hlmp - cwxx t-1 ? (5mm) extra bright precision optical performance white led lamps data sheet hlmp-cw11, hlmp-cw12, hlmp-cw26, hlmp-cw27, hlmp-cw36, hlmp-cw37 description these high intensity white led lamps are based on in - gan material technology. a blue led die is coated by phosphor to produce white. the typical resulting color is described by the coordinates x = 0.31, y = 0.31 using the 1931 cie chromaticity diagram. these t-1 ? lamps are untinted, non-difused, and incor - porate precise optics which produce well-defned spatial radiation patterns at specifc viewing cone angle. features ? well defned spatial radiation pattern ? high luminous white emission ? viewing angle: 15, 23 and 30 ? standof or non-standof leads ? superior resistance to moisture applications ? electronic signs and signals ? small area illumination ? legend backlighting ? general purpose indicators beneft ? reduced power consumption, higher reliability, and increased optical/mechanical design fexibility compared to incandescent bulbs and other alternative white light sources. caution: devices are class 1 esd sensitive. please observe appropriate precautions during handling and pro - cessing. refer to application note an-1142 for additional details.
1.14 0.20 (0.045 0.008) 5.80 0.20 (0.228 0.008) 5.00 0.20 (0.197 0.008) 31.60 (1.244) min. 0.70 (0.028) max. 1.00 (0.039) min. 8.71 0.20 (0.343 0.008) 2.54 0.38 (0.100 0.015) 0.50 0.10 (0.020 0.004) sq. typ. cathode lead 2.35 (0.093) max. cathode flat 1.14 0.20 (0.045 0.008) 5.80 0.20 (0.228 0.008) 5.00 0.20 (0.197 0.008) 31.60 (1.244) min. 0.70 (0.028) max. 1.00 (0.039) min. 8.71 0.20 (0.343 0.008) 2.54 0.38 (0.100 0.015) 0.50 0.10 (0.020 0.004) sq. typ. cathode lead cathode flat 1.50 0.15 (0.059 0.006) dimension h package dimensions package dimension a package dimension b mechanical option 00: bulk dd: ammo pack straight leads color bin options 0: full color bin distribution b: color bin 2 & 3 only maximum intensity bi n 0: no maximum intensity bin limit others: refer to device selection guide minimum intensity bi n refer to device selection guide viewing angle and standoff option 11: 15? without standoff 12: 15? with standoff 26: 23? without standoff 27: 23? with standoff 36: 30? without standoff 37: 30? with standoff h l m p - - x x x x x xx cw part numbering system
part number typical viewing angle, 2 ? (degree) intensity (mcd) at 20 ma standof package dimension min. max. hlmp-cw11-wz0xx 15 5500 16000 no a hlmp-cw11-x10xx 15 7200 21000 no a hlmp-cw11-xy0xx 15 7200 12000 no a hlmp-cw11-yz0xx 15 9300 16000 no a hlmp-cw12-wz0xx 15 5500 16000 yes b hlmp-cw12-x10xx 15 7200 21000 yes b hlmp-cw12-xy0xx 15 7200 12000 yes b hlmp-cw12-xybxx 15 7200 12000 yes b hlmp-cw12-yz0xx 15 9300 16000 yes b hlmp-cw12-yzbxx 15 9300 16000 yes b hlmp-cw26-ux0xx 23 3200 9300 no a hlmp-cw26-vw0xx 23 4200 7200 no a hlmp-cw26-vy0xx 23 4200 12000 no a hlmp-cw26-wx0xx 23 5500 9300 no a hlmp-cw27-ux0xx 23 3200 9300 yes b hlmp-cw27-ux2xx 23 3200 9300 yes b hlmp-cw27-vw0xx 23 4200 7200 yes b hlmp-cw27-vy0xx 23 4200 12000 yes b hlmp-cw27-wx0xx 23 5500 9300 yes b hlmp-cw36-tw0xx 30 2500 7200 no a hlmp-cw36-uv0xx 30 3200 5500 no a hlmp-cw36-uvbxx 30 3200 5500 no a hlmp-cw36-vw0xx 30 4200 7200 no a hlmp-cw36-vwbxx 30 4200 7200 no a hlmp-cw37-tw0xx 30 2500 7200 yes b hlmp-cw37-uv0xx 30 3200 5500 yes b hlmp-cw37-uvbxx 30 3200 5500 yes b hlmp-cw37-vw0xx 30 4200 7200 yes b hlmp-cw37-vwbxx 30 4200 7200 yes b notes: 1. tolerance for luminous intensity measurement is +/- 15% 2. the luminous intensity is measured on the mechanical axis of the lamp package. 3. the optical axis is closely aligned with the package mechanical axis. 4. led light output is bright enough to cause injuries to the eyes. precautions must be taken to prevent looking directly at the led without proper safety equipment. 5. 2 ? is the of-axis angle where the luminous intensity is ? the on axis intensity. 6. part numbers in bold are recommended for new designs. device selection guide
notes: 1. derate linearly as shown in fgure 2. 2. duty factor 10%, frequency 1khz parameters value unit dc forward current [1] 30 ma peak pulsed forward current [2] 100 ma power dissipation 105 mw led junction temperature 110 c operating temperature range -40 to +85 c storage temperature range -40 to +100 c absolute maximum rating at t a = 25 c parameters symbol min typ max units test condition forward voltage v f 3.2 4.0 v i f = 20 ma reverse voltage [1] v r 5.0 v i r = 10 ma thermal resistance r j-pin 240 c/w led junction to anode lead chromaticity coordinates [2] x 0.31 i f = 20 ma y 0.31 capacitance c 70 v f =0, f=1mhz notes: 1. the reverse voltage of the product is equivalent to the forward voltage of the protective chip at i r = 10 a 2. the chromaticity coordinates are derived from the cie 1931 chromaticity diagram and represent the perceived color of the device. electrical / optical characteristics t a = 25 c 0.0 0.2 0.4 0.6 0.8 1.0 380 480 580 680 780 wavelength - nm relative luminous intensity 0 5 10 15 20 25 30 35 0 2 0 4 0 6 0 8 0 100 ambient temperature - ?c i f - forward current - ma r j-a = 585?c/w r j-a = 780?c/w 0 0.3 0.6 0.9 1.2 1.5 0 1 0 2 0 3 0 forward current - ma relative luminous intensity figure 1. relative intensity vs. wavelength figure 2. forward current vs. ambient temperature figure 3. relative intensity vs. dc forward current
-0.010 -0.005 0.000 0.005 0.010 0.015 0.020 0.025 -0.005 0.000 0.005 0.010 0.015 x-coordinates y-coordinates 30ma 20ma 10ma 5ma 1ma 0 5 10 15 20 25 30 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6 v f - forward voltage - volts i f - forward current - ma 0 0.5 1 -90 -60 -30 0 3 0 6 0 9 0 angular displacement (?) relative luminous intensity 0 0.5 1 -90 -60 -30 0 3 0 6 0 9 0 angular displacement (?) relative luminous intensity 0 0.5 1 -90 -60 -30 0 3 0 6 0 9 0 angular displacement (?) relative luminous intensity figure 4. chromaticity shift vs. current figure 5. forward current vs. forward voltage *note: (x,y) values @ 20ma reference to (0,0) figure 6. spatial radiation pattern for cw1x figure 7. spatial radiation pattern for cw2x figure 8. spatial radiation pattern for cw3x
bin intensity (mcd) at 20 ma min max q 1150 1500 r 1500 1900 s 1900 2500 t 2500 3200 u 3200 4200 v 4200 5500 w 5500 7200 x 7200 9300 y 9300 12000 z 12000 16000 1 16000 21000 intensity bin limit table tolerance for each bin limit is 15% rank limits (chromaticity coordinates) 1 x 0.330 0.330 0.356 0.361 y 0.360 0.318 0.351 0.385 2 x 0.287 0.296 0.330 0.330 y 0.295 0.276 0.318 0.339 3 x 0.264 0.280 0.296 0.283 y 0.267 0.248 0.276 0.305 4 x 0.283 0.287 0.330 0.330 y 0.305 0.295 0.339 0.360 tolerance for each bin limit is 0.01 note: 1. bin categories are established for classifcation of products. products may not be available in all bin categories. please contact your avago technologies representative for information on currently available bins. 0.40 0.35 0.30 0.25 0.20 0.26 0.30 0.34 0.38 y-coordinate x-coordinat e 3 2 4 1 black body curve color bin limits with respect to cie 1931 chromaticity diagram color bin limit table
precautions: lead forming: ? the leads of an led lamp may be preformed or cut to length prior to insertion and soldering into pc board. ? if lead forming is required before soldering, care must be taken to avoid any excessive mechanical stress induced to led package. otherwise, cut the leads of led to length after soldering process at room temperature. the solder joint formed will absorb the mechanical stress of the lead cutting from traveling to the led chip die attach and wirebond. ? it is recommended that tooling made to precisely form and cut the leads to length rather than rely upon hand operation. soldering condition: ? care must be taken during pcb assembly and soldering process to prevent damage to led component. ? the closest led is allowed to solder on board is 1.59mm below the body (encapsulant epoxy) for those parts without standof. ? recommended soldering condition: wave soldering manual solder dipping pre-heat temperature 105 c max. - preheat time 30 sec max - peak temperature 250 c max. 260 c max. dwell time 3 sec max. 5 sec max ? if necessary, use fxture to hold the led component in proper orientation with respect to the pcb during soldering process. ? proper handling is imperative to avoid excessive thermal stresses to led components when heated. therefore, the soldered pcb must be allowed to cool to room temperature, 25c before handling. ? special attention must be given to board fabrication, solder masking, surface plating and lead holes size and component orientation to assure solderability. ? recommended pc board plated through holes size for led component leads. led component ead size diagonal plated through hole diameter 0.457 x 0.457mm (0.018 x 0.018inch) 0.646 mm (0.025 inch) 0.976 to 1.078 mm (0.038 to 0.042 inch) 0.508 x 0.508mm (0.020 x 0.020inch) 0.718 mm (0.028 inch) 1.049 to 1.150mm (0.041 to 0.045 inch) note: refer to application note an1027 for more information on soldering led components. bottom side of pc board top side of pc board note: allow for boards to be sufficiently cooled before exerting mechanical force. conveyor speed = 1.83 m/min (6 ft/min) preheat setting = 150 c (100 c pcb) solder wave temperature = 245 c air knife air temperature = 390 c air knife distance = 1.91 mm (0.25 in.) air knife angle = 40 solder: sn63; flux: rma 250 200 150 fluxing turbulent wave preheat time - seconds temperature - ?c 100 50 30 0 1 0 2 0 3 0 4 0 5 0 6 0 7 0 8 0 9 0 100 laminar wave hot air knife recommended wave soldering profle
for product information and a complete list of distributors, please go to our web site: www.avagotech.com avago, avago technologies, and the a logo are trademarks of avago technologies, pte. in the united states and other countries. data subject to change. copyright ? 2006 avago technologies pte. all rights reserved. 5989-4117en - april 19, 2006
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