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1/11 www.rohm.com 2011.11 - rev.b ? 2011 rohm co., ltd. all rights reserved. power management ics for mobile phones power management ics for battery chargers BD5650AFVM description BD5650AFVM is small controller built in high accuracy refer ence voltage, constant voltage controlled amplifier and over current detection. BD5650AFVM functions as constant voltage control to realize stable power supply and abnormal (open-collector on) output in case a controller continues to det ect over current overtime. a time until driving is flexible depend on external capacitance. features 1) constant voltage control 2) supply voltage range: 2.5v 18v 3) high accuracy reference voltage: 1.21v1% 4) current detected voltage: 73mv5%(0 85 ) 5) built-in over current detection with delay time 6) small package: msop8 applications it is suitable for secondary side controller in ac/dc adaptor to protect from over current. absolute maximum ratings (ta=25 ) parameter symbol ratings unit maximum supply voltage vmax -0.3 20 v cp pin maximum voltage vcpmax -0.3 7 v power dissipation pd 587 *1 mw operating temperatur e range topr -30 +85 maximum junction temperature tjmax 150 storage temperature range tstg -55 +150 *1 pd derate at 4.7mw/ for temperature above ta = 25 (when mounted on a pcb 70.0mm70.0mm1.6mm) operating condition (ta=0 +85 ) parameter symbol ratings unit supply voltage vcc 2.5 18 v cp pin operating voltage vcp 0 5.5 v no.10032ebt02
technical note 2/11 BD5650AFVM www.rohm.com 2011.11 - rev.b ? 2011 rohm co., ltd. all rights reserved. electric characteristics (ta=25 , vcc=+5v) parameter symbol limits unit conditions min. typ. max. whole device total supply current - not taking the output sinking current into account icc - 0.6 1.2 ma voltage control loop transconduction gain(vct). sink current only gmv 1.0 4.5 - ma/mv voltage control loop reference at 1.5ma sinking current vref 1.198 1.21 1.222 v ta = 2 5 1.186 1.21 1.234 0 < ta < 85 current detection current detection reference vse 69.4 73 76.6 mv 0 < ta < 85 current out of pin ict ibi 2 5 9 a ict=-0.1v output stage output short circuit current, output to vcc, sink current only ios 11 25 50 ma out=vcc, ict=-0.2v vse=0v delay time setting cp charge current ichg 612 665 718 na set 4 second, when cp=2.2uf this product is not designed to be radiation-resistant. measurement circuit diagram fig.1 - + - vref + - + 5 3 1 2 comparator with latch voltage reference 6 vref 8 ichg 73mv detection comparator 7 4 io io vcc 1uf a a a v a v error amplifier
technical note 3/11 BD5650AFVM www.rohm.com 2011.11 - rev.b ? 2011 rohm co., ltd. all rights reserved. reference data 69 70 71 72 73 74 75 76 77 0 20406080 ambient temper atur e: ta[ ] vse[mv] 2.5v 5.0v 18v 1.18 1.19 1.2 1.21 1.22 1.23 1.24 0 20406080 ambient temperatur e: ta[ ] vref[v] 18v 5v 2.5v -60 -40 -20 0 20 40 60 0 20406080 ambient temperature: ta[ ] ibv[na] 2.5v 5.0v 18v 2 3 4 5 6 0 20406080 ambient temperature: ta[ ] toth[sec] 2.5v 5.0v 18v fig.3 voltage controlled reference voltage vs temp. fig.4 over-current detected voltage vs temp. fig.5 voltage controlled amplifier:gm vs temp. fig.6 vct pin input bias current vs temp. fig.7 delay time vs temp. 0 0. 2 0. 4 0. 6 0. 8 1 1. 2 0 20406080 ambient temperature: ta[ ] icc[ma] 2.5v 5v 18v fig.11 circuit current vs vcc fig.12 voltage controlled reference voltage vs vcc fig.13 sinking output voltage vs iout ta =25 0 2 4 6 8 0 20406080 ambient temperature: ta[ ] gmv[ma/mv] 2.5v 5.0v 18v 0 2 4 6 8 0 20406080 ambient temperature: ta[ ] ibi[ua] 2.5v 5.0v 18v 0 10 20 30 40 50 60 70 020406080 ambient temperature: ta[ ] ios[ma] 2.5v 5.0v 18v 0 100 200 300 400 020406080 ambient temperature: ta[ ] vol[mv] 2.5v 5.0v 18v 0.0 0.2 0.4 0.6 0.8 1.0 1.2 051015 power supply : vcc[v] icc[ma] ta =25 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 0 5 10 15 power supply : vcc[v] vref[v] 0.0 0.5 1.0 1.5 2.0 2.5 0 5 10 15 iout [ma] vol[v] ta =25 cp=2.2uf fig.2 circuit current vs temp. fig.9 10ma sinking output voltage vs temp. fig.10 output short-circuit current vs temp. fig.8 ict pin output current vs temp.
technical note 4/11 BD5650AFVM www.rohm.com 2011.11 - rev.b ? 2011 rohm co., ltd. all rights reserved. block diagram fig.14 pin description pin no. pin name function 1 vct input pin of the voltage control loop 2 gnd ground line. 0v reference for all voltages 3 out output pin. sinking current only 4 ocp output pin for over current detect ion. after delay time, sinking current. 5 vcc positive power supply line 6 vse input pin of the current dete ction(+). normally short to gnd. 7 ict input pin of the current de tection(-). detected at -73mv. 8 cp set delay time by capacitor. package dimensions fig.15 - + - vref + - + 5 3 1 2 comparator with latch voltage reference 6 vref 8 ichg 73mv detection comparator 7 4 5 6 5 0 a lot no. 2.9 0.1 ? max 3.25 4.0 0.2 2.8 0.1 8 7 6 5 4 3 1 2 0.475 0.65 0.8 0.05 0.75 0.05 0.9max 0.08 0.22 +0.05 -0.04 1pin mark 0.145 +0.05 -0.03 0.29 0.15 0.6 0.2 4 +6 -4 max 3.25 incle burr msop8 (unit:mm)
technical note 5/11 BD5650AFVM www.rohm.com 2011.11 - rev.b ? 2011 rohm co., ltd. all rights reserved. typical application fig.16 vout = vref (r1+r2) / r2 [v] current limit : il = vse / rs [a] recommended part list symbol products recommended value c0 ud series (nichikon) 220 1000 f c1 ud series (nichikon) 100 680 f c21 mch182cn104 (rohm) 0.1 f cp - (tolerence b) r1 mcr03 (rohm) 160k (tolerence f) r2 mcr03 (rohm) 51k (tolerence f) r3 mcr03 (rohm) 470 r21 mcr03 (rohm) 1k r22 mcr03 (rohm) 470 rs mcr25 (rohm) 0.3 (tolerence f) d1 sb240 - pc pc17k1dd (kodenshi) - caution in use we are convinced that an example above application circuit is no problem, but you should sufficiently evaluate the characteristics for your application. you need to decide external values sufficient ly considering static characteristics, transient characteristics and ic?s unevenness to keep working ap plication margin when you use in change external circuit value. you need to evaluate when you decide external value, since the frequency response in overall system is affected in particular from not ic only but characteristi cs of optocoupler and primary side control ic. - + - vref + - + 5 3 1 2 comparator with latch voltage reference 6 vref 8 ichg 73mv detection comparator 7 4 rs vs 470uf /10v 1000pf pc r1 r2 load cp vout 0.1uf 1k il error amplifier d1 l1 r3 c21 r21 r22 set divided resistance at output voltage your request. recommended use f grade. p. 6 phase compensation parts for voltage controlled amplifier. p. 6 set at limit current your request. set delay time from over-current detection to protection latch. p. 7 p. 7
technical note 6/11 BD5650AFVM www.rohm.com 2011.11 - rev.b ? 2011 rohm co., ltd. all rights reserved. explanation for circuit working 1. constant voltage control (1-1) output voltage voltage feedback system is composited from error amplifie r, resistance r1 / r2 and optocoupler connected to out terminal. output voltage ?vout? is defined by expression (1). vout = vref (r1+r2)/r2 (1) vout is free setting from r1 / r2, but a pot ential of out terminal is not over vcc. in addition, it is recommended that resistance r1 / r2 has high impedance not to have heavy load at output. but an input bias current is 50na(typ.) in vct terminal, you need to select a resistance value that flow over 10ua not to influence the ratio of resistance in (1). we show a reference value below. when r1=160k , r2=51k , vout=5.00v (1-2) frequency response of error amplifier in BD5650AFVM, shunt regulation execut es constant voltage control. monitoring an alteration of output voltage in vct terminal, through error amplifier, finally respond as sink current in out terminal. a frequency response of transconductance, a change at output current against an change at input voltage, is sh own in fig.17. in case that frequency is higher over 200khz, a response of gain is lower, e rror amplifier is losing its function little by little. fig.17 fig.18 it is needed that your application circuit connects external capacitance and resistance between out terminal and vct terminal for phase compensation regarding constant voltage cont rol. but you need to decide external values sufficiently considering static characteristics, transient characterist ics and ic?s unevenness to keep working application margin. + - 1.21v out vcc bd5650fvm 51 160 ch1 osc 50 vct g= ch1[a] osc[v] gnd error amplifier
technical note 7/11 BD5650AFVM www.rohm.com 2011.11 - rev.b ? 2011 rohm co., ltd. all rights reserved. 2. over current detection BD5650AFVM has a function regarding over current detection. when over current your set limit freely flow during a continuous time you also set capacitance in cp terminal, open co llector in ocp terminal is driving (on). once turned to on, its state keep(latch) in internal. when you want to release latch state, you need that cp terminal fall to gnd, or, vcc voltage apply lower under about 1v. an application circuit in fig.16 has a function that adaptor output stop due to st op feedback to primary side. (2-1) limit current overcurrent detection is composited from detection comparator, sensing resistance rs. limit current ?il? is defined by expression (2). il = vse / rs (2) il means limit current, vse means current detected voltage(73mv: a potential difference from ict tovse). we show a reference value below. when il=1a, rs=73m you need to decide rs value sufficiently considering maximum load current il,max in application. pl=vseil,max (3) for example, when il,max set to 2a, the maximum power lo ss ?pl.max? is 200mw in rs resistance. since BD5650AFVM itself can?t limit il,max, considering a characteristics on m odule, you need to select resistance includes enough margin for power loss. but for mostly small power adaptor, selecting 1/4 watt or 1/2 watt resistance is sufficiently suitable. (2-2) cp charge a delay time from a occur of over current to tu rn on in ocp terminal is below expression (4). toth=cpvref/ichg (4) timing chart when over current detection is shown in fig.19. fig.19 cp vs iout il (73mv/rs) toth vref 73v iocp il,max
technical note 8/11 BD5650AFVM www.rohm.com 2011.11 - rev.b ? 2011 rohm co., ltd. all rights reserved. in case that over current reduces and vs become under 73mv during cp charging, an electric charge in cp capacitance discharge and cp voltage returns to 0v. when over current detect for the second time, start to charge. its discharging velocity is shown in expression (8). ? ? rdis cp t - vcp0 vcp exp ) t ( ? (8) vcp0 means cp terminal voltage at discharge start, and rdis is internal discharge resistance:900 (typ.). if you don?t set up a delay time, you need that cp terminal is open or connects 10pf order of magnitude. in this case, when ic detects surge current in an instant, normal working stops by protection. consequently, you need to use this mode considering a characteristics of module. in addition, when you don?t use a functi on that ic detects over current, you need to short ict terminal to vse terminal and pull down to gnd by about 10k in cp terminal. regarding board layout around cp capacitance, you pay attenti on that cp capacitance will not be in parallel with noisy parts and lines wherever possible, and place to short pattern line as possible. internal equivalent circuit diagram vct(1pin) ocp(4pin) vse(6pin) ict(7pin) cp(8pin) out(3pin) ocp pow vse ict vref cp out pow
technical note 9/11 BD5650AFVM www.rohm.com 2011.11 - rev.b ? 2011 rohm co., ltd. all rights reserved. operation notes 1) absolute maximum ratings use of the ic in excess of absolute maximum ratings such as the applied voltage or operating temperature range may result in ic deterioration or damage. assumptions should not be made regarding the stat e of the ic (short mode or open mode) when such damage is suffered. a physical safety measure such as a fuse should be implemented when use of the ic in a special mode w here the absolu te maximum ratings may be exceeded is anticipated. 2) gnd potential ensure a minimum gnd pin potential in all operating conditi ons. in addition, ensure that no pins other than the gnd pin carry a voltage lower than or equal to the gnd pin, in cluding during actual transient phenomena. as an exception, the circuit design allows voltages up to -0.3 v to be applied to the ict pin. 3) setting of heat use a thermal design that allows for a sufficient margin in light of the power dissipati on (pd) in actual operating conditions. 4) pin short and mistake fitting use caution when orienting and positioning the ic for mounti ng on printed circuit boards. improper mounting may result in damage to the ic. shorts between output pins or between output pins and the power s upply and gnd pin caused by the presence of a foreign object may result in damage to the ic. 5) actions in strong magnetic field use caution when using the ic in the presence of a strong elec tromagnetic field as doing so may cause the ic to malfunction. 6) mutual impedance power supply and ground wiring should reflect considerati on of the need to lower mutual impedance and minimize ripple as much as possible (by making wiring as short and thick as possible or rejecting ripple by incorporating inductance and capacitance). 7) regarding input pin of the ic this ic is a monolithic ic which (as shown is fig-1)has p + substrate and between the various pins. a p-n junction is formed from this p layer of each pin. for exampl e, the relation between each potential is as follows, (when gnd > pinb and gnd > pina, the p-n junction operates as a parasitic diode.) (when pinb > gnd > pina, the p-n junction operates as a parasitic transistor.) parasitic diodes can occur inevitably in the structure of the ic. t he operation of parasitic diodes can result in mutual interference among circuits as well as operation faults and physical damage. accordingly you must not use methods by which parasitic diodes operate, such as applying a voltage that is lower than the gnd (p substrate) voltage to an input pin. although the circuit design allows voltages up to -0.3 v to be applied to the ict pin, voltages lower than this may cause the behavior described above. use c aution when designing the circuit. parasitic diode gnd b p p substrate parasitic diode fig.20 simplified structure of a bipolar ic p substrate parasitic diode gnd n p resistance transistor (npn) other adjacent components (pinb) (pina) p gnd n n b c e n (pina) (pinb) gnd gnd parasitic diode c e
technical note 10/11 BD5650AFVM www.rohm.com 2011.11 - rev.b ? 2011 rohm co., ltd. all rights reserved. power dissipation reduction 0 0.2 0.4 0.6 0 25 50 75 100 125 150 ta [ ] pd[w] 587mw msop8 when mounted on a pcb (70 mm ? 70 mm ? 1.6 mm, glass epoxy)
technical note 11/11 BD5650AFVM www.rohm.com 2011.11 - rev.b ? 2011 rohm co., ltd. all rights reserved. ordering part number b d 5 6 5 0 a f v m - t r part no. part no. package fvm: msop8 packaging and forming specification tr: embossed tape and reel direction of feed reel ? order quantity needs to be multiple of the minimum quantity. embossed carrier tape tape quantity direction of feed the direction is the 1pin of product is at the upper right when you hold reel on the left hand and you pull out the tape on the right hand 3000pcs tr () 1pin (unit : mm) msop8 0.08 s s 4.0 0.2 8 3 2.8 0.1 1 6 2.9 0.1 0.475 4 5 7 (max 3.25 include burr) 2 1pin mark 0.9max 0.75 0.05 0.65 0.08 0.05 0.22 +0.05 ? 0.04 0.6 0.2 0.29 0.15 0.145 +0.05 ? 0.03 4 + 6 ? 4
r1120 a www.rohm.com ? 2011 rohm co., ltd. all rights reserved. notice rohm customer support system http://www.rohm.com/contact/ thank you for your accessing to rohm product informations. more detail product informations and catalogs are available, please contact us. notes no copying or reproduction of this document, in part or in whole, is permitted without the consent of rohm co.,ltd. the content specified herein is subject to change for improvement without notice. the content specified herein is for the purpose of introducing rohm's products (hereinafter "products"). if you wish to use any such product, please be sure to refer to the specifications, which can be obtained from rohm upon request. examples of application circuits, circuit constants and any other information contained herein illustrate the standard usage and operations of the products. the peripheral conditions must be taken into account when designing circuits for mass production. great care was taken in ensuring the accuracy of the information specified in this document. however, should you incur any damage arising from any inaccuracy or misprint of such information, rohm shall bear no responsibility for such damage. the technical information specified herein is intended only to show the typical functions of and examples of application circuits for the produc ts. rohm does not grant you, explicitly or implicitly, any license to use or exercise intellectual property or other rights held by rohm and other parties. rohm shall bear no responsibility whatsoever for any dispute arising from the use of such technical information. the products specified in this document are intended to be used with general-use electronic equipment or devices (such as audio visual equipment, office-automation equipment, commu- nication devices, electronic appliances and amusement devices). the products specified in this document are not designed to be radiation tolerant. while rohm always makes efforts to enhance the quality and reliability of its products, a product may fail or malfunction for a variety of reasons. please be sure to implement in your equipment using the products safety measures to guard against the possibility of physical injury, fire or any other damage caused in the event of the failure of any product, such as derating, redundancy, fire control and fail-safe designs. rohm shall bear no responsibility whatsoever for your use of any product outside of the prescribed scope or not in accordance with the instruction manual. the products are not designed or manufactured to be used with any equipment, device or system which requires an extremely high level of reliability the failure or malfunction of which may result in a direct threat to human life or create a risk of human injury (such as a medical instrument, transportation equipment, aerospace machinery, nuclear-reactor controller, fuel- controller or other safety device). rohm shall bear no responsibility in any way for use of any of the products for the above special purposes. if a product is intended to be used for any such special purpose, please contact a rohm sales representative before purchasing. if you intend to export or ship overseas any product or technology specified herein that may be controlled under the foreign exchange and the foreign trade law, you will be required to obtain a license or permit under the law.

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