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description the power plcc-4 smt led with lens are high-performance plcc-4 package size smt leds targeted mainly in automo- tive & electronics signs and signals (ess) markets. these top-mount single-chip packages with focused radiation offer high brightness in beam direction and are excellent for interior automotive, indoor and outdoor sign and indus- trial applications. with additional lens in 30 variants, these products are especially fitting to applications for traffic lights, chmsl and displays. the plcc-4 package family is able to dissipate heat better compared to the plcc-2 packages. in proportion to this increase in driving current, this family of leds is able to produce higher light output compared to the conventional plcc-2 smt leds. as an extension of the standard flat top plcc-4 smt leds, the power plcc-4 with lens device is able to provide fo- cused beams within narrow viewing angles (30 ) meeting the markets requirements for focused radiation and high brightness in beam directions. the power plcc-4 smt led with 30 is ideal for panel, push button, or general backlighting in automotive interior & exterior, sign, office equipment, industrial equipment and home appliances applications. this package design coupled with careful selection of component materials al- low the power plcc-4 smt led with lens to perform with higher reliability in a larger temperature range -40 c to 100 c. this high reliability feature is crucial to allow the power plcc-4 smt led with lens to do well in harsh envi- ronments such as its target automotive & ess markets. the power plcc4 smt led with lens package is also designed to be compatible with both ir-solder re-flow and through- the-wave soldering. hsmx-a43x-xxxxx surface mount led indicator data sheet features industry standard plcc-4 high reliability led package high brightness using allngap and ingan dice tech- nologies high optical efficiency narrow viewing angle at 30 available in 8mm carrier tape on 7-inch reel compatible with both ir and ttw soldering process applications interior automotive instrument panel backlighting central console backlighting cabin backlighting navigation and audio system dome lighting push button backlighting exterior automotive turn signals chmsl rear combination lamp side repeaters electronic signs and signals interior and exterior full color sign variable message sign garden lighting office automation, home appliances, industrial equipment front panel backlighting push button backlighting display backlighting caution: hsmn, hsmm-a43x-xxxxx leds are class 2 esd sensitive. please observe appropriate precautions during handling and processing. refer to avago application note an-1142 for additional details.
2 the new avago technologies power plcc-4 smt led with 30 lens will carry the part number hsmx- a43xxxxxx. the high brightness alingap and ingan dice technologies utilized will provide the product brightness that meets the automotive and ess markets requirements. the lens package will complement and complete the existing alin- gap & ingan color standard power-plcc-4 led that avago technologies offers, providing customers an extra lens option from one supplier. to facilitate easy pick and place assembly, the leds are packed in eia-compliant tape and reel. every reel will be shipped in single intensity and color bin (except for red color), to provide close uniformity package dimensions note: all dimensions in mm electrical connection between all cathodes is recommended 2.8 0.2 2.2 0.2 0.7 0.1 3.5 0.2 0.8 0.3 0.5 0.1 0.80 0.1 0.1 typ. 3.87 max. package marking 3.2 0.2 -ve -ve +ve -ve
3 device selection guide color part number min. i v (mcd) typ. i v (mcd) max. i v (mcd) test current (ma) dice technology red hsmc-a430-w50m1 1125.00 2300.00 3550.00 50 alingap hsmc-a431-x90m1 2240.00 4000.00 7150.00 50 alingap red orange hsmj-a430-w50m1 1125.00 2300.00 3550.00 50 alingap hsmj-a431-x90m1 2240.00 4500.00 7150.00 50 alingap orange hsml-a431-x90m1 2240.00 4500.00 7150.00 50 alingap amber HSMA-A430-W90M1 1400.00 3000.00 4500.00 50 alingap hsma-a431-y00m1 2850.00 5000.00 - 50 alingap hsma-a431-x90m1 2240.00 4700.00 7150.00 50 alingap green hsmm-a430-x90m2 2240.00 7150.00 30 ingan blue hsmn-a430-v50m2 715.00 2240.00 30 ingan notes: 1. the luminous intensity i v , is measured at the mechanical axis of the lamp package. the actual peak of the spatial radiation pattern may not be aligned with this axis. 2. iv tolerance 12% part numbering system h sm x 1 - a x 2 x 3 x 4 - x 5 x 6 x 7 x 8 x 9 pa c kaging option co l or bin se l e c tion intensity bin se l e c t devi c e spe c ifi c configuration pa c kage t ype led chip co l or
4 optical characteristics (t a = 25 c) color part number dice technology peak wavelength peak (nm) dominant wavelength d [1] (nm) viewing angle 2 ? [2] (degrees) luminous efficacy v [3] (lm/w) typical typical typical typical red hsmc-a43x alingap 635 626 30 150 red orange hsmj-a43x alingap 621 615 30 240 hsmv-a430 alingap 623 617 30 263 orange hsml-a431 alingap 609 605 30 320 amber hsma-a43x alingap 592 590 30 480 green hsmm-a430 ingan 518 525 30 500 blue hsmn-a43x ingan 468 470 30 75 cyan hsmk-a43x ingan 500 502 30 285 notes: 1. the dominant wavelength, d , is derived from the cie chromaticity diagram and represents the color of the device. 2. ? is the off-axis angle where the luminous intensity is ? the peak intensity. 3. radiant intensity, ie in watts / ster adian, may be calculated from the equation ie = i v / v , where i v is the luminous intensity in candelas and v is the luminous efficacy in lumens / watt. absolute maximum ratings (t a =25 c) parameters hsmc/a hsmv hsmk/m/n dc forward current [1] 70 ma 70 ma 30 ma peak forward current [2] 200 ma 200 ma 90 ma power dissipation 180 mw 240 mw 114 mw reverse voltage 5v 5v 4v junction temperature 110 c operating temperature - 40 c to + 100 c storage temperature - 40 c to + 100 c notes: 1. derate linearly as shown in figure 4. 2. duty factor = 10%, frequency = 1khz electrical characteristics (t a = 25 c) part number forward voltage v f (volts)@i f =50 ma reverse voltage v r @100 a reverse voltage v r @10 a minimum typical maximum minimum minimum hsmc/j/l/a 1.7 2.2 2.5 5 - hsmv 1.7 2.8 3.4 5 - part number forward voltage v f (volts)@i f =30 ma reverse voltage v r @100 a reverse voltage v r @10 a minimum typical maximum minimum minimum hsmk/m/n 2.7 3.9 4.6 - 5
5 figure 1. relative intensity vs. wavelength 0 0.2 0.4 0. 6 0.8 1 380 430 480 530 580 6 30 6 80 730 780 waveleng th - nm rela ti ve i n t ens it y a li ngap red a li ngap red orange a li ngap amber i ngan bl ue i ngan green a li ngap orange cyan i ngan figure 2. forward current vs. forward voltage 0 1 0 20 30 40 50 6 0 70 80 0 1 2345 f orward vol t age - v f orward c u rren t - ma h smv h smc/ j /l/a h smk/m/n 0 0.2 0.4 0. 6 0.8 1 .0 1 .2 1 .4 05 1 0 1 52025303540455055 6 0 6 57075 dc f orward c u rren t - ma rela ti ve l u m i no u s i n t ens it y (normal iz ed a t 50 ma) 0 0.2 0.4 0. 6 0.8 1 .0 1 .2 05 1 0 1 520253035 dc f orward c u rren t - ma rela ti ve l u m i no u s i n t ens it y (normal iz ed a t 30 ma) figure 3a. relative intensity vs. forward current (alingap). figure 3b. relative intensity vs. forward current (ingan).
6 figure 4a. maximum forward current vs. ambient temperature. derated b ased on t j max= 110c (alingap) figure 4b. maximum forward current vs. ambient temperature. derated b ased on t j max= 110c (ingan) 0 0. 1 0.2 0.3 0.4 0.5 0. 6 0.7 0.8 0. 9 1 -9 0 -6 0 - 30 0 30 6 0 9 0 ang u lar d i splacemen t - degrees normal iz ed i n t ens it y figure 5. radiation pattern 0 80 0 20 6 0 80 120 ma x im u m forward c u rrent C ma am b ient temperat u re C c 40 40 6 0 30 300c/w 20 70 100 10 350c/w 470c/w 50 0 0 20 6 0 80 120 ma x im u m forward c u rrent C ma am b ient temperat u re C c 40 20 30 15 300c/w 10 35 100 5 350c/w 470c/w 25
7 figure 6 a. recommended soldering pad pattern (ir reflow). figure 6 b. recommended soldering pad pattern (ttw). 2. 6 0 (0. 1 03) solder res i s t represen t s elec t r i cal connec ti v it y b e t ween pads 4.50 (0. 1 78) y x 0.40 (0.0 16 ) x 0.50 (0.020) y 1 . 1 0 (0.043) 1 .50 (0.05 9 ) d i mens i ons i n mm ( i nc h es). x x 0.5 (0.020) y y 1 .0 (0.03 9 ) 2.0 (0.07 9 ) 2.0 (0.07 9 ) 6 .0 (0.23 6 ) 3.0 (0. 11 8) 2.8 (0. 11 0) 6 . 1 (0.240) d i mens i ons i n mm ( i nc h es). represen t s elec t r i cal connec ti v it y b e t ween pads solder res i s t
8 figure 8a. recommended snpb reflow soldering profile figur e 8b. recommended pb-free reflow soldering profile. figure 9 . recommended wave soldering profile. figure 7. soft tip vacuum pick-up tool for extracting smt led components from carrier tape. note: for detail information on reflow soldering of avago surface mount leds, do refer to avago application note an 1060 surface mounting smt led indicator components. t empera tu re ti me 1 0 t o 20 sec. 255 c + 5c - 0c 1 25c + / - 25c 2 1 7c 3c/sec ma x . ma x . 1 20 sec. -6 c/sec ma x . 6 0 -1 50 sec. lam i nar wave b o tt om s i de o f pc b oard h o t a i r kn if e tu r bu len t wave f l uxi ng pre h ea t 0 1 020 30 50 1 00 1 50 200 250 30 40 50 ti me C seconds t empera tu re C c 6 07080 9 0 1 00 t op s i de o f pc b oard conveyor speed = 1 .83 m/min (6 f t /min) prehea t se tt ing = 1 50 c ( 1 00 c pcb) solder wave t empera tu re = 245 c air knife air t empera tu re = 390 c air knife dis t ance = 1 .9 1 mm (0.25 in.) air knife angle = 40 solder: sn63 ; fl u x: rma no t e: allow for boards t o be s u fficien t ly cooled before exer t ing mechanical force. 240 c ma x . 20 sec. ma x . 3 c/sec. ma x . 1 20 sec. ma x . ti me t empera tu re 1 83 c 1 00 -1 50 c C 6 c/sec. ma x . 6 0 -1 50 sec. 3 c/sec. ma x . vacuum pick - up t oo l sof t t ip no zzl e i nner diame t er si z e : 1 .0 t o 1 .5 mm 1 .25mm radius con t our
9 figure 11. tape dimensions figure 10. tape leader and trailer dimensions figure 12. reeling orientation. 200 mm min. for ? 180 reel. 200 mm min. for ? 330 reel. trailer component leader 480 mm min. for ? 180 reel. 96 0 mm min. for ? 330 reel. c a u ser feed direction cathode side u ser feed direction printed la b el 2.00 0.05 1.75 0.10 5.50 0.05 .388 0.02 3.52 0.10 3.70 0.10 3.00 0.10 8 ma x 12.00 + 0.30 - 0.10 8.00 0.10 4.00 0.10 1.24 32 ma x 8 ma x 32 ma x ? 1.50 0.10
10 intensity b in select ( x 5 x 6 ) individual reel will contain parts from one half bin only x 5 min iv b in x 6 0 full distribution 2 2 half bins starting from x 5 1 3 3 half bins starting from x 5 1 4 4 half bins starting from x 5 1 5 5 half bins starting from x 5 1 6 2 half bins starting from x 5 2 7 3 half bins starting from x 5 2 8 4 half bins starting from x 5 2 9 5 half bins starting from x 5 2 intensity b in limits b in id min (mcd) max (mcd) u 1 450.00 560.00 u 2 560.00 715.00 v1 715.00 900.00 v2 900.00 1125.00 w1 1125.00 1400.00 w2 1400.00 1800.00 x1 1800.00 2240.00 x2 2240.00 2850.00 y1 2850.00 3550.00 y2 3550.00 4500.00 z1 4500.00 5600.00 z2 5600.00 7150.00 11 7150.00 9000.00 12 9000.00 11250.00 21 11250.00 14000.00 22 14000.00 18000.00 tolerance of each bin limit = 12% moisture sensitivity this product is qualified as moisture sensitive level 2a per jedec j-std-020. precautions when handling this moisture sensitive product is important to ensure the reliability of the product. do refer to avago application note an5305 handling of moisture sensitive surface mount devices for details. a. storage before use - u nopen moisture barrier bag (mbb) can be stored at <40c/90%rh for 12 months. if the actual shelf life has exceeded 12 months and the hic indicates that baking is not required, then it is safe to reflow the leds per the original msl rating. - it is not recommended to open the mbb prior to assem- bly (e.g. for iqc). b. control after opening the mbb - the humidity indicator card (hic) shall be read immedi- ately upon opening of mbb. - the leds must be kept at <30c / 60%rh at all time and all high temperature related process including solder- ing, curing or rework need to be completed within 672 hours. c. control for unfinished reel - for any unuse leds, they need to be stored in sealed mbb with desiccant or desiccator at <5%rh. d. control of assembled boards - if the pcb soldered with the leds is to be subjected to other high temperature processes, the pcb need to be stored in sealed mbb with desiccant or desiccator at <5%rh to ensure no leds have exceeded their floor life of 672 hours. e. baking is required if: - 10% is not blue and 5% hic indicator turns pink. - the leds are exposed to condition of >30c / 60% rh at any time. - the leds floor life exceeded 672 hours. recommended baking condition: 605c for 20 hours.
for product information and a complete list of distributors, please go to our web site: www.avagotech.com avago, avago technologies, and the a logo are trademarks of avago technologies in the united states and other countries. data subject to change. copyright ? 2005-2010 avago technologies. all rights reserved. obsoletes av01-0313en av02-0208en - june 24, 2010 amber min. (nm) max. (nm) a 582.0 584.5 b 584.5 587.0 c 587.0 589.5 d 589.5 592.0 e 592.0 594.5 f 594.5 597.0 orange min. (nm) max. (nm) a 597.0 600.0 b 600.0 603.0 c 603.0 606.0 d 606.0 609.0 e 609.0 612.0 red/orange min. (nm) max. (nm) a 611.0 616.0 b 616.0 620.0 red min. (nm) max. (nm) full distribution tolerance of each bin limit = 1nm packaging option ( x 8 x 9 ) option test current package type reel si z e m1 50ma top mount 13 inch m2 30ma top mount 13 inch forward voltage b in table for hsmv C a43x-xxxxx only b in min. max. va 1.9 2.2 vb 2.2 2.5 vc 2.5 2.8 vd 2.8 3.1 ve 3.1 3.4 tolerance for each bin limit = 0.1v color b in select ( x 7 ) individual reel will contain parts from 1 full bin only x 7 0 full distribution z a and b only y b and c only w c and d only v d and e only u e and f only t f and g only s g and h only q a, b and c only p b, c and d only n c, d and e only m d, e and f only l e, f and g only k f, g and h only 1 a, b, c and d only 2 e, f g and h only color b in limits b lue min. (nm) max. (nm) a 460.0 465.0 b 465.0 470.0 c 470.0 475.0 d 475.0 480.0 cyan min. (nm) max. (nm) a 490.0 495.0 b 495.0 500.0 c 500.0 505.0 d 505.0 510.0 green min. (nm) max. (nm) a 515.0 520.0 b 520.0 525.0 c 525.0 530.0 d 530.0 535.0

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