d escription ? compact footprint for high density, high current/low voltage applications ? foil technology that adds higher reliability factor over the traditional magnet wire used for higher frequency circuit designs ? frequency range up to 1mhz ? ferrite core material applications ? next generation microprocessors ? energy storage applications ? dc-dc converters ? computers environmental data ? storage temperature range: -40 to +125? ? operating ambient temperature range: -40 to +85? (range is application specific). ? solder reflow temperature: +260 max. for 10 seconds max. packaging ? supplied in tape and reel packaging, 44mm width, 130 parts per 13" reel ? 45 parts per tray, bulk packaging also available p ar t rated ocl (1) irms (2) isat (3) dcr (4) volts (5) number inductance h 20% amperes amperes ohms ?ec h (t yp.) (t yp.) (max.) hc2lp-r47-r .47 .52 52.9 63.75 .0006 6.87 hc2lp-r68-r .68 .63 52.9 50.00 .0006 6.87 hc2lp-1r0-r 1.0 1.15 33.0 42.50 .0013 10.31 hc2lp-2r2-r 2.2 2.00 24.3 31.90 .0023 13.75 hc2lp-4r7-r 4.7 4.55 17.0 21.25 .0046 20.62 HC2LP-6R0-R 6.0 6.00 17.0 16.50 .0046 20.62 1) open circuit inductance test parameters: 300khz, 0.250 vrms, 0.0 adc 2) dc current for an approximate temperature change of 40 without core loss. derating is necessary for ac currents. pcb layout, trace thickness and width, air-flow and proximity of other heat generating components will affect the temperature rise. it is recommended that the temper ature of the part not exceed 125 under worst case operating conditions verified in the end application. 3) p eak current for approximately 30% roll-off 4) values @ 20 5) applied volt-time product (v-?) across the inductor. this value represents the applied v-? at 300khz necessary to generate a core loss equal to 10% of the total losses f or 40 temperature rise. high current 2lp low profile power inductors mechanical diagrams 1 2 19.00 10.00 5.50 5.50 9.5 typ 19.2 max 19.2 max 2.8 typ 2.3 typ 11.18 max front view top view schematic recommended pcb pad layout hc2lp-xxx wwllyy r 1 2 1 40.4 +/-0.1 44.0 +/-0.3 11.3 32 19.3 a 1.7 20.2 2.0 1.5dia +0.10 -0.00 4.0 a user direction of feed section a-a 19.3 packaging information dimensions in millimeters p arts packaged on 13" diameter reel, 130 par ts per reel. xxx = inductance value wwllyy = date code r = revision level rohs 2002/95/ec
i r ms der ating with core loss 1000 8 00 600 500 400 3 00 2 00 1 00 8 0 6 0 5 0 4 0 30 2 0 10 % of applied v olt- -seconds 99 98 97 96 95 94 92 90 8 0 7 0 60 50 4 0 20 0 % o f l o s s e s f r o m i r m s ( m a x i m u m ) 1 m h z 5 0 0 k h z 3 0 0 k h z 2 0 0 k h z 1 0 0 k h z ocl vs. isat 0 20 40 60 80 100 120 140 160 180 200 0 10 20 30 40 50 60 7 0 80 90 100 % of i sat % o f o c l high current 2lp low profile power inductors visit us on the web at www.cooperbussmann.com 1225 broken sound pkwy. suite f boca raton, fl 33487 t el: +1-561-998-4100 t oll f ree: +1-888-414-2645 fax: +1-561-241-6640 this bulletin is intended to present product design solutions and technical information that will help the end user with design applications. cooper electronic technologies reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. cooper electronic technologies also reserves the right to change or update, without notice, any technical information contained in this bulletin. once a product has been selected, it should be tested by the user in all possible applications. life support policy: cooper electronic technologies does not authorize the use of any of its products for use in life support devices or systems without the express written approval of an officer of the company. life support systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. pm-4114 8/06 cooper electronic t echnologies 2006 inductance characteristics core loss
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