d i m e n s i o n s p a r t n u m b e r n o . o f l e a d s p i t c h a b c d e ic235-0202-201-* 20 (26) 1.27 17.3 22.0 9.22 7.56 17.44 ic235-0242-202-* 24 (26) 1.27 17.3 22.0 9.22 7.56 17.44 ic235-0242-203-* 24 (28) 1.27 19.9 23.3 11.76 10.16 18.71 ic235-0262-206-* 26 1.27 17.3 22.0 9.22 7.56 17.44 ic235-0282-204-* 28 1.27 19.9 23.3 11.76 10.16 18.71 ic235-0322-253* 32 1.27 20.2 26.4 11.76 10.16 21.35 ic235-0402-205-* 40 (44) 0.80 19.9 24.0 11.76 10.16 18.71 ic235-0442-207-* 44 0.80 19.9 24.0 11.76 10.16 18.71 IC235-0442-215-* -50 0.80 20.2 26.4 11.76 10.16 21.35 ic235-0502-209-* 50 0.80 20.2 26.4 11.76 10.16 21.35 ic235-0542-218-* 54 0.80 23.0 28.0 14.30 12.70 22.47 ic235-0542-239 54 0.80 20.2 28.0 11.76 10.16 22.92 characteristics insulation resistance: 1,000m?minimum at 500 vdc withstanding voltage: 700 vac for 1 minute contact resistance: 30m? max. at 10ma/20mv (initial) operating temperature: -40?c ~ +150?c material insulator: pei (glass filled) contact: beryllium copper plating: gold over nickel t s o p p ( ( t y y p p e e i i , o p p e e n n t o o p p ) ) 1 1 8 i c 2 3 5 s e r i e s arrays inline memory modules quad flat packages small outline packages speciality test products ic235- 032 2- 001 n socket series no. of leads no. of sides with contacts positioning pin n: without positioning pin no mark: with positioning pin design no.
1 1 9 p c board layouts t s o p p ( ( t y y p p e e ii , o p p e e n n t o o p p ) ) ic235 series ? ? ? ? ? ? ? ? ? ? ? ?
t s o p p ( ( t y y p p e e ii , o p p e e n n t o o p p ) ) ic235 series p c board layouts 1 2 0 ? ? ? ? ? ? ? ? arrays inline memory modules quad flat packages small outline packages speciality t est products
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