specifications and information are subject to change without notice wj communications, inc ? phone 1-800-wj1-4401 ? fax: 408-577-6621 ? e-mail: sales@wj.com ? web site: www.wj.com page 1 of 6 june 2005 AG203-86 ingap hbt gain block product information product features ? dc ? 6000 mhz ? +8 dbm p1db at 900 mhz ? +21 dbm oip3 at 900 mhz ? 19.5 db gain at 900 mhz ? single voltage supply ? green sot-86 smt package ? internally matched to 50 ? applications ? mobile infrastructure ? catv / dbs ? w-lan / ism ? rfid ? defense / homeland security ? fixed wireless product description the AG203-86 is a general-purpose buffer amplifier that offers high dynamic range in a low-cost surface-mount package. at 900 mhz, the AG203-86 typically provides 19.5 db gain, +21 dbm oip3, and +8 dbm p1db. the device combines dependable performance with consistent quality to maintain mttf values exceeding 100 years at mounting temperatures of +85 c & is housed in a sot-86 (micro-x) industry-standard smt lead-free/green/rohs-compliant package. the AG203-86 consists of darlington pair amplifiers using the high reliability ingap/gaas hbt process technology and only requires dc-blocking capacitors, a bias resistor, and an inductive rf choke for operation. the broadband mmic amplifier can be directly applied to various current and next generation wireless technologies such as gprs, gsm, cdma, and w-cdma. in addition, the AG203-86 will work for other various applications within the dc to 6 ghz frequency range such as catv and fixed wireless. functional diagram function pin no. input 1 output/bias 3 ground 2, 4 specifications (1) parameter units min typ max operational bandwidth mhz dc 6000 test frequency mhz 900 gain db 19.4 input return loss db 25 output return loss db 15 output ip3 (2) dbm +20.8 output ip2 dbm +25 output p1db dbm +8.0 noise figure db 3.1 test frequency mhz 1900 gain db 16.2 17.2 18.2 output ip3 (2) dbm +20.7 output p1db dbm +7.3 device voltage v 4.05 device current ma 20 1. test conditions: 25o c, supply voltage = +5 v, r bias = 47.5 ? , 50 ? system. 2. 3oip measured with two tones at an output power of -10 dbm/tone separated by 10 mhz. the suppression on the largest im3 product is used to calculate the 3oip using a 2:1 rule. absolute maximum rating parameter rating operating case temperature -40 to +85 c storage temperature -55 to +125 c dc voltage +4.5 v rf input power (continuous) +10 dbm junction temperature +250 c operation of this device above any of these parameters may cause permanent damage. typical performance (1) parameter units typical frequency mhz 500 900 1900 2140 s21 db 20 19.4 17.2 16.6 s11 db -25 -25 -20 -16 s22 db -15 -15 -15 -15 output p1db dbm +8.1 +8.0 +7.3 +7.2 output ip3 dbm +20.8 +20.8 +20.7 +20.5 noise figure db 3.1 3.1 3.3 3.3 ordering information part no. description AG203-86* ingap hbt gain block (lead-tin sot-86 pkg) AG203-86g ingap hbt gain block (lead-free/green/rohs-compliant sot-86 pkg) AG203-86pcb 700 ? 2400 mhz fully assembled eval. board * this package is being phased out in favor of the green package type which is backwards compatible for existing designs. refer to product change notification wjpcn06may05tc1 on the wj website. rf out rf in gnd gnd 1 2 3 4
specifications and information are subject to change without notice wj communications, inc ? phone 1-800-wj1-4401 ? fax: 408-577-6621 ? e-mail: sales@wj.com ? web site: www.wj.com page 2 of 6 june 2005 AG203-86 ingap hbt gain block product information typical device rf performance supply bias = +5 v, r bias = 47.5 ? ? ? ? , i cc = 20 ma frequency mhz 100 500 900 1900 2140 2400 3500 5800 s21 db 20.2 20.0 19.4 17.2 16.6 16.0 14.1 10.7 s11 db -20 -25 -25 -20 -16 -16 -16 -16 s22 db -13 -15 -15 -15 -15 -14 -18 -15 output p1db dbm +8.2 +8.1 +8.0 +7.3 +7.2 +7.2 +6.5 output ip3 dbm +21.0 +20.8 +20.8 +20.7 +20.5 +20.3 noise figure db 3.1 3.1 3.1 3.3 3.3 3.4 1. test conditions: t = 25o c, supply voltage = +5 v, device voltage = 4.05 v, rbias = 47.5 ? , icc = 20 ma typical, 50 ? system. 2. 3oip measured with two tones at an output power of -10 dbm/tone separated by 10 mhz. the suppression on the largest im3 pro duct is used to calculate the 3oip using a 2:1 rule. 3. data is shown as device performance only. actual implementation for the desired frequency band will be determined by exter nal components shown in the application circuit. gain vs. frequency 12 14 16 18 20 22 01234 frequency (ghz) gain (db) -40 c +25 c +85 c return loss -40 -30 -20 -10 0 0123456 frequency (ghz) s11, s22 ( db ) s11 s22 i-v curve 0 10 20 30 40 3.0 3.5 4.0 4.5 device voltage (v) device current ( ma ) optimal operating point output ip3 vs. frequency 5 10 15 20 25 00.511.522.53 frequency (ghz) oip3 ( dbm ) -40 c +25 c +85 c output ip2 vs. frequency 15 20 25 30 35 0 200 400 600 800 1000 frequency (mhz) oip2 ( dbm ) -40c +25c +85c noise figure vs. frequency 0 1 2 3 4 5 00.511.522.53 frequency (ghz) nf (db) -40 c +25 c +85 c p1db vs. frequency -10 -5 0 5 10 00.511.522.533.54 frequency (ghz) p1db ( dbm ) -40 c +25 c +85 c output power / gain vs. input power frequency = 900 mhz 10 12 14 16 18 20 -20 -16 -12 -8 -4 0 4 input power (dbm) gain (db) -4 0 4 8 12 16 output power (dbm) output power gain output power / gain vs. input power frequency = 2000 mhz 6 8 10 12 14 16 -20 -16 -12 -8 -4 0 4 input power (dbm) gain (db) -6 -2 2 6 10 14 output power (dbm) output power gain
specifications and information are subject to change without notice wj communications, inc ? phone 1-800-wj1-4401 ? fax: 408-577-6621 ? e-mail: sales@wj.com ? web site: www.wj.com page 3 of 6 june 2005 AG203-86 ingap hbt gain block product information typical device rf performance (cont?d) supply bias = +6 v, r bias = 98 ? ? ? ? , i cc = 20 ma gain vs. frequency 12 14 16 18 20 22 01234 frequency (ghz) gain (db) -40 c +25 c +85 c output ip3 vs. frequenc y 5 10 15 20 25 00.511.522.53 frequency (ghz) oip3 ( dbm ) -40 c +25 c +85 c output ip2 vs. frequenc y 15 20 25 30 35 0 200 400 600 800 1000 frequency (mhz) oip2 ( dbm ) -40c +25c +85c p1db vs. frequency -10 -5 0 5 10 00.511.522.533.54 frequency (ghz) p1db ( dbm ) -40 c +25 c +85 c noise figure vs. frequency 0 1 2 3 4 5 00.511.522.53 frequency (ghz) nf (db) -40 c +25 c +85 c typical device rf performance supply bias = +8 v, r bias = 198 ? ? ? ? , i cc = 20 ma gain vs. frequency 12 14 16 18 20 22 01234 frequency (ghz) gain (db) -40 c +25 c +85 c output ip3 vs. frequenc y 5 10 15 20 25 00.511.522.53 frequency (ghz) oip3 ( dbm ) -40 c +25 c +85 c output ip2 vs. frequenc y 15 20 25 30 35 0 200 400 600 800 1000 frequency (mhz) oip2 ( dbm ) +85c +25c -40c p1db vs. frequency -10 -5 0 5 10 00.511.522.533.54 frequency (ghz) p1db ( dbm ) -40 c +25 c +85 c noise figure vs. frequency 0 1 2 3 4 5 00.511.522.53 frequency (ghz) nf (db) -40 c +25 c +85 c
specifications and information are subject to change without notice wj communications, inc ? phone 1-800-wj1-4401 ? fax: 408-577-6621 ? e-mail: sales@wj.com ? web site: www.wj.com page 4 of 6 june 2005 AG203-86 ingap hbt gain block product information application circuit recommended component values reference frequency (mhz) designator 50 500 900 1900 2200 2500 3500 l1 820 nh 220 nh 68 nh 27 nh 22 nh 18 nh 15 nh c1, c2, c4 .018 f 1000 pf 100 pf 68 pf 68 pf 56 pf 39 pf 1. the proper values for the components are dependent upon the intended frequency of operation. 2. the following values are contained on the evaluation board to achieve optimal broadband performance: ref. desig. value / type size l1 39 nh wirewound inductor 0603 c1, c2 56 pf chip capacitor 0603 c3 0.018 f chip capacitor 0603 c4 do not place r1 47.5 ? 1% tolerance 0603 recommended bias resistor values supply voltage r1 value size 5 v 47.5 ohms 0603 6 v 98 ohms 0603 7 v 148 ohms 0805 8 v 198 ohms 0805 9 v 248 ohms 1206 10 v 298 ohms 1210 12 v 398 ohms 1210 the proper value for r1 is dependent upon the supply voltage and allows for bias stability over temperature. wj recommends a minimum supply bias of +5 v. a 1% tolerance resistor is recommended. typical device data s-parameters (v device = +4.05 v, i cc = 20 ma, t = 25 c, calibrated to device leads. freq (mhz) s11 (db) s11 (ang) s21 (db) s21 (ang) s12 (db) s12 (ang) s22 (db) s22 (ang) 50 -22.84 -0.07 20.75 177.32 -23.39 0.76 -13.40 -3.20 250 -23.86 9.00 20.67 166.89 -23.73 2.56 -13.66 -11.48 500 -27.29 28.82 20.50 153.87 -23.63 1.56 -15.89 -24.47 750 -26.07 34.92 20.14 141.62 -23.52 1.40 -16.64 -41.51 1000 -25.11 29.08 19.67 129.97 -23.71 -0.82 -17.55 -58.52 1250 -22.93 24.43 19.20 118.62 -22.95 0.96 -17.47 -77.84 1500 -22.25 14.88 18.61 108.25 -23.00 -0.16 -17.07 -93.14 1750 -20.95 2.45 18.05 98.43 -22.57 1.41 -16.20 -104.31 2000 -19.51 -8.95 17.41 89.13 -22.18 2.42 -15.55 -110.13 2250 -16.43 -13.31 16.82 81.09 -21.84 -1.23 -13.16 -105.60 2500 -16.78 -23.33 16.42 75.17 -22.12 -6.06 -13.53 -109.50 2750 -16.30 -34.19 15.94 66.69 -21.11 -6.07 -14.17 -114.41 3000 -16.36 -40.45 15.44 59.03 -20.69 -4.81 -15.24 -120.33 3250 -17.08 -46.15 15.04 51.80 -20.33 -6.56 -16.92 -126.45 3500 -18.26 -50.28 14.61 44.52 -19.98 -9.18 -19.42 -142.16 3750 -20.54 -49.45 14.22 37.06 -19.86 -14.94 -22.27 -170.32 4000 -24.06 -47.33 13.82 29.86 -19.34 -14.68 -21.48 152.21 4250 -26.27 -34.92 13.42 22.90 -18.89 -20.14 -19.26 128.72 4500 -28.81 -7.87 12.97 15.72 -18.65 -21.13 -17.44 118.35 4750 -29.10 4.10 12.58 8.48 -18.33 -26.55 -15.98 114.86 5000 -29.66 -6.98 12.26 1.83 -17.90 -29.89 -14.84 117.23 5250 -27.47 -47.93 11.89 -4.38 -17.79 -34.21 -15.32 122.63 5500 -23.43 -76.94 11.53 -10.48 -17.36 -36.99 -15.49 131.30 5750 -20.02 -92.84 11.26 -16.74 -17.43 -39.01 -15.72 145.53 6000 -17.60 -100.20 10.98 -22.74 -17.06 -44.67 -15.62 155.14 device s-parameters are available for download off of the website at: http://www.wj.com c1 blocking capacitor rf out l1 rf choke c3 0.018 f r1 bias resistor rf in c4 bypass capacito r c2 blocking ca p acito r vcc icc = 20 ma AG203-86
specifications and information are subject to change without notice wj communications, inc ? phone 1-800-wj1-4401 ? fax: 408-577-6621 ? e-mail: sales@wj.com ? web site: www.wj.com page 5 of 6 june 2005 AG203-86 ingap hbt gain block product information AG203-86 (sot-86 package) mechanical information this package may contain lead-bearing materials. the plating material on the leads is snpb. outline drawing land pattern thermal specifications parameter rating operating case temperature -40 to +85 c thermal resistance, rth (1) 457 c/w junction temperature, tjc (2) 122 c 1. the thermal resistance is referenced from the hottest part of the junction to the ground lead (pin 2 or 4). 2. this corresponds to the typical biasing condition of +4.05v, 20 ma at an 85 c case temperature. a minimum mttf of 1 million hours is achieved for junction temperatures below 177 c. product marking the component will be marked with a ?c? designator followed by a two-digit numeric lot code on the top surface of the package. tape and reel specifications for this part are located on the website in the ?application notes? section. msl / esd rating esd rating: class 0 value: passes at 150 v test: human body model (hbm) standard: jedec standard jesd22-a114 esd rating: class ii value: passes at 250 v test: charged device model (cdm) standard: jedec standard jesd22-c101 msl rating: level 1 standard: jedec standard j-std-020 mounting config. notes 1. ground / thermal vias are critical for the proper performance of this device. vias should use a .35mm (#80 / .0135?) diameter drill and have a final plated thru diameter of .25 mm (.010?). 2. add as much copper as possible to inner and outer layers near the part to ensure optimal thermal performance. 3. mounting screws can be added near the part to fasten the board to a heatsink. ensure that the ground / thermal via region contacts the heatsink. 4. do not put solder mask on the backside of the pc board in the region where the board contacts the heatsink. 5. rf trace width depends upon the pc board material and construction. 6. use 1 oz. copper minimum. 7. all dimensions are in millimeters (inches). angles are in degrees.
specifications and information are subject to change without notice wj communications, inc ? phone 1-800-wj1-4401 ? fax: 408-577-6621 ? e-mail: sales@wj.com ? web site: www.wj.com page 6 of 6 june 2005 AG203-86 ingap hbt gain block product information AG203-86g (green / lead-free sot-86 package) mechanical information this package is lead-free/green/rohs-compliant. it is compatible with both lead-free (maximum 260 c reflow temperature) and leaded (maximum 245 c reflow temperature) soldering processes. the plating material on the pins is annealed matte tin over copper. outline drawing land pattern thermal specifications parameter rating operating case temperature -40 to +85 c thermal resistance, rth (1) 457 c/w junction temperature, tjc (2) 122 c 1. the thermal resistance is referenced from the hottest part of the junction to the ground lead (pin 2 or 4). 2. this corresponds to the typical biasing condition of +4.05v, 20 ma at an 85 c case temperature. a minimum mttf of 1 million hours is achieved for junction temperatures below 177 c. product marking the component will be marked with a ?n? designator followed by a two-digit numeric lot code on the top surface of the package. tape and reel specifications for this part are located on the website in the ?application notes? section. msl / esd rating esd rating: class 1c value: passes at 1000 v min. test: human body model (hbm) standard: jedec standard jesd22-a114 esd rating: class iv value: passes at 1000 v min. test: charged device model (cdm) standard: jedec standard jesd22-c101 msl rating: level 3 at +260 c convection reflow standard: jedec standard j-std-020 mounting config. notes 1. ground / thermal vias are critical for the proper performance of this device. vias should use a .35mm (#80 / .0135?) diameter drill and have a final plated thru diameter of .25 mm (.010?). 2. add as much copper as possible to inner and outer layers near the part to ensure optimal thermal performance. 3. mounting screws can be added near the part to fasten the board to a heatsink. ensure that the ground / thermal via region contacts the heatsink. 4. do not put solder mask on the backside of the pc board in the region where the board contacts the heatsink. 5. rf trace width depends upon the pc board material and construction. 6. use 1 oz. copper minimum. 7. all dimensions are in millimeters (inches). angles are in degrees. mttf vs. gnd lead temperature 1 10 100 1000 10000 60 70 80 90 100 110 120 ground lead temperature (c) mttf ( million hrs )
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