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to our customers, old company name in catalogs and other documents on april 1 st , 2010, nec electronics corporation merged with renesas technology corporation, and renesas electronics corporation took over all the business of both companies. therefore, although the old company name remains in this document, it is a valid renesas electronics document. we appreciate your understanding. renesas electronics website: http://www.renesas.com april 1 st , 2010 renesas electronics corporation issued by: renesas electronics corporation (http://www.renesas.com) send any inquiries to http://www.renesas.com/inquiry.
notice 1. all information included in this document is current as of the date this document is issued. such information, however, is subject to change without any prior notice. before purchasing or using any renesas el ectronics products li sted herein, please confirm the latest product information with a renesas electronics sales office. also , please pay regular and careful attention to additional and different information to be disclosed by rene sas electronics such as that disclosed through our website. 2. renesas electronics does not assume any liability for infringeme nt of patents, copyrights, or other intellectual property ri ghts of third parties by or arising from the use of renesas electroni cs products or techni cal information descri bed in this document . no license, express, implied or otherwise, is granted hereby under any patents, copyri ghts or other intell ectual property right s of renesas electronics or others. 3. you should not alter, modify, copy, or otherwise misappropriate any re nesas electronics product, wh ether in whole or in part . 4. descriptions of circuits, software and other related informat ion in this document are provided only to illustrate the operat ion of semiconductor products and application examples. you are fully re sponsible for the incorporation of these circuits, software, and information in the design of your equipment. renesas electronics assumes no responsibility for any losses incurred by you or third parties arising from the use of these circuits, software, or information. 5. when exporting the products or technology described in this doc ument, you should comply with the applicable export control laws and regulations and follow the proc edures required by such laws and re gulations. you should not use renesas electronics products or the technology described in this docum ent for any purpose relating to mil itary applicati ons or use by the military, including but not l imited to the development of weapons of mass de struction. renesas electronics products and technology may not be used for or incor porated into any products or systems whose manufacture, us e, or sale is prohibited under any applicable dom estic or foreign laws or regulations. 6. renesas electronics has used reasonable care in preparing th e information included in this document, but renesas electronics does not warrant that such information is error free. renesas electronics assumes no liability whatsoever for any damages incurred by you resulting from errors in or omissions from the information included herein. 7. renesas electronics products ar e classified according to the following three quality grades: ?standard?, ?high quality?, an d ?specific?. the recommended applications for each renesas electronics product de pends on the product?s quality grade, as indicated below. you must check the qua lity grade of each renesas electronics pr oduct before using it in a particular application. you may not use any renesas electronics produc t for any application categorized as ?speci fic? without the prior written consent of renesas electronics. further, you may not use any renesas electronics product for any application for which it is not intended without the prior written consent of renesas electronics. re nesas electronics shall not be in any way liable for any damages or losses incurred by you or third partie s arising from the use of any renesas electronics product for a n application categorized as ?specific? or for which the product is not intende d where you have failed to obtain the prior writte n consent of renesas electronics. the quality grade of each renesas electronics product is ?standard? unless otherwise expressly specified in a renesas electr onics data sheets or data books, etc. ?standard?: computers; office equipmen t; communications e quipment; test and measurement equipment; audio and visual equipment; home electronic a ppliances; machine tools; personal electronic equipmen t; and industrial robots. ?high quality?: transportation equi pment (automobiles, trains, ships, etc.); traffic control systems; anti-disaster systems; an ti- crime systems; safety equipment; and medical equipment not specif ically designed for life support. ?specific?: aircraft; aerospace equipment; submersible repeaters; nuclear reactor control systems; medical equipment or systems for life support (e.g. artificial life support device s or systems), surgical im plantations, or healthcare intervention (e.g. excision, etc.), and any other applicati ons or purposes that pose a di rect threat to human life. 8. you should use the renesas electronics pr oducts described in this document within the range specified by renesas electronics , especially with respect to the maximum ra ting, operating supply voltage range, movement power volta ge range, heat radiation characteristics, installation and other product characteristics. renesas electronics shall have no liability for malfunctions o r damages arising out of the use of renesas electronics products beyond such specified ranges. 9. although renesas electronics endeavors to improve the quality and reliability of its produc ts, semiconductor products have specific characteristics such as the occurrence of failure at a certain rate a nd malfunctions under certain use conditions. fur ther, renesas electronics products are not subject to radiation resistance design. please be sure to implement safety measures to guard them against the possibility of physic al injury, and injury or damage caused by fire in the event of the failure of a renesas electronics product, such as safe ty design for hardware and software in cluding but not limited to redundancy, fire control and malfunction prevention, appropri ate treatment for aging degradation or an y other appropriate measures. because the evaluation of microcomputer software alone is very difficult , please evaluate the safety of the final products or system manufactured by you. 10. please contact a renesa s electronics sales office for details as to environmental matters such as the environmental compatibility of each renesas electronics product. please use renesas electronics products in compliance with all applicable laws and regulations that regul ate the inclusion or use of c ontrolled substances, including wi thout limitation, the eu rohs directive. renesas electronics assumes no liability for damage s or losses occurring as a result of your noncompliance with applicable laws and regulations. 11. this document may not be reproduced or duplicated, in any form, in w hole or in part, without prio r written consent of renes as electronics. 12. please contact a renesa s electronics sales office if you have any questi ons regarding the informat ion contained in this document or renesas electroni cs products, or if you have any other inquiries. (note 1) ?renesas electronics? as used in this document means renesas electronics corporation and also includes its majority- owned subsidiaries. (note 2) ?renesas electronics product(s)? means any product developed or manufactured by or for renesas electronics.
data sheet 1997 the mark shows major revised points. bipolar analog integrated circuit pc358 document no. g11765ej6v0ds00 (6th edition) date published december 2007 n printed in japan low power dual operational amplifiers description the pc358 is a dual operational amplifier which is designed to operate from a single power supply over a wide range of voltages. operation from split power supplies is also possible and the power supply current drain is very low. further advantage, the input common- mode voltage range includes ground in the linear mode. features internally frequency compensation wide output voltage swing v to v + ?.5 v common mode input voltage range includes v wide supply voltage range 3 v to 30 v (single) 1.5 v to 15 v (split) output short circuit protection equivalent circuit (1/2 circuit) v + v out q 6 q 5 q 7 q 13 q 12 q 11 q 10 q 9 q 8 q 4 q 3 q 2 q 1 c c i i i n r sc 6 a 6 a 100 a 50 a pin configuration (marking side) out 1 i i1 i n1 v v + out 2 i i2 i n2 1 2 3 4 8 7 6 5 + 1 + 2 pc358c, 358g2 ordering information part number package pc358c 8-pin plastic dip (7.62 mm (300)) pc358g2 8-pin plastic sop (5.72 mm (225)) pc358g2(5) 8-pin plastic sop (5.72 mm (225)) the information in this document is subject to change without notice. before using this document, please confirm that this is the latest version. not all products and/or types are available in every country. please check with an nec electronics sales representative for availability and additional information.
pc358 2 data sheet g11765ej6v0ds absolute maximum ratings (t a = 25 c) parameter symbol ratings unit voltage between v + and v note 1 v + ?v ?.3 to +32 v differential input voltage v id 32 v input voltage note 2 v i v ?.3 to v +32 v output voltage note 3 v o v ?.3 to v + +0.3 v power dissipation c package note 4 p t 350 mw g2 package note 5 440 mw output short circuit duration note 6 indefinite s operating ambient temperature t a ?0 to +80 c storage temperature t stg ?5 to +125 c notes 1. reverse connection of supply voltage can cause destruction. 2. the input voltage should be allowed to input without damage or destruction independent of the magnitude of v + . either input signal should not be allowed to go negative by more than 0.3 v. the normal operation will establish when the both inputs are within the common mode input voltage range of electrical characteristics. 3. this specification is the voltage which should be allowed to supply to the output terminal from external without damage or destructive. even during the transition period of supply voltage, power on/off etc., this specification should be kept. the output voltage of normal operation will be the output voltage swing of electrical characteristics. 4. thermal derating factor is ?.0 mw/ c when operating ambient temperature is higher than 55 c. 5. thermal derating factor is ?.4 mw/ c when operating ambient temperature is higher than 25 c. 6. pay careful attention to the total power dissipation not to exceed the absolute maximum ratings, note 4 and note 5. recommended operating conditions parameter symbol min. typ. max. unit supply voltage (split) v 1.5 15 v supply voltage (v ? = gnd) v + +3 +30 v pc358c, pc358g2 electrical characteristics (t a = 25 c, v + = +5 v, v = gnd) parameter symbol conditions min. typ. max. unit input offset voltage v io r s = 0 ? 2 7mv input offset current i io 5 50 na input bias current note 7 i b 45 250 na large signal voltage gain a v r l 2 k ? 25 100 v/ma supply current note 8 i cc r l = , i o = 0 a 0.7 1.2 ma common mode rejection ratio cmr 65 70 db supply voltage rejection ratio svr 65 100 db output voltage swing v o r l = 2 k ? (connect to gnd) 0 v + ?.5 v common mode input voltage range v icm 0v + ?.5 v output current (source) i o source v in + = +1 v, v in = 0 v 20 40 ma output current (sink) i o sink v in = +1 v, v in + = 0 v 10 20 ma v in = +1 v, v in + = 0 v, 12 50 a v o = 200 mv channel separation f = 1 khz to 20 khz 120 db notes 7. input bias currents flow out from ic. because each currents are base current of pnp-transistor on input stage. 8. this current flows irrespective of the existence of use.
pc358 3 data sheet g11765ej6v0ds pc358g2(5) electrical characteristics (t a = 25 c, v + = +5 v, v = gnd) parameter symbol conditions min. typ. max. unit input offset voltage v io r s = 0 ? 2 3mv input offset current i io 5 50 na input bias current note 7 i b 45 60 na large signal voltage gain a v r l 2 k ? 50 100 v/ma supply current note 8 i cc r l = , i o = 0 a 0.7 0.9 ma common mode rejection ratio cmr 65 70 db supply voltage rejection ratio svr 65 100 db output voltage swing v o r l = 2 k ? (connect to gnd) 0 v + ?.5 v common mode input voltage range v icm 0v + ?.4 v output current (source) i o source v in + = +1 v, v in = 0 v 30 40 ma output current (sink) i o sink v in = +1 v, v in + = 0 v 15 20 ma v in = +1 v, v in + = 0 v, 30 50 a v o = 200 mv channel separation f = 1 khz to 20 khz 120 db notes 7. input bias currents flow out from ic. because each currents are base current of pnp-transistor on input stage. 8. this current flows irrespective of the existence of use.
pc358 4 data sheet g11765ej6v0ds typical performance characteristics (t a = 25 c, typ.) power dissipation p t - total power dissipation - mw t a - operating ambient temperature - c supply current i cc - supply current - ma 4 3 2 1 v + - supply voltage - v (v = gnd) input offset voltage v io - input offset voltage - mv 0 3 2 1 0 v + - supply voltage - v (v = gnd) input offset voltage v io - input offset voltage - mv ?0 5 4 3 2 1 0 ? ? ? ? t a - operating ambient temperature - ?c input bias current i b - input bias current - na v + - supply voltage - v (v = gnd) input bias current i b - input bias current - na t a - operating ambient temperature - ?c 0102 03040 i cc v + + t a = 0 to 70 c t a = ?0 c a t a = 25 ?c 10 20 30 40 050 100 v + = 5 v 600 0 500 400 300 200 100 20 40 60 80 100 pc358g2 pc358c 100 040 75 50 25 30 20 10 t a = 25 c 100 ?0 100 80 40 20 50 0 60 0 v + = +15 v v = gnd each 5 samples data
pc358 5 data sheet g11765ej6v0ds output short circuit current i o short - output short circuit current - ma ?0 70 60 50 40 30 t a - ambient temperature - ?c open loop frequency response a - open loop voltage gain - db 1 140 120 100 80 60 40 20 0 f - frequency - hz open loop voltage gain a v - open loop voltage gain - db 0 160 120 80 40 v + - supply voltage - v (v = gnd) large signal frequency response v o - output voltage swing -v p-p f - frequency - hz 02 06 08 01 0 100 k 10 m 10 20 30 40 i o short + v + = 30 v 10 m ? v in v + /2 v + v o + 0.1 f v + = 10 to 15 v r l = 20 k ? r l = 2 k ? 40 10 k 100 1 k 1 m 20 1 k + +15 v v o v in 100 k ? 15 10 5 0 35 10 k 30 50 100 k 300 500 1 m 1 k ? +7 v 2 k ? voltage follower pulse response input voltage - v output voltage - v v in -v o - 4 3 2 1 0 3 2 1 0204 06080 common mode rejection ratio cmr - common mode rejection ratio - db 100 120 100 80 60 40 20 0 f - frequency - hz 1 k 10 k 100 k 1 m r l 2 k ? v + = 15 v t - time - s
pc358 6 data sheet g11765ej6v0ds slew rate ?0 0.3 0.2 0.1 0 t a - operating ambient temperature - ?c 050 100 sr - slew rate - v/ s sr sr + v = ?5 v v o = ?0 v 100 50 30 20 10 v o - output voltage - v 0.5 0.3 0.2 0.1 0.05 0.03 0.02 0.01 output sink current limit + v o i o sink v + v + /2 0.01 0.03 0.05 0.1 0.3 0.5 1 2 5 10 100 50 30 20 3 i o sink - output sink current - ma 5 3 2 1 v + = +15 v ? v o - output voltage to v + - v 5 3 1 0 2 v + /2 v + ? v o i o source + v + = +15 v output source current limit 0.01 4 i o sourse - out p ut source current - ma 0.03 0.05 0.1 0.5 1 2 5 10 20 100 50 30 0.3 3
pc358 7 data sheet g11765ej6v0ds package drawings 14 85 item millimeters notes 1. each lead centerline is located within 0.25 mm of its true position (t.p.) at maximum material condition. p8c-100-300b,c-2 n 0.25 p 0.9 min. r0 15 a 10.16 max. b 1.27 max. f 1.4 min. g 3.2 0.3 j 5.08 max. k 7.62 (t.p.) c 2.54 (t.p.) d 0.50 0.10 h 0.51 min. i 4.31 max. l 6.4 m 0.25 + 0.10 ? 0.05 2. ltem "k" to center of leads when formed parallel. m a r m p i j h g f dn c b 8-pin plastic dip (7.62mm(300)) l k
pc358 8 data sheet g11765ej6v0ds item b c i 8-pin plastic sop (5.72 mm (225)) d e f g h j p millimeters 1.27 (t.p.) 0.78 max. 4.4 0.15 0.1 0.1 0.42 1.59 0.21 6.5 0.3 1.49 + 0.08 ? 0.07 1.1 0.2 3 + 7 ? 3 note each lead centerline is located within 0.12 mm of its true position (t.p.) at maximum material condition. a 5.2 + 0.17 ? 0.20 k l m n 0.6 0.2 0.17 0.12 0.10 + 0.08 ? 0.07 s8gm-50-225b-6 85 1 4 s m c detail of lead end a m s n f g b e d p h i j k l
pc358 9 data sheet g11765ej6v0ds recommended soldering conditions the pc358 should be soldered and mounted under the following recommended conditions. for soldering methods and conditions other than those recommended below, contact an nec electronics sales representative. for technical information, see the following website. semiconductor device mount manual (http://www.necel.com/pkg/en/mount/index.html) type of surface mount device pc358g2: 8-pin plastic sop (5.72 mm (225)) process conditions symbol infrared ray reflow peak temperature: 235 c or below (package surface temperature), ir35-00-3 reflow time: 30 seconds or less (at 210 c or higher), maximum number of reflow processes: 3 time. vapor phase soldering peak temperature: 215 c or below (package surface temperature), vp15-00-3 reflow time: 40 seconds or less (at 200 c or higher), maximum number of reflow processes: 3 time. wave soldering solder temperature: 260 c or below, flow time: 10 seconds or less, ws60-00-1 maximum number of flow processes: 1 time, pre-heating temperature: 120 c or below (package surface temperature). partial heating method pin temperature: 350 c or below, p350 heat time: 3 seconds or less (per each side of the device). caution apply only one kind of soldering condition to a device, except for ?artial heating method? or the device will be damaged by heat stress. types of through-hole device pc358c: 8-pin plastic dip (7.62 mm (300)) process conditions wave soldering solder temperature: 260 c or below, (only to leads) flow time: 10 seconds or less. partial heating method pin temperature: 300 c or below, heat time: 3 seconds or less (per each lead). caution for through-hole device, the wave soldering process must be applied only to leads, and make sure that the package body does not get jet soldered.
pc358 10 data sheet g11765ej6v0ds reference documents quality grades on nec semiconductor devices c11531e semiconductor device mount manual http://www.necel.com/pkg/en/mount/index.html nec semiconductor device reliability/ iei-1212 quality control system - standard linear ic
2 pc358 the information in this document is current as of december, 2007. the information is subject to change without notice. for actual design-in, refer to the latest publications of nec electronics data sheets or data books, etc., for the most up-to-date specifications of nec electronics products. not all products and/or types are available in every country. please check with an nec electronics sales representative for availability and additional information. no part of this document may be copied or reproduced in any form or by any means without the prior written consent of nec electronics. nec electronics assumes no responsibility for any errors that may appear in this document. nec electronics does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from the use of nec electronics products listed in this document or any other liability arising from the use of such products. no license, express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of nec electronics or others. descriptions of circuits, software and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. the incorporation of these circuits, software and information in the design of a customer's equipment shall be done under the full responsibility of the customer. nec electronics assumes no responsibility for any losses incurred by customers or third parties arising from the use of these circuits, software and information. while nec electronics endeavors to enhance the quality, reliability and safety of nec electronics products, customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. to minimize risks of damage to property or injury (including death) to persons arising from defects in nec electronics products, customers must incorporate sufficient safety measures in their design, such as redundancy, fire-containment and anti-failure features. nec electronics products are classified into the following three quality grades: "standard", "special" and "specific". the "specific" quality grade applies only to nec electronics products developed based on a customer- designated "quality assurance program" for a specific application. the recommended applications of an nec electronics product depend on its quality grade, as indicated below. customers must check the quality grade of each nec electronics product before using it in a particular application. the quality grade of nec electronics products is "standard" unless otherwise expressly specified in nec electronics data sheets or data books, etc. if customers wish to use nec electronics products in applications not intended by nec electronics, they must contact an nec electronics sales representative in advance to determine nec electronics' willingness to support a given application. (note) ? ? ? ? ? ? m8e 02. 11-1 (1) (2) "nec electronics" as used in this statement means nec electronics corporation and also includes its majority-owned subsidiaries. "nec electronics products" means any product developed or manufactured by or for nec electronics (as defined above). computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots. transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support). aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems and medical equipment for life support, etc. " standard": " special": " specific":

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