spec no: dsak5031 rev no: v.3 date: jan/24/2011 page: 1 of 6 approved: wynec checked: allen liu drawn: c.h.han e rp: 1201200195 part number: KAD1-1010SE28Z1S reddish-orange features z plcc-4 package. z single color. z high luminance. z high power,operating current @350ma. z suitable for all smt assembly methods. z package : 300pcs / reel. z moisture sensitivity level : level 3. z rohs compliant. package dimensions notes: 1. all dimensions are in millimeters (inches). 2. tolerance is 0.25(0.01") unless otherwise noted. 3.the specifications, characteristics and technical data described in the datasheet are subject to change without prior notice. 4. the device has a single mounting surface. the devi ce must be mounted according to the specifications. applications z traffic signaling. z backlighting (illuminated advertising , general lighting). z interior and exterior automotive lighting. z substitution of micr o incandescent lamps. z portable light source (e.g. bicycle flashlight). z signal and symbol luminaire for orientation. z marker lights (e.g. steps, exit ways, etc). z decorative and entertainment lighting. z indoor and outdoor commercial and residential architectural lighting. xpower attention observe precautions for handling electrostatic discharge sensitive devices application note static electricity and surge damage the leds. it is recommended to use a wrist band or anti-electrostatic glove when handling the leds. all devices, equipment and machinery must be electrically grounded.
spec no: dsak5031 rev no: v.3 date: jan/24/2011 page: 2 of 6 approved: wynec checked: allen liu drawn: c.h.han e rp: 1201200195 handling precautions compare to epoxy encapsulant that is hard and brittle, si licone is softer and flexible. although its characteristic significantly reduces thermal stress, it is more su sceptible to damage by external mechanical force. as a result, special handling precau tions need to be observed during asse mbly using silicone encapsulated led products. failure to comply might lead to damage and premature failure of the led. 1. handle the component along the side surfaces by using forceps or appropriate tools. 2. do not directly touch or handle the silicone lens surface. it may damage the internal circuitry. 3. do not stack together assembled pcbs containing ex posed leds. impact may scratch the silicone lens or damage the internal circuitry. 5. as silicone encapsulation is permeable to gases, some corro sive substances such as h 2 s might corrode silver plating of leadframe. special care should be taken if an led with silicone encapsulation is to be used near such substances. 4.1. the outer diameter of the smd pickup nozzle should not exce ed the size of the led to prevent air leaks. the inner diameter of the no zzle should be as large as possible. 4.2. a pliable material is suggested fo r the nozzle tip to avoid scratching or damaging the led surface during pickup. 4.3. the dimensions of the component must be accurately program med in the pick-and-place machine to insure precise pickup and avoid damage during production.
spec no: dsak5031 rev no: v.3 date: jan/24/2011 page: 3 of 6 approved: wynec checked: allen liu drawn: c.h.han e rp: 1201200195 selection guide part no. dice lens type luminous intensity iv(cd)@ 350 ma [2] v iewing angle [1] min. typ. min. typ. 2 1/2 KAD1-1010SE28Z1S reddish-orange (algainp) water clear 24 43 24 35 20 v (lm) [2] @ 350ma parameter symbol value unit power dissipation p d 1.05 w junction temperature t j 110 c operating temperature top -40 to +85 c storage temperature ts t g -40 to +85 c dc forward current[1] i f 350 ma peak forward current [2] i fm 500 ma thermal resistance [1] r th 60 c/w reverse voltage v r 5 v absolute maximum ratings at t a =25c electrical / optical characteristics at t a =25c parameter symbol value unit wavelength at peak emission i f =350ma [typ.] peak 640 nm dominant wavelength i f =350ma [typ.] dom [1] 625 nm spectral bandwidth at 50% rel max i f =350ma [typ.] ? 30 nm forward voltage i f =350ma [min.] v f [2] 2.0 v forward voltage i f =350ma [typ.] 2.5 forward voltage i f =350ma [max.] 3.0 temperature coefficient of peak i f =350ma, -10 c t 100 c [typ.] tc peak 0.14 nm/ c temperature coefficient of dom i f =350ma, -10 c t 100 c [typ.] tc dom 0.12 nm/ c temperature coefficient of v f i f =350ma, -10 c t 100 c [typ.] tc v -3.0 mv/ c allowable reverse current [max.] i r 85 ma notes: 1.results from mounting on pc board fr4(pad size 100mm 2 ), mounted on pc board-metal core pcb is recommend for lowest thermal resistance. 2.1/10 duty cycle, 0.1ms pulse width. notes: 1.wavelength: +/-1nm. 2. forward voltage: +/-0.1v. notes: 1. 1/2 is the angle from optical centerline where the lumi nous intensity is 1/2 of the optical peak value. 2. luminous intensity/ luminous flux: +/-15%.
spec no: dsak5031 rev no: v.3 date: jan/24/2011 page: 4 of 6 approved: wynec checked: allen liu drawn: c.h.han e rp: 1201200195 KAD1-1010SE28Z1S
spec no: dsak5031 rev no: v.3 date: jan/24/2011 page: 5 of 6 approved: wynec checked: allen liu drawn: c.h.han e rp: 1201200195 tape specifications (units : mm) KAD1-1010SE28Z1S recommended soldering pattern (units : mm; tolerance: 0.1) reflow soldering is recommended and the soldering profile is shown below. other soldering methods are not recommended as they might cause damage to the product. reel dimension
spec no: dsak5031 rev no: v.3 date: jan/24/2011 page: 6 of 6 approved: wynec checked: allen liu drawn: c.h.han e rp: 1201200195 packing & label specifications KAD1-1010SE28Z1S
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