description this series of right angle mount chipleds is designed with the smallest footprint to achieve high density of components on board. they have the industry standard footprint of 1.6 mm x 1.0 mm and a height of only 0.6 mm. this makes them very suitable for cellular phone and mobile equipment backlighting and agilent hsma/c/l-c120, hsmd/g/s/h-c120, hsmm/n/q/r-c120 right angle chipled data sheet features ? small size right angle mount ? 0603 industry standard footprint ? operating temperature range of C30?c to +85?c ? available in various colors ? compatible with ir solder reflow ? available in 8 mm tape on 7" diameter reel ? reel sealed in zip locked moisture barrier bags applications ? lcd backlighting ? keypad backlighting ? pushbutton backlighting ? symbol indicator caution : hsmm/n/q/r-c120 leds are class 1 esd sensitive per mil-std-1686. please observe appropriate precautions during handling and processing. refer to agilent technologies application note an-1142 for additional details. indication application where space is a constraint. they are available in a wide range of color combination. in order to facilitate automated pick and place operation, these chipleds are shipped in tape and reel, with 4000 units per reel. these parts are compatible with ir soldering.
2 package dimensions device selection guide as alingap ingan amber red orange green blue package description HSMA-C120 hsmc-c120 hsml-c120 hsmm-c120 hsmn-c120 untinted, hsmq-c120 hsmr-c120 non diffused algaas gap red green orange her package description hsmh-c120 hsmg-c120 hsmd-c120 hsms-c120 untinted, non diffused 1.6 (0.063) 0.4 (0.016) polarity [3] cathode mark
(anode mark for hsmh-c120) 1.0 (0.039) 3 ?0.3 (0.012) 1.2 (0.047) 0.3 (0.012) led die clear
epoxy pc board soldering
terminal 0.6 (0.024) cathode line notes:
1. all dimensions in millimeters (inches).
2. tolerance is ?0.1 mm (?0.004 in.) unless otherwise specified.
3. polarity for hsmh-c120 will be the opposite of what is shown on above drawing.
3 absolute maximum ratings at t a = 25?c hsma/c/l- hsmd/g/s- hsmh- hsmm/n- hsmq/r- parameter c120 c120 c120 c120 c120 units dc forward current [1] [2] 25 20 25 20 20 ma power dissipation 60 52 65 78 78 mw reverse voltage (i r = 100 m a)555 55v led junction temperature 95 95 95 95 95 ?c operating temperature range C30 to +85 ?c storage temperature range C40 to +85 ?c soldering temperature see ir soldering profile (figure 6) notes: 1. derate linearly as shown in figure 4. 2. drive currents above 5 ma are recommended for best long term performance. electrical characteristics at t a = 25?c forward reverse voltage breakdown capacitance c thermal v f (volts) v r (volts) (pf), v f = 0, resistance @ i f = 20 ma @ i r = 100 m a f = 1 mhz r q j-pin (?c/w) part number typ. max. min. typ. typ. HSMA-C120 1.9 2.4 5 11 400 hsmc-c120 1.9 2.4 5 15 400 hsml-c120 1.9 2.4 5 20 400 hsmd-c120 2.2 2.6 5 7 350 hsmg-c120 2.2 2.6 5 9 350 hsms-c120 2.1 2.6 5 5 350 hsmh-c120 1.8 2.6 5 20 400 hsmm-c120 3.4 3.9 5 45 450 hsmn-c120 3.4 3.9 5 45 450 hsmq-c120 3.4 3.9 5 100 450 hsmr-c120 3.4 3.9 5 100 450 note: 1. v f tolerance: 0.1 v
4 color bin limits [1] green color bins dom. wavelength (nm) bin id min. max. a 561.5 564.5 b 564.5 567.5 c 567.5 570.5 d 570.5 573.5 e 573.5 576.5 tolerance: 0.5 nm light intensity (i v ) bin limits [1] intensity (mcd) bin id min. max. a 0.11 0.18 b 0.18 0.29 c 0.29 0.45 d 0.45 0.72 e 0.72 1.10 f 1.10 1.80 g 1.80 2.80 h 2.80 4.50 j 4.50 7.20 k 7.20 11.20 l 11.20 18.00 m 18.00 28.50 n 28.50 45.00 p 45.00 71.50 q 71.50 112.50 r 112.50 180.00 s 180.00 285.00 t 285.00 450.00 u 450.00 715.00 tolerance: 15% optical characteristics at t a = 25?c luminous intensity peak dominant luminous i v (mcd) wavelength wavelength viewing angle efficacy @ 20 ma [1] l peak [2] (nm) l d [2] (nm) 2 q 1/2 degrees [3] h v (lm/w) part number min. typ. typ. typ. typ. typ. HSMA-C120 25 90 595 592 155 480 hsmc-c120 25 90 637 626 155 155 hsml-c120 25 90 609 605 155 370 hsmd-c120 2.5 8 605 604 155 380 hsmg-c120 4.0 15 570 572 155 595 hsms-c120 2.5 10 630 626 155 145 hsmh-c120 4.0 15 660 639 155 70 hsmm-c120 40 120 523 525 155 490 hsmn-c120 10 30 468 470 155 80 hsmq-c120 40 145 520 527 155 500 hsmr-c120 16 55 469 473 155 85 notes: 1.the luminous intensity i v is measured at the peak of the spatial radiation pattern which may not be aligned with the mechanical axis of the lamp package. 2.the coordinate is derived from the cie chromatically diagram and represents the perceived color of the device. 3. q 1/2 is the off-axis angle where the luminous intensity is 1/2 the peak intensity. yellow/amber color bins dom. wavelength (nm) bin id min. max. a 582.0 584.5 b 584.5 587.0 c 587.0 589.5 d 589.5 592.0 e 592.0 594.5 f 594.5 597.0 tolerance: 0.5 nm blue color bins dom. wavelength (nm) bin id min. max. a 460.0 465.0 b 465.0 470.0 c 470.0 475.0 d 475.0 480.0 tolerance: 1 nm ingan green color bins dom. wavelength (nm) bin id min. max. a 515.0 520.0 b 520.0 525.0 c 525.0 530.0 d 530.0 535.0 tolerance: 1 nm
5 figure 1. relative intensity vs. wavelength. figure 2. forward current vs. forward voltage. color bin limits orange color bins dom. wavelength (nm) bin id min. max. a 597.0 600.0 b 600.0 603.0 c 603.0 606.0 d 606.0 609.0 e 609.0 612.0 f 612.0 615.0 tolerance: 1 nm notes: 1.bin categories are established for classification of products. products may not be available in all categories. please contact your agilent representative for information on currently available bins. 100 50 0 500 550 600 650 700 750 relative intensity ?% wavelength - nm gap green 90 80 70 60 40 30 20 10 gap orange her algaas red 100 50 0 400 450 550 600 650 700 relative intensity ?% wavelength - nm ingan blue 90 80 70 60 40 30 20 10 as orange 500 ingan green as amber as red gap orange 100 10 1 0.1 1.5 1.6 2.0 2.3 v f ?forward voltage ?v i f ?forward current ?ma as allngap 1.7 1.8 1.9 2.1 2.2 algaas her gap green 100 10 1 0.1 1.5 2.0 4.0 v f ?forward voltage ?v i f ?forward current ?ma hsmm,
hsmn ingan 2.5 3.0 3.5 hsmq,
hsmr ingan
6 figure 4. maximum forward current vs. ambient temperature. figure 3. luminous intensity vs. forward current. 0 5 15 25 i f ?forward current ?ma 0 0.4 1.0 1.2 luminous intensity
(normalized at 20 ma) 20 as alingap 0.6 0.8 0.2 10 gap algaas 0 5 15 25 i f ?forward current ?ma 0 0.4 1.0 1.2 luminous intensity
(normalized at 20 ma) 20 0.6 0.8 0.2 10 hsmq,
hsmr ingan hsmm,
hsmn ingan alingap
algaas gap 0 102030405060708090 t a ?ambient temperature ?? 30 25 20 15 10 5 0 i f max. ?maximum forward current ?ma hsmq,
hsmr ingan hsmm,
hsmn ingan 0 102030405060708090 t a ?ambient temperature ?? 25 20 15 10 5 0 i f max. ?maximum forward current ?ma
7 figure 5. relative intensity vs. angle. figure 6. recommended reflow soldering profile. figure 7. recommended soldering pattern. note: all dimensions in millimeters (inches). 100 90 80 70 60 50 40 30 20 10 0 relative intensity -90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 angle 100 90 80 70 60 50 40 30 20 10 0 relative intensity -90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 angle 230? max. 10 sec. max. 4?/sec.
max. over 2 min. time temperature 140-160? ??/sec. max. 4?/sec. max. 0.7 (0.028) 0.8
(0.031) 0.8
(0.031) 1.2
(0.047) 0.4 (0.016) 0.15 (0.006) 0.4 (0.016) centering
board
8 figure 8. reeling orientation. figure 9. reel dimensions. x x x x x x x x x x x x x x x x x x x x cathode side printed label user feed direction x x x x x 10.50 ?1.0 (0.413 ?0.039) 59.60 ?1.00
(2.346 ?0.039) ? 20.20 min.
( ? 0.795 min.) 6 ps 178.40 ?1.00
(7.024 ?0.039) 3.0 ?0.5
(0.118 ?0.020) 4.0 ?0.5
(0.157 ?0.020) 5.0 ?0.5
(0.197 ?0.020) ? 13.1 ?0.5
( ? 0.516 ?0.020) 8.0 ?1.0 (0.315 ?0.039) note: all dimensions in millimeters (inches).
9 figure 10. tape dimensions. figure 11. tape leader. 8.0 ?0.30
(0.315 ?0.012) user feed
direction dim. a
(see table 1) 3.5 ?0.05
(0.138 ?0.002) 1.75 (0.069) dim. c
(see table 1) 0.20 ?0.05
(0.008 ?0.002) carrier tape dim. b
(see table 1) 4.0 (0.157) 4.0 (0.157) ? 1.50 (0.059) table 1
dimensions in millimeters (inches) cathode dim. a
?0.10 (0.004) dim. b
?0.10 (0.004) part number dim. c
?0.10 (0.004) hsmx-c120 series 1.90 (0.075) 1.15 (0.045) 0.75 (0.030) cover tape r 0.5 ?0.05
(0.020 ?0.002) 2.00 ?0.05
(0.079 ?0.002) end start there shall be a minimum
of 160 mm (6.3 inches) of
empty component pockets
sealed with cover tape. mounted with
components. minimum of
230 mm (9.05 in.)
may consist
of carrier
and/or
cover tape. there shall be a minimum
of 160 mm (6.3 inches) of
empty component pockets
sealed with cover tape. notes: 1. all dimensions in millimeters (inches). 2. tolerance is 0.1 mm ( 0.004 in.) unless otherwise specified. convective ir reflow soldering for more information on ir reflow soldering, refer to application note 1060, surface mounting smt led indicator components. storage condition: 5 to 30?c @ 60% rh max. baking is required under the condition: a) the blue silica gel indicator becoming white/transparent color b) the pack has been opened for more than 1 week baking recommended condition: 60 +/C 5?c for 20 hours.
www.agilent.com/semiconductors for product information and a complete list of distributors, please go to our web site. for technical assistance call: americas/canada: +1 (800) 235-0312 or (408) 654-8675 europe: +49 (0) 6441 92460 china: 10800 650 0017 hong kong: (+65) 6271 2451 india, australia, new zealand: (+65) 6271 2394 japan: (+81 3) 3335-8152(domestic/interna- tional), or 0120-61-1280(domestic only) korea: (+65) 6271 2194 malaysia, singapore: (+65) 6271 2054 taiwan: (+65) 6271 2654 data subject to change. copyright ? 2002 agilent technologies, inc. april 6, 2002 5988-5401en
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