m ? ? ? @ b ? ? ? ? ? ? l @ i ? n @ q p w y u @ r ? ? ? ? @ r ? n l @ h ? ? ? ? ? l @ t ? ? ? ? @ w w p y y t ? z @ r x q n y x x n t v p p @ @ f ? ? z @ r x q n y x x n t v q u @ @ ? ? ? n ? ? ? ? ? ? ? ? ? n ? ? e r p p u @ m ? ? ? @ b ? ? ? ? ? ? l @ i ? n c f k 2 0 6 2 - p 1 x p p @ ? ? @ y p p @ m h ? k s p @ ? b @ p ? ? ? ? @ g ? a ? @ f e t
3236 scott boulevard santa clara, california 95054 phone: (408) 986-5060 fax: (408) 986-5095 CFK2062-P1 features ? high gain ? +30 dbm power output ? proprietary power fet process ? >40% linear power added efficiency ? surface mount so-8 power package applications ? ism band base stations and terminals ? cellular base stations and terminals ? wireless local loop description the CFK2062-P1 is a high-gain fet intended for dri- ver amplifier applications in high-power systems, and output stage usage in medium power applications at power levels up to +30 dbm. the device is easily matched and provides excellent linearity at 1 watt. manufactured in celeritek s proprietary power fet process, this device is assembled in an industry standard surface mount so-8 power package that is compatible with high volume, automated board assembly techniques. 800 to 900 mhz +30 dbm power gaas fet product specifications december 1997 (1 of 4) 1 3 4 7 8 6 5 2 g g d d back plane is source gnd gnd gnd gnd package diagram absolute maximum ratings parameter symbol rating drain-source voltage v ds 10v (3) gate-source voltage v gs -5v drain current i ds idss continuous dissipation p t 6w channel temperature t ch 175? storage temperature t stg -65? to +175? so-8 power package physical dimensions notes: 1. sum to two tones with 1 mhz spacing = 25 dbm. 2. see thermal considerations information on page 4. 3. maximum potential difference across the device (vd + vg) cannot exceed 12v. parameters conditions min typ max units v d = 8v, i d = 400 ma (quiescent) p -1 db 29.0 30.0 dbm ssg 18.0 20.0 db 3rd order products (1) ?0 dbc efficiency @ p1db 40 % v d = 5v, i d = 600 ma (quiescent) p -1 db 29.5 dbm ssg 19.0 db specifications (ta = 25?) the following specifications are guaranteed at room temperature in celeritek test fixture at 850 mhz. parameters conditions min typ max units g m vds = 2.0v, vgs = 0v 650 ms i dss vds = 2.0v, vgs = 0v 1.4 a v p vds = 3.0v, ids = 25 ma -1.8 volts bv gd igd = 2.5 ma 15 17 volts jl (2) @150? tch 12 ?/w
3236 scott boulevard, santa clara, california 95054 phone: (408) 986-5060 fax: (408) 986-5095 CFK2062-P1 product specifications - december 1997 (2 of 4) rf match data shown in the performance graphs was taken in the test circuit shown at right. layout is important for prop- er operation. phase length of input and output 50 ? line varies as a function of exact desired frequency of operation. output shunt inductor effects output performance. celeritek recom- mends the use of a high impedance printed inductor lambda/4 in length.please contact the factory for an evalua- tion board and/or more detailed application support. typical scattering parameters (ta = 25?, vds = 5 v, ids = 600 ma) frequency s 11 s 21 s 12 s 22 (ghz) mag ang mag ang mag ang mag ang 0.6 0.927 -129.75 8.7 102.7 0.024 21.95 0.576 -178.45 0.7 0.921 -138.64 7.587 97.2 0.025 16.98 0.588 179.24 0.8 0.919 -145.3 6.726 92.32 0.025 12.77 0.597 177.37 0.9 0.919 -150.58 6.02 88.2 0.025 12.07 0.6 176.07 1.0 0.914 -154.69 5.449 84.82 0.025 8.72 0.6 175.04 1.1 0.911 -157.8 5.018 82.03 0.026 7.57 0.597 174.42 1.2 0.91 -160.09 4.678 79.43 0.027 6.24 0.594 173.69 1.3 0.908 -162.37 4.423 76.85 0.027 4.79 0.588 172.66 1.4 0.904 -164.19 4.225 74.15 0.028 2.63 0.578 171.66 1.5 0.9 -166.3 4.066 71.35 0.029 2.62 0.567 170.4 2.0 0.883 177.09 3.605 52.62 0.05 -10.6 0.512 154.61 2.5 0.887 150.54 2.944 28.96 0.035 -30.13 0.539 128.94 3.0 0.917 135.01 2.081 13.19 0.03 -41.27 0.623 118.42 3.5 0.932 137.14 1.635 8.18 0.028 -41.69 0.643 124.18 4.0 0.913 143.42 1.641 3.36 0.032 -41.15 0.557 131.38 (ta = 25?, vds = 8 v, ids = 400 ma) 0.6 0.91 -131.25 9.129 100.5 0.026 17.07 0.521 -174.04 0.7 0.905 -139.87 7.943 95.18 0.026 13.22 0.534 -176.65 0.8 0.906 -146.47 7.028 90.26 0.026 11.05 0.543 -178.82 0.9 0.906 -151.44 6.281 86.16 0.027 8.59 0.547 179.94 1.0 0.904 -155.33 5.68 82.61 0.027 6.34 0.548 178.8 1.1 0.903 -158.37 5.226 79.83 0.027 3.72 0.547 178.18 1.2 0.903 -160.69 4.866 77.15 0.027 3.34 0.544 177.57 1.3 0.899 -167.2 4.574 74.6 0.028 0.5 0.538 176.86 1.4 0.897 -164.68 4.366 71.76 0.029 1.6 0.53 176.13 1.5 0.892 -166.63 4.203 68.96 0.03 -0.36 0.519 174.97 2.0 0.877 176.74 3.696 50.36 0.035 -13.77 0.463 160.21 2.5 0.882 150.43 3.014 26.66 0.036 -31.65 0.486 133.49 3.0 0.915 135.06 2.136 10.26 0.031 -46.6 0.579 121.99 3.5 0.93 137.37 1.662 4.59 0.027 -43.86 0.611 128.44 4.0 0.912 143.75 1.642 -0.35 0.031 -43.95 0.541 137.64 rf out rf in CFK2062-P1, 8v, 400 ma 50 ? uuuu v g uuuu 100 pf 50 ? 0.1 f 5.1 ? 0.1 f 91 ? 100 pf v d 6.8 pf 10 pf 47 nh 100 nh
3236 scott boulevard santa clara, california 95054 phone: (408) 986-5060 fax: (408) 986-5095 power output & power added efficiency vs power input 850 mhz, v ds = 5 v, i ds = 600 ma power input (dbm) power output (dbm) efficiency (%) efficiency power output 5 15 25 35 45 10 15 20 25 30 35 -5 0 5 15 20 10 55 power input (dbm) power output & power added efficiency vs power input 850 mhz, v ds = 8 v, i ds = 400 ma power output (dbm) efficiency (%) efficiency power output 0 10 20 30 40 50 10 15 20 25 30 35 -5 0 5 15 20 10 gain @ p -1 db frequency, mhz power output and gain vs frequency v ds =8v, i ds = 400 ma power output @ p -1 db 825 850 875 900 925 gain 20 21 22 23 19 28 29 30 31 32 power output frequency, mhz power output @ p -1 db gain @ p -1 db power output 19 20 21 22 18 gain 28 29 30 31 32 power output and gain vs frequency v ds =5v, i ds = 600 ma 825 875 925 850 900 volts power output and gain vs voltage @ 850 mhz i ds = 400 ma power output @ p -1 db gain @ p -1 db gain power output 19 22 25 28 31 34 17 18 19 20 21 22 3 5 7 4 6 8 volts power output and gain vs voltage @ 850 mhz i ds = 600 ma power output @ p -1 db gain @ p -1 db gain power output 18 19 20 21 22 23 3 5 7 4 6 8 21 24 27 30 33 36 CFK2062-P1 product specifications - december 1997 (3 of 4) typical performance
3236 scott boulevard, santa clara, california 95054 phone: (408) 986-5060 fax: (408) 986-5095 CFK2062-P1 product specifications - december 1997 (4 of 4) celeritek reserves the right to make changes without further notice to any products herein. celeritek makes no warranty, repres entation or guarantee regarding the suitability of its products for any particular purpose, nor does celeritek assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. ?ypical?parameters can and do vary in different applications. all operating parameters, including ?ypicals?must be validated for each customer application by customer s technical experts. celeritek doe s not convey any license under its patent rights nor the rights of others. celeritek products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the celeritek prod uct could create a situation where personal injury or death may occur. should buyer purchase or use celeritek products for any such unintended or unauthorized application, buyer shall indemnify and hold celeritek and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that celeritek was negligent regarding the design or manufacture of the part. celeritek is a registered trademark of celeritek, inc. celeritek, inc. is an e qual opportunity/affirmative action employer. ordering information the CFK2062-P1 power stage is available in a so-8 surface mount package. devices are available in tape and reel. ordering part numbers are listed. part number for ordering function package CFK2062-P1 800 - 900 mhz power stage so-8 surface mount power package CFK2062-P1-000t 800 - 900 mhz power stage so-8 surface mount power package in tape and reel thermal considerations the data shown was taken on a 31 mil thick fr-4 board with 1 ounce copper on both sides. the board was mounted to a base- plate with 3 screws as shown. the screws bring the top side copper temperature to the same value as the baseplate. the thermal resistance to the indicated reference lead, jl , is 12?/w. the thermal resistance to the reference screw is 14?/w. 1. use 1 or 2 ounce copper if possible. 2. solder all eight leads of the CFK2062-P1 package to the appropriate electrical connection. 3. solder the copper pad on the backside of the CFK2062-P1 package to the ground plane. 4. use a large ground pad area with many plated through-holes as shown. 5. if possible, use at least one screw no more than 0.2 inches from the CFK2062-P1 package to provide a low thermal resistance path to the baseplate of the package.
CFK2062-P1 800-900 mhz +30 dbm power gaas fet mimix broadband, inc., 10795 rockley rd., houston, texas 77099 tel: 281.988.4600 fax: 281.988.4615 mimixbroadband.com characteristic data and specifications are subject to change without notice. ? 2007 mimix broadband, inc. export of this item may require appropriate export licensing from the u.s. government. in purchasing these parts, u.s. domestic customers accept their obligation to be compliant with u.s. export laws. november 2007 - rev 15-nov-07 handling and assembly information caution! - mimix broadband mmic products contain gallium arsenide (gaas) which can be hazardous to the human body and the environment. for safety, observe the following procedures: do not ingest. do not alter the form of this product into a gas, powder, or liquid through burning, crushing, or chemical processing as these by-products are dangerous to the human body if inhaled, ingested, or swallowed. observe government laws and company regulations when discarding this product. this product must be discarded in accordance with methods specified by applicable hazardous waste procedures. life support policy - mimix broadband's products are not authorized for use as critical components in life support devices or systems without the express written approval of the president and general counsel of mimix broadband. as used herein: (1) life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury to the user. (2) a critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. package attachment - this packaged product from mimix broadband is provided as a rugged surface mount package compatible with high volume solder installation. care should be taken not to apply heavy pressure to the top or base material to avoid package damage. vacuum tools or other suitable pick and place equipment may be used to pick and place this part. care should be taken to ensure that there are no voids or gaps in the solder connection so that good rf, dc and ground connections are maintained. voids or gaps can eventually lead not only to rf performance degradation, but reduced reliability and life of the product due to thermal stress. mimix lead-free rohs compliant program - mimix has an active program in place to meet customer and governmental requirements for eliminating lead (pb) and other environmentally hazardous materials from our products. all mimix rohs compliant components are form, fit and functional replacements for their non-rohs equivalents. lead plating of our rohs compliant parts is 100% matte tin (sn) over copper alloy and is backwards compatible with current standard snpb low-temperature reflow processes as well as higher temperature (260c reflow) ?pb free? processes.
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