1 zarlink semiconductor inc. zarlink, zl and the zarlink semiconductor logo are trademarks of zarlink semiconductor inc. copyright 2007, zarlink semiconductor inc. all rights reserved. a full data sheet is available to qualified customers. to register, please send an email to opto@zarlink.com. features ? 12 parallel channels, total 32.6 gbps capacity ? data rate up to 2.72 gbps per channel ? 850 nm vcsel array ? link reach 300 m with 50/125 m 500 mhz . km fiber at 2.5 gbps ? channel ber better than 10 -12 ? industry standard mpo/mtp ? ribbon fiber connector interface ? pluggable megarray ? ball grid array connector ? optionally available with emi shield ? laser class 1m iec 60825-1:2001 compliant ? power supply 3.3 v ? compatible with industry msa applications ? high-speed interconnects within and between switches, routers and transport equipment ? low cost sonet/sdh vsr (very short reach) oc-192/stm64 connections ? infiniband ? connections ? interconnects rack-to-rack, shelf-to-shelf, board- to-board, board-to-optical backplane description the zl60101 and zl60102 together make a high speed transmitter/receiver pair for parallel fiber applications. the zl60101 transmitter module converts parallel electrical input signals via a laser driver and a vcsel array into parallel optical output signals at a wavelength of 850 nm. the zl60102 receiver module converts parallel optical input signals via a pin photodiode array and a transimpedance and limiting amplifier into electrical output signals. the modules are pluggable each fitted with an industry- standard megarray ? bga connector. this provides ease of assembly on the host board and enables provisioning of bandwidth on demand. reliability assurance is based on telcordia gr-468- core and the parts are compliant to the eu directive 2002/95/ec issued 27 january 2003 [rohs]. exemption 6 & 7 march 2007 ordering information zl60101mldc parallel fiber transmitter zl60102mldc parallel fiber receiver zl6010xmmdc parallel fiber module with emi gasket 0 c to +80 c zl60101/2 12 x 2.7 gbps parallel fiber optic link transmitter and receiver shortform data sheet
zl60101/2 shortform data sheet 2 zarlink semiconductor inc. classified in accordance with ie c 60825-1/a2:2001, iec 60825-2: 2000 class 1 m laser product emitted wavelength: 840 nm figure 1 - zl60101 transmitter block diagram front view - mtp key up ch12 ch11 ch10 ch9 ch8 ch7 ch6 ch5 ch4 ch3 ch2 ch1 host circuit board table 1 - transmitter optical channel assignment vcsel driver vcsel array vcsel driver controller 1 2 3 4 5 6 7 8 9 10 11 12 din1- din1+ din12- din12+ tx_dis fault v cc tx_en reset v ee
zl60101/2 shortform data sheet 3 zarlink semiconductor inc. figure 2 - zl60102 receiver block diagram front view - mtp key up ch12 ch11 ch10 ch9 ch8 ch7 ch6 ch5 ch4 ch3 ch2 ch1 host circuit board table 2 - receiver optical channel assignment pin array trans- impedance and limiting amplifier 2 3 4 5 6 7 8 9 10 11 1 12 dout1+ dout1- dout12- v cc v ee rx_en rx_sd sq_en rx_sd1 rx_sd12 dout12+
? zarlink semiconductor 2002. all rights reserved. issue acn date apprd. previous package codes title drawing type package code projection method 1 114347 rev1 08-nov-05 114347 ml 16,89 (rx) 19,43 (tx) 1 , 1 4 5 1 3 , 7 2 1 7 , 5 a c b j n 0,15 m a b-c 2 -56 unc-2b, 3,50 deep min (2x) j n 0,15 m a n 3,63 (2x) j n 0,15 m a b-c n 1,3 (2x) 2-56 unc - 2b, 3,50 deep min 1 2 , 7 m a x 3 m i n 14,4 30,23 31,75 0 , 7 6 36,87 4 , 3 1 2 , 2 3 7,42 1,5 (6x) 4 (5x) 45 19,5 5 1,38 (4x) 5,38 (3x) notes:- 1. all dimensions in mm. 2. tolerancing per asme y14.5m-1994. 3,8 (2x) 1,25 (2x) m.andersson package drawing - module layout 0,5 min (2x) 2 114347rev2 19-dec-05 d.nidelius
? zarlink semiconductor 2002. all rights reserved. issue acn date apprd. previous package codes title drawing type package code projection method 1 114347 rev1 08-nov-05 114347 ml 14,4 17,5 a1 a10 k1 k10 b c 13,72 1,145 a 5 , 1 5 ` 0 , 2 5 1 6 , 8 9 ( r x ) 1 9 , 4 3 ( t x ) 3 0 , 2 3 3 1 , 7 5 3 5 , 3 1 ` 0 , 7 5 max product outline. component keep out area. recommended keep out area j n 0,1 a b-c j n 0,1 a b-c j n 0,1 a b-c ( n 2.69 ` 0,12 hole) n 1,70 ` 0,12 hole j n 0,1 a b-c notes:- 1. all dimensions in mm. 2. tolerancing per asme y14.5m-1994. j n 0,05 a b-c n 0,58 ` 0,05 pads n 2.69 ` 0,12 hole (2x) n 4,30 min pads (2x), keep out 3 , 8 m.andersson package drawing, circuit board footprint layout 2 19-dec-05 d.nidelius 114347rev2
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