![]() |
|
If you can't view the Datasheet, Please click here to try to view without PDF Reader . |
|
Datasheet File OCR Text: |
www.irf.com 1 automotive grade features advanced planar technology low on-resistance dual p channel mosfet dynamic dv/dt rating logic level 150c operating temperature fast switching lead-free, rohs compliant automotive qualified* description specifically designed for automotive applications, this cellular design of hexfet? power mosfets utilizes the latest processing techniques to achieve low on-resistance per silicon area. this benefit com- bined with the fast switching speed and ruggedized device design that hexfet power mosfets are well known for, provides the designer with an ex- tremely efficient and reliable device for use in auto- motive and a wide variety of other applications. so-8 AUIRF7304Q d1 d1 d 2 d2 g1 s2 g2 s1 top view 8 1 2 3 4 5 6 7 absolute maximum ratings stresses beyond those listed under ?absolute maximum ratings? may cause permanent damage to the device. these are stress ratings only; and functional operation of the device at these or any other condition beyond those indicated in the specifications is not implied. exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. the thermal resistance and power dissipation ratings are measured under board mounted and still air conditions. ambient temperature (t a ) is 25c, unless otherwise specified. hexfet ? is a registered trademark of international rectifier. * qualification standards can be found at http://www.irf.com/ parameter units i d @ t a = 25c 10 sec. pulsed drain current, v gs @ -4.5v i d @ t a = 25c continuous drain current, v gs @ -4.5v a i d @ t a = 70c continuous drain current, v gs @ -4.5v i dm pulsed drain current p d @t a = 25c power dissipation w linear derating factor w/c v gs gate-to-source voltage v dv/dt peak diode recovery dv/dt v/ns t j operating junction and c t stg storage temperature range thermal resistance parameter typ. max. units r ja junction-to-ambient ??? 62.5 c/w max. -4.7 -4.3 -17 -3.4 -55 to + 150 2.0 0.016 -5.0 12 v (br)dss -20v r ds(on) max. 0.090 i d -4.3a www.irf.com 2 !"# i sd $%%&' ? (&)'* * ' + (,- pulse width 300 s; duty cycle 2%. s d g s d g static electrical characteristics @ t j = 25c (unless otherwise specified) parameter min. typ. max. units v (br)dss drain-to-source breakdown voltage -20 ??? ??? v . 0.01 0.00 0.10 0.0 1. .0 1.0 100 100 dynamic electrical characteristics @ t j = 25c (unless otherwise specified) parameter min. typ. max. units q g total gate charge ??? ??? 22 q gs gate-to-source charge ??? ??? 3.3 q gd gate-to-drain ("miller") charge ??? ??? 9.0 t d(on) turn-on delay time ??? 8.4 ??? t r rise time ??? 26 ??? t d(off) turn-off delay time ??? 51 ??? t f fall time ??? 33 ??? l d internal drain inductance ??? 4.0 ??? between lead, nh 6mm (0.25in.) l s internal source inductance ??? 6.0 ??? from package and center of die contact c iss input capacitance ??? 610 ??? c oss output capacitance ??? 310 ??? c rss reverse transfer capacitance ??? 170 ??? diode characteristics parameter min. typ. max. units i s continuous source current (body diode) i sm pulsed source current (body diode) v sd diode forward voltage ??? ??? -1.0 v t rr reverse recovery time ??? 56 84 ns t j = 25c,i f = -2.2a q rr reverse recovery charge ??? 71 110 nc di/dt = 100a/ s t on forward turn-on time intrinsic turn-on time is negligible (turn-on is dominated by ls+ld) -17 ??? ??? ??? ??? -2.5 i d = -2.2a r g = 6.0 . , . 10 v gs = 0v v ds = -15v ? = 1.0mhz, see fig. 5 na a v ds = -16v, v gs = 0v v ds = -16v, v gs = 0v, t j = 125c v gs = -4.5v, see fig. 6 & 12 v gs = 12v v ds = -16v v dd = -10v a pf ns nc t j = 25c, i s = -1.8a, v gs = 0v integral reverse p-n junction diode. conditions mosfet symbol showing the conditions v gs = 0v, i d = -250 a reference to 25c, i d = -1ma v gs = -4.5v, i d = -2.2a r ds(on) static drain-to-source on-resistance v gs = -2.7v, i d = -1.8a v ds = v gs , i d = -250 a conditions v ds = -16v, i d = -2.2a i d = -2.2a v gs = -12v starting t j = 25c, r g = 25 , i as = -2.2a. when mounted on 1 inch square copper board, t<10 sec. www.irf.com 3 0.1 1 10 100 0.01 0.1 1 10 100 d ds 20 s pulse width t = 25c a -i , drain-to-source current (a) -v , drain-to-source voltage (v) j vgs top - 7.5v - 5.0v - 4.0v - 3.5v - 3.0v - 2.5v - 2.0v bottom - 1.5v -1.5v 0.1 1 10 100 0.01 0.1 1 10 100 d ds 20 s pulse width t = 150c a -i , drain-to-source current (a) -v , drain-to-source voltage (v) j vgs top - 7.5v - 5.0v - 4.0v - 3.5v - 3.0v - 2.5v - 2.0v bottom - 1.5v -1.5v 0.1 1 10 100 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 t = 25c t = 150c j j gs d a -i , drain-to-source current (a) -v , gate-to-source voltage (v) v = -15v 20 s pulse width ds 0.0 0.5 1.0 1.5 2.0 -60 -40 -20 0 20 40 60 80 100 120 140 160 j t , junction temperature (c) r , drain-to-source on resistance ds(on) (normalized) a i = -3.6a d v = -4.5v gs www.irf.com 4 ! "# !$ ! % ! % ! 0 500 1000 1500 1 10 100 c, capacitance (pf) a ds -v , drain-to-source voltage (v) v = 0v, f = 1mhz c = c + c , c shorted c = c c = c + c gs iss gs gd ds rss gd oss ds gd c iss c oss c rss 0 2 4 6 8 10 0 5 10 15 20 25 g gs a for test circuit see figure 12 -v , gate-to-source voltage (v) q , total gate charge (nc) i = -2.2a v = -16v d ds 0.1 1 10 100 0.3 0.6 0.9 1.2 1.5 t = 25c t = 150c j j v = 0v gs sd sd a -i , reverse drain current (a) -v , source-to-drain voltage (v) 1 10 100 1 10 100 operation in this area limited by r ds(on) single pulse t t = 150 c = 25 c j a -v , drain-to-source voltage (v) -i , drain current (a) i , drain current (a) ds d 1ms 10ms www.irf.com 5 + - ! v ds 90% 10% v gs t d(on) t r t d(off) t f * $( * 1 0.1 % "# $& !'( * * ./+ "#) ( *+,$& 0.1 1 10 100 0.0001 0.001 0.01 0.1 1 10 100 notes: 1. duty factor d = t / t 2. peak t = p x z + t 1 2 j dm thja a p t t dm 1 2 t , rectangular pulse duration (sec) thermal response (z ) 1 thja 0.01 0.02 0.05 0.10 0.20 d = 0.50 single pulse (thermal response) 25 50 75 100 125 150 0.0 1.0 2.0 3.0 4.0 5.0 t , case temperature ( c) -i , drain current (a) c d www.irf.com 6 -% !'( % ! q g q gs q gd v g charge d.u.t. v ds i d i g -3ma v gs .3 f 50k .2 f 12v current regulator same type as d.u.t. current sampling resistors + - ./ www.irf.com 7 p.w. period di/dt diode recovery dv/dt ripple 5% body diode forward drop re-applied voltage reverse recovery current body diode forward current v gs =10v v dd i sd driver gate drive d.u.t. i sd waveform d.u.t. v ds waveform inductor curent d = p. w . period + - + + + - - - * ? ? 0 . 1 2.2 ? ./+$./ + - 3 - ? 3! 0 ? 4 5 ? 3360 - + " 0 5 " 5$- 77/5$-. " 5$-8 0 * 7 00 12 000 * 9(*" 33:*. . 3 4)5) www.irf.com 8 so-8 package outline dimensions are shown in millimeters (inches) so-8 part marking ! " ! #$$ ! %& % % !% |