500mw do-35 hermetically sealed glass zener voltage regulators cbzx55cxxlc descriptions this is a complete series of 500mw zener diodes with lim its and excellent operating characteristics that reflect the superior capabilities of silicon-oxide passivated junctions. all this in an axial-lead hermetically sealed glass package that offers protection in a ll common environmental conditions. features ? zener voltage range : 2.4 v to 47 v ? esd rating of class 3 (>16kv) per human body model ? double slug type construction ?metallurgical bonded construction mechanical characteristics: ?case: double slug type, hermetically sealed glass ?finish: all external surfaces are corrosion r esistant and leads are readily solderable ?maximum lead temperature for soldering purposes: 230 , 1/16 from the case for 10 seconds ?polarity: cathode indicated by the polarity band ?mounting position: any maximum ratings characteristics symbol max unit total device dissipation p tot 500* mw thermal resistance junction to ambient r ja 300* c/w storage temperature tstg -65 to +175 c junction temperature tj 175 c *valid provided that leads are kept at ambien t temperature at a distance of 8mm from case. ???e?o??e?t1??? xinghe electronics gaomi xinghe electronicsco.,ltd. www.sddzg.com tel:0536-2210359 1
2 electrical characteristics (t l =30 , unless otherwise noted, v f =1.0v max @i f =100ma for all types.) test current maximum zener impedance (note 2) maximum reverse leakage current device nominal zener voltage vz at iz t (v) (note1) i zt (ma) z zt at i zt ( ) z zk at i zk =1ma ( ) typical temperature coefficient (% / ) i r ( a) test voltage (v) maximum regulation current i zm (ma) (note 3) cbzx55c2v4 2.28-2.56 5 85 600 -0.070 50 1.0 150 cbzx55c2v7 2.5-2.9 5 85 600 -0.070 10 1.0 135 cbzx55c3v0 2.8-3.2 5 85 600 -0.070 4 1.0 125 cbzx55c3v3 3.1-3.5 5 85 600 -0.065 2 1.0 115 cbzx55c3v6 3.4-3.8 5 85 600 -0.060 2 1.0 105 cbzx55c3v9 3.7-4.1 5 85 600 -0.050 2 1.0 95 cbzx55c4v3 4.0-4.6 5 75 600 -0.025 1 1.0 90 cbzx55c4v7 4.4-5.0 5 60 600 -0.010 0.5 1.0 85 cbzx55c5v1 4.8-5.4 5 35 550 +0.015 0.1 1.0 80 cbzx55c5v6 5.2-6.0 5 25 450 +0.025 0.1 1.0 70 cbzx55c6v2 5.8-6.6 5 10 200 +0.035 0.1 2.0 64 cbzx55c6v8 6.4-7.2 5 8 150 +0.045 0.1 3.0 58 cbzx55c7v5 7.0-7.9 5 7 50 +0.050 0.1 5.0 53 cbzx55c8v2 7.7-8.7 5 7 50 +0.050 0.1 6.0 47 cbzx55c9v1 8.5-9.6 5 10 50 +0.060 0.1 7.0 43 cbzx55c10 9.4-10.6 5 15 70 +0.070 0.1 7.5 40 cbzx55c11 10.4-11.6 5 20 70 +0.070 0.1 8.5 36 cbzx55c12 11.4-12.7 5 20 90 +0.070 0.1 9.0 32 cbzx55c13 12.4-14.1 5 26 110 +0.070 0.1 10 29 cbzx55c15 13.8-15.6 5 30 110 +0.070 0.1 11 27 cbzx55c16 15.3-17.1 5 40 170 +0.070 0.1 12 24 cbzx55c18 16.8-19.1 5 50 170 +0.070 0.1 14 21 cbzx55c20 18.8-21.2 5 55 220 +0.070 0.1 15 20 cbzx55c22 20.8-23.3 5 55 220 +0.070 0.1 17 18 cbzx55c24 22.8-25.6 5 80 220 +0.080 0.1 18 16 cbzx55c27 25.1-28.9 5 80 220 +0.080 0.1 20 14 cbzx55c30 28-32 5 80 220 +0.080 0.1 22 13 cbzx55c33 31-35 5 80 220 +0.080 0.1 24 12 cbzx55c36 34-38 5 80 220 +0.080 0.1 27 11 cbzx55c39 37-41 2.5 90 500 +0.080 0.1 30 10 cbzx55c43 40-46 2.5 90 600 +0.080 0.1 33 9.2 cbzx55c47 44-50 2.5 110 700 +0.080 0.1 36 8.5 note: 1.the type numbers listed have zener voltage min/max as shown. device tolerance of 2% are indicated by a ?b? instead of a ?c?. zener voltage is measured with the device junction in thermal equilibrium at the lead temperature of 30 1 and 3/8 lead length. 2.z zt and z zk are measured by dividing the ac voltage drop across th e device by the ac current applied. the specified limits are for i z(ac) =0.1i z(dc) with the ac frequency = 1k hz. 3.this data was calculated using nominal voltages. the maximum current handling capability on a worse case basis is limited by the actual zener voltage at the operating point and the powered derating curve. ???e?o??e?t1??? xinghe electronics gaomi xinghe electronicsco.,ltd. www.sddzg.com tel:0536-2210359
3 xinghe electronics ???e?o??e?t1??? do-35(glass) dimension *:typical inches millimeters inches millimeters dim min. max. min. max. dim min. max. min. max. a 0.0181 0.0220 0.46 0.56 d 0.9646 1.2811 24.50 32.54 b 0.9646 1.2811 24.50 32.54 e 0.0602 0.0787 1.53 2.00 c 0.1200 0.1700 3.05 4.20 notes : 1.controlling dimension : millimeters. 2.maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.if there is any question with packing spec ification or packing method, please cont act your local cystek sales office. important notice: ? all rights are reserved. reproduction in whole or in part is prohibited without the prior written approval of cystek. ? cystek reserves the right to make changes to its products without notice. ? cystek semiconductor products are not warranted to be suitab le for use in life-support applications, or systems. ? cystek assumes no liability for any consequence of customer pr oduct design, infringement of pat ents, or application assistance . a b c d do-35 glass package, cystek package code: lc b c d a e gaomi xinghe electronicsco.,ltd. www.sddzg.com tel:0536-2210359
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