this is information on a product in full production. june 2012 doc id 023285 rev 1 1/8 8 DCPL-WB-02D3 wide-band, dual-path directional coupler with integrated 50 oh m loaded isolated port datasheet ? production data features 50 nominal input / output impedance wide operating frequency range: ? 2400 mhz-5850 mhz low insertion loss high esd ruggedness lead-free csp small footprint: 1670 x 1440 m very low profile (< 600 m after reflow) benefits high rf performance rf module size reduction applications multi-band equipment such as: power amplifier module front end module wlan figure 1. pin configuration (bump view) description the DCPL-WB-02D3 is a wide-band, dual-path directional coupler designed to measure transmission output power in wlan applications. this dual path cpl has been customized for wide-band operating frequencies (2g/5g wlan) with low insertion losses in the transmission bandwidth (2400 mhz - 5850 mhz). this device is built with two different rf couplers (one dedicated to lb, the other dedicated to hb) sharing the same coupled ports. isolated port is loaded with an integrated 50 resistor. the DCPL-WB-02D3 has been designed using stmicroelectronics ipd (integrated passive device) technology on non-conductive glass substrate to optimize rf performance. the device is delivered 100% tested in tape and reel. flip chip (7 bumps) lb path hb path b1 c2 hb in 1 2 3 b1 a c cpld 50 lb out gnd lb in gnd b hb out www.st.com
characteristics DCPL-WB-02D3 2/8 doc id 023285 rev 1 1 characteristics table 1. a bsolute maximum rating (limiting values) symbol parameter value unit min. typ. max. p in input power rf in (cw mode) 25 dbm v esd (hbm) human body model, jesd 22-a114f, all i/o 2 kv v esd (mm) machine model, jesd 22-a115-a, all i/o 100 v v esd (cdm) charge device model, jesd 22-c101-c, all i/o 500 v t op operating temperature -30 +85 c table 2. electrical characteristics - impedances (t amb = 25 c) symbol parameter value unit min. typ. max. z out nominal output impedance (lb and hb paths) 50 z in nominal input impedance (lb and hb paths) 50 z cpl nominal coupled port impedance 50
DCPL-WB-02D3 characteristics doc id 023285 rev 1 3/8 table 3. electrical characteristics - lb wlan path rf performance (t amb = 25 c) symbol parameter test condition value unit min. typ. max. f frequency range (bandwidth) 2400 2450 2500 mhz il lb lb path insertion loss from 2400 mhz to 2500 mhz 0.2 db rl lb lb path return loss (in, out pins) from 2400 mhz to 2500 mhz 15 db cpld lb lb path coupling factor at 2.45 ghz 17 18 19 db ripple lb coupling ripple in lb from 2400 mhz to 2500 mhz 0.5 db table 4. electrical characteristics - hb wlan path rf performance (t amb = 25 c) symbol parameter test condition value unit min. typ. max. f frequency range (bandwidth) 4900 5375 5850 mhz il hb hb path insertion loss from 4900 mhz to 5850 mhz 0.5 db rl hb hb path return loss (in, out pins) from 4900 mhz to 5850 mhz 15 db cpld hb hb path coupling factor at 5.375 ghz 11 12 13 db ripple hb coupling ripple in hb from 4900 mhz to 5850 mhz 1.2 db
pcb recommendation DCPL-WB-02D3 4/8 doc id 023285 rev 1 2 pcb recommendation figure 2. recommended land pattern 3 ordering information scheme figure 3. ordering information scheme top layer pad ?220 m aperture 130 m gnd cpl gnd lb_in hb_in lb_out hb_out dcpl wb ? 02 d3 dual high directivity coupler wide band package d3 = bump diameter, 255 m version ?
DCPL-WB-02D3 package information doc id 023285 rev 1 5/8 4 package information in order to meet environmental requirements, st offers these devices in different grades of ecopack ? packages, depending on their level of environmental compliance. ecopack ? specifications, grade definitions and product status are available at: www.st.com . ecopack ? is an st trademark. figure 4. package dimensions figure 5. footprint figure 6. marking - 1.67 mm 50 m 1.44 mm 50 m 632 m 517 m ? 255 m 40 m 630 m 60 m 200 m lb path hb path b1 c2 hb in b1 cpld 50 lb out gnd lb in gnd hb out copper pad diameter: 220 m recommended solder stencil opening: 220 m recommended solder mask opening: 300 m minimum x y x w z w dot, st logo ecopack status xx = marking z = manufacturing location yww = datecode (y = year ww = week)
package information DCPL-WB-02D3 6/8 doc id 023285 rev 1 figure 7. tape and reel specifications note: more packing information is available in the stmicroelectr onics application notes: an2348: ?ipad? 400 m flip chip: package description and recommendations for use? an1751: ?emi filters: recommendations and measurements? user direction of unreeling all dimensions in mm(typical values) 4.0 2.0 8.0 4.0 1.75 3.5 ? 1.50 0.73 1.54 0.20 1.77 x x x y y y x x x w w w z z z w w w
DCPL-WB-02D3 ordering information doc id 023285 rev 1 7/8 5 ordering information 6 revision history table 5. ordering information order code marking package weight base qty delivery mode DCPL-WB-02D3 sf flip chip 2.5 mg 5000 tape and reel 7? table 6. document revision history date revision changes 18-jun-2012 1 initial release
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