ. max. unit power supply rise time (note 7) tpup vdd period of time from 10%vdd to 90%vdd (note 8) 200 s power-down mode transit time (note 7) vdd period of time from 90%vdd at power-on to power-down mode 100 s wait time before mode setting twat 100 s (note 7) reference value for design (note 8) only when vdd meets this condition, por circuit starts and resets ak8975/c. after reset, all registers are initialized and ak8975/c transits to power-down mode. tpup 10%vdd 90%vdd 5.3.3. analog circ uit characteristics parameter symbol condition min. typ. max. unit measurement data output bit dbit 13 bit time for measurement tsm single measurement mode 7.3 9 ms magnetic sensor sensitivity bse tc=25 c (note 9) 0.285 0.3 0.315 t/lsb magnetic sensor measurement range (note 10) brg tc=25c (note 9) 1229 t magnetic sensor initial offset (note 11) tc=25c -1000 +1000 lsb (note 9) value after sensitivity is adjusted us ing sensitivity fine adjustment data stored in fuse rom. (refer to 8.3.11 for how to adjust.) (note 10) reference value for design (note 11) value of measurement data register on shipment without applying magnetic field on purpose. ms1187-e-02 - 8 - 2010/05 [ak8975/c] 5.3.4. 4-wire spi 4-wire spi is compliant with mode 3 parameter symbol condition min. typ. max. unit csb setup time tcs 50 ns data setup time ts 50 ns data hold time th 50 ns vid 2.5v 100 ns sk high time twh 2.5v>vid 1.65v 150 ns vid 2.5v 100 ns sk low time twl 2.5v>vid 1.65v 150 ns sk setup time tsd 50 ns sk to so delay time (note 12) tdd 50 ns csb to so delay time (note 12) tcd 50 ns sk rise time (note 13) tr 100 ns sk fall time (note 13) tf 100 ns csb high time tch 150 ns (note 12) so load capacitance: 20pf (note 13) reference value for design. [4-wire spi] csb sk si tc s so ts tsd tcd th tdd hi-z hi-z twh twl tch [rise time and fall time] sk t r tf 0.9vid 0.1vid ms1187-e-02 - 9 - 2010/05 [ak8975/c] 5.3.5. i 2 c bus interface csb pin = ?h? i 2 c bus interface is compliant with standard mode and fast mode. standard/fast mode is selected automatically by fscl. (1) standard mode fscl 100khz 1.65v vid vdd symbol parameter min. typ. max. unit fscl scl clock frequency 100 khz thigh scl clock "high" time 4.0 s tlow scl clock "low" time 4.7 s tr sda and scl rise time 1.0 s tf sda and scl fall time 0.3 s thd:sta start condition hold time 4.0 s tsu:sta start condition setup time 4.7 s thd:dat sda hold time (vs. scl falling edge) 0 s tsu:dat sda setup time (vs. scl rising edge) 250 ns tsu:sto stop condition setup time 4.0 s tbuf bus free time 4.7 s (2) fast mode 100khz |