selection guide luminous intensity iv (mcd) @ 10 ma color part number min. max. redf hlmp-3316f 22.00f - f hlmp-3316-i00xxf 22.0f - f hlmp-3416f 14.7f - yellowf hlmp-3416-g00xxf 14.7f - f hlmp-3416-ij0xxf 37.6f 120.2 greenf hlmp-3519f 10.6f - f hlmp-3519-f00xxf 10.6f - description this f familyf off t-1 3 / 4 f nondifusedf ledf lampsf is f speciallyf designed f for f applica tionsf requiring f higher f on-axisf intensity f thanf isf achievable f withf af standard f lamp. f the f light f generated f isf focused f to f af narrow f beamf tof achievefthisf efect. features ? f high f intensity ? f choice foff3f brightf colorsf f f f f fffCf highf efciencyf redf f f f f fffCf yellowf f f f f f fffCf highf performancef green ? popular f t-1 3 / 4 f diameterf package ? f selected fminimumf intensities ? narrow fviewingfangle ? general f purposefleads ? reliable fandfrugged ? available fonftapefandf reel hlmp-331x series hlmp-341x series hlmp-351x series t-1 3 / 4 (5 mm) high intensity led lamps data sheet
2 package dimensions part numbering system h l m p - 3 x 1 x - x x x x x mechanical options 00:fbulk 01:f tape f&f reel,f crimpedf leads 02:f tape f&f reel,f straightf leads b1:f rightf anglef housing,f unevenf leads b2:f rightf anglef housing,f evenf leads f color bin options 0:f fullf colorfbinf distribution f maximum iv bin options 0:fopenf(nofmax.flimit) others: f pleasef referf tofthef ivfbinf table f minimum iv bin options please f referf tofthef ivfbinf table f brightness level 5,f7:f lessf brightness 6,f9:f higherf brightness f color options 3:f gapfher 4:f gapf yellow 5:f gapf green
3 notes: 1.f q 1/2 fisfthefof-axisfanglef atfwhichfthefluminousf intensityfisfhalffthefaxialfluminousf intensity. 2.f the f dominantf wavelength,f l d ,fisf derivedf fromfthefcief chromaticityf diagramfandf representsfthefsinglef wavelengthfwhichfdefnesfthef colorfoff thef device. 3.f radiantf intensity,fi e ,finf watts/steradian,f mayfbef foundf fromfthef equationfi e f=fi v / h v ,f wherefi v fisfthefluminousf intensityfinfcandelasfandf h v fisfthef luminousf efcacyfinf lumens/watt. electrical characteristics at t a = 25c device symbol description hlmp- min. typ. max. units test conditions i v f luminous f intensityf 3316f 22f 60.0f f mcdf i f f=f10fmaf (figuref3) f f 3416f 14.7f 50.0f f mcdf i f f=f10fmaf (figuref8) f f 3519f 10.6f 70.0f f mcdf i f f=f10fmaf (figuref13) 2 q 1 / 2 f including f anglef betweenf halff 3316f f 35f f deg.f i f f=f10fma f f luminous f intensityf pointsf f f f f f see f notef1f (figuref6) f f 3416f f 35f f deg.f i f f=f10fma f f f f f f f f see f notef1f (figuref11) f f 3519f f 24f f deg.f i f f=f10fma f f f f f f f f see f notef1f (figuref16) l peak f peak f wavelengthf 331xf f 635f f nmf measurement f atf peak f f f 341xf f 583f f f (figure f1) f f f 351xf f 565 dl 1/2f spectral flinefhalfwidthf 331xf f 40f f nm f f f 341xf f 36 f f f 351xf f 28 l d f dominant f wavelengthf 331xf f 626f f nmf see f notef2f (figuref1) f f f 341xf f 585 f f f 351xf f 569 t s f speed foff responsef 331xf f 90f f ns f f f 341xf f 90 f f f 351xf f 500 cf capacitancef 331xf f 11f f pff v f f=f0;fff=f1f mhz f f f 341xf f 15 f f f 351xf f 18 r q j-pin f thermal f resistancef 331xf f 260f f c/wf junction f tof cathode f f f 341xf f f f f lead f f f 351x v f f forward f voltagef 331xf f 1.9f 2.4f vf i f f=f10fmaf (figuref2) f f f 341xf f 2.0f 2.4f f i f f=f10fmaf (figuref7) f f f 351xf f 2.1f 2.7f f i f f=f10fmaf (figuref12) v r f reverse f breakdownf volt.f allf 5.0f f f vf i r f=f100fa h v f luminous f efcacyf 331xf f 145f f lumensf see f notef3 f f f 341xf f 500f f f watt f f f 351xf f 595 f
4 figure 1. relative intensity vs. wavelength. absolute maximum ratings at t a = 25c parameter 331x series 341x series 351x series units peak f forwardf currentf 90f 60f 90f ma average f forwardf current [1] f 25f 20f 25f ma dcf current [2] f 30f 20f 30f ma power f dissipation [3] f 135f 85f 135f mw reverse f voltage f(i r f=f100f a)f 5f 5f 5f v transient f forwardf current [4] f 500f 500f 500f ma f (10fsecf pulse) ledf junctionf temperature ff 110f 110f 110f c operating f temperatur ef rangef -40f tof +100f -40f tof +100f -20f tof+100f c storage f temperature fr angef -40f tof+100 f -40f tof+100 f -40f tof+100f c f notes: 1.f seef figuref5f (red),f10f (yellow),forf15f (green)f tofestablishfpulsedf operatingf conditions. 2.f forf redfandf greenf seriesf deratef linearlyf fromf50cf atf0.5fma/c.f forf yellow f seriesf deratef linearlyf fromf50cf atf0.2fma/c. 3.f forf redfandf greenf seriesf deratef powerf linearlyf fromf25cf atf1.8fmw/c.f forf yellow f seriesf deratef powerf linearlyf fromf50cf atf1.6f mw/c. 4.f the f transientfpeakf currentfisfthefmaximumf non-recurringfpeakf currentf thatfcanfbefappliedf tofthef devicefwithoutf damagingfthefledfdiefandf wirebond. f itfisfnotf recommendedf thatfthef devicefbef operatedf atfpeakf currentsf beyondfthefpeakf forwardf currentf listedfinfthef absolutef maxi - mumf ratings.
5 high efciency red hlmp-331x series figure 3. relative luminous intensity vs. dc forward current. figure 2. forward current vs. forward voltage characteristics. figure 4. relative efciency (luminous intensity per unit current) vs. peak led current. figure 5. maximum tolerable peak current vs. pulse duration (i dc max as per max ratings). figure 6. relative luminous intensity vs. angular displacement.
6 yellow hlmp-341x series figure 8. relative luminous intensity vs. dc forward current. figure 7. forward current vs. forward voltage characteristics. figure 9. relative efciency (luminous intensity per unit current) vs. peak current. figure 10. maximum tolerable peak current vs. pulse duration (i dc max as per max ratings). figure 11. relative luminous intensity vs. angular displacement.
7 green hlmp-351x series figure 13. relative luminous intensity vs. dc forward current. figure 12. forward current vs. forward voltage characteristics. figure 14. relative efciency (luminous inten - sity per unit current) vs. peak led current. figure 15. maximum tolerable peak current vs. pulse duration (i dc max as per max ratings). figure 16. relative luminous intensity vs. angular displacement. t-1 3 / 4 lamp.
8 table 2. intensity bin limit intensity range (mcd) color bin min. max. f hf 15.5f 24.8 f if 24.8f 39.6 f jf 39.6f 63.4 f kf 63.4f 101.5 f lf 101.5f 162.4 f mf 162.4f 234.6 f nf 234.6f 340.0 f of 340.0f 540.0 redf pf 540.0f 850.0 f qf 850.0f 1200.0 f rf 1200.0f 1700.0 f sf 1700.0f 2400.0 f tf 2400.0f 3400.0 f uf 3400.0f 4900.0 f vf 4900.0f 7100.0 f wf 7100.0f 10200.0 f xf 10200.0f 14800.0 f yf 14800.0f 21400.0 f zf 21400.0f 30900.0 f table 2. (cont'd) table 2. (cont'd) maximum f tolerancef forfeachfbinflimitfisf18%. intensity range (mcd) color bin min. max. f gf 16.6f 26.5 f hf 26.5f 42.3 f if 42.3f 67.7 f jf 67.7f 108.2 f kf 108.2f 173.2 f lf 173.2f 250.0 f mf 250.0f 360.0 yellowf nf 360.0f 510.0 f of 510.0f 800.0 f pf 800.0f 1250.0 f qf 1250.0f 1800.0 f rf 1800.0f 2900.0 f sf 2900.0f 4700.0 f tf 4700.0f 7200.0 f uf 7200.0f 11700.0 f vf 11700.0f 18000.0 f wf 18000.0f 27000.0 f intensity range (mcd) color bin min. max. f ef 7.6f 12.0 f ff 12.0f 19.1 f gf 19.1f 30.7 f hf 30.7f 49.1 f if 49.1f 78.5 f jf 78.5f 125. 7 f kf 125.7f 201.1 f lf 201.1f 289.0 greenf mf 289.0f 417.0 f nf 417.0f 680.0 f of 680.0f 1100.0 f pf 1100.0f 1800.0 f qf 1800.0f 2700.0 f rf 2700.0f 4300.0 f sf 4300.0f 6800.0 f tf 6800.0f 10800.0 f uf 10800.0f 16000.0 f vf 16000.0f 25000.0 f wf 25000.0f 40000.0
9 color categories lambda (nm) color cat # min. max. f 6f 561.5f 564.5 f 5f 564.5f 567.5 greenf 4f 567.5f 570.5 f 3f 570.5f 573.5 f 2f 573.5f 576.5 f 1f 582.0f 584.5 f 3f 584.5f 587.0 yellowf 2f 587.0f 589.5 f 4f 589.5f 592.0 f 5f 592.0f 593.0 f mechanical option matrix mechanical option code defnition f f f 00f bulkf packaging,fminimumf incrementf500fpcs/bag f f f 01f tape f&f reel,f crimpedf leads,fminimumf incrementf1300fpcs/bag f f f 02f tape f&f reel,f straightf leads,fminimumf incrementf1300fpcs/bag f f f b1f right f anglef housing,f unevenf leads,fminimumf incrementf500fpcs/bag f f f b2f right f anglef housing,f evenf leads,fminimumf incrementf500fpcs/bag note: all f categoriesf arefestablishedf forf classifcationfoff products.f productsf mayfnotfbef availablefinfallf categories.f pleasef contactf yourflocalf avagof repre - sentative f forf furtherf clarifcation/information.
precautions lead forming ? f the f leadsf off anf ledf lampf may f bef preformed f orf cutf to f lengthf priorf tof insertionfandf solderingf intofpcf board. ? f if f leadf forming f isf required f before f soldering, f care f mustf bef takenf to f avoid f any f excessive f mechanicalf stress f induced f to f ledf package. f otherwise, f cutf thef leadsf off ledf to f lengthf after f soldering f process f at f room f temperature. f the f solderf joint f formed f willf absorb f thef mechanicalf stress f off thef leadf cuttingf from f traveling f to f thefledfchipfdief attachfandf wirebond. ? f it f isf recommended f that f tooling f madef to f precisely f form f andf cutf thef leadsf to f lengthf rather f thanf rely f uponf handf operation. soldering conditions ? f care f mustf bef takenf during f pcbf assemblyf andf soldering f process f tof preventfdamagef tofledf component. ? f the f closestf ledf isf allowed f to f solderf onf board f isf 1.59f mmf below f thef bodyf (encapsulant f epoxy) f for f thosef parts fwithoutf standof. ? f recommended f solderingf conditions:f ? f wave f soldering f parameter f mustf bef setf andf maintained f according f to f recommended f temperature f andf dwell f timef inf thef solderf wave. f customer f isf advisedf to f periodically f checkf onf thef soldering f profle f to f ensure f thef soldering f profle f usedf isf always f conforming f to f recommended f solderingf condition. ? f if f necessary, f usef fxture f to f holdf thef ledf component f inf proper f orientation f withf respect f to f thef pcbf during f soldering f process. ? f proper f handlingf isf imperative f to f avoid f excessive f thermal f stresses f to f ledf components f whenf heated. f therefore, f thef soldered f pcbf mustf bef allowed f to f cool f to f roomf temperature,f25c,f beforef handling. ? f special f attention f mustf bef given f to f board f fabrication, f solderf masking, f surface f plating f andf leadf holesf size f andf componentf orientationf tof assuref solderability. ? f recommended f pcf board f plated f through f holef sizes f for fledf componentfleads: manual solder wave soldering dipping pre-heat f temperaturef 105 fcf max.f C pre-heat f timef 30 fsecf max.f C peak f temperaturef 250 fcf max.f 260fcf max. dwell f timef 3fsecf max.f 5fsecf max. f led component plated through lead size diagonal hole diameter 0.457fxf0.457f mmf 0.646f mmf 0.976f tof1.078fmm f (0.018fxf0.018f inch)f (0.025f inch)f (0.038f tof0.042finch) 0.508fxf0.508f mmf 0.718f mmf 1.049f tof1.150fmm f (0.020fxf0.020f inch)f (0.028f inch)f (0.041f tof0.045finch) f note: f referf tof applicationf notefan1027f forf moref information fonf solderingfledf components. figure 17. recommended wave soldering profle. for product information and a complete list of distributors, please go to our website: www.avagotech.com avago, avago technologies, and the a logo are trademarks of avago technologies in the united states and other countries. data subject to change. copyright ? 2005-2008 avago technologies. all rights reserved. obsoletes 5989-4259en av02-1023en - october 13, 2008 laminar wa ve bo tt om side of pc bo ard ho t air knife turbulent wa ve fluxing prehea t 0 1 0 2 0 30 50 100 150 200 250 30 40 50 time ? seconds tempera ture ? c 60 70 80 90 100 t op side of pc bo ard convey or speed = 1.83 m/min (6 ft/min) prehea t setting = 150 c (100 c pcb) solder wa ve tempera ture = 245 c air knife air tempera ture = 390 c air knife dist ance = 1.91 mm (0.25 in.) air knife angle = 40 solder: sn63; flux: rma no te: allo w for bo ards to be sufficientl y cooled before exer ting mechanical force.
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