surface mount rf pin diodes in sot-363 (sc-70, 6 lead) technical data features ? unique configurations in surface mount sot-363 package C add flexibility C save board space C reduce cost ? switching C ultra low distortion switching C low capacitance provides faster switching C low resistance at low current for low loss ? attenuating C variable resistance useful for setting power in agc functions C low current attenuating for less power consumption ? matched diodes for consistent performance ? better thermal conductivity for higher power dissipation package lead code identification (top view) description the hsmp-386l is a general purpose pin diode designed for low current attenuators and low cost switches. the hsmp-389l/r/t/ u/v is optimized for switching applica- tions where low resistance at low current, and low capacitance are required. applications hsms-389 a switch in the 0.5 C 2 ghz range hsms-386l good general purpose switch and attenuator typical markets for each include: tv satellite receivers (dbs, tvro); cellular, pcs; ism (industrial-scientific-medical unlicensed band use) hsmp-386l hsmp-389l /r/t/u/v gu 1 2 3 6 5 4 pin connections and package marking notes: 1. package marking provides orientation and identification. 2. see electrical specifications for appropriate package marking. series shunt pair low inductance single t unconnected trio l 123 654 123 654 123 654 u high frequency series v 123 654 dual switch model r 123 654 applications hsms-389 a switch in the 0.5 C 2 ghz range hsms-386l good general purpose switch and attenuator typical markets for each include: tv satellite receivers (dbs, tvro); cellular, pcs; ism (industrial-scientific-medical unlicensed band use)
2 electrical specifications, t c = +25 c, each diode pin general purpose diodes minimum typical typical part package breakdown total total number marking lead voltage resistance capacitance hsmp- code [1] code configuration v br (v) r t ( w )c t (pf) 386l ll l unconnected trio 50 3.0 1.5* 0.20 test conditions v r = v br i f = 10 ma v r = 50 v measure f = 100 mhz f = 1 mhz i r 10 m ai f = 100 ma* pin switching diodes minimum maximum maximum part package breakdown total total number marking lead voltage resistance capacitance hsmp- code [1] code configuration v br (v) r t ( w )c t (pf) 389l gl l unconnected trio 100 2.5 0.30 389r s r dual switch mode 389t z t low inductance single 389u gu u series-shunt pair 389v gv v high frequency series pair test conditions v r = v br i f = 5 ma v r = 5 v measure f = 100 mhz f = 1 mhz i r 10 m a absolute maximum ratings [1] , t c = + 25 c symbol parameter unit absolute maximum i f forward current (1 m s pulse) amp 1 p iv peak inverse voltage v same as v br t j junction temperature c 150 t stg storage temperature c -65 to 150 q jc thermal resistance [2] c/w 140 notes: 1. operation in excess of any one of these conditions may result in permanent damage to the device. 2. t c = 25 c, where t c is defined to be the temperature at the package pins where contact is made to the circuit board. esd warning: handling precautions should be taken to avoid static discharge.
3 hsmp-386l typical performance, t c = 25 c, each diode figure 1. rf capacitance vs. reverse bias. 0.15 0.30 0.25 0.20 0.35 02 6 41012 816 14 18 20 total capacitance (pf) reverse voltage (v) 1 ghz 100 mhz 1 mhz 10000 1000 100 10 1 0.1 rf resistance (ohms) i f ?forward bias current (ma) 0.01 0.1 1 10 100 figure 2. total rf resistance at 25 c vs. forward bias current. 120 115 110 105 100 95 90 85 11030 i f ?forward bias current (ma) figure 3. 2nd harmonic input intercept point vs. forward bias current for switch diodes. input intercept point (dbm) hsmp-3880 diode mounted as a series switch in a 50 microstrip and tested at 123 mhz 1000 100 10 10 20 30 t rr - reverse recovery time (ns) forward current (ma) figure 4. reverse recovery time vs. forward current for various reverse voltages. v r = 5v v r = 10v v r = 20v 100 10 1 0.1 0.01 0 0.2 0.4 0.6 0.8 1.0 1.2 i f ?forward current (ma) v f ?forward voltage (v) figure 5. forward current vs. forward voltage. 125 c 25 c ?0 c typical parameters at t c = +25 c part number total resistance carrier lifetime reverse recovery time total capacitance hsmp- r t ( w ) t (ns) t rr (ns) (pf) 389 a series 3.8 200 test conditions i f = 1 ma i f = 10 ma v r = 10 v 50 v f = 100 mhz i r = 6 ma i f = 20 ma 90% recovery note: 1. package marking code is laser marked. typical parameters at t c = +25 c part number total resistance carrier lifetime reverse recovery time total capacitance hsmp- r t ( w ) t (ns) t rr (ns) (pf) 386l 22 500 80 0.20 test conditions i f = 1 ma i f = 50 ma v r = 10 v 50 v f = 100 mhz t r = 250 ma i f = 20 ma 90% recovery
4 hsmp-389 a series typical performance, t c = 25 c, each diode 10000 1000 100 10 1 0.1 rf resistance (ohms) i f ?forward bias current (ma) 0.01 0.1 1 10 100 figure 6. total rf resistance at 25 c vs. forward bias current. 120 115 110 105 100 95 90 85 11030 i f ?forward bias current (ma) figure 8. 2nd harmonic input intercept point vs. forward bias current. input intercept point (dbm) hsmp-3880 diode mounted as a series switch in a 50 microstrip and tested at 123 mhz 200 160 120 80 40 0 10 20 15 25 30 t rr ?reverse recovery time (ns) forward current (ma) figure 9. typical reverse recovery time vs. reverse voltage. v r = 2v v r = 5v v r = ?0v 100 10 1 0.1 0.01 0 0.2 0.4 0.6 0.8 1.0 1.2 i f ?forward current (ma) v f ?forward voltage (v) figure 10. forward current vs. forward voltage. 125 c 25 c ?0 c 0.55 0.50 0.45 0.40 0.35 0.30 0.25 0.20 04 1 mhz 1 ghz 812 16 20 reverse voltage (v) total capacitance (pf) figure 7. capacitance vs. reverse voltage. typical applications for multiple diode products figure 11. hsmp-38 x l used in a sp3t switch. 1 1 2 3 4 0 56 b1 b2 b3 2 3 1 11 rf in rf out 2 2 3 456 1 0 0 2 +v ? ?n ?ff figure 12. hsmp-38 x l unconnected trio used in a dual voltage, high isolation switch.
5 typical applications for multiple diode products , continued rf in rf out 1 +v 0 2 0 +v ?n ?ff 4 5 6 1 11 2 2 3 figure 13. hsmp-38 x l unconnected trio used in a positive voltage, high isolation switch. figure 14. hsmp-389t used in a low inductance shunt mounted switch. rf in rf out 4 5 6 12 3 figure 16. hsmp-389v series/shunt pair used in a 1.8 ghz transmit/receive switch. l 4 rcvr xmtr bias ant pa bias hsmp-389u lna l 4 figure 15. hsmp-389u series/shunt pair used in a 900 mhz transmit/receive switch. rcvr bias xmtr hsmp-389v antenna l 4 l 4 rcvr xmtr bias ant cc
6 assembly information sot-363 pcb footprint a recommended pcb pad layout for the miniature sot-363 (sc-70, 6 lead) package is shown in figure 17 (dimensions are in inches). this layout provides ample allowance for package placement by automated assembly equipment without adding parasitics that could impair performance. 0.026 0.075 0.016 0.035 figure 17. pcb pad layout (dimensions in inches). smt assembly reliable assembly of surface mount components is a complex process that involves many material, process, and equipment factors, including: method of heating (e.g., ir or vapor phase reflow, wave soldering, etc.) circuit board material, conductor thickness and pattern, type of solder alloy, and the thermal conductivity and thermal mass of components. components with a low mass, such as the sot-363 package, will reach solder reflow temperatures faster than those with a greater mass. hps sot-363 diodes have been qualified to the time-temperature profile shown in figure 18. this profile is representative of an ir reflow type of surface mount assembly process. after ramping up from room temperature, the circuit board with components attached to it (held in place with solder paste) passes through one or more preheat zones. the preheat zones increase the temperature of the board and components to prevent thermal shock and begin evaporat- ing solvents from the solder paste. the reflow zone briefly elevates the temperature sufficiently to produce a reflow of the solder. the rates of change of tempera- ture for the ramp-up and cool- down zones are chosen to be low enough to not cause deformation of the board or damage to compo- nents due to thermal shock. the maximum temperature in the reflow zone (t max ) should not exceed 235 c. these parameters are typical for a surface mount assembly process for hp sot-363 diodes. as a general guideline, the circuit board and components should be exposed only to the minimum temperatures and times necessary to achieve a uniform reflow of solder. time (seconds) t max temperature ( c) 0 0 50 100 150 200 250 60 preheat zone cool down zone reflow zone 120 180 240 300 figure 18. surface mount assembly profile.
7 device orientation user feed direction cover tape carrier tape reel end view 8 mm 4 mm top view ## ## ## ## note: ?#?represents package marking code. package marking is right side up with carrier tape perforations at top. conforms to electronic industries rs-481, ?aping of surface mounted components for automated placement.?standard quantity is 3,000 devices per reel. tape dimensions for outline sot-363 (sc-70, 6 lead) p p 0 p 2 f w c d 1 d e a 0 8 max. t 1 (carrier tape thickness) t t (cover tape thickness) 5 max. b 0 k 0 description symbol size (mm) size (inches) length width depth pitch bottom hole diameter a 0 b 0 k 0 p d 1 2.24 0.10 2.34 0.10 1.22 0.10 4.00 0.10 1.00 + 0.25 0.088 0.004 0.092 0.004 0.048 0.004 0.157 0.004 0.039 + 0.010 cavity diameter pitch position d p 0 e 1.55 0.05 4.00 0.10 1.75 0.10 0.061 0.002 0.157 0.004 0.069 0.004 perforation width thickness w t 1 8.00 0.30 0.255 0.013 0.315 0.012 0.010 0.0005 carrier tape cavity to perforation (width direction) cavity to perforation (length direction) f p 2 3.50 0.05 2.00 0.05 0.138 0.002 0.079 0.002 distance width tape thickness c t t 5.4 0.10 0.062 0.001 0.205 0.004 0.0025 0.00004 cover tape
2.20 (0.087) 2.00 (0.079) 1.35 (0.053) 1.15 (0.045) 1.30 (0.051) ref. xx 0.650 bsc (0.025) 2.20 (0.087) 1.80 (0.071) 0.10 (0.004) 0.00 (0.00) 0.25 (0.010) 0.15 (0.006) 1.00 (0.039) 0.80 (0.031) 0.20 (0.008) 0.10 (0.004) 0.30 (0.012) 0.10 (0.004) 0.30 ref. 10 0.425 (0.017) typ. dimensions are in millimeters (inches) package marking code package dimensions outline sot-363 (sc-70, 6 lead) package characteristics lead material ........................................................................................ copper lead finish ............................................................................. tin-lead 85/15% maximum soldering temperature ............................... 260 c for 5 seconds minimum lead strength ........................................................... 2 pounds pull typical package inductance ................................................................... 2 nh typical package capacitance .............................. 0.08 pf (opposite leads) part number ordering information part number no. of devices container hsmp-389 a -tr2* 10000 13" reel hsmp-389 a -tr1* 3000 7" reel hsmp-389 a -blk* 100 antistatic bag hsmp-386l-tr2 10000 13" reel hsmp-386l-tr1 3000 7" reel hsmp-386l-blk 100 antistatic bag * where a = l, r, t, u or v www.hp.com/go/rf for technical assistance or the location of your nearest hewlett-packard sales office, distributor or representative call: americas/canada: 1-800-235-0312 or 408-654-8675 far east/australasia: call your local hp sales office. japan: (81 3) 3335-8152 europe: call your local hp sales office. data subject to change. copyright ? 1998 hewlett-packard co. obsoletes 5966-2028e 5968-2354e (12/98)
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