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? 2000 microchip technology inc. ds11177b-page 1 features ? low power i dd = 25 a, max low offset voltage: 250 v, max rail-to-rail swing at output 80pa, low input bias current over temperature specifications rated for 2.5v to 5.5v supplies unity gain stable chip select capability with mcp608 industrial temperature range supported no phase reversal available in single, dual, and quad applications battery power instruments high impedance applications - photodiode pre-amps - ph probe buffer amplifier - infrared detectors - precision integrators - charge amplifier for piezoelectric transducers strain gauges medical instruments test equipment available tools spice macromodels (at ww w . m icrochip.com ) filterlab tm software (at www.microchip.com ) ? 2000 microchip technology inc. description the mcp606, mcp607, mcp608 and mcp609 from microchip technology, inc. are unity gain stable, low offset voltage operational amplifiers capable of preci- sion low power single supply operation. performance characteristics include ultra low offset voltage (250v, max), rail-to-rail output swing capability, and low input bias current (80pa@85c). these features make this family of amplifiers well suited for single supply preci- sion, high impedance, battery powered applications. the single mcp606 is available in standard 8-lead pdip, soic, and tssop packages. another version of the single op amp, mcp608 is offered with a chip select option in standard 8-lead pdip, soic, and tssop packages. the dual mcp607 is offered in stan- dard 8-lead pdip, soic, as well as the tssop pack- age. finally, the quad mcp609 is offered in 14-lead pdip, soic and tssop packages. all devices are fully specified from -40 c to +85 c with power supplies from 2.5v to 5.5v. packages +in -in v ss v dd out 1 2 3 4 8 7 6 5 - + nc nc nc +ina -in v ss 1 2 3 4 8 7 6 5 - outa + - + a b v dd out -inb +inb +in -in v ss v dd out 1 2 3 4 8 7 6 5 - + nc cs nc +ina -ina v ss 1 2 3 4 14 13 12 11 - outa + - + a d v dd outd -ind +ind 10 9 8 5 6 7 out1 -inb +inb +inc -inc outc + - b c - + mcp606 pdip, soic,tssop mcp607 pdip, soic,tssop mcp608 pdip, soic,tssop mcp609 pdip, soic,tssop mcp606/607/608/609 2.5v to 5.5v micropower cmos op amps
mcp606/607/608/609 ds11177b-page 2 ? 2000 microchip technology inc. 1.0 electrical characteristics 1.1 maximum ratings* v dd ..................................................................................7.0v all inputs and outputs w.r.t. ............ v ss ? 0.3v to v dd +0.3v difference input voltage ....................................... |v dd - v ss | output short circuit current ..................................continuous current at input pin .................................................... +/-2ma current at output and supply pins .......................... +/-30ma storage temperature .....................................-65 c to +150 c ambient temp. with power applied ................-55 c to +125 c soldering temperature of leads (10 seconds) ............. +300 c esd protection on all pins .................................................. 2 kv *notice: stresses above those listed under ? maximum rat- ings ? may cause permanent damage to the device. this is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operational listings of this specification is not implied. expo- sure to maximum rating conditions for extended periods may affect device reliability. pin function table dc characteristics name function +in/+ina/+inb/+inc/+ind non-inverting input terminals -in/-ina/-inb/-inc/-ind inverting input terminals v dd positive power supply v ss negative power supply out/outa/outb/outc/outd output terminals cs chip select nc no internal connection to ic unless otherwise specified, all limits are specified for v dd = +2.5v to +5.5v, v ss = gnd, t a = 25 c, v cm = v dd /2, r l = 100k ? to v dd /2, and v out ~ v dd /2 parameters symbol min. typ. max. units conditions input offset input offset voltage v os -250 ? +250 v drift with temperature, dv os /dt ? 1.8 ? v/ ct a = -40 c to+85 c power supply rejection psrr 80 93 ? db for v dd = 2.5v to 5.5v input bias current and impedance input bias current i b ? 1 ? pa over temperature i b ?? 80 pa t a = -40 c to+85 input offset bias current i os ? 1 ? pa common mode input impedance z cm ? 10 13 ||6 ? ? ||pf differential input impedance z diff ? 10 13 ||6 ? ? ||pf common mode common-mode input range vcm v ss ? 0.3 v dd ? 1.1 v cmrr > 75db common-mode rejection ratio cmrr 75 91 ? db v dd = 5v, v cm = -0.3 to 3.9v open loop gain dc open loop gain a ol 105 121 ? db r l = 25k ? to gnd, 50mv < v out < (v dd ? 50mv) dc open loop gain a ol 100 118 ? db r l = 5k ? to gnd, 100mv < v out < (v dd ? 100mv) output low level/high level output voltage swing v ol , v oh v ss + 0.015 ? v dd ? 0.020 v r l = 25k ? to v dd /2 v ol , v oh v ss + 0.045 ? v dd ? 0.060 v r l = 5k ? to v dd /2 linear region maximum output voltage swing v out v ss + 0.050 ? v dd ? 0.050 v r l = 25k ? to v dd /2, a ol 105db v out v ss + 0.100 ? v dd ? 0.100 v r l = 5k ? to v dd /2, a ol 100db output short circuit current i sc 17 ma v out = 2.5v, v dd = 5v power supply supply voltage v s 2.5 ? 5.5 v quiescent current per amp i q ? 18.7 25 ai o = 0
? 2000 microchip technology inc. ds11177b-page 3 mcp606/607/608/609 ac characteristics specifications for mcp608 chip select feature temperature specifications unless otherwise specified, all limits are specified for v dd = +2.5v to +5.5v, v ss = gnd, t a = 25 c, v cm = v dd /2, r l = 100k ? to v dd /2, and v out ~ v dd /2 parameters symbol min. typ. max. units conditions gain bandwidth product gbwp ? 155 ? khz v dd = 5v, c l = 60 pf phase margin at unity crossing ? 62 ? degrees v dd = 5v, c l = 60 pf slew rate sr ? 0.08 ? v/ sg = 1, v dd = 5v, c l = 60 pf input voltage noise e n ? 2.8 ? vp-p f = 0.1hz to 10hz noise density e n ? 38 ? nv/ hz f = 1khz input current noise density i n ? 3 ? fa/ hz f = 1khz unless otherwise specified, all limits are specified for v dd = +2.5v to +5.5v, v ss = gnd, t a = 25 c, v cm = v dd /2, r l = 100k ? , and v out ~ v dd /2 parameters symbol min. typ. max. units conditions cs low specifications cs logic threshold, low v il v ss ? 0.2 v dd v for entire v dd range cs input current, low i csl -0.1 0.01 ? acs = 0.2v dd cs high specifications cs logic threshold, high v ih 0.8 v dd ? v dd v for entire v dd range cs input current, high i csh ? 0.01 0.1 acs = v dd cs input high, gnd current i q ? 0.05 0.1 a cs = v dd amplifier output leakage, cs high ? 10 ? na cs = 0.8v dd dynamic specifications cs low to amplifier output high turn-on time t on ? 9 100 scs low = 0.2v dd , v out = 0.9 *v dd /2, g = +1v/v cs high to amplifier output high z t off ? 0.1 ? scs high = 0.8v dd , v out = 0.1 *v dd /2, g = +1v/v hysteresis ? 0.6 ? vv dd = 5v unless otherwise specified, all limits are specified for v dd = +2.5v to +5.5v, v ss = gnd parameters symbol min. typ. max. units conditions temperature ranges specified temperature range t a -40 ? +85 c operating temperature range t a -40 ? +85 c storage temperature range t a -65 ? +150 c thermal package resistance thermal resistance, 8l-pdip ja ? 85 ? c/w thermal resistance, 8l-soic ja ? 163 ? c/w thermal resistance, 8l-tssop ja ? 124 ? c/w thermal resistance, 14l-pdip ja ? 70 ? c/w thermal resistance, 14l-soic ja ? 120 ? c/w thermal resistance, 14l-tssop ja ? 100 ? c/w
mcp606/607/608/609 ds11177b-page 4 ? 2000 microchip technology inc. 2.0 typical performance curves note: unless otherwise indicated, t a = 25 c, v cm = v dd / 2 and v out ~ v dd /2, v ss = gnd figure 2-1: offset voltage vs. number of occurrences with v dd = 5.5v figure 2-2: offset voltage vs. number of occurrences with v dd = 2.5v figure 2-3: quiescent current vs. power supply voltage vs. temperature figure 2-4: offset voltage drift vs. number of occurrences with v dd = 5.5v figure 2-5: offset voltage drift vs. number of occurrences with v dd = 2.5v figure 2-6: quiescent current vs. temperature
? 2000 microchip technology inc. ds11177b-page 5 mcp606/607/608/609 note: unless otherwise indicated, t a = 25 c, v cm = v dd / 2 and v out ~ v dd /2, v ss = gnd figure 2-7: normalized offset voltage vs. temperature figure 2-8: open loop gain, phase margin vs. frequency figure 2-9: phase margin, gain bandwidth, vs. load resistance figure 2-10: input offset voltage vs. common mode voltage figure 2-11: phase margin, gain bandwidth product vs. temperature figure 2-12: input voltage noise density vs. frequency
mcp606/607/608/609 ds11177b-page 6 ? 2000 microchip technology inc. note: unless otherwise indicated, t a = 25 c, v cm = v dd / 2 and v out ~ v dd /2, v ss = gnd figure 2-13: input bias current, input offset current vs. temperature figure 2-14: dc open loop gain vs. output load resistance figure 2-15: common-mode rejection ratio, power supply rejection ratio vs. frequency figure 2-16: input bias current, input offset current vs. common mode input voltage figure 2-17: dc open loop gain vs. power supply voltage figure 2-18: common-mode rejection ratio, power supply rejection ratio vs. temperature
? 2000 microchip technology inc. ds11177b-page 7 mcp606/607/608/609 note: unless otherwise indicated, t a = 25 c, v cm = v dd / 2 and v out ~ v dd /2, v ss = gnd figure 2-19: low level and high level output swing vs. load resistance figure 2-20: maximum full scale output voltage swing vs. frequency figure 2-21: slew rate vs. temperature figure 2-22: low level and high level output swing vs. temperature, r l =5k ? figure 2-23: low level and high level output swing vs. temperature, r l =25k ? figure 2-24: output short circuit current vs. temperature
mcp606/607/608/609 ds11177b-page 8 ? 2000 microchip technology inc. note: unless otherwise indicated, t a = 25 c, v cm = v dd / 2 and v out ~ v dd /2, v ss = gnd figure 2-25: large signal non-inverting signal pulse response figure 2-26: small signal non-inverting pulse response figure 2-27: channel to channel separation (mcp607 and mcp609 only) figure 2-28: large signal inverting signal pulse response figure 2-29: small signal inverting signal pulse response figure 2-30: chip select to amplifier output response time (mcp608 only)
? 2000 microchip technology inc. ds11177b-page 9 mcp606/607/608/609 note: unless otherwise indicated, t a = 25 c, v cm = v dd / 2 and v out ~ v dd /2, v ss = gnd figure 2-31: cs hysteresis (mcp608 only)
mcp606/607/608/609 ds11177b-page 10 ? 2000 microchip technology inc. 3.0 applications information the mcp606/607/608/609 family of operational ampli- fiers are fabricated on microchip ? s state-of-the-art cmos process. they are unity gain stable and suitable for a wide range of general purpose applications. with this family of operational amplifiers, the power supply pin should be by-passed with a 0.1 f capacitor. 3.1 rail-to-rail output swing there are two specifications that describe the output swing capability of the mcp606/607/608/609 family of operational amplifiers. the first specification, low level and high level output voltage swing, defines the absolute maximum swing that can be achieved under specified loaded conditions. for instance, the low level output voltage swing of the mcp606/607/ 608/609 family is specified to be able to swing at least to 15mv from the negative rail with a 25k ? load to v dd / 2. this output swing performance is shown in figure 3-1, where the output of an mcp606 is configured in a gain of +2v/v and overdriven with a 4khz triangle wave. in this figure, the degradation of the output swing linearity is clearly illustrated. this degradation occurs after the point at which the open loop gain of the amplifier is specified and before the amplifier reaches its maximum and minimum output swing. figure 3-1: low level and high level output swing the second specification that describes the output swing capability of these amplifiers is the linear region maximum output voltage swing. this specification defines the maximum output swing that can be achieved while the amplifier is still operating in its linear region. the linear region maximum output voltage swing of the mcp606/607/608/609 family is specified within 50mv from the positive and negative rail with a 25k ? load and 100mv from the rails with a 5k ? load. the overriding condition that defines the linear region of the amplifier is the open loop gain that is specified over that region. in the voltage output region between v ss + 50mv and v dd - 50mv, the open loop gain is specified to 105db (min) with a 25k ? load. the classical definition of the dc open loop gain of an amplifier is: a ol = 20 log 10 ?( vout / ? vos) where: a ol is the dc open loop gain of the amplifier, ? v out is equal to (v dd - 50mv) - (v ss + 50mv) for r l = 25k ? , and ? v os is the change in offset voltage with the changing output voltage of the amplifier. 3.2 input voltage and phase reversal since the mcp606/607/608/609 amplifier family is designed with cmos devices, it does not exhibit phase inversion when the input pins exceed the negative sup- ply voltage. figure 3-2 shows an input voltage exceed- ing both supplies with no resulting phase inversion. figure 3-2: the mcp606/607/608/609 family of op amps do not have phase reversal issues. for this graph, the amplifier is in a gain of +2v/v. 0 1 2 3 4 5 6 7 8 9 10 0 100 200 300 400 500 600 700 time (us) input voltage (v) 4 4.1 4.2 4.3 4.4 4.5 4.6 4.7 4.8 4.9 5 output voltage (0.1v/div) v ss v ss v ss v dd v dd v dd v oh v ol
? 2000 microchip technology inc. ds11177b-page 11 mcp606/607/608/609 the maximum operating common-mode voltage that can be applied to the inputs is v ss - 0.3v to v dd - 1.1v. in contrast, the absolute maximum input voltage is v ss - 0.3v and v dd + 0.3v. voltages on the input that exceed this absolute maximum rating can cause excessive current to flow in or out of the input pins. cur- rent beyond 2ma can cause possible reliability prob- lems. applications that exceed this rating must be externally limited with an input resistor as shown in fig- ure 3-3. figure 3-3: if the inputs of the amplifier exceed the absolute maximum specifications, an input resistor, r in , should be used to limit the current flow into that pin. 3.3 capacitive load and stability driving capacitive loads can cause stability problems with many of the higher speed amplifiers. for any closed loop amplifier circuit, a good rule of thumb is to design for a phase margin that is no less than 45 . this is a conservative theoretical value, how- ever, if the phase margin is lower, layout parasitics can degrade the phase margin further causing a truly unstable circuit. a system phase shift of 45 will have an overshoot in its step response of approximately 25%. a buffer configuration with a capacitive load is the most difficult configuration for an amplifier to maintain stabil- ity. the phase versus capacitive load of the mcp60x amplifier is shown in figure 3-4. in this figure, it can be seen that the amplifier has a phase margin above 40 , while driving capacitance loads up to 220pf. figure 3-4: gain bandwidth, phase margin vs. capacitive load figure 3-5: amplifier circuits that can be used when driving heavy capacitive loads. if the amplifier is required to drive larger capacitive loads, the circuit shown in figure 3-5 can be used. a small series resistor (r iso ) at the output of the amplifier improves the phase margin when driving large capaci- tive loads. this resistor decouples the capacitive load from the amplifier by introducing a zero in the transfer function. this zero adjusts the phase margin by approximately: ? m = tan -1 (2 gbwp x r iso x c l ) where: ? m is the improvement in phase margin, gbwp is the gain bandwidth product of the amplifier, r iso is the capacitive decoupling resistor, and c l is the load capacitance r in = (maximum expected voltage - v dd ) / 2ma or (v ss - minimum expected voltage)/ 2ma. mcp60x r in 0 10 20 30 40 50 60 70 80 10 100 1000 load capacitance(pf) phase margin() 20 40 60 80 100 120 140 160 180 gain-bandwidth (khz) phase margin gain bandwidth v dd = 5v r l =100k ? v in v dd mcp60x r iso v out c l
mcp606/607/608/609 ds11177b-page 12 ? 2000 microchip technology inc. figure 3-6: timing diagram for the cs function of the mcp608 amplifier 3.4 the chip select option of the mcp608 the mcp608 is a single amplifier with a chip select option. when cs is pulled high the supply current drops to 50 na (typ). in this state, the amplifier is put into a high impedance state. by pulling cs low, the amplifier is enabled. if the cs pin is left floating, the amplifier will not operate properly. figure 3-6 shows the output voltage and supply current response to a cs pulse. 3.5 layout considerations in applications where low input bias current is critical, pc board surface leakage effects and signal coupling from trace to trace need to be taken into consideration. 3.5.1 surface leakage surface leakage across a pc board is a consequence of differing dc voltages between two traces combined with high humidity, dust or contamination on the board. for instance, the typical resistance from pc board trace to pad is approximately 10 12 ? under low humidity conditions. if an adjacent trace is biased to 5v and the input pin of the amplifier is biased at or near zero volts, a 5pa leakage current will appear on the amplifier ? s input node. this type of pcb leakage is five times the room temperature input bias current (1pa, typ) of the mcp606/607/608/609 family of amplifiers. the simplest technique that can be used to reduce the effects of pc board leakage is to design a ring around sensitive pins and traces. an example of this type of layout is shown in figure 3-7. figure 3-7: example of guard ring for the mcp606, the a-amplifier of the mcp607 or the mcp608 in a pc board layout circuit examples of ring implementations are shown in figure 3-8. in figure 3-8a, b and c, the guard ring is biased to the common-mode voltage of the amplifier. this type of guard ring is most effective for applications where the common-mode voltage of the input stage changes, such as buffers, non-inverting gain amplifiers or instrumentation amplifiers. the strategy shown in figure 3-8d, biases the com- mon-mode voltage and guard ring to ground. this type of guard ring is typically used in precision photo sens- ing circuits. v il hi-z t on v ih t off hi-z 50 na (typ) 50 na (typ) 18.7 a (typ) 18.7 a (typ) cs output v dd supply current -in +in v- guard ring
? 2000 microchip technology inc. ds11177b-page 13 mcp606/607/608/609 figure 3-8: examples of how to design pc board traces to minimize leakage paths to the high impedance input pins of the mcp606/607/608/609 amplifiers. 3.5.2 signal coupling the input pins of the mcp606/607/608/609 amplifiers have a high impedance providing an opportunity for noise injection, if layout issues are not considered. these high impedance input terminals are sensitive to injected currents. this can occur if the trace from a high impedance input is next to a trace that has fast chang- ing voltages, such as a digital or clock signal. when a high impedance trace is in close proximity to a trace with these types of voltage changes, charge is capaci- tively coupled into the high impedance trace. figure 3-9: capacitors can be built with pcb traces allowing for coupling of signals from one trace to another. as shown in figure 3-9, the value of the capacitance between two traces is primarily dependent on the dis- tance (d) between the traces and the distance that the two traces are in parallel (l). from this model, the amount of current generated into the high impedance trace is equal to: i = c ? v/ ? t where: i equals the current that appears on the high impedance trace, c equals the value of capacitance between the two pcb traces, ? v equals the change in voltage of the trace that is switching, and ? t equals the amount of time that the voltage change took to get from one level to the next. mcp60x mcp60x mcp60x mcp60x v dd figure 3-8a figure 3-8c figure 3-8b figure 3-8d voltage reference (could be ground) w= thickness of pcb trace l = length of pcb trace d = distance between the two pcb traces pcb trace w (typ 0.003mm) pcb cross-section w x l x e o x e r c = pf d l d
mcp606/607/608/609 ds11177b-page 14 ? 2000 microchip technology inc. 3.6 typical application s 3.6.1 low side battery current sensing the mcp606/607/608/609 amplifiers can be used to sense the output current on the low side of a battery using the circuit in figure 3-10. in this circuit, the cur- rent from the power supply (minus the current required to power the mcp606) flows through a ten ohm resistor from the rest of the circuit in the system. this current is converted to a voltage through the sense resistor and gained by the resistors around the amplifier. since the input bias current and offset voltage of the mcp606 is low, there is very little error generated by the amplifier. additionally, the amplifier is capable of swinging below ground and the quiescent current is very low. these four specifications make this amplifier appropriate for this type of circuit. figure 3-10: low side battery current sensing 3.6.2 preamplifier for photo detection circuit any amplifier from this family of operational amplifiers can be used to convert an output current signal from a sensor into a voltage. a sensor that fits this description is a photodetector as shown in figure 3-11. this type of circuit is implemented with a single resistor and an optional capacitor in the feedback loop of the amplifier. as light impinges on the photo diode, charge is gener- ated, causing a current to flow in the reverse bias direc- tion of the photodetector. two circuits are shown in figure 3-11. the top circuit is designed to provide precision sensing from the photo- detector. in this circuit the voltage across the detector is nearly zero and equal to the offset voltage of the amplifier. with this configuration, current that appears across the resistor, r 2 , is primarily a result of the light excitation on the photodetector. the photosensing cir- cuit on the bottom of figure 3-11 is designed for higher speed sensing. this is done by reverse biasing the photodetector, which reduces the parasitic capacitance of the diode. the key specifications that influence the accuracy of these circuits are low offset voltage, low input bias cur- rent, high input impedance and an input common mode range below ground. the low input offset voltage and low input bias current provide an environment where there is minimal voltage placed across the photodetec- tor, consequently the linearity of the photodetector is not compromised. given that the mcp606/607/608/ 609 amplifiers are specified for a 250 v(max) offset voltage and input bias currents in the pico ampere region they are ideal for these circuits. additionally, these two circuits will only work if the common-mode range of the amplifier includes zero, which is the case with the mcp606/607/608/609 amplifiers. figure 3-11: pre-amplifier for photo detection circuit v dd v ss 50k ? to l o a d +2.5 to 5.5v v ss v dd 5k ? 10 ? i load r sense 1 r f r in ---------- - + ---------------------------------------------- r in r f mcp606 * * c 2 r 2 v dd d 1 light i d1 mcp606 v out r 2 v dd d 1 light i d1 mcp606 v out v out = r 2 i d1 *bypass capacitor, 1 f v bias
? 2000 microchip technology inc. ds11177b-page 15 mcp606/607/608/609 3.6.3 two op-amp instrumentation amplifier the two op-amp instrumentation amplifier shown in figure 3-12 serves the function of taking the difference of two input voltages, level shifting then and providing a single output. this configuration is best suited for higher gains. (gain > 3 v/v) is shown in figure 3-12. the key specifications that make the mcp606/607/ 608/609 family appropriate for this application circuit is low input bias current, low offset voltage and high com- mon-mode rejection. the reference voltage of this cir- cuit is supplied to the first op amp in the signal chain. typically, this voltage is half of the supply voltage in a single supply environment. figure 3-12: two op-amp instrumentation amplifier 3.6.4 three op-amp instrumentation amplifier a classic, three op amp instrumentation amplifier is illustrated in figure 3-15. the input operational amplifi- ers in this circuit provide signal gain. the output opera- tional amplifier converts the signal from two inputs to a single ended output with a difference amplifier. the gain of this circuit is simply adjusted with one resistor, r g . the reference voltage of the difference stage of this instrumentation amplifier is capable of spanning a wide range. most typically this node is referenced to half of the supply voltage in a signal supply application. figure 3-13: three op-amp instrumentation amplifier 3.6.5 precision gain with good load isolation in figure 3-14, the low input offset voltage of the mcp606 is used to implement a circuit with a high gain. this precision measurement can easily be disrupted by changing the output current drive of the device that is doing the amplification work. consequently the preci- sion amplifier configuration is followed by a mcp601 amplifier which is capable of driving higher currents. since the two amplifiers are housed in separate pack- ages, there is minimal change in offset voltage of the mcp606 due to loading effects. figure 3-14: precision gain with good load isolation * v out v 1 v 2 ? () 1 r 1 r 2 ------ - 2r 1 r g ---------- ++ ?? ?? v ref + = 1 / 2 1 / 2 r 1 v ref r 2 r g v dd r 1 r 2 v 2 v 1 mcp607 mcp607 v out *bypass capacitor, 0.1 f * * v out v 1 v 2 ? () 1 2r 2 r g ---------- + ?? ?? r 4 r 3 ------ - ?? ?? v ref r 4 r 3 ------ - ?? ?? + = 1 / 2 1 / 2 1 / 2 v 2 v s mcp607 r 3 r 4 v dd mcp607 v out r 4 v ref r g v 1 mcp607 r 2 r 2 r 3 *bypass capacitor, 1 f * * r 1 r 2 v s v out buffer v dd v in mcp606 precision amplifier + ? ? + mcp601 *bypass capacitor, 1 f
mcp606/607/608/609 ds11177b-page 16 ? 2000 microchip technology inc. 4.0 spice macromodel the spice macromodel for the mcp606, mcp607, mcp608 and mcp609 simulates the typical amplifier performance of offset voltage, dc power supply rejec- tion, input capacitance, dc common mode rejection ratio, open loop gain over frequency, phase margin with no capacitive load, output swing, dc power supply cur- rent, power supply current change with supply voltage, input common mode range and input voltage noise. the characteristics of the mcp606, mcp607, mcp608, and mcp609 amplifiers are similar in terms of performance and behavior. this single op amp mac- romodel supports all four devices with the exception of the chip select function of the mcp608, which is not modeled. the listing for this macromodel is shown on the next page. the most recent revision of the model can be downloaded from microchip ? s web site at ww w . m icro- chip.com .
? 2000 microchip technology inc. ds11177b-page 17 mcp606/607/608/609 software license agreement the software supplied herewith by microchip technology incorporated (the ? company ? ) for its picmicro ? microcontroller is intended and supplied to you, the company ? s customer, for use solely and exclusively on microchip picmicro microcontroller prod- ucts. the software is owned by the company and/or its supplier, and is protected under applicable copyright laws. all rights are rese rved. any use in violation of the foregoing restrictions may subject the user to criminal sanctions under applicable laws, as well as to civil liability for the breach of the terms and conditions of this license. this software is provided in an ? as is ? condition. no warranties, whether express, implied or statu- tory, including, but not limited to, implied warranties of merchantability and fitness for a particu- lar purpose apply to this software. the company shall not, in any circumstances, be liable for special, incidental or consequential damages, for any reason whatsoever. .subckt mcp606 1 2 3 4 5 * | | | | | * | | | | output * | | | negative supply * | | positive supply * | inverting input * non-inverting input * * macromodel for mcp606 (single), mcp607 (dual), mcp608 (single w/cs), and mcp609 (quad) * * the characteristics of the mcp606, mcp607, mcp608, and mcp609 have the same fundamental * performance and behavior. consequently, this single op amp macromodel supports all four * devices. however, the chip select function of the mcp608 is not modeled. * * revision history: * rev a : 6-30-99 created bcb * * this macromodel models typical amplifier offset voltage, dc power supply rejection, input * capacitance, open loop gain over frequency, phase margin with 60pf load, output swing, * power supply current, input voltage noise, slew rate. * * notice: the information provided herein is believed to be reliable, * however, microchip assumes no responsibility for inaccuracies or * omissions. microchip assumes no responsibility for the use of this * information, and all use of such information shall be entirely at * the user?s own risk. no intellectural property rights or licenses * to any of the tecnology described herein are implied or granted to * any third party. microchip reserves the right to change this model * at any time without notice. * * *input stage, pole at 300khz m1 9 64 7 3 ptype m2 8 2 7 3 ptype cdiff 1 2 3e-12 ccm1 1 4 6e-12 ccm2 2 4 6e-12 idd 3 7 13.33e-6 ra 8 6 1.839e3 rb 9 6 1.839e3 ca 8 9 125e-12 icomp 3 4 -194.63e-6 *input stage common-mode clampling vcmm 4 6 0.35 ecm 55 4 3 64 1 rcm 57 56 1e3 dcmp 56 55 dy vcmp 57 4 1.2 rst 58 59 1e3 dst 59 55 dx
mcp606/607/608/609 ds11177b-page 18 ? 2000 microchip technology inc. vst 58 4 1.6 gcmp2 23 4 poly(2) 57 56 58 59 0 0 0;0 -0.5e-3 0.5e-3 *input errors (vos, en, psr) err 64 1 poly(2) (67,4) (3, 4) -229.9e-6 1 23e-6 *second stage, pole at 0.183hz gs 23 4 8 9 543.78e-6 r1 23 4 8.2144e9 c2 23 4 110e-12 vsom 3 24 4.784 vsop 25 4 -3.98 dsom 23 24 dy dsop 25 23 dy *hcm 23 3 vcmp fs 3 4 poly(11) vo3 vo5 vo4 vo6 vo1 vo2 vo9 vo10 vmid1 vsop vsom + 200e-6 -1 -1 -1 1 -1 -1 1 1 -1 -1 -1 *mid-supply reference rmid1 3 35 61.62e3 vmid1 35 34 0 rmid2 4 34 61.62e3 elevel 34 4 23 4 -1 *output stage do3 34 43 dy do4 44 34 dy do5 3 45 dy do6 3 46 dy do7 4 45 dy do8 4 46 dy vo3 43 5 0.1 vo4 5 44 0.03 go5 3 47 3 34 10e-3 vo5 47 5 0 go6 4 48 34 4 10e-3 vo6 48 5 0 go1 49 4 5 34 10e-3 vo1 49 45 0 go2 50 4 34 5 10e-3 vo2 50 46 0 ro9 3 51 100 vo9 51 5 0 ro10 52 4 100 vo10 52 5 0 * input voltage noise vn1 65 4 0.6 dn1 65 67 dx rn1 67 4 10e3 .model ptype pmos l=2 w=105 .model dy d (is=1e-15 bv =50) .model dx d (is=1e-18 af=0.6 kf=10e-17) .ends
? 2000 microchip technology inc. ds11177b-page 19 mcp606/607/608/609 5.0 packaging information 5.1 package marking information xxxxxxxx xxxxxnnn yyww 8-lead pdip (300 mil) example 8-lead tssop example mcp606 xxxxxnnn 0025 8-lead soic (208 mil) example legend: xx...x customer specific information* yy year code (last 2 digits of calendar year) ww week code (week of january 1 is week ? 01 ? ) nnn alphanumeric traceability code note : in the event the full microchip part number cannot be marked on one line, it will be carried over to the next line thus limiting the number of available characters for customer specific information. * standard otp marking consists of microchip part number, year code, week code, facility code, mask rev#, and assembly code. for otp marking beyond this, certain price adders apply. please check with your microchip sales office. for qtp devices, any special marking adders are included in qtp price. xxxxxxx xxxyyww nnn mcp606 xxx0025 nnn xxxx yyww nnn xxxx 0025 nnn
mcp606/607/608/609 ds11177b-page 20 ? 2000 microchip technology inc. package marking information (continued) 14-lead pdip (300 mil) example 14-lead tssop example 14-lead soic (208 mil) example legend: xx...x customer specific information* yy year code (last 2 digits of calendar year) ww week code (week of january 1 is week ? 01 ? ) nnn alphanumeric traceability code note : in the event the full microchip part number cannot be marked on one line, it will be carried over to the next line thus limiting the number of available characters for customer specific information. * standard otp marking consists of microchip part number, year code, week code, facility code, mask rev#, and assembly code. for otp marking beyond this, certain price adders apply. please check with your microchip sales office. for qtp devices, any special marking adders are included in qtp price. xxxxxxxxxxxxxx xxxxxxxxxxxxxx yywwnnn mcp606 xxxxxxxxxxxxxx 0025nnn xxxxxxxxxx yywwnnn mcp606 0025nnn xxxxxx yyww nnn xxxxxx yyww nnn
? 2000 microchip technology inc. ds11177b-page 21 mcp606/607/608/609 8-lead plastic dual in-line (p) ? 300 mil (pdip) b1 b a1 a l a2 p e eb c e1 n d 1 2 units inches* millimeters dimension limits min nom max min nom max number of pins n 88 pitch p .100 2.54 top to seating plane a .140 .155 .170 3.56 3.94 4.32 molded package thickness a2 .115 .130 .145 2.92 3.30 3.68 base to seating plane a1 .015 0.38 shoulder to shoulder width e .300 .313 .325 7.62 7.94 8.26 molded package width e1 .240 .250 .260 6.10 6.35 6.60 overall length d .360 .373 .385 9.14 9.46 9.78 tip to seating plane l .125 .130 .135 3.18 3.30 3.43 lead thickness c .008 .012 .015 0.20 0.29 0.38 upper lead width b1 .045 .058 .070 1.14 1.46 1.78 lower lead width b .014 .018 .022 0.36 0.46 0.56 overall row spacing eb .310 .370 .430 7.87 9.40 10.92 mold draft angle top 51015 51015 mold draft angle bottom 51015 51015 * controlling parameter notes: dimensions d and e1 do not include mold flash or protrusions. mold flash or protrusions shall not exceed jedec equivalent: ms-001 drawing no. c04-018 .010 ? (0.254mm) per side. significant characteristic
mcp606/607/608/609 ds11177b-page 22 ? 2000 microchip technology inc. 8-lead plastic small outline (sn) ? narrow, 150 mil (soic) foot angle 048048 15 12 0 15 12 0 mold draft angle bottom 15 12 0 15 12 0 mold draft angle top 0.51 0.42 0.33 .020 .017 .013 b lead width 0.25 0.23 0.20 .010 .009 .008 c lead thickness 0.76 0.62 0.48 .030 .025 .019 l foot length 0.51 0.38 0.25 .020 .015 .010 h chamfer distance 5.00 4.90 4.80 .197 .193 .189 d overall length 3.99 3.91 3.71 .157 .154 .146 e1 molded package width 6.20 6.02 5.79 .244 .237 .228 e overall width 0.25 0.18 0.10 .010 .007 .004 a1 standoff 1.55 1.42 1.32 .061 .056 .052 a2 molded package thickness 1.75 1.55 1.35 .069 .061 .053 a overall height 1.27 .050 p pitch 8 8 n number of pins max nom min max nom min dimension limits millimeters inches* units 2 1 d n p b e e1 h l c 45 a2 a a1 * controlling parameter notes: dimensions d and e1 do not include mold flash or protrusions. mold flash or protrusions shall not exceed .010 ? (0.254mm) per side. jedec equivalent: ms-012 drawing no. c04-057 significant characteristic
? 2000 microchip technology inc. ds11177b-page 23 mcp606/607/608/609 8-lead plastic thin shrink small outline (st) ? 4.4 mm (tssop) 10 5 0 10 5 0 mold draft angle bottom 10 5 0 10 5 0 mold draft angle top 0.30 0.25 0.19 .012 .010 .007 b lead width 0.20 0.15 0.09 .008 .006 .004 c lead thickness 0.70 0.60 0.50 .028 .024 .020 l foot length 3.10 3.00 2.90 .122 .118 .114 d molded package length 4.50 4.40 4.30 .177 .173 .169 e1 molded package width 6.50 6.38 6.25 .256 .251 .246 e overall width 0.15 0.10 0.05 .006 .004 .002 a1 standoff 0.95 0.90 0.85 .037 .035 .033 a2 molded package thickness 1.10 .043 a overall height 0.65 .026 p pitch 8 8 n number of pins max nom min max nom min dimension limits millimeters* inches units a2 a a1 l c 1 2 d n p b e e1 foot angle 048048 * controlling parameter notes: dimensions d and e1 do not include mold flash or protrusions. mold flash or protrusions shall not exceed .005 ? (0.127mm) per side. jedec equivalent: mo-153 drawing no. c04-086 significant characteristic
mcp606/607/608/609 ds11177b-page 24 ? 2000 microchip technology inc. 14-lead plastic dual in-line (p) ? 300 mil (pdip) e1 n d 1 2 eb e c a a1 b b1 l a2 p units inches* millimeters dimension limits min nom max min nom max number of pins n 14 14 pitch p .100 2.54 top to seating plane a .140 .155 .170 3.56 3.94 4.32 molded package thickness a2 .115 .130 .145 2.92 3.30 3.68 base to seating plane a1 .015 0.38 shoulder to shoulder width e .300 .313 .325 7.62 7.94 8.26 molded package width e1 .240 .250 .260 6.10 6.35 6.60 overall length d .740 .750 .760 18.80 19.05 19.30 tip to seating plane l .125 .130 .135 3.18 3.30 3.43 lead thickness c .008 .012 .015 0.20 0.29 0.38 upper lead width b1 .045 .058 .070 1.14 1.46 1.78 lower lead width b .014 .018 .022 0.36 0.46 0.56 overall row spacing eb .310 .370 .430 7.87 9.40 10.92 mold draft angle top 5 10 15 5 10 15 5 10 15 5 10 15 mold draft angle bottom * controlling parameter notes: dimensions d and e1 do not include mold flash or protrusions. mold flash or protrusions shall not exceed .010 ? (0.254mm) per side. jedec equivalent: ms-001 drawing no. c04-005 significant characteristic
? 2000 microchip technology inc. ds11177b-page 25 mcp606/607/608/609 14-lead plastic small outline (sl) ? narrow, 150 mil (soic) foot angle 048048 15 12 0 15 12 0 mold draft angle bottom 15 12 0 15 12 0 mold draft angle top 0.51 0.42 0.36 .020 .017 .014 b lead width 0.25 0.23 0.20 .010 .009 .008 c lead thickness 1.27 0.84 0.41 .050 .033 .016 l foot length 0.51 0.38 0.25 .020 .015 .010 h chamfer distance 8.81 8.69 8.56 .347 .342 .337 d overall length 3.99 3.90 3.81 .157 .154 .150 e1 molded package width 6.20 5.99 5.79 .244 .236 .228 e overall width 0.25 0.18 0.10 .010 .007 .004 a1 standoff 1.55 1.42 1.32 .061 .056 .052 a2 molded package thickness 1.75 1.55 1.35 .069 .061 .053 a overall height 1.27 .050 p pitch 14 14 n number of pins max nom min max nom min dimension limits millimeters inches* units 2 1 d p n b e e1 h l c 45 a2 a a1 * controlling parameter notes: dimensions d and e1 do not include mold flash or protrusions. mold flash or protrusions shall not exceed .010 ? (0.254mm) per side. jedec equivalent: ms-012 drawing no. c04-065 significant characteristic
mcp606/607/608/609 ds11177b-page 26 ? 2000 microchip technology inc. 14-lead plastic thin shrink small outline (st) ? 4.4 mm (tssop) 8 4 0 8 4 0 foot angle 10 5 0 10 5 0 mold draft angle bottom 10 5 0 10 5 0 mold draft angle top 0.30 0.25 0.19 .012 .010 .007 b1 lead width 0.20 0.15 0.09 .008 .006 .004 c lead thickness 0.70 0.60 0.50 .028 .024 .020 l foot length 5.10 5.00 4.90 .201 .197 .193 d molded package length 4.50 4.40 4.30 .177 .173 .169 e1 molded package width 6.50 6.38 6.25 .256 .251 .246 e overall width 0.15 0.10 0.05 .006 .004 .002 a1 standoff 0.95 0.90 0.85 .037 .035 .033 a2 molded package thickness 1.10 .043 a overall height 0.65 .026 p pitch 14 14 n number of pins max nom min max nom min dimension limits millimeters* inches units l c 2 1 d n b p e1 e a2 a1 a * controlling parameter notes: dimensions d and e1 do not include mold flash or protrusions. mold flash or protrusions shall not exceed .005 ? (0.127mm) per side. jedec equivalent: mo-153 drawing no. c04-087 significant characteristic
? 2000 microchip technology inc. ds11177b-page 27 mcp606/607/608/609 on-line support microchip provides on-line support on the microchip world wide web (www) site. the web site is used by microchip as a means to make files and information easily available to customers. to view the site, the user must have access to the internet and a web browser, such as netscape or microsoft explorer. files are also available for ftp download from our ftp site. connecting to the microchip internet web site the microchip web site is available by using your favorite internet browser to attach to: www.microchip.com the file transfer site is available by using an ftp ser- vice to connect to: ftp://ftp.microchip.com the web site and file transfer site provide a variety of services. users may download files for the latest development tools, data sheets, application notes, user ? s guides, articles and sample programs. a vari- ety of microchip specific business information is also available, including listings of microchip sales offices, distributors and factory representatives. other data available for consideration is: latest microchip press releases technical support section with frequently asked questions design tips device errata job postings microchip consultant program member listing links to other useful web sites related to microchip products conferences for products, development systems, technical information and more listing of seminars and events systems information and upgrade hot line the systems information and upgrade line provides system users a listing of the latest versions of all of microchip's development systems software products. plus, this line provides information on how customers can receive any currently available upgrade kits.the hot line numbers are: 1-800-755-2345 for u.s. and most of canada, and 1-480-786-7302 for the rest of the world. trademarks: the microchip name, logo, pic, picmicro, picstart, picmaster, pro mate and mplab are registered trademarks of microchip technology incorpo- rated in the u.s.a. and other countries. flex rom and fuzzy lab are trademarks and sqtp is a service mark of microchip in the u.s.a. all other trademarks mentioned herein are the property of their respective companies. 991103
mcp606/607/608/609 ds11177b-page 28 ? 2000 microchip technology inc. reader response it is our intention to provide you with the best documentation possible to ensure successful use of your microchip prod- uct. if you wish to provide your comments on organization, clarity, subject matter, and ways in which our documentation can better serve you, please fax your comments to the technical publications manager at (480) 786-7578. please list the following information, and use this outline to provide us with your comments about this data sheet. to : technical publications manager re: reader response total pages sent from: name company address city / state / zip / country telephone: (_______) _________ - _________ application (optional): would you like a reply? y n device: literature number: questions: fax: (______) _________ - _________ ds11177b mcp606/607/608/609 1. what are the best features of this document? 2. how does this document meet your hardware and software development needs? 3. do you find the organization of this data sheet easy to follow? if not, why? 4. what additions to the data sheet do you think would enhance the structure and subject? 5. what deletions from the data sheet could be made without affecting the overall usefulness? 6. is there any incorrect or misleading information (what and where)? 7. how would you improve this document? 8. how would you improve our software, systems, and silicon products?
? 2000 microchip technology inc. ds11177b-page 29 mcp606/607/608/609 notes:
mcp606/607/608/609 ds11177b-page 30 ? 2000 microchip technology inc. notes:
? 2000 microchip technology inc. ds11177b-page 31 mcp606/607/608/609 mcp606/607/608/609 product identification system to order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. sales and support package: p = plastic dip (300 mil body), 8-lead and 14-lead sn = plastic soic (150 mil body), 8-lead sl = plastic soic (150 mil body), 14-lead st = plastic tssop, 8-lead and 14-lead temperature range: i = ? 40 c to +85 c device: mcp606 = single operational amplifier mcp606t = single operational amplifier (tape and reel-soic/tssop) mcp607 = dual operational amplifier mcp607t = dual operational amplifier (tape and reel-soic/tssop) mcp608 = single operational amplifier w/cs function mcp608t = single operational amplifier w/cs function (tape and reel-soic/tssop) mcp609 = quad operational amplifier mcp609t = quad operational amplifier (tape and reel-soic/tssop) part number x /x data sheets products supported by a preliminary data sheet may have an errata sheet describing minor operational differences and recommended workarounds. to determine if an errata sheet exists for a particular device, please contact one of the following: 1. your local microchip sales office 2. the microchip corporate literature center u.s. fax: (480) 786-7277 3. the microchip worldwide site (www.microchip.com) please specify which device, revision of silicon and data sheet (include literature #) you are using. new customer notification system register on our web site (www.microchip.com/cn) to receive the most current information on our products.
information contained in this publication regarding device applications and the like is intended through suggestion only and ma y be superseded by updates. it is your responsibility to ensure that your application meets with your specifications. no representation or warranty is give n and no liability is assumed by microchip technology incorporated with respect to the accuracy or use of such information, or infringement of patents or other intellectual property rights arising from such use or otherwise. use of microchip ? s products as critical components in life support systems is not authorized except with express written approval by microchip. no licenses are conveyed, implicitly or otherwise, except as maybe explicitly expressed herein, under an y intellectual property rights. the microchip logo and name are registered trademarks of microchip technology inc. in the u.s.a. and other countries. a ll rights reserved. all other trademarks mentioned herein are the property of their respective companies. ds11177b-page 32 ? 2000 microchip technology inc. all rights reserved. ? 2000 microchip technology incorporated. printed in the usa. 7/00 printed on recycled paper. americas corporate office microchip technology inc. 2355 west chandler blvd. chandler, az 85224-6199 tel: 480-786-7200 fax: 480-786-7277 technical support: 480-786-7627 web address: http://www.microchip.com atlanta microchip technology inc. 500 sugar mill road, suite 200b atlanta, ga 30350 tel: 770-640-0034 fax: 770-640-0307 boston microchip technology inc. 2 lan drive, suite 120 westford, ma 01886 tel: 508-480-9990 fax: 508-480-8575 chicago microchip technology inc. 333 pierce road, suite 180 itasca, il 60143 tel: 630-285-0071 fax: 630-285-0075 dallas microchip technology inc. 4570 westgrove drive, suite 160 addison, tx 75001 tel: 972-818-7423 fax: 972-818-2924 dayton microchip technology inc. two prestige place, suite 150 miamisburg, oh 45342 tel: 937-291-1654 fax: 937-291-9175 detroit microchip technology inc. tri-atria office building 32255 northwestern highway, suite 190 farmington hills, mi 48334 tel: 248-538-2250 fax: 248-538-2260 los angeles microchip technology inc. 18201 von karman, suite 1090 irvine, ca 92612 tel: 949-263-1888 fax: 949-263-1338 new york microchip technology inc. 150 motor parkway, suite 202 hauppauge, ny 11788 tel: 631-273-5305 fax: 631-273-5335 san jose microchip technology inc. 2107 north first street, suite 590 san jose, ca 95131 tel: 408-436-7950 fax: 408-436-7955 americas (continued) toronto microchip technology inc. 5925 airport road, suite 200 mississauga, ontario l4v 1w1, canada tel: 905-405-6279 fax: 905-405-6253 asia/pacific china - beijing microchip technology, beijing unit 915, 6 chaoyangmen bei dajie dong erhuan road, dongcheng district new china hong kong manhattan building beijing, 100027, p.r.c. tel: 86-10-85282100 fax: 86-10-85282104 china - shanghai microchip technology unit b701, far east international plaza, no. 317, xianxia road shanghai, 200051, p.r.c. tel: 86-21-6275-5700 fax: 86-21-6275-5060 hong kong microchip asia pacific unit 2101, tower 2 metroplaza 223 hing fong road kwai fong, n.t., hong kong tel: 852-2-401-1200 fax: 852-2-401-3431 india microchip technology inc. india liaison office no. 6, legacy, convent road bangalore, 560 025, india tel: 91-80-229-0061 fax: 91-80-229-0062 japan microchip technology intl. inc. benex s-1 6f 3-18-20, shinyokohama kohoku-ku, yokohama-shi kanagawa, 222-0033, japan tel: 81-45-471- 6166 fax: 81-45-471-6122 korea microchip technology korea 168-1, youngbo bldg. 3 floor samsung-dong, kangnam-ku seoul, korea tel: 82-2-554-7200 fax: 82-2-558-5934 asia/pacific (continued) singapore microchip technology singapore pte ltd. 200 middle road #07-02 prime centre singapore, 188980 tel: 65-334-8870 fax: 65-334-8850 taiwan microchip technology taiwan 10f-1c 207 tung hua north road taipei, taiwan tel: 886-2-2717-7175 fax: 886-2-2545-0139 europe denmark microchip technology denmark aps regus business centre lautrup hoj 1-3 ballerup dk-2750 denmark tel: 45 4420 9895 fax: 45 4420 9910 france arizona microchip technology sarl parc d ? activite du moulin de massy 43 rue du saule trapu batiment a - ler etage 91300 massy, france tel: 33-1-69-53-63-20 fax: 33-1-69-30-90-79 germany arizona microchip technology gmbh gustav-heinemann-ring 125 d-81739 m nchen, germany tel: 49-89-627-144 0 fax: 49-89-627-144-44 italy arizona microchip technology srl centro direzionale colleoni palazzo taurus 1 v. le colleoni 1 20041 agrate brianza milan, italy tel: 39-039-65791-1 fax: 39-039-6899883 united kingdom arizona microchip technology ltd. 505 eskdale road winnersh triangle wokingham berkshire, england rg41 5tu tel: 44 118 921 5858 fax: 44-118 921-5835 05/16/00 w orldwide s ales and s ervice microchip received qs-9000 quality system certification for its worldwide headquarters, design and wafer fabrication facilities in chandler and tempe, arizona in july 1999. the company?s quality system processes and procedures are qs-9000 compliant for its picmicro ? 8-bit mcus, k ee l oq ? code hopping devices, serial eeproms and microperipheral products. in addition, microchip ? s quality system for the design and manufacture of development systems is iso 9001 certified.

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