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uq9-07-007a date:19.july.2007 re v.2.1 (tq9-07-279, 19.july.2007) page 1 of 14 mitsubishi (optical devices) mf-27wxe series 100mbps-2.7gbps, multi-rate dwdm sfp transceiver module 2.7gbps multi-rate dwdm sfp transceiver with digital diagnostic monitoring interface mf-27wxe series 1. description this transceiver is compliant with small form-factor pluggable (sfp) msa, and optimized for 100mbps to 2.7gbps dense wavelength division multiplexing (dwdm) applications. the optical subassembly consists of two parts, the transmitter with a cooled dfb laser in a hermetic sealed module, and the receiver with an apd preamp in a hermetic sealed coaxial module and integrated circuits for reshaping received optical signals. the built-in serial id recognition is incorporated, which allows users to interface with two wire serial interface that displays information on manufacturer, part number, link, distance, and other parameters. the digital diagnostic monitoring interface is incorporated, which monitors transceiver parameters including temperature, supply voltage, laser bias current, laser power and received optical power. 2. features ? small form-factor pluggable (sfp) msa compliant transceiver with sonet/sdh system quality ? all 100ghz c-band wavelengths line-up for dwdm itu-t grid ? 100mbps to 2.7gbps multi-rate operation capability ? transmission target distance up to 80km ( 1600ps/nm) / 120km (2400ps/nm) / 160km (3200ps/nm) ? 2 classes of optical output power version: norm al power (0 to 4dbm) / high power (3 to 7dbm) ? lc duplex receptacle ? single +3.3v power supply ? differential data inputs and outputs ? operating case temperature range -5 c to +70 c ? comply with sff-8472 msa ? incorporating digital diagnostic monitoring interface with internal calibration ? serial id functionality ? apd receiver ? bail latch type ? rohs compliant mitsubishi electric corp. datasheet
uq9-07-007a date:19.july.2007 re v.2.1 (tq9-07-279, 19.july.2007) page 2 of 14 mitsubishi (optical devices) mf-27wxe series 100mbps-2.7gbps, multi-rate dwdm sfp transceiver module 3. block diagram control circuits (ddm) memory l mod_def[2] mod_def[1] rd+ td+ rx_los tx_disable tx_fault opt_in opt_out bias circuit fault detector temperature monitor circuit rd- td- apd bias circuit (dc/dc converter) signal detect circuit limiting amp &low pass fil. driver apd tia rosa ld monitor pd tosa supply voltage monitor circuit ld bias & pout monitor circuit rx received po monitor circuit a.t.c cooler/ sensor 4. absolute maximum ratings stress below listed absolute maximum rating may cause permanent damage to the module. this is a stress only and functional operation of the m odule at these or any other conditions in excess of those given in the operational sections of this data sheet. exposure to absolute maximum rating for extended periods may affect module reliability. parameters symbol ratings unit supply voltage vcc 0 to +4.0 v storage temperature tstg -40 to +85 c operating case temperature tc -5 to +70 c relative humidity (non condensation) - 5 to 85 %
uq9-07-007a date:19.july.2007 re v.2.1 (tq9-07-279, 19.july.2007) page 3 of 14 mitsubishi (optical devices) mf-27wxe series 100mbps-2.7gbps, multi-rate dwdm sfp transceiver module 5. electrical characteristics all parameters are specified over the operating case temperature. measurement conditions are at 2.666057gbps +/-20ppm, nrz pn2 23 -1 and 50%duty cycle data signal. the data input/output signal interface is ac-coupled internally. tx_disable input signal level is lvttl comp atible. (with internally pull-up 4.7k to 10k ) tx_fault and los (loss of signal) output are open-collector/drain, and the levels indicated assuming 4.7k to 10k ohm pull up resistor to host_vcc is present. parameters symbol min. typ. max. unit supply voltage vcc 3.13 3.3 3.47 v normal power - 1.0 1.4 power consumption high power pc - 1.2 1.6 w v ih 2.0 - vcc v tx_disable input voltage v il 0 - 0.8 v v oh 2.0 - vcc v tx_fault output voltage v ol 0 - 0.5 v v oh 2.0 - vcc v rx_los output voltage v ol 0 - 0.5 v v oh vcc 0.8 - vcc v mod_def[2] output voltage v ol - - 0.4 v v ih vcc 0.7 - vcc v mod_def[1], [2] input voltage v il 0 - vcc 0.3 v input amplitude, differential v t 500 - 1800 mv p-p input impedance, differential r t - 100 - output amplitude, differential v o 370 - 1600 mv p-p output impedance, differential r o - 100 - data output rise/fall time (20% to 80%) tr/tf - - 150 ps electrical input data return loss 100mhz < f < 1.2ghz(differential) rld1 12 - - db electrical input data return loss 1.2ghz < f < 2.7ghz(differential) rld2 8 - - db
uq9-07-007a date:19.july.2007 re v.2.1 (tq9-07-279, 19.july.2007) page 4 of 14 mitsubishi (optical devices) mf-27wxe series 100mbps-2.7gbps, multi-rate dwdm sfp transceiver module 6. optical characteristics all parameters are specified over the operating case temperature. measurement conditions are at 2.666057gbps +/-20ppm, nrz pn2 23 -1 and 50%duty cycle data signal. transmitter parameter min. max. unit wavelength (note 1) 1527.22 1563.86 nm optical source slm - optical power bol (3.3v, 25degc) +1 +4 dbm normal power optical power eol 0 +4 dbm optical power bol (3.3v, 25degc) +4 +7 dbm high power optical power eol +3 +7 dbm optical power when disable - -40 dbm spectral width (-20db) - 0.4 nm wavelength deviation bol -50 +50 pm wavelength deviation eol -100 +100 pm smsr 30 - db extinction ratio 8.2 - db optical waveform sonet/sdh mask compliant - return loss at s 24 - db chromatic dispersion (-m3) 1600 - ps/nm chromatic dispersion (-m1) 2400 - ps/nm chromatic dispersion (-m2) 3200 - ps/nm path penalty (-m3) - 2 db path penalty (-m1, m2) - 3 db jitter generation (note 2) -bandwidth 12khz to 20mhz - 0.007 uirms jitter generation (note 2) -bandwidth 12khz to 20mhz - 0.07 uipp note1: wavelength table code wavelength code wavelength code wavelength code wavelength 630 1527.22 510 1536.61 390 1546.12 270 1555.75 620 1527.99 500 1537.40 380 1546.92 260 1556.55 610 1528.77 490 1538.19 370 1547.72 250 1557.36 600 1529.55 480 1538.98 360 1548.51 240 1558.17 590 1530.33 470 1539.77 350 1549.32 230 1558.98 580 1531.12 460 1540.56 340 1550.12 220 1559.79 570 1531.90 450 1541.35 330 1550.92 210 1560.61 560 1532.68 440 1542.14 320 1551.72 200 1561.42 550 1533.47 430 1542.94 310 1552.52 190 1562.23 540 1534.25 420 1543.73 300 1553.33 180 1563.05 530 1535.04 410 1544.53 290 1554.13 170 1563.86 520 1535.82 400 1545.32 280 1554.94
uq9-07-007a date:19.july.2007 re v.2.1 (tq9-07-279, 19.july.2007) page 5 of 14 mitsubishi (optical devices) mf-27wxe series 100mbps-2.7gbps, multi-rate dwdm sfp transceiver module note2: jitter generation (itu-t g.783 compliant) receiver parameter min. max. unit wavelength 1525 1565 nm sensitivity bol (3.3v, 25degc, ber=1e-10) - -29 dbm sensitivity eol (ber=1e-10) - -28 dbm overload bol (3.3v, 25degc) -7 - dbm overload eol -8 - dbm rx_los assert level -39 - dbm rx_los de-assert level - -29 dbm rx_los hysteresis 0.3 4.0 db jitter tolerance, transfer itu-t g. 783 compliant (with reference cdr) - maximum reflectance of receiver at r - -27 db jitter analyzer sfp rx sfp tx opt. att data out+ electrical output of jitter analyzer txd- txd+ data out-
uq9-07-007a date:19.july.2007 re v.2.1 (tq9-07-279, 19.july.2007) page 6 of 14 mitsubishi (optical devices) mf-27wxe series 100mbps-2.7gbps, multi-rate dwdm sfp transceiver module 7. digital diagnostic monitoring accuracy the diagnostic monitoring features internal calibrati on, and is calibrated over operating temperature and voltage range. the monitor parameters are represented as defined in sff-8472. these parameters of the monitoring accuracy are gua ranteed, as long as operating conditions of this sfp transceiver do not exceed ranges defined below. digital diagnostic monitoring accuracy parameter min. max. unit range for accurate monitoring transceiver temperature * -3 +3 c -5 to 70 c supply voltage -3 +3 % 3 to 3.6 v tx bias current -10 +10 % - tx optical power -3 +3 db 0 to 4 dbm (normal power) 3 to 7 dbm (high power) rx optical power -3 +3 db -29 to -7dbm *transceiver temperature is defined as an internal temperature. 8. transceiver pin allocation no. symbol description no. symbol description 1 tx gnd transmitter ground 11 rx gnd receiver ground 2 tx_fault transmitter fault indication 12 rd- receiver data output-bar 3 tx_disable transmitter disable 13 rd+ receiver data output 4 mod _ def[2] module definition 2 14 rx gnd receiver ground 5 mod _ def[1] module definition 1 15 rx vcc receiver power supply 6 mod _ def[0] module definition 0 16 tx vcc transmitter power supply 7 nuc no user connection 17 tx gnd transmitter ground 8 rx_los loss of signal 18 td+ transmitter data in 9 rx gnd receiver ground 19 td- transmitter data in-bar 10 rx gnd receiver ground 20 tx gnd transmitter ground
uq9-07-007a date:19.july.2007 re v.2.1 (tq9-07-279, 19.july.2007) page 7 of 14 mitsubishi (optical devices) mf-27wxe series 100mbps-2.7gbps, multi-rate dwdm sfp transceiver module 9. pin descriptions pin no. function i/o pin description 1,17,20 tx gnd i these pins are the transmitter ground connections. they should be connected to a low impedance ground plane (0v). 9,10, 11,14 rx gnd i these pins are th e receiver ground connections. they should be connected to a low impedance ground plane (0v). 16 tx vcc * i this is the power supply pin for the transceiver part. it should be connected to +3.3v. recommended power supply decoupling. (see figure 8) 15 rx vcc * i this is the power supply pin for the receiver part. it should be connected to +3.3v. recommended power supply decoupling. (see figure 8) * both tx vcc and rx vcc have been internally connected due to supply of control circuit vcc. 18,19 td+ / td- i this data input pin modulates the laser diode. when the td+ input is asserted, the laser diode is turned on. they are internally ac-coupled into an equivalent load of ri differential, as shown in figure 8. 3 tx_disable i active high ttl input, with inte rnal 7.4k ohm pull-up resistor to vcc. asserting the transmitter disable will deactiv ate the laser within the assert time. table 1 indicates the timing of tx_disable. 12,13 rd+ / rd- o received data out and inverted received data out are differential serial output from the receiver. these are ac-coupled 100 ohm differential lines which should be terminated with a 100 ohm (differential) at the user serdes, as shown in figure 8. ac coupling is done inside the module and is thus not required on the host board. 8 rx_los o active high open collector/drain output that indicates a loss-of-signal condition (los). when the average optical power received by the module is below the assert level, rx_los is indicated. table 1 indicates the timing of rx_los. rx_los requires a 4.7k to 10k ohm pull-up resistor external to the module, i.e., in the host system host_vcc, as shown in figure 8. the pull-up voltage is between 2.0 v and vccr (vcct) + 0.3 v. 2 tx_fault o active high open collector/drain output that indicates a fault in the module. this can be failure of the laser diode. under this condition, tx_fault will activate and be latched. and then the lase r will be deactivated within the assert time. tx_fault also requires a 4.7k to 10k ohm pull-up resistor externally, i.e. in the host system host_vcc, as shown in figure 8. the pull-up voltage is between 2.0 v and vcct (vccr) +0.3v. toggling tx_disable high for at least t_reset can reset it. see figure 8 and figure 5. 6,5,4 mod_def [0:2] - this module has a serial id function, which provides information about the transceiver?s capabilities, standard interfaces, manufacturer and other information. this function is provided via a tw o wire serial eeprom interface. mod_def[0] is connected to ground inside the module.(low) mod_def[1] is the serial clock signal input.(scl) mod_def[2] is the data output/input.(sda) they should be pulled up with 4.7kohm -10kohm resistor on the host board. the pull-up voltage shall be vcct or vccr. the serial id definitions are as given in the ?sfp-msa? standard. 7 nuc - these pins are no user connection and should be left open.
uq9-07-007a date:19.july.2007 re v.2.1 (tq9-07-279, 19.july.2007) page 8 of 14 mitsubishi (optical devices) mf-27wxe series 100mbps-2.7gbps, multi-rate dwdm sfp transceiver module table 1 timing of control and status i/o the timing of the control and status line are listed in below and figure 1 to 7. parameter symbol min max unit condition tx_disable assert time t_off - 10 s time from rising edge of tx_disable to when the optical output falls below 10% of nominal tx_disable negate time t_on - 1 ms time from falling edge of tx_disable to when the modulated optical output rises above 90% of nominal time to initialize, including reset of tx_fault t_init - 300 ms from power on or negation of tx_fault using tx_disable tx_fault assert time t_fault - 100 s time from fault to tx_fault on tx_disable to reset t_reset 10 - s time tx_disable must be held high to reset tx_fault startup time t_startup - 60 s from power on to nagation of tx fault/int, indicating laser temperature has stabilised to within operating range. rx_los assert time t_losson - 100 s time from los state to rx_los assert rx_los negate time t_lossoff - 100 s time from non-los state to rx_los de-assert serial id clock rate f_clock - 100 khz - figure 1 power on initialization of sfp transceiver, tx_fault will be asserted high, transmitted signal will be off at this stage and changing the value of tx_disable will have not effect. when the laser temperature is stabilized tx_fault is de-asserted; from this point the module is in normal operation and tx_disable will control the laser on-off state. figure 2 power on initialization of sfp transceiver, tx_disable asserted t_startup laser temp stable t_fault tx_fault transmitted si g nal t_init power on vcc t_on
uq9-07-007a date:19.july.2007 re v.2.1 (tq9-07-279, 19.july.2007) page 9 of 14 mitsubishi (optical devices) mf-27wxe series 100mbps-2.7gbps, multi-rate dwdm sfp transceiver module figure 3 sfp tx_disable timing during normal operation figure 4 detection of transmitter fault condition figure 5 successful recovery from transient fault condition figure 6 unsuccessful recovery from fault condition figure 7 timing of rx_los detection
uq9-07-007a date:19.july.2007 re v.2.1 (tq9-07-279, 19.july.2007) page 10 of 14 mitsubishi (optical devices) mf-27wxe series 100mbps-2.7gbps, multi-rate dwdm sfp transceiver module figure 8 example of sfp host board schematic protocol ic protocol vcc 4.7k to 10k ohm 4.7k to 10k ohm td+ td- laser driver 100 ohm host board sfp module tx_fault tx_disable tx gnd pld/pal rd+ rd- 4.7k to 10k ohm 4.7k to 10k ohm 4.7k to 10k ohm 100 ohm tx vcc rx vcc rx gnd preamp & postamp rx_los mod_def[0] mod_def[1] mod_def[2] +3.3v 0.1 uf 0.1 uf 0.1 uf 10 uf 10 uf 10 uf +3.3v 1 uh 1 uh rate select 0 rate select 1 serial id 33k ohm 33k ohm serdes ic 7.4k ohm
uq9-07-007a date:19.july.2007 re v.2.1 (tq9-07-279, 19.july.2007) page 11 of 14 mitsubishi (optical devices) mf-27wxe series 100mbps-2.7gbps, multi-rate dwdm sfp transceiver module 10. type number table 1 code wavelength code wavelength code wavelength code wavelength 630 1527.22 510 1536.61 390 1546.12 270 1555.75 620 1527.99 500 1537.40 380 1546.92 260 1556.55 610 1528.77 490 1538.19 370 1547.72 250 1557.36 600 1529.55 480 1538.98 360 1548.51 240 1558.17 590 1530.33 470 1539.77 350 1549.32 230 1558.98 580 1531.12 460 1540.56 340 1550.12 220 1559.79 570 1531.90 450 1541.35 330 1550.92 210 1560.61 560 1532.68 440 1542.14 320 1551.72 200 1561.42 550 1533.47 430 1542.94 310 1552.52 190 1562.23 540 1534.25 420 1543.73 300 1553.33 180 1563.05 530 1535.04 410 1544.53 290 1554.13 170 1563.86 520 1535.82 400 1545.32 280 1554.94 11. reliability reference telcordia gr-468-core radiated emission:iec61000-6-3 immunity:iec61000-4- 2, iec61000-4-3 flammability: ul94v-0 esd for pin interface: 500v by human body model (with rd=1500ohm and cd=100pf) 12. laser safety information class 1 laser product (iec60825 and cdrh compliant) mf - 27wxe ? m 1 1 z a 630 m1: 120km (2400ps/nm) version m2: 160km (3200ps/nm) version m3: 80km (1600ps/nm) version center wavelength ( see table 1 ) 1: normal power version 2: high power version
uq9-07-007a date:19.july.2007 re v.2.1 (tq9-07-279, 19.july.2007) page 12 of 14 mitsubishi (optical devices) mf-27wxe series 100mbps-2.7gbps, multi-rate dwdm sfp transceiver module 13. general outline drawing [unit: mm]
uq9-07-007a date:19.july.2007 re v.2.1 (tq9-07-279, 19.july.2007) page 13 of 14 mitsubishi (optical devices) mf-27wxe series 100mbps-2.7gbps, multi-rate dwdm sfp transceiver module 14. packing mitsubishi reserves the right to change the circuitr y and specifications without notice at any time. no liability is assumed as a result of their use or application. no rights under any patent accompany the sale of any such product(s) or information. this product is sensitive to electrostatic discharge. take precautions to prevent esd; use wrist straps, grounded work surfaces and recognized anti-st atic techniques when handling sfp module. sfp dust cap presses plate packing box ten sfps are packed up in this packing box. - capacity: 10pcs. / box - packing box and presses plate material : cardboard with esd protection coat.
uq9-07-007a date:19.july.2007 re v.2.1 (tq9-07-279, 19.july.2007) page 14 of 14 mitsubishi (optical devices) mf-27wxe series 100mbps-2.7gbps, multi-rate dwdm sfp transceiver module safety cautions for use of optoelectronic devices general: although the manufacturer is always striving to improve the relia bility of its product, problems a nd errors may occur with semi conductor products. therefore, the user's products ar e required to be designed with full safety rega rd to prevent any accide nts that result in inju ry, death, fire or environmental damage even when semiconducto r products happen to error. especially it is recommended to take in consideration ab out redundancy, fire prevention, error prevention safeguards. and the fo llowing requirements must be strictly observed. warning! 1. eye safety : semiconductor laser radiates laser light duri ng operation. laser light is very dangerous when shot directly into human eyes. do n't look at laser light directly, or through optics such as a lens. the laser light should be observed using the itv camera, ir-viewer, or other appropriate instruments. 2. product handling : the product contains gaas (gallium arsenide). it is safe for re gular use, but harmful to the human body if made into powder or steam. be sure to avoid dangerous process like smashing, burni ng, chemical etching. never put this product in one's mouth or swallow it. 3. product disposal : this product must be disposed of as special industrial waste. it is necessary to separate it from general industrial waste and general garbage. handling cautions for optoelectronic devices 1. general: (1) the products described in this specifica tion are designed and manufactured for use in general communication systems or electro nic devices, unless their applications or reliability are othe rwise specified. therefore, they are not designed or ma nufactured for installation in devices or systems that may affect human life or that are used in social infrastr ucture requiring high reliability. (2) when the customer is considering to use the products in special applications, such as transportation systems (automobiles, tra ins, vessels), medical equipments, aerospace, nuclear power control, and submarine repeaters or systems, pl ease contact mitsubishi electric or an auth orized distributor. 2. shipping conditions: (1) during shipment, place the packing boxes in th e correct direction, and fix them firmly to keep them immovable. placing the box es upside down, tilting, or applying abnormal pressu re onto them may cause deformation in the elect rode terminals, breaking of optical fiber, o r other problems. (2) never throw or drop the packing boxes. hard im pact on the boxes may cause break of the devices. (3) take strict precautions to keep the devi ces dry when shipping under rain or snow. 3. storage conditions: when storing the products, it is recommended to store them follo wing the conditions described be low without opening the packing . not taking enough care in storing may result in defects in electrical charact eristics, soldering quality, visu al appearance, and so on. th e main points are described below (if special storage conditions are given to the product in the specification sheet, they have priority over the following general cautions): (1) appropriate temperature and humidity cond itions, i.e., temperature range between 5~30 c , and humidity between 40~60 percent rh, should be maintained in storage locations. controlling the temperature and humidity within this ra nge is particularly important in case o f long-term storage for six months or more. (2) the atmosphere should be particular ly free from toxic gases and dust. (3) do not apply any load on the product. (4) do not cut or bend the leads of the devices which are to be stor ed. this is to preven t corrosion in the cut or bent part of th e lead causing soldering problems in the customer?s assembling process. (5) sudden change in temperature may cause c ondensation in the product or packing, theref ore, such locations should be avoided for storing. temperature in storage locations should be stable. (6) when storing ceramic package products for extended periods of time, the leads may turn reddish due to reaction with sulfur in the atmosphere. (7) storage conditions for bare chip and unsealed products shall be stated separately because bare chip and unsealed products requ ire stricter controls than package sealed products. 4. design conditions and environment under use: (1) avoid use in locations where water or orga nic solvents adhere directly to the produc t, or where there is any possibility of th e generation of corrosive gas, explosive gas, dust, salinity, or ot her troublesome conditions. such environmen ts will not only significantly lower the re liability, but also may lead to serious accidents. (2) operation in excess of the absolute maximu m ratings can cause permanent damage to th e device. the customers are requested to d esign not to exceed those ratings even for a short time. 5. esd safety cautions: the optoelectronic devices are sensitive to static electricity (esd, electro-static discharge). the product can be broken by es d. when handling this product, please observe the following countermeasures: to prevent break of devices by static electricity or surge, please adopt the following countermeasures in the assembly line: (1) ground all equipments, machinery jigs, and tools in the process line with earth wires installed in them. take particular care with hot plates, solder irons and other items for which the commercial power supplies are prone to leakage. (2) workers should always use earth bands. use of antistatic clot hing, electric conductive shoes, a nd other safety equipment while at work is highly recommended. (3) use conductive materials for this product?s container, etc. (4) it is recommended that grounding mats be placed on the surfaces of assembly line workbench and the surrounding floor in work a rea, etc. (5) when mounting this product in parts or materials which can be electrically charged (printed wiring boards, plastic products, e tc.), pay close attention to the static electricity in those parts. esd may damage the product. (6) humidity in working environment should be controlled to be 40 percent rh or higher. these countermeasures are most general, an d there is a need to carefully confirm the line before starting mass production using th is product (in the trial production, etc.). it is extremely important to prevent surge, eliminate it rapidly, and pr event it from spreading. the end of document

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