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? semiconductor components industries, llc, 2000 december, 2000 rev. 0 1 publication order number: nl27wzu04/d nl27wzu04 product preview dual unbuffered inverter the nl27wzu04 is a high performance dual unbuffered inverter operating from a 2.3 to 5.5 v supply. this device consists of a dual unbuffered inverter. in combination with others, or in the mc74lcxu04 hex unbuffered inverter, these devices are well suited for use as oscillators, pulse shapers, and in many other applications requiring a highinput impedance amplifier. for digital applications, the nl27wz04 or the mc74lcx are recommended. current drive capability is 24 ma at the outputs. ? designed for 2.3 v to 5.5 v v cc operation ? over voltage tolerant inputs ? lvttl compatible interface capability with 5 v ttl logic with v cc = 3 v ? lvcmos compatible ? 24 ma balanced output sink and source capability ? near zero static supply current substantially reduces system power requirements v cc in a1 out y1 gnd in a2 out y2 1 figure 1. 6lead sot363 pinout (top view) figure 2. logic symbol in a2 out y2 1 out y1 in a1 pin assignment 1 2 3in a2 in a1 gnd 4 5v cc out y2 out y1 6 function table l h a input y output h l 1 2 34 5 6 this document contains information on a product under development. on semiconductor reserves the right to change or discontinue this product without notice. http://onsemi.com see detailed ordering and shipping information in the package dimensions section on page 4 of this data sheet. ordering information marking diagrams sc88 / sot363/sc70 df suffix case 419b pin 1 d = date code m6 d tsop6/sot23/sc59 dt suffix case 318g pin 1 d = date code m6 d
nl27wzu04 http://onsemi.com 2 maximum ratings (note 1.) symbol parameter condition value unit v cc dc supply voltage 0.5 to +7.0 v v i dc input voltage 0.5 v i +7.0 v v o dc output voltage output in high or low state.(note 3.) 0.5 v o v cc + 0.5 v i ik dc input diode current v i < gnd 50 ma i ok dc output diode current v o < gnd 50 ma v o > v cc +50 ma i o dc output source/sink current 50 ma i cc dc supply current per supply pin 100 ma i gnd dc ground current per ground pin 100 ma t stg storage temperature range 65 to +150 c p d power dissipation in still air sc88, tsop6 per derating (note 2.) 200 mw v esd esd withstand voltage human body model (note 4.) machine model (note 5.) charged device model (note 6.) > 2000 > 200 > 3000 v i latchup latchup performance above v cc and below gnd at 85 c (note 7.) 500 ma 1. absolute maximum continuous ratings are those values beyond which damage to the device may occur. exposure to these condition s or conditions beyond those indicated may adversely affect device reliability. functional operation under absolutemaximumrated co nditions is not implied. 2. derating e sc88 package: 3 mw/ c from 65 to 125 c e tsop6 package: 5 mw/ c from 65 to 125 c 3. i o absolute maximum rating must be observed. 4. tested to eia/jesd22a114a 5. tested to eia/jesd22a115a 6. tested to jesd22c101a 7. tested to eia/jesd78 recommended operating conditions symbol parameter min max unit v cc supply voltage operating data retention only 2.3 1.5 5.5 5.5 v v i input voltage 0 5.5 v v o output voltage (high or low state) 0 v cc v i oh high level output current v cc = 4.5 v 5.5 v v cc = 3.0 v 3.6 v v cc = 2.7 v 3.0 v v cc = 2.3 v 2.7 v 8 6 4 2 ma i ol low level output current v cc = 4.5 v 5.5 v v cc = 3.0 v 3.6 v v cc = 2.7 v 3.0 v v cc = 2.3 v 2.7 v + 8 +6 + 4 +2 ma t a operating freeair temperature 40 +85 c d t/ d v input transition rise or fall rate v cc = 2.5 v 0.2 v v cc =3.0 v 0.3 v v cc =5.0 v 0.5 v 0 0 0 20 10 5 ns/v
nl27wzu04 http://onsemi.com 3 the ja of the package is equal to 1/derating. higher junction temperatures may affect the expected lifetime of the device per the ta ble and figure below. device junction temperature versus time to 0.1% bond failures junction temperature c time, hours time, years 80 1,032,200 117.8 90 419,300 47.9 100 178,700 20.4 110 79,600 9.4 120 37,000 4.2 130 17,800 2.0 140 8,900 1.0 1 1 10 100 1000 time, years normalized failure rate t j = 80 c t j = 90 c t j = 100 c t j = 110 c t j = 130 c t j = 120 c failure rate of plastic = ceramic until intermetallics occur figure 3. failure rate vs. time junction temperature dc electrical characteristics v cc t a = 25 c t a 85 c symbol parameter condition (v) min typ max min max unit v ih minimum highlevel input voltage 2.3 to 5.5 0.8 v cc 0.8 v cc v v il maximum lowlevel input voltage 2.3 to 5.5 0.2 v cc 0.2 v cc v v oh minimum highlevel output voltage i oh = 100 m a 23 2.1 tbd 2.1 v oh gg v in = v ih or v il i oh = 100 m a 2.7 2.4 tbd 2.4 i oh = 100 m a 3.0 2.7 tbd 2.7 i oh = 100 m a 4.5 4.0 tbd 4.0 i oh = 2 ma 2.3 1.9 tbd 1.9 i oh = 3 ma 2.7 2.2 tbd 2.2 i oh = 4 ma 3.0 2.4 tbd 2.4 i oh = 6 ma 3.0 2.3 tbd 2.3 i oh = 8 ma 4.5 3.8 tbd 3.8 v ol maximum lowlevel output voltage i ol = 100 m a 2.3 tbd 0.2 0.2 v ol g v in = v ih or v il i ol = 100 m a 2.7 tbd 0.3 0.3 i ol = 100 m a 3.0 tbd 0.3 0.3 i ol = 100 m a 4.5 tbd 0.5 0.5 i ol = 2 ma 2.3 tbd 0.3 0.3 i ol = 3 ma 2.7 tbd 0.4 0.4 i ol = 4 ma 3.0 tbd 0.4 0.4 i ol = 6 ma 3.0 tbd 0.55 0.55 i ol = 8 ma 4.5 tbd 0.55 0.55 i in maximum input leakage current v in or v out = v cc or gnd 0 to 5.5 0.1 0.1 m a i cc maximum quiescent supply current v in = v cc or gnd 5.5 1 10 m a d i cc peak dynamic supply current v in =adjust for peak i cc 2.5 2 ma cc yy in j cc current, v out = open 3.3 5 out 5.0 15
nl27wzu04 http://onsemi.com 4 ????????????????????????????????? ac electrical characteristics t r = t f = 2.5 ns; c l = 50 pf; r l = 500 w ???? ???? ?????????? ?????????? ??????? ??????? ???? ???? ??????? ??????? t a = 25 c ????? ????? t a 85 c ?? ?? ???? ???? symbol ?????????? ?????????? parameter ??????? ??????? condition ???? ???? v cc (v) ??? ??? min ??? ??? typ ??? ??? max ??? ??? min ??? ??? max ?? ?? unit ???? ???? t plh ?????????? ?????????? maximum propagation delay iay ??????? ??????? r l = 1 m c l = 15 pf ???? ???? 2.5 0.2 ??? ??? 1.2 ??? ??? 3.3 ??? ??? 5.7 ??? ??? 1.2 ??? ??? 6.3 ?? ?? ns ???? ???? plh t phl ?????????? ?????????? gy input a to y fi gu r e 4. a n d 5 . ??????? ??????? r l = 1 m c l = 15 pf ???? ???? 3.3 0.3 ??? ??? 0.8 ??? ??? 2.7 ??? ??? 4.1 ??? ??? 0.8 ??? ??? 4.5 ?? ?? ???? ???? ?????????? ?????????? figure 4 . and 5 . ??????? ??????? r l = 500 c l = 50 pf ???? ???? ??? ??? 1.2 ??? ??? 4.0 ??? ??? 6.4 ??? ??? 1.2 ??? ??? 7.0 ?? ?? ???? ???? ?????????? ?????????? ??????? ??????? r l = 1 m c l = 15 pf ???? ???? 5.0 0.5 ??? ??? 0.5 ??? ??? 2.2 ??? ??? 3.3 ??? ??? 0.5 ??? ??? 3.6 ?? ?? ???? ???? ?????????? ?????????? ??????? ??????? r l = 500 c l = 50 pf ???? ???? ??? ??? 0.8 ??? ??? 3.4 ??? ??? 5.6 ??? ??? 0.8 ??? ??? 6.2 ?? ?? capacitive characteristics symbol parameter condition typical unit c in input capacitance v cc = 5.5 v, v i = 0 v or v cc 7 pf c out output capacitance v cc = 5.5 v, v i = 0 v or v cc 8 pf c pd power dissipation capacitance (note 8.) 10 mhz, v cc = 5.5 v, v i = 0 v or v cc 25 pf 8. c pd is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption with out load. average operating current can be obtained by the equation: i cc(opr ) = c pd v cc f in + i cc . c pd is used to determine the noload dynamic power consumption; p d = c pd v cc 2 f in + i cc v cc . v cc gnd 50% 50% v cc a or b y t phl t plh figure 4. switching waveforms propagation delays t r = t f = 2.5 ns, 10% to 90%; f = 1 mhz; t w = 500 ns pulse generator r t dut v cc r l c l figure 5. test circuit c l =50 pf or equivalent (includes jig and probe capacitance) r l = r 1 = 500 w or equivalent r t = z out of pulse generator (typically 50 w ) device ordering information device nomenclature device order number logic circuit indicator no. of gates per package temp range identifier technology device function package suffix tape & reel suffix package type (name/sot#/ common name) tape and reel size nl27wzu04dft2 nl 2 7 wz u04 df t2 sc88 / sot363 / sc70 178 mm (7o) 3000 unit nl27wzu04dft4 nl 2 7 wz u04 df t4 sc88 / sot363 / sc70 330 mm (13o) 10000 unit nl27wzu04dtt1 nl 2 7 wz u04 dt t1 tsop6 / sot23 / sc59 178 mm (7o) 3000 unit nl27wzu04dtt3 nl 2 7 wz u04 dt t3 tsop6 / sot23 / sc59 330 mm (13o) 10000 unit
nl27wzu04 http://onsemi.com 5 d 1 for components 10 pitches cumulative tolerance on tape 0.2 mm ( 0.008o) 2.0 mm 1.2 mm and larger center lines of cavity embossment user direction of feed k 0 see note 10. p 0 p 2 d e f w b 0 + + + k t b 1 top cover tape p see note 10. a 0 for machine reference only including draft and radii concentric around b 0 r min. tape and components shall pass around radius aro without damage bending radius *top cover tape thickness (t 1 ) 0.10 mm (0.004o) max. embossed carrier embossment typical component cavity center line typical component center line maximum component rotation 10 camber (top view) allowable camber to be 1 mm/100 mm nonaccumulative over 250 mm 100 mm (3.937o) 1 mm (0.039o) max 250 mm (9.843o) 1 mm max tape figure 6. carrier tape specifications embossed carrier dimensions (see notes 9. and 10.) tape size b 1 max d d 1 e f k p p 0 p 2 r t w 8 mm 4.35 mm (0.171o) 1.5 +0.1/ 0.0 mm (0.059 +0.004/ 0.0o) 1.0 mm min (0.039o) 1.75 0.1 mm (0.069 0.004o) 3.5 0.5 mm (1.38 0.002o) 2.4 mm (0.094o) 4.0 0.10 mm (0.157 0.004o) 4.0 0.1 mm (0.156 0.004o) 2.0 0.1 mm (0.079 0.002o) 25 mm (0.98o) 0.3 0.05 mm (0.01 +0.0038/ 0.0002o) 8.0 0.3 mm (0.315 0.012o) 9. metric dimensions governenglish are in parentheses for reference only. 10. a 0 , b 0 , and k 0 are determined by component size. the clearance between the components and the cavity must be within 0.05 mm min to 0.50 mm max. the component cannot rotate more than 10 within the determined cavity
nl27wzu04 http://onsemi.com 6 13.0 mm 0.2 mm (0.512o 0.008o) 1.5 mm min (0.06o) 50 mm min (1.969o) 20.2 mm min (0.795o) full radius t max g a figure 7. reel dimensions reel dimensions tape size t&r suffix a max g t max 8 mm t1, t2 178 mm (7o) 8.4 mm, +1.5 mm, 0.0 (0.33o + 0.059o, 0.00) 14.4 mm (0.56o) 8 mm t3, t4 330 mm (13o) 8.4 mm, +1.5 mm, 0.0 (0.33o + 0.059o, 0.00) 14.4 mm (0.56o) direction of feed barcode label hole pocket figure 8. reel winding direction
nl27wzu04 http://onsemi.com 7 tape trailer (connected to reel hub) no components 160 mm min tape leader no components 400 mm min components direction of feed cavity tape top tape figure 9. tape ends for finished goods figure 10. dft2 and dft4 (sc88) reel configuration/orientation figure 11. dtt1 and dtt3 (tsop6) reel configuration/orientation user direction of feed at1o pin one away from sprocket hole user direction of feed at2o pin one away from sprocket hole
nl27wzu04 http://onsemi.com 8 package dimensions scale 4:1 notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: inch. dim a min max min max millimeters 1.80 2.20 0.071 0.087 inches b 1.15 1.35 0.045 0.053 c 0.80 1.10 0.031 0.043 d 0.10 0.30 0.004 0.012 g 0.65 bsc 0.026 bsc h --- 0.10 --- 0.004 j 0.10 0.25 0.004 0.010 k 0.10 0.30 0.004 0.012 n 0.20 ref 0.008 ref s 2.00 2.20 0.079 0.087 v 0.30 0.40 0.012 0.016 b 0.2 (0.008) mm 123 a g v s h c n j k 654 b d 6 pl sc88/sot363/sc70 df suffix case 419b01 issue g 0.5 mm (min) 0.4 mm (min) 0.65 mm 0.65 mm 1.9 mm
nl27wzu04 http://onsemi.com 9 package dimensions scale 2:1 style 1: pin 1. drain 2. drain 3. gate 4. source 5. drain 6. drain 23 4 5 6 a l 1 s g d b h c 0.05 (0.002) dim min max min max inches millimeters a 0.1142 0.1220 2.90 3.10 b 0.0512 0.0669 1.30 1.70 c 0.0354 0.0433 0.90 1.10 d 0.0098 0.0197 0.25 0.50 g 0.0335 0.0413 0.85 1.05 h 0.0005 0.0040 0.013 0.100 j 0.0040 0.0102 0.10 0.26 k 0.0079 0.0236 0.20 0.60 l 0.0493 0.0610 1.25 1.55 m 0 10 0 10 s 0.0985 0.1181 2.50 3.00 notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: millimeter. 3. maximum lead thickness includes lead finish thickness. minimum lead thickness is the minimum thickness of base material. m j k style 2: pin 1. emitter 2 2. base 1 3. collector 1 4. emitter 1 5. base 2 6. collector 2 style 3: pin 1. enable 2. n/c 3. r boost 4. vz 5. v in 6. v out style 4: pin 1. n/c 2. v in 3. not used 4. ground 5. enable 6. load tsop6/sot23/sc59 dt suffix case 318g02 issue g mm inches 1.9 0.039 1.0 0.094 0.7 0.074 2.4 0.028 0.95 0.037 0.95 0.037
nl27wzu04 http://onsemi.com 10 notes
nl27wzu04 http://onsemi.com 11 notes
nl27wzu04 http://onsemi.com 12 on semiconductor and are trademarks of semiconductor components industries, llc (scillc). scillc reserves the right to make changes without further notice to any products herein. scillc makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does scillc assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. atypicalo parameters which may be provided in scill c data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. all operating parameters, including atypicalso must be validated for each customer application by customer's technical experts. scillc does not convey any license under its patent rights nor the rights of others. scillc products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body , or other applications intended to support or sustain life, or for any other application in which the failure of the scillc product could create a sit uation where personal injury or death may occur. should buyer purchase or use scillc products for any such unintended or unauthorized application, buyer shall indemnify and hold scillc and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthori zed use, even if such claim alleges that scillc was negligent regarding the design or manufacture of the part. scillc is an equal opportunity/affirmative action employer. publication ordering information central/south america: spanish phone : 3033087143 (monfri 8:00am to 5:00pm mst) email : onlitspanish@hibbertco.com tollfree from mexico: dial 018002882872 for access then dial 8662979322 asia/pacific : ldc for on semiconductor asia support phone : 3036752121 (tuefri 9:00am to 1:00pm, hong kong time) toll free from hong kong & singapore: 00180044223781 email : onlitasia@hibbertco.com japan : on semiconductor, japan customer focus center 4321 nishigotanda, shinagawaku, tokyo, japan 1410031 phone : 81357402700 email : r14525@onsemi.com on semiconductor website : http://onsemi.com for additional information, please contact your local sales representative. nl27wzu04/d north america literature fulfillment : literature distribution center for on semiconductor p.o. box 5163, denver, colorado 80217 usa phone : 3036752175 or 8003443860 toll free usa/canada fax : 3036752176 or 8003443867 toll free usa/canada email : onlit@hibbertco.com fax response line: 3036752167 or 8003443810 toll free usa/canada n. american technical support : 8002829855 toll free usa/canada europe: ldc for on semiconductor european support german phone : (+1) 3033087140 (monfri 2:30pm to 7:00pm cet) email : onlitgerman@hibbertco.com french phone : (+1) 3033087141 (monfri 2:00pm to 7:00pm cet) email : onlitfrench@hibbertco.com english phone : (+1) 3033087142 (monfri 12:00pm to 5:00pm gmt) email : onlit@hibbertco.com european tollfree access*: 0080044223781 *available from germany, france, italy, uk, ireland

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