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| 1/10 www.rohm.com 2011.06 - rev.b ? 2011 rohm co., ltd. all rights reserved. led drivers for lcd backlights backlight led drivers for small lcd panels (charge pump type) bd1604muv, BD1604MVV description this lsi is a 4 white led driver for small lcd backlight. at the charge pump type, the number of external devices is minimized. features 1) 4 parallel led driver is mounted. 2) the led current can be controlled via an external resistance. 3) maximum current is 120ma (30ma 4). 4) led1 to led4 can be turned on or off via an external control pin. 5) the relative current accuracy among leds (led1 to led4) is 3%. 6) automatically transition to each mode (1.0, 1.5, 2.0). 7) high efficiency (90% or more at maximum) is achieved. 8) various protection functions such as output voltage protection function, current overload limiter and thermal shutdown circuit are mounted. applications this driver provides for: - backlight using white led - auxiliary lights for mobile phone cameras and simplified flash lineup parameter bd1604muv BD1604MVV number of led channels 4ch 4ch maximum current 120ma 120ma package vqfn016v3030 3.00mm3.00mm sqfn016v4040 4.00mm4.00mm absolute ma ximum rating (ta=25 ) parameter symbol ratings unit power supply voltage vmax 7 v allowable loss bd1604muv pd 700 * 1 mw BD1604MVV 780 * 2 operating temperature range topr 30~85 storage temperature range tstr 55~150 *1 when a glass epoxy substrate ( 70mm70mm1.6mm) has been mounted, this loss will decrease 5.6mw/ if ta is higher than or equal to 25 . *2 when a glass epoxy substrate ( 70mm70mm1.6mm) has been mounted, this loss will decrease 6.24mw/ if ta is higher than or equal to 25 . recommended operation range parameter symbol limits unit condition operating supply voltage vbat 2.7 5.5 v vbat voltage no.11040ebt23
technical note 2/10 www.rohm.com 2011.06 - rev.b ? 2011 rohm co., ltd. all rights reserved. bd1604muv, BD1604MVV electrical characteristics unless otherwise specified, ta is 25 and vbat is 3.6v. parameter symbol limits unit condition min. typ. max. [circuit current] circuit current 0 i q0 - 0.1 1 a en=0v circuit current 1.0 i q1.0 - 1.0 2.0 ma x1.0 mode, iout = 0ma circuit current 1.5 i q1.5 - 2.3 3.3 ma x1.5 mode, iout = 0ma circuit current 2.0 i q2.0 - 2.5 3.5 ma x2.0 mode, iout = 0ma unless otherwise specified, ta is 25 and vbat is 3.6v. parameter symbol limits unit condition min. typ. max. [current driver] led maximum current i ledmax - - 30 ma led current accuracy i leddiff - 0.5 5.0 % i led =10ma led current matching i ledmatch - 0.5 3.0 % i led =10ma *1) led pin control voltage v led 0.08 0.10 0.20 v minimum voltage at led1~led4 pins iset voltage i set 0.5 0.6 0.7 v oscillation frequency fosc 0.8 1.0 1.2 mhz over current limiter i ov - 600 900 ma led current limiter i ledov 40 60 100 ma *1) led current matching = (iledm ax-iledmin)/(iledmax+iledmin)*100 iledmax : maximum value of led1-4 current iledmin : minimum value of led1-4 current unless otherwise specified, ta is 25 and vbat is 5.5v. parameter symbol limits unit condition min. typ. max. [control signal etc.] input ?h? voltage v ih 1.4 - - v en,sel0,sel1,sel2 input ?l? voltage v il - - 0.4 v en,sel0,sel1,sel2 input ?h? current1 i ih1 - 18.3 30 a en=5.5v input ?h? current2 i ih2 - 0 1 a sel0,sel1,sel2=5.5v input ?l? current i il -1 0 - a en,sel0,sel1,sel2=0v unless otherwise specified, ta is 25 and vbat is 3.6v. parameter symbol limits unit condition min. typ. max. [control signal etc.] uvlo detecting voltage v uvlo 1.9 2.2 2.5 v technical note 3/10 www.rohm.com 2011.06 - rev.b ? 2011 rohm co., ltd. all rights reserved. bd1604muv, BD1604MVV reference data (evaluation under led v f =3.2v) 40 50 60 70 80 90 100 2.53 3.544.5 55.5 supply voltage : vbat[v] efficiency [%] down up fig.1 circuit current (standby) fig.11 led current vs. pwm duty (cycle 100hz) fig.2 circuit current (1.0 mode operation) fig.3 efficiency hysteresis (20ma 4 leds) fig.4 efficiency (5ma 4 leds) fig.10 led current vs. rset (ta=25 ) fig.7 led current (20ma) (vbat=2.7v) fig.8 led current (20ma) (vbat=3.6v) fig.9 led current (20ma) (vbat=5.5v) fig.6 efficiency (20ma 4 leds) fig.5 efficiency (15ma 4 leds) 0 5 10 15 20 25 0 20406080100 pwm duty[%] iled [ma] 0 5 10 15 20 25 30 35 0 50 100 150 200 rset[ko] iled [ma] 0 0.1 0.2 0.3 0.4 0.5 3 3.5 4 4.5 5 5.5 input voltage : vbat[v] stand-by current : istb [a] ta =25 ta =85 ta =-3 0 0 5 10 15 20 25 0 0.3 0.6 0.9 1.2 led voltage : vled[v] led current : iled [ma] ta =85 ta =25 ta =-3 0 40 50 60 70 80 90 100 2.533.5 44.555.5 supply voltage : vbat[v] efficiency [%] ta =85 ta =25 ta =-3 0 40 50 60 70 80 90 100 2.533.5 44.555.5 supply voltage : vbat[v] efficiency [%] ta =85 ta =25 ta =-3 0 40 50 60 70 80 90 100 2.533.5 44.555.5 supply voltage : vbat[v] efficiency [%] ta =85 ta =25 ta =-3 0 0 5 10 15 20 25 0 0.3 0.6 0.9 1.2 led voltage : vled[v] led current : iled [ma] ta =85 ta =25 ta =-3 0 0 5 10 15 20 25 0 0.3 0.6 0.9 1.2 led voltage : vled[v] led current : iled [ma] ta =85 ta =25 ta =-3 0 0 0.5 1 1.5 2 012 345 input voltage : vbat[v] cur rent consum ption : iq1.0 [ a] ta =85 ta =25 ta =-3 0 technical note 4/10 www.rohm.com 2011.06 - rev.b ? 2011 rohm co., ltd. all rights reserved. bd1604muv, BD1604MVV block diagram, recommended circuit example and pin location diagram 1 iset led 1 led 2 led 3 led4 vbat vout c1n c2n c2p 2 3 4 5 6 7 8 en sel0 sel1 sel2 c1p 12 11 10 9 16 15 14 13 gnd bd1604muv BD1604MVV fig.12 pin location diagram (top view) fig.13 block diagram and recommended circuit diagram 1, 1.5, 2 charge pump over voltage protect osc tsd control vout control charge pump mode control iset resistor driver current driver gnd iset led1 led2 led3 led4 en sel0 sel1 sel2 battery vbat vout c1n c1p c2n c2p c1 c2 cin rset cout technical note 5/10 www.rohm.com 2011.06 - rev.b ? 2011 rohm co., ltd. all rights reserved. bd1604muv, BD1604MVV [pin table] pin name pin number pin circuit diagram bd1604muv BD1604MVV en 1 1 f sel0 2 2 e sel1 3 3 e sel2 4 4 e iset 5 5 g vout 6 6 c vbat 7 7 h c1p 8 8 b c1n 9 9 a c2n 10 10 a c2p 11 11 b gnd 12 12 i led1 13 13 d led2 14 14 d led3 15 15 d led4 16 16 d i/o equivalence circuit diagram the following shows i/o equivalence circuits. fig.14 pin diagram pa d pa d pa d pa d pad pa d pa d pa d pa d a b c d e f g h i technical note 6/10 www.rohm.com 2011.06 - rev.b ? 2011 rohm co., ltd. all rights reserved. bd1604muv, BD1604MVV description of block operations 1) led light control and current control when led lights are controlled, h- or l-level voltage is applied to respective control pins. current control in the bd1604muv/mvv can take pl ace via a resistance connected to the iset pin. on/off control sel2 sel1 sel0 led1 led2 led3 led4 0 0 0 off off off on 0 0 1 off off on off 0 1 0 off on off off 0 1 1 on off off off 1 0 0 off off on on 1 0 1 off on on on 1 1 0 on on on on 1 1 1 off off off off rset: see the following table. 0: 0v, 1: vbat when handling pins, the led pins must be connected to vbat so long as led is always off. current control rset 165k ? 97.6k ? 48.7k ? 32.4k ? 24.3k ? 16.2k ? iled 3ma 5ma 10ma 15ma 20ma 30ma the led current can be changed by the rset value. iled=480/rset the above expression can be used for approximation. 2) low supply voltage detection circuit (uvlo) when the ic-applied supply voltage drops, all the circuits including the dc/dc converter are stopped. when supply voltage drops to a detecting voltage, uvlo is activated. when it rises, uvlo is automatically released. 3) soft start by dc/dc converter startup when a dc/dc converter is started, soft start is enabled so t hat output voltage can be increased gradually to prevent output voltage overshooting. application parts selection method capacitor (use the ceramics parts with good frequency and temperature characteristics.) symbol recommended value recommended part type cout,cin,c1,c2 1 f grm188b11a105ka61b(murata) ceramics capacitor resistance symbol recommended value recommended part set current value rset 16k ? mcr006yzpf series (rohm) 30ma ~ ~ 240k ? 2ma connect an input bypass capacitor (cin) between vbat and gnd pin in proximity. in addition, connect an output capacitor between vout and gnd pins in proximity. connect a capacitor between c1p and c1n and also a capacitor between c2p and c2n in proximity to the chips. connect a resistance in proximity to the iset pin. when other than these parts are used, the equivalent parts must be used. technical note 7/10 www.rohm.com 2011.06 - rev.b ? 2011 rohm co., ltd. all rights reserved. bd1604muv, BD1604MVV gnd iset led1 led2 led3 led4 en sel0 se l1 sel2 bat tery vbat vout c1n c1p c2n c2p 1, 1.5, 2 charge pump over voltage protect osc ts d control vout control char ge pum p mode c ontr ol iset resistor driver current driver c1 c2 cin rset cout pwm signal input (on for the signal set to high) cautions on layout pattern when designing a layout pattern, lay out wires to a power line in a way that the layout pattern impedance can be minimized and connect a bypass capacitor if necessary. the gnd pin and cin must be placed nearby. wiring from the vbat pin to cin must meet a low impedance. led led led led vbat gnd 1 f 1 f 1 f 1 f rset vout gnd fig.15 example of bd1604muv layout pattern fig.16 example of bd1604muv layout pattern (front, top view) (rear, top view) led current control there are two methods for led current control. one method uses an external pwm signal and another changes the resistance value of rref (rset) connected to the iref (iset) pi n. for details, refer to the respective circuit examples. don?t make the setting of 30ma or more per channel for bd1604muv/mvv. 1) controlling the current by using the pwm method the pwn signal must be input to the en pin. pwm signal ?h? level: 1.4v or more pwm signal ?l? level: 0.4v or less when pwm duty is used in an area of 10% or less, the pwm cycle must be a range from 100hz to 200hz. when extremely high-speed pwm control takes place, the li nearity of led current value to pwm duty is lost if the pwm duty is small (for example, 10% or less) or it is la rge (for example, 90% or more). 2) controlling the current by changing the set resistance value rset-rset1=rse t2// ? //restn. this means that the current can be adjusted more finely by adding the types of resistance values. iled=480/rset [a] the approximate led current can be obtained from the above expression. because the current of 30ma or more per led is not permitted, make the setting in a way that the rset resistance value can be maintained to be greater than or equal to16k . gnd iset led1 led2 led3 led4 en sel0 se l1 sel2 bat tery vbat vout c1n c1p c2n c2p 1, 1.5, 2 charge pump over voltage protect osc ts d control vout control char ge pum p mode c ontr ol iset resistor driver current driver c1 c2 cin rset1 cout rset2 rsetn fig.17 controlling the current by using the pwm method fig.18 controlling the current by changing the resistance value technical note 8/10 www.rohm.com 2011.06 - rev.b ? 2011 rohm co., ltd. all rights reserved. bd1604muv, BD1604MVV notes for use (1) absolute maximum ratings an excess in the absolute maximum ratings, such as supply voltage, temperat ure range of operating conditions, etc., can break down devices, thus making impossible to identify breaking mode such as a short circuit or an open circuit. if any special mode exceeding the absolute maximum ratings is assumed, consideration should be given to take physical safety measures including the use of fuses, etc. (2) operating conditions these conditions represent a range within which characte ristics can be provided approx imately as expected. the electrical characteristics are guaranteed under the conditions of each parameter. (3) reverse connection of power supply connector the reverse connection of power supply connector can brea k down ics. take protective measures against the breakdown due to the reverse connection, such as mounting an external diode between the power supply and the ic?s power supply terminal. (4) power supply line design pcb pattern to provide low impedance for the wiring between the power supply and the gnd lines. in this regard, for the digital block power supply and the analog block po wer supply, even though these power supplies has the same level of potential, separate the power supply pattern for the digital block fr om that for the analog bl ock, thus suppressing the diffraction of digital noises to the analog block power su pply resulting from impedance common to the wiring patterns. for the gnd line, give consideration to design the patterns in a similar manner. furthermore, for all power supply terminals to ics, mount a capacitor between the power supply and the gnd terminal. at the same time, in order to use an electrolytic capacito r, thoroughly check to be sure the characteristics of the capacitor to be used present no problem including the occurr ence of capacity dropout at a low temperature, thus determining the constant. (5) gnd voltage make setting of the potential of the gnd te rminal so that it will be maintained at the minimum in any operating state. furthermore, check to be sure no terminals are at a potential lower than the gnd voltage including an actual electric transient. (6) short circuit between terminals and erroneous mounting in order to mount ics on a set pcb, pay thorough attention to the direction and offset of the ics. erroneous mounting can break down the ics. furthermore, if a short circuit occurs due to foreign matters entering between terminals or between the terminal and the power supply or the gnd terminal, the ics can break down. (7) operation in strong electromagnetic field be noted that using ics in the strong elec tromagnetic field can malfunction them. (8) inspection with set pcb on the inspection with the set pcb, if a capacitor is connect ed to a low-impedance ic terminal, the ic can suffer stress. therefore, be sure to discharge from the set pcb by each pr ocess. furthermore, in order to mount or dismount the set pcb to/from the jig for the inspection process, be sure to turn off the power supply and then mount the set pcb to the jig. after the completion of the inspection, be sure to turn off the power supply and then dismount it from the jig. in addition, for protection against static el ectricity, establish a ground for the a ssembly process and pay thorough attention to the transportation and t he storage of the set pcb. (9) input terminals in terms of the construction of ic, parasitic elements are in evitably formed in relation to po tential. the op eration of the parasitic element can cause interference with circuit operatio n, thus resulting in a malf unction and then breakdown of the input terminal. therefore, pay thorough attention not to handle the input terminals, such as to apply to the input terminals a voltage lower than the gnd respectively, so that any parasitic element will operate. furthermore, do not apply a voltage to the input terminals when no power supply voltage is applied to the ic. in addition, even if the power supply voltage is applied, apply to the input terminals a voltage lower than the power supply voltage or within the guaranteed value of electr ical characteristics. (10) ground wiring pattern if small-signal gnd and large-current gnd are provided, it will be recommended to separate the large-current gnd pattern from the small-signal gnd pattern and establish a si ngle ground at the reference poi nt of the set pcb so that resistance to the wiring pattern and voltage fluctuations due to a larg e current will cause no fluctuations in voltages of the small-signal gnd. pay att ention not to cause fluctuations in the gnd wiring pattern of external parts as well. technical note 9/10 www.rohm.com 2011.06 - rev.b ? 2011 rohm co., ltd. all rights reserved. bd1604muv, BD1604MVV (11) external capacitor in order to use a ceramic capacitor as the external capaci tor, determine the constant with consideration given to a degradation in the nominal capacitance due to dc bias and c hanges in the capacitance due to temperature, etc. (12) not connecting input terminals in terms of extremely high impedance of cmos gate, to open the input terminals causes uns table state. unstable state occurs from the inside gate voltage of p-channel or n-channel transistor into active. as a result, power supply current may increase. and unstable state can also cause unexpected operation of ic. so unless otherwise specified, input terminals not being used should be connected to the power supply or gnd line. (13) thermal shutdown circuit (tsd) when junction temperatures become setting temperature or higher, the thermal shutdown circuit operates and turns a switch off. the thermal shutdown circuit, which is aim ed at isolating the lsi from thermal runaway as much as possible, is not aimed at the protection or guarantee of the lsi. therefore, do not continuously use the lsi with this circuit operating or use the lsi assuming its operation. (14) thermal design perform thermal design in which there are adequate margins by taking into account the permissible dissipation (pd) in actual states of use. thermal loss the following conditions must be met for thermal design. (because the following temperature is only the assured temperature, be sure to consider the margin for design.) 1. the ambient temperature ta must be 85 ? c. 2. the ic loss must be smaller than an allowable loss (pd). power dissipation character the following shows the power dissipation character. mount board specification material : glass epoxy size : 70mm 70mm 1.6mm 0 0.2 0.4 0.6 0.8 1 0 25 50 75 100 125 150 temparature[ ] power dissipation : pd[w] 0.78w 0 0.2 0.4 0.6 0.8 1 0 25 50 75 100 125 150 temparature[ ] power dissipation : pd[w] 0.70w fig.20 bd1604muv fig.19 BD1604MVV technical note 10/10 www.rohm.com 2011.06 - rev.b ? 2011 rohm co., ltd. all rights reserved. bd1604muv, BD1604MVV ordering part number b d 1 6 0 4 m u v - e 2 part no. bd part no. 1604 package muv: vqfn016v3030 mvv: sqfn016v4040 packaging and forming specification e2: embossed tape and reel ? order quantity needs to be multiple of the minimum quantity. r1120 a www.rohm.com ? 2011 rohm co., ltd. all rights reserved. notice rohm customer support system http://www.rohm.com/contact/ thank you for your accessing to rohm product informations. more detail product informations and catalogs are available, please contact us. notes no copying or reproduction of this document, in part or in whole, is permitted without the consent of rohm co.,ltd. the content specified herein is subject to change for improvement without notice. the content specified herein is for the purpose of introducing rohm's products (hereinafter "products"). if you wish to use any such product, please be sure to refer to the specifications, which can be obtained from rohm upon request. examples of application circuits, circuit constants and any other information contained herein illustrate the standard usage and operations of the products. the peripheral conditions must be taken into account when designing circuits for mass production. great care was taken in ensuring the accuracy of the information specified in this document. however, should you incur any damage arising from any inaccuracy or misprint of such information, rohm shall bear no responsibility for such damage. the technical information specified herein is intended only to show the typical functions of and examples of application circuits for the produc ts. rohm does not grant you, explicitly or implicitly, any license to use or exercise intellectual property or other rights held by rohm and other parties. rohm shall bear no responsibility whatsoever for any dispute arising from the use of such technical information. the products specified in this document are intended to be used with general-use electronic equipment or devices (such as audio visual equipment, office-automation equipment, commu- nication devices, electronic appliances and amusement devices). the products specified in this document are not designed to be radiation tolerant. while rohm always makes efforts to enhance the quality and reliability of its products, a product may fail or malfunction for a variety of reasons. please be sure to implement in your equipment using the products safety measures to guard against the possibility of physical injury, fire or any other damage caused in the event of the failure of any product, such as derating, redundancy, fire control and fail-safe designs. rohm shall bear no responsibility whatsoever for your use of any product outside of the prescribed scope or not in accordance with the instruction manual. the products are not designed or manufactured to be used with any equipment, device or system which requires an extremely high level of reliability the failure or malfunction of which may result in a direct threat to human life or create a risk of human injury (such as a medical instrument, transportation equipment, aerospace machinery, nuclear-reactor controller, fuel- controller or other safety device). rohm shall bear no responsibility in any way for use of any of the products for the above special purposes. if a product is intended to be used for any such special purpose, please contact a rohm sales representative before purchasing. if you intend to export or ship overseas any product or technology specified herein that may be controlled under the foreign exchange and the foreign trade law, you will be required to obtain a license or permit under the law. |
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