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1. product profile 1.1 general description the ld6806 series is a small-size low-dropo ut regulator (ldo) fa mily with a typical voltage drop of 60 mv at 200 ma current rating. the device is available in three different surface-mounted packages, one 0.4 mm pitch csp, one leadless plastic package sot886 and one gull wing package sot753. the operating voltage ranges from 2.3 v to 5.5 v and the output voltage ranges from 1.2 v to 3.6 v. ld6806x/xxh devices show a high-ohmic state at the output pin, while the ld6806x/xxp contains a pull-down switchin g transistor, to provide a low-ohmic output stage when the device is disabled. all devices use the same regulator design and are manufactured in monolithic silicon technology. these features make the ld6806 series ideal for use in applications requiring component miniaturization, such as mob ile phone handsets, cordless te lephones and personal digital devices. 1.2 features and benefits ? input voltage range 2.3 v to 5.5 v ? output voltage range 1.2 v to 3.6 v ? dropout voltage 60 mv at 200 ma output rating ? low quiescent current in shutdown mode (typical 1.0 ? a) ? 30 ? v rms output noise voltage (typical value) at 10 hz to 100 khz ? turn-on time just 200 ? s ? 55 db power supply rejection ratio (psrr) at 1 khz ? temperature watchdog ? current limiter ? ld6806xxxh: high-ohmic (3-state) output state when disabled ? ld6806xxxp: low-ohmic output state when disabled ? integrated esd protection of 10 kv human body model ? wlcsp with 0.4 mm pitch and package size of 0.76 mm ? 0.76 mm ? 0.47 mm ? sot886 leadless package 1.0 mm ? 1.45 mm ? 0.5 mm ? sot753 plastic surface-mounted device ? pb-free, rohs compliant and free of halogen and antimony (dark green compliant) ld6806 series ultra low-dropout regulato r, low noise, 200 ma rev. 3 ? 9 december 2011 product data sheet
ld6806_ser all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 3 ? 9 december 2011 2 of 36 nxp semiconductors ld6806 series ultra low-dropout regulator, low noise, 200 ma 1.3 applications ? analog and digital interfaces requiring lower than standard supply voltage in mobile appliances such as mobile phones, media players and so on. 2. pinning information 2.1 pinning 2.2 pin description fig 1. configuration for sot753 fig 2. configuration for wlcsp4 fig 3. configuration for sot886 13 2 45 001aao10 7 transparent top view, solder balls facing down b a 21 bump a1 index area ld6806 n.c. 001aao333 out gnd n.c. in en transparent top view 2 3 1 5 4 6 table 1. pin description for sot753 symbol pin description in 1 supply voltage input gnd 2 supply ground en 3 device enable input; active high n.c. 4 not connected out 5 regulator output voltage table 2. pin description for wlcsp4 symbol pin description gnd a1 supply ground en a2 device enable input; active high out b1 regulator output voltage in b2 supply voltage input table 3. pin description for sot886 symbol pin description out 1 regulator output voltage n.c. 2 not connected gnd 3 supply ground
ld6806_ser all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 3 ? 9 december 2011 3 of 36 nxp semiconductors ld6806 series ultra low-dropout regulator, low noise, 200 ma 3. ordering information [1] size 0.76 mm ? 0.76 mm. 3.1 ordering options further information on output volt age is available on request; see section 21 ? contact information ? . en 4 device enable input; active high n.c. 5 not connected in 6 supply voltage input table 3. pin description for sot886 symbol pin description table 4. ordering information type number package name description version LD6806CX4/xxx wlcsp4 wafer level chip-size package; 4 bumps (2 ? 2) [1] - LD6806CX4/c/xxx wlcsp4 wafer level chip-size package; 4 bumps (2 ? 2) with backside coating [1] - ld6806f/xxx xson6 plastic extremely thin small outline package; no leads; 6 terminals; body 1 ? 1.45 ? 0.5 mm sot886 ld6806td/xxx tsop5 plastic surface-mounted package; 5 leads sot753 table 5. type number and nominal output voltage of high-ohmic output type number nominal output voltage type number nominal output voltage ld6806[cx4, cx4/c, f, td]/12h 1.2 v ld 6806[cx4, cx4/c, f, td]/23h 2.3 v ld6806[cx4, cx4/c, f, td]/13h 1.3 v ld 6806[cx4, cx4/c, f, td]/25h 2.5 v ld6806[cx4, cx4/c, f, td]/14h 1.4 v ld 6806[cx4, cx4/c, f, td]/28h 2.8 v ld6806[cx4, cx4/c, f, td]/16h 1.6 v ld 6806[cx4, cx4/c, f, td]/29h 2.9 v ld6806[cx4, cx4/c, f, td]/18h 1.8 v ld 6806[cx4, cx4/c, f, td]/30h 3.0 v ld6806[cx4, cx4/c, f, td]/20h 2.0 v ld 6806[cx4, cx4/c, f, td]/33h 3.3 v ld6806[cx4, cx4/c, f, td]/22h 2.2 v ld 6806[cx4, cx4/c, f, td]/36h 3.6 v table 6. type number and nominal output voltage of low.ohmic output type number nominal output voltage type number nominal output voltage ld6806[cx4, cx4/c, f, td]/12p 1.2 v ld 6806[cx4, cx4/c, f, td]/23p 2.3 v ld6806[cx4, cx4/c, f, td]/13p 1.3 v ld 6806[cx4, cx4/c, f, td]/25p 2.5 v ld6806[cx4, cx4/c, f, td]/14p 1.4 v ld 6806[cx4, cx4/c, f, td]/28p 2.8 v ld6806[cx4, cx4/c, f, td]/16p 1.6 v ld 6806[cx4, cx4/c, f, td]/29p 2.9 v
ld6806_ser all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 3 ? 9 december 2011 4 of 36 nxp semiconductors ld6806 series ultra low-dropout regulator, low noise, 200 ma 4. block diagram ld6806[cx4, cx4/c, f, td]/18p 1.8 v ld 6806[cx4, cx4/c, f, td]/30p 3.0 v ld6806[cx4, cx4/c, f, td]/20p 2.0 v ld 6806[cx4, cx4/c, f, td]/33p 3.3 v ld6806[cx4, cx4/c, f, td]/22p 2.2 v ld 6806[cx4, cx4/c, f, td]/36p 3.6 v table 6. type number and nominal output voltage of low.ohmic output ?continued type number nominal output voltage type number nominal output voltage fig 4. block diagram of ld6806x/xxh fig 5. block diagram of ld6806x/xxp 001aan756 thermal protection overcurrent protection v reference generator v in v out gnd r2 r1 v en 001aan299 thermal protection over current protection v reference generator v in v out gnd r2 r1 v en
ld6806_ser all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 3 ? 9 december 2011 5 of 36 nxp semiconductors ld6806 series ultra low-dropout regulator, low noise, 200 ma 5. limiting values [1] the (absolute) maximum power dissipa tion depends on the junction temperature t j . higher power dissipation is allowed with lower ambient temperatures. the conditions to determine the specified values are t amb = 25 ? c and the use of a two layer pcb. [2] according to iec 61340-3-1. [3] according to jesd22-a115c. 6. recommended operating conditions [1] see section 10.1 ? output capacitor values ? . table 7. limiting values in accordance with the absolute maximum rating system (iec 60134). voltages are referenced to gnd (ground = 0 v). symbol parameter conditions min max unit v in voltage on pin in 4 ms transient ? 0.5 +6.0 v p tot total power dissipation LD6806CX4/xxx, LD6806CX4/cxxx [1] -7 7 0m w ld6806f/xxx [1] -4 5 0m w ld6806td/xxx [1] -8 0 0m w t stg storage temperature ? 55 +150 ?c t j junction temperature ? 40 +125 ?c t amb ambient temperature ? 40 +85 ?c v esd electrostatic discharge voltage human body model level 6 [2] ? 10 kv machine model class 3 [3] - ? 400 v table 8. operating conditions voltages are referenced to gnd (ground = 0 v). symbol parameter conditions min max unit t amb ambient temperature ? 40 +85 ?c t j junction temperature - +125 ?c pin in v in voltage on pin in 2.3 5.5 v pin en v en voltage on pin en 0 v in v pin out c l(ext) external load capacitance [1] 1.0 - ? f
ld6806_ser all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 3 ? 9 december 2011 6 of 36 nxp semiconductors ld6806 series ultra low-dropout regulator, low noise, 200 ma 7. thermal characteristics [1] the overall r th(j-a) can vary depending on the board layout. to minimize the effective r th(j-a) , all pins must have a solid connection to larger cu layer areas for example to the power and ground layer. in multi-layer pcb applications, the second layer should be used to create a large heat spreader area directly below the ldo. if this layer is either ground or power, it should be connected with several vias to the top layer connecting to the device ground or suppl y. avoid the use of solder-stop varnish under the chip. [2] use the measurement data given for a rough estimation of the r th(j-a) in your application. the actual r th(j-a) value can vary in applications using different layer stacks and layouts. 8. characteristics table 9. thermal characteristics symbol parameter conditions typ unit r th(j-a) thermal resistance from junction to ambient LD6806CX4/xxx, LD6806CX4/cxxx [1] [2] 130 k/w ld6806f/xxx [1] [2] 220 k/w ld6806td/xxx [1] [2] 125 k/w table 10. electrical characteristics at recommended input voltages and t amb = ? 40 ? cto+85 ? c; voltages are referenced to gnd (ground = 0 v); unless otherwise specified. symbol parameter conditions min typ max unit ? v o output voltage variation v out < 1.8 v; i out = 1 ma t amb = +25 ?c ? 3 ? 0.5 +3 % ? 30 ?c ? t amb ? +85 ?c ? 4- +4 % v out ? 1.8 v; i out = 1 ma t amb = +25 ?c ? 2 ? 0.5 +2 % ? 30 ?c ? t amb ? +85 ?c ? 3- +3 % line regulation error ? v o /(v o x? v i ) relative output voltage variation with input voltage v in = (v o(nom) + 0.2 v) to 5.5 v [1] ? 0.1 - +0.1 %/v load regulation error ? v o /(v o x? i o ) relative output voltage variation with output current 1ma ? i out ? 200 ma LD6806CX4/xxx, LD6806CX4/cxxx - 0.0025 0.01 %/ma ld6806f/xxx, ld6806td/xxx - 0.005 0.02 %/ma v do dropout voltage i out = 200 ma; v in >v o(nom) [1] LD6806CX4/xxx, LD6806CX4/cxxx - 60 100 mv ld6806f/xxx, ld6806td/xxx - 80 130 mv v il low-level input voltage pin en 0 - 0.4 v v ih high-level input voltage pin en 1.4 - 5.5 v i out current on pin out - - 200 ma i om peak output current v in =(v o(nom) + 0.2 v) to 5.5 v [1] v o(nom) > 1.8 v; v out ? 0.95 ? v o(nom) 300 - - ma v o(nom) < 1.8 v; v out ? 0.9 ? v o(nom) 300 - - ma
ld6806_ser all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 3 ? 9 december 2011 7 of 36 nxp semiconductors ld6806 series ultra low-dropout regulator, low noise, 200 ma [1] v o(nom) = nominal output voltage (device specific). [2] the junction temperature must decrease by t sd(hys) to enable the device after t sd was reached and the device was disabled. [3] ld6806x/xxp only. 9. dynamic behavior all results described in section 9 are based on measurements of types LD6806CX4xxx and ld6806fxxx from the ld 6806 product series within section 6 ? recommended operating conditions ? . 9.1 dropout the dropout voltage is defined as the smallest input to output voltage difference at a specified load current when the regulator operates within its linear region with the pass transistor functioning as a plain resistor. this means that the input voltage is below the nominal output voltage value. a small dropout voltage guaranties lower power consumption and efficiency maximization. i sc short-circuit current pin out - 600 - ma i q quiescent current v en = 1.4 v; i out = 0 ma - 70 100 ? a v en = 1.4v; 1ma ? i out ? 200 ma - 155 250 ? a v en ? 0.4 v - 0.1 1.0 ? a t sd shutdown temperature - 160 - ?c t sd(hys) shutdown temperature hysteresis [2] -20 - ?k psrr power supply rejection ratio v in = v o(nom) + 1 v; i out = 30 ma; f ripple = 1 khz [1] - ? 55 - db v n(o)(rms) rms output noise voltage bandwidth = 10 hz to 100 khz; c l(ext) =1 ? f -30 - ? v t startup(reg) regulator start-up time v in = 5.5 v; v out = 0.95 ? v o(nom) ; i out = 200 ma; c l(ext) =1 ? f [1] - - 200 ? s t sd(reg) regulator shutdown time v in = 5.5 v; c l(ext) =1 ? f [3] -300- ? s r pd pull-down resistance [3] -100- ? table 10. electrical characteristics ?continued at recommended input voltages and t amb = ? 40 ? cto+85 ? c; voltages are referenced to gnd (ground = 0 v); unless otherwise specified. symbol parameter conditions min typ max unit
ld6806_ser all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 3 ? 9 december 2011 8 of 36 nxp semiconductors ld6806 series ultra low-dropout regulator, low noise, 200 ma (1) +85 ? c (2) +25 ? c (3) ? 40 ? c (1) +85 ? c (2) +25 ? c (3) ?40 ? c fig 6. dropout as a function of temperature for LD6806CX4/25h fig 7. dropout as a function of temperature for ld6806f/25h i out (ma) 0 200 160 80 120 40 001aan929 40 60 20 80 100 v do (mv) 0 (1) (2) (3) i out (ma) 0 200 160 80 120 40 001aan930 40 60 20 80 100 v do (mv) 0 (1) (2) (3) (1) +85 ? c (2) +25 ? c (3) ? 40 ? c (1) +85 ? c (2) +25 ? c (3) ?40 ? c fig 8. dropout as a function of temperature for LD6806CX4/36h fig 9. dropout as a function of temperature for ld6806f/36h i out (ma) 0 200 160 80 120 40 001aan935 40 60 20 80 100 v do (mv) 0 (1) (2) (3) i out (ma) 0 200 160 80 120 40 001aan936 40 60 20 80 100 v do (mv) 0 (1) (2) (3)
ld6806_ser all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 3 ? 9 december 2011 9 of 36 nxp semiconductors ld6806 series ultra low-dropout regulator, low noise, 200 ma 9.2 output voltage variation the guaranteed output voltages are specified in ta b l e 1 0 . (1) +85 ? c (2) +25 ? c (3) ?40 ? c fig 10. dropout as a function of temperature for ld6806td/36p i out (ma) 0 200 160 80 120 40 018aaa223 40 60 20 80 100 v do (mv) 0 (1) (2) (3) (1) i out =1ma (2) i out = 100 ma (3) i out = 200 ma (1) i out =1ma (2) i out = 100 ma (3) i out = 200 ma fig 11. output voltage variation for LD6806CX4/12h fi g 12. output voltage variation for LD6806CX4/25h t amb (c) -60 140 100 20 60 -20 001aan942 1.20 1.18 1.22 1.24 v out (v) 1.16 (1) (2) (3) t amb (c) -60 140 100 20 60 -20 001aan943 2.50 2.48 2.52 2.54 v out (v) 2.46 (1) (2) (3)
ld6806_ser all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 3 ? 9 december 2011 10 of 36 nxp semiconductors ld6806 series ultra low-dropout regulator, low noise, 200 ma 9.3 quiescent current quiescent or ground current is the difference between the input and the output current of the regulator. (1) i out =10ma (2) i out =0ma (1) i out =10ma (2) i out =0ma fig 13. quiescent current for LD6806CX4/12h fig 14. quiescent current for LD6806CX4/25h t amb (c) -60 140 100 20 60 -20 001aao106 i gnd (a) 60 65 70 75 80 (1) (2) t amb (c) -60 140 100 20 60 -20 001aan944 75 80 85 i gnd (a) 70 (1) (2)
ld6806_ser all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 3 ? 9 december 2011 11 of 36 nxp semiconductors ld6806 series ultra low-dropout regulator, low noise, 200 ma 9.4 noise output noise voltage of an ldo circuit is given as noise density or rms output noise voltage over a defined range of frequencies (10 hz to 100 khz). permanent conditions are a constant output current and a ripple-free in put voltage. the output noise voltage is generated by the ldo regulator. (1) 0 ma (2) 1 ma (3) 50 ma (4) 100 ma (5) 150 ma (6) 200 ma (1) 0 ma (2) 1 ma (3) 50 ma (4) 100 ma (5) 150 ma (6) 200 ma fig 15. noise density for LD6806CX4/25h fig 16. noise density for LD6806CX4/36h 001aan941 1 10 -1 10 10 -2 10 10 5 10 4 10 2 10 3 (1) (2) (3) (4) (5) (6) noise (v/hz) frequency (hz) 001aao104 1 10 -1 10 noise (v/hz) 10 -2 frequency (hz) 10 10 5 10 4 10 2 10 3 (1) (2) (3) (4) (5) (6)
ld6806_ser all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 3 ? 9 december 2011 12 of 36 nxp semiconductors ld6806 series ultra low-dropout regulator, low noise, 200 ma 9.5 line regulation line regulation response is th e capability of the circuit to maintain the nominal output voltage while varying the input voltage. regulation % v ? ?? v out ? v in ? ---------------- - 100 v out ------------- ? = (1) v in (2) v out (1) v in (2) v out fig 17. line regulation for LD6806CX4/12h fig 18. line regulation for ld6806f/12h time (ms) 0 0.8 0.6 0.2 0.4 001aan925 2 4 6 v in (v) 0 1.4 1.8 1.2 1.6 2.0 v out (v) 1.0 (1) (2) time (ms) 0 0.2 0.4 0.6 0.7 0.5 0.3 0.1 001aan926 2 4 6 v in (v) 0 1.4 1.8 1.2 1.6 2.0 v out (v) 1.0 (1) (2) (1) v in (2) v out (1) v in (2) v out fig 19. line regulation for LD6806CX4/25h fig 20. line regulation for ld6806f/25h time (ms) 0 0.4 0.3 0.1 0.2 001aan931 2 4 6 v in (v) 0 2.51 2.54 2.47 2.53 2.55 v out (v) 2.45 2.49 2.46 2.52 2.48 2.50 (1) (2) time (ms) 0 0.4 0.3 0.1 0.2 001aan932 2 4 6 v in (v) 0 2.51 2.54 2.47 2.53 2.55 v out (v) 2.45 2.49 2.46 2.52 2.48 2.50 (1) (2)
ld6806_ser all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 3 ? 9 december 2011 13 of 36 nxp semiconductors ld6806 series ultra low-dropout regulator, low noise, 200 ma 9.6 load regulation load regulation is the capability of the circui t to maintain the nominal output voltage while varying the output load current. (1) v in (2) v out (1) v in (2) v out fig 21. line regulation for LD6806CX4/36h fig 22. line regulation for ld6806f/36h time (ms) 0 0.8 0.6 0.2 0.4 001aan937 2 4 6 v in (v) 0 3.55 3.65 3.75 v out (v) 3.45 (1) (2) time (ms) 0 0.70.6 0.2 0.4 0.1 0.3 0.5 001aan938 2 4 6 v in (v) 0 3.55 3.65 3.75 v out (v) 3.45 (1) (2) load regulation % ma ? ?? v out ? v o nom ?? ------------------- 100 ? i out max ?? ---------------------------------- - = (1) i out (2) v out (1) i out (2) v out fig 23. load regulation for LD6806CX4/12h fig 24. load regulation for ld6806f/12h time (ms) 0 0.2 0.4 0.6 0.7 0.5 0.3 0.1 001aan927 0.1 0.3 0.5 i out (a) -0.1 0.9 1.2 0.7 1.1 1.3 v out (v) 0.5 0.8 0.6 1.0 (1) (2) time (ms) 0 0.8 0.6 0.2 0.4 001aan928 0.1 0.3 0.5 i out (a) -0.1 1.10 1.25 1.00 1.20 1.30 v out (v) 0.90 1.05 0.95 1.15 (1) (2)
ld6806_ser all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 3 ? 9 december 2011 14 of 36 nxp semiconductors ld6806 series ultra low-dropout regulator, low noise, 200 ma (1) i out (2) v out (1) i out (2) v out fig 25. load regulation for LD6806CX4/25h fig 26. load regulation for ld6806f/25h time (ms) 0 0.4 0.3 0.1 0.2 001aan933 0.1 0.3 0.5 i out (a) -0.1 2.4 2.5 2.6 v out (v) 2.3 (1) (2) time (ms) 0 0.4 0.3 0.1 0.2 001aan934 0.1 0.3 0.5 i out (a) -0.1 2.4 2.5 2.6 v out (v) 2.3 (1) (2) (1) i out (2) v out (1) i out (2) v out fig 27. load regulation for LD6806CX4/36h fig 28. load regulation for ld6806f/36h time (ms) 0 0.70.6 0.2 0.4 0.1 0.3 0.5 001aan939 0.1 0.3 0.5 i out (a) -0.1 3.5 3.6 3.7 v out (v) 3.4 (1) (2) time (ms) 0 0.70.6 0.2 0.4 0.1 0.3 0.5 001aan940 0.1 0.3 0.5 i out (a) -0.1 3.5 3.6 3.7 v out (v) 3.4 (1) (2)
ld6806_ser all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 3 ? 9 december 2011 15 of 36 nxp semiconductors ld6806 series ultra low-dropout regulator, low noise, 200 ma 9.7 start-up and shut down start-up time defines the time needed for th e ldo to achieve 95 % of its typical output voltage level after activation via the enable pin. shut down time defines the time needed for the ldo to pull-down the output voltage to 10% of its nominal output voltage after deactivation via the enable pin. (1) v en . (2) v out . (1) v en . (2) v out . fig 29. start-up for LD6806CX4/23h fig 30. shut down for ld6806f/25p time (ms) 0 0.2 0.15 0.05 0.1 001aan946 0.8 0.4 1.2 1.6 v enable (v) 0 v out (v) 0.5 1 1.5 2 2.5 3 0 (1) (2) time (ms) 0 0.4 0.3 0.1 0.2 001aan947 0.8 1 0.6 0.4 0.2 1.2 1.4 v enable (v) 0 (1) (2) v out (v) 0.5 1 1.5 2 2.5 3 0
ld6806_ser all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 3 ? 9 december 2011 16 of 36 nxp semiconductors ld6806 series ultra low-dropout regulator, low noise, 200 ma 9.8 power supply reje ction ratio (psrr) psrr stands for the capability of the regulator to suppress unwanted signals on the input voltage like noise or ripples. for all frequencies psrr db ?? 20 v out ripple ?? v in ripple ?? -------------------------- log = (1) 1 ma (2) 50 ma (3) 100 ma (4) 200 ma (1) 1 ma (2) 50 ma (3) 100 ma (4) 200 ma fig 31. psrr for LD6806CX4/25h fig 32. psrr for LD6806CX4/36h 001aan945 0 psrr (db) -70 frequency (hz) 10 2 10 5 10 4 10 3 -60 -50 -40 -30 -20 -10 (1) (2) (3) (4) 001aao105 -40 -20 0 pssr (db) -60 frequency (hz) 10 2 10 5 10 4 10 3 (1) (2) (3) (4)
ld6806_ser all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 3 ? 9 december 2011 17 of 36 nxp semiconductors ld6806 series ultra low-dropout regulator, low noise, 200 ma 9.9 enable threshold voltage an active high signal enables the ldo wh en the signal exceeds the minimum input high voltage threshold. the device is in off state as long the signal is below the maximum low threshold. the input voltage threshold is independent from the ldo supply voltage. (1) low to high (2) high to low fig 33. enable threshold voltage v en (v) 0.3 1.5 1.1 0.7 0.5 1.3 0.9 001aan808 1.5 0.5 2.5 3.5 v out (v) -0.5 (2) (1)
ld6806_ser all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 3 ? 9 december 2011 18 of 36 nxp semiconductors ld6806 series ultra low-dropout regulator, low noise, 200 ma 10. application information 10.1 output capacitor values the ld6806 series requires external capaci tors at the output to guarantee a stable regulator behavior. also an input capacitor is recommended to keep the input voltage stable. these capacitors should not under-ru n the specified minimum equivalent series resistance (esr). the absolute value of the total capacitance attached to the output pin out influences the shutdown time (t sd(reg) ) of the ld6806 series. [1] the minimum value of capacitance fo r stability and correct operation is 0.7 ? f. the capacitor tolerance should be ? 30 % or better over the temperature range. t he full range of operating conditions for the capacitor in the application should be considered during device selecti on to ensure that this minimum capacitance specification is met. the recommended capacitor type is x7r to meet the full device temperature specification of ?40 ? c to +125 ? c. 11. test information 11.1 quality information this product has been qualified in accordance with nx2-00001 nxp semiconductors quality and reliability specification and is suitable for use in consumer applications. table 11. external load capacitor symbol parameter conditions min typ max unit c l(ext) external load capacitance [1] -1.0- ? f esr equivalent series resistance 5 - 500 m ? fig 34. application diagram out out in gnd in en 1f 1f 001aan647
ld6806_ser all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 3 ? 9 december 2011 19 of 36 nxp semiconductors ld6806 series ultra low-dropout regulator, low noise, 200 ma 12. package outline fig 35. package outline wlcsp4 wlcsp4_2x2_po european projection wlcsp4: wafer level chip-size package; 4 bumps (2 x 2) bump a1 index area d e x detail x a a 1 a 2 b e e 12 a b table 12. dimensions of LD6806CX4/xxx for package outline wlcsp4; see figure 35 symbol min typ max unit a 0.44 0.47 0.50 mm a 1 0.18 0.20 0.22 mm a 2 0.26 0.27 0.28 mm b 0.21 0.26 0.31 mm d 0.71 0.76 0.81 mm e 0.71 0.76 0.81 mm e- 0 . 4 - m m
ld6806_ser all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 3 ? 9 december 2011 20 of 36 nxp semiconductors ld6806 series ultra low-dropout regulator, low noise, 200 ma fig 36. package outline wlcsp4 with backside coating european projection bump a1 index area d e b e e 12 a b wlcsp4: wafer level chip-size package with backside coating; 4 bumps (2 x 2) detail x a a 1 a 2 a 3 wlcsp4_2x2_c_po x table 13. dimensions of LD6806CX4/cxxx for packag e outline wlcsp4 with backside coating; see figure 36 symbol min typ max unit a 0.47 0.51 0.55 mm a 1 0.18 0.20 0.22 mm a 2 0.26 0.27 0.28 mm a 3 0.03 0.04 0.05 mm b 0.21 0.26 0.31 mm d 0.71 0.76 0.81 mm e 0.71 0.76 0.81 mm e- 0 . 4 - m m
ld6806_ser all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 3 ? 9 december 2011 21 of 36 nxp semiconductors ld6806 series ultra low-dropout regulator, low noise, 200 ma fig 37. package outline sot886 (xson6) terminal 1 index area references outline version european projection issue date iec jedec jeita sot886 mo-252 sot886 04-07-15 04-07-22 dimensions (mm are the original dimensions) xson6: plastic extremely thin small outline package; no leads; 6 terminals; body 1 x 1.45 x 0.5 mm d e e 1 e a 1 b l l 1 e 1 0 1 2 mm scale notes 1. including plating thickness. 2. can be visible in some manufacturing processes. unit mm 0.25 0.17 1.5 1.4 0.35 0.27 a 1 max b e 1.05 0.95 d ee 1 l 0.40 0.32 l 1 0.50.6 a (1) max 0.5 0.04 1 6 2 5 3 4 6 (2) 4 (2) a
ld6806_ser all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 3 ? 9 december 2011 22 of 36 nxp semiconductors ld6806 series ultra low-dropout regulator, low noise, 200 ma fig 38. sot753; plastic surface-mounted package; 5 leads references outline version european projection issue date iec jedec jeita sot753 sc-74a wb m b p d e a a 1 l p q detail x h e e v m a a b y 0 1 2 mm scale c x 13 2 4 5 plastic surface-mounted package; 5 leads sot753 unit a 1 b p cd e h e l p qy wv mm 0.100 0.013 0.40 0.25 3.1 2.7 0.26 0.10 1.7 1.3 e 0.95 3.0 2.5 0.2 0.1 0.2 dimensions (mm are the original dimensions) 0.6 0.2 0.33 0.23 a 1.1 0.9 02-04-16 06-03-16
ld6806_ser all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 3 ? 9 december 2011 23 of 36 nxp semiconductors ld6806 series ultra low-dropout regulator, low noise, 200 ma 13. soldering fig 39. soldering footprint wlcsp4 wlcsp4_2x2_fr solder resist occupied area solder paste = solderland dimensions in mm e d ee c (4) f (4) table 14. dimensions of soldering footprint wlcsp4; see figure 39 symbol min typ max unit c - 0.25 - mm d 0.71 0.76 0.81 mm e 0.71 0.76 0.81 mm e-0.4-mm f - 0.325 - mm fig 40. soldering footprint sot886 (xson6) sot886_fr solder resist occupied area solder paste = solderland dimensions in mm 0.425 (6) 1.250 0.675 1.700 0.325 (6) 0.270 (6) 0.370 (6) 0.500 0.500
ld6806_ser all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 3 ? 9 december 2011 24 of 36 nxp semiconductors ld6806 series ultra low-dropout regulator, low noise, 200 ma 14. soldering of wlcsp packages 14.1 introduction to soldering wlcsp packages this text provides a very brief insight into a complex technology. a more in-depth account of soldering wlcsp (wafer level chip-size packages) can be found in application note an10439 ?wafer level chip scale package? and in application note an10365 ?surface mount reflow soldering description? . wave soldering is not su itable for this package. fig 41. sot753 (tsop5); refl ow soldering footprint fig 42. sot753 (tsop5); wave soldering footprint solder lands solder resist occupied area solder paste sot753_fr 2.8253.3 0.45 (5) 0.55 (5) 0.7 (5) 0.8 (5) 3.45 1.95 0.95 0.95 2.4 dimensions in mm sot753_fw 5.3 5.05 0.45 1.5 (4) 1.45 (5) 2.85 1.475 1.475 solder lands solder resist occupied area preferred transport direction during soldering dimensions in mm
ld6806_ser all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 3 ? 9 december 2011 25 of 36 nxp semiconductors ld6806 series ultra low-dropout regulator, low noise, 200 ma all nxp wlcsp packages are lead-free. 14.2 board mounting board mounting of a wlcsp requires several steps: 1. solder paste printing on the pcb 2. component placement with a pick and place machine 3. the reflow soldering itself 14.3 reflow soldering key characteristics in reflow soldering are: ? lead-free versus snpb solderi ng; note that a lead-free reflow process usually leads to higher minimum peak temperatures (see figure 43 ) than a pbsn process, thus reducing the process window ? solder paste printing issues, such as sm earing, release, and adjusting the process window for a mix of large and small components on one board ? reflow temperature profile; this profile includ es preheat, reflow (in which the board is heated to the peak temperature), and coo ling down. it is imper ative that the peak temperature is high enough for the solder to make reliable solder joints (a solder paste characteristic) while being low enough that the packages and/or boards are not damaged. the peak temperature of the package depends on package thickness and volume and is classified in accordance with ta b l e 1 5 . moisture sensitivity precautions, as indicat ed on the packing, must be respected at all times. studies have shown that small packages reach higher temperatures during reflow soldering, see figure 43 . table 15. lead-free process (from j-std-020c) package thickness (mm) package reflow temperature ( ?c) volume (mm 3 ) < 350 350 to 2000 > 2000 < 1.6 260 260 260 1.6 to 2.5 260 250 245 > 2.5 250 245 245
ld6806_ser all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 3 ? 9 december 2011 26 of 36 nxp semiconductors ld6806 series ultra low-dropout regulator, low noise, 200 ma for further information on temperature profiles, refer to application note an10365 ?surface mount reflow soldering description? . 14.3.1 stand off the stand off between the substrate and the chip is determined by: ? the amount of printed solder on the substrate ? the size of the solder land on the substrate ? the bump height on the chip the higher the stand off, the better the stresses are released due to tec (thermal expansion coefficient) differences between substrate and chip. 14.3.2 quality of solder joint a flip-chip joint is considered to be a good joint when the entire solder land has been wetted by the solder from the bump. the surface of the joint should be smooth and the shape symmetrical. the soldered joints on a chip should be uniform. voids in the bumps after reflow can occur during the reflow process in bumps with high ratio of bump diameter to bump height, i.e. low bumps with large diameter. no failures have been found to be related to these voids. solder joint inspection after reflow can be done with x-ray to monitor defects such as bridging, open circuits and voids. 14.3.3 rework in general, rework is not recommended. by rework we mean the process of removing the chip from the substrate and replacing it with a new chip. if a chip is removed from the substrate, most solder balls of the chip will be damaged. in that case it is recommended not to re-use the chip again. msl: moisture sensitivity level fig 43. temperature profiles for large and small components 001aac844 temperature time minimum peak temperature = minimum soldering temperature maximum peak temperature = msl limit, damage level peak temperature
ld6806_ser all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 3 ? 9 december 2011 27 of 36 nxp semiconductors ld6806 series ultra low-dropout regulator, low noise, 200 ma device removal can be done when the substrate is heated until it is certain that all solder joints are molten. the chip can then be carefully removed from the substrate without damaging the tracks and solder lands on the substrate. removing the device must be done using plastic tweezers, because me tal tweezers can damage the silicon. the surface of the substrate should be carefully cleaned and all solder and flux residues and/or underfill remove d. when a new chip is placed on the substrate, use the flux process instead of solder on the solder lands. apply flux on the bumps at the chip side as well as on the solder pads on the substrate. place and align the new chip while viewing with a microscope. to reflow the solder, use the solder profile shown in application note an10365 ?surface mount reflow soldering description? . 14.3.4 cleaning cleaning can be done after reflow soldering. 15. soldering of smd packages this text provides a very brief insight into a complex technology. a more in-depth account of soldering ics can be found in application note an10365 ?surface mount reflow soldering description? . 15.1 introduction to soldering soldering is one of the most common methods through which packages are attached to printed circuit boards (pcbs), to form electr ical circuits. the soldered joint provides both the mechanical and the electrical connection. th ere is no single sold ering method that is ideal for all ic packages. wave soldering is often preferred when through-hole and surface mount devices (smds) are mixed on one printed wiring board; however, it is not suitable for fine pitch smds. reflow soldering is ideal for the small pitches and high densities that come with increased miniaturization. 15.2 wave and reflow soldering wave soldering is a joining technology in which the joints are made by solder coming from a standing wave of liquid solder. the wave soldering process is suitable for the following: ? through-hole components ? leaded or leadless smds, which are glued to the surface of the printed circuit board not all smds can be wave soldered. packages with solder balls, and some leadless packages which have solder lands underneath the body, cannot be wave soldered. also, leaded smds with leads having a pitch smaller than ~0.6 mm cannot be wave soldered, due to an increased pr obability of bridging. the reflow soldering process involves applying solder paste to a board, followed by component placement and exposure to a temperature profile. leaded packages, packages with solder balls, and leadless packages are all reflow solderable. key characteristics in both wave and reflow soldering are: ? board specifications, in cluding the board finish , solder masks and vias ? package footprints, including solder thieves and orientation
ld6806_ser all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 3 ? 9 december 2011 28 of 36 nxp semiconductors ld6806 series ultra low-dropout regulator, low noise, 200 ma ? the moisture sensitivit y level of the packages ? package placement ? inspection and repair ? lead-free soldering versus snpb soldering 15.3 wave soldering key characteristics in wave soldering are: ? process issues, such as application of adhe sive and flux, clinching of leads, board transport, the solder wave parameters, and the time during which components are exposed to the wave ? solder bath specifications, including temperature and impurities 15.4 reflow soldering key characteristics in reflow soldering are: ? lead-free versus snpb solderi ng; note that a lead-free reflow process usually leads to higher minimum peak temperatures (see figure 44 ) than a snpb process, thus reducing the process window ? solder paste printing issues including smearing, release, and adjusting the process window for a mix of large and small components on one board ? reflow temperature profile; this profile includ es preheat, reflow (in which the board is heated to the peak temperature) and cooling down. it is imperative that the peak temperature is high enough for the solder to make reliable solder joints (a solder paste characteristic). in addition, the peak temperature must be low enough that the packages and/or boards are not damaged. the peak temperature of the package depends on package thickness and volume and is classified in accordance with ta b l e 1 6 and 17 moisture sensitivity precautions, as indicat ed on the packing, must be respected at all times. table 16. snpb eutectic process (from j-std-020c) package thickness (mm) package reflow temperature ( ?c) volume (mm 3 ) < 350 ? 350 < 2.5 235 220 ? 2.5 220 220 table 17. lead-free process (from j-std-020c) package thickness (mm) package reflow temperature ( ?c) volume (mm 3 ) < 350 350 to 2000 > 2000 < 1.6 260 260 260 1.6 to 2.5 260 250 245 > 2.5 250 245 245
ld6806_ser all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 3 ? 9 december 2011 29 of 36 nxp semiconductors ld6806 series ultra low-dropout regulator, low noise, 200 ma studies have shown that small packages reach higher temperatures during reflow soldering, see figure 44 . for further information on temperature profiles, refer to application note an10365 ?surface mount reflow soldering description? . 16. mounting 16.1 pcb design guidelines it is recommended, for optimum performance, to use a non-solder mask defined (nsmd), also known as a coppe r-defined design, in corporating laser-drilled micro-vias connecting the ground pads to a buried ground-plane layer. this results in the lowest possible ground inductance and provides the best high frequency and esd performance. refer to ta b l e 1 8 for the recommended pcb design parameters. msl: moisture sensitivity level fig 44. temperature profiles for large and small components 001aac844 temperature time minimum peak temperature = minimum soldering temperature maximum peak temperature = msl limit, damage level peak temperature table 18. recommended pcb design parameters parameter value or specification pcb pad diameter 250 ? m micro-via diameter 100 ? m (0.004 inch) solder mask aperture diameter 325 ? m copper thickness 20 ? m to 40 ? m copper finish auni or osp pcb material fr4
ld6806_ser all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 3 ? 9 december 2011 30 of 36 nxp semiconductors ld6806 series ultra low-dropout regulator, low noise, 200 ma 16.2 pcb assembly guidelines for pb-free soldering table 19. assembly recommendations parameter value or specification solder screen aperture diameter 250 ? m solder screen thickness 100 ? m (0.004 inch) solder paste: pb-free snag (3 % to 4 %); cu (0.5 % to 0.9 %) solder to flux ratio 50 : 50 solder reflow profile see figure 45 the device is capable of withstanding at least three reflows at this profile. fig 45. pb-free solder reflow profile table 20. characteristics symbol parameter conditions min typ max unit t reflow(peak) peak reflow temperature 230 - 260 ?c t 1 time 1 soak time 60 - 180 s t 2 time 2 time during t ? 250 ? c--30s t 3 time 3 time during t ? 230 ? c10-50s t 4 time 4 time during t > 217 ? c 30 - 150 s t 5 time 5 - - 540 s dt/dt rate of change of temperature cooling rate - - ? 6 ?c/s preheat 2.5 - 4.0 ?c/s 001aai943 t reflow(peak) 250 230 217 t (c) cooling rate preheat t 1 t 5 t 4 t 3 t 2 t (s)
ld6806_ser all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 3 ? 9 december 2011 31 of 36 nxp semiconductors ld6806 series ultra low-dropout regulator, low noise, 200 ma 17. abbreviations 18. references [1] iec 60134 ? rating systems for electronic tu bes and valves and analogous semiconductor devices [2] iec 61340-3-1 ? methods for simulation of electrostatic effects - human body model (hbm) electrostatic discharge test waveforms [3] jesd22-a115c ? electrostatic discharge (esd) sensitivity testing machine model (mm) [4] nx2-00001 ? nxp semiconductors quality and reliability specification [5] an10439 ? wafer level chip size package [6] an10365 ? surface mount reflow soldering description table 21. abbreviations acronym description csp chip-size package dut device under test emi electromagnet ic interference esd electrostatic discharge fr4 flame retard 4 hbm human body model ldo low dropout mm machine model nsmd non-solder mask design osp organic solderability preservation pcb printed-circuit board psrr power supply rejection ratio psu power supply unit qrs quality and reliability specification rms root mean square wlcsp wafer level chip-size package
ld6806_ser all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 3 ? 9 december 2011 32 of 36 nxp semiconductors ld6806 series ultra low-dropout regulator, low noise, 200 ma 19. revision history table 22. revision history document id release date data sheet status change notice supersedes ld6806_ser v.3 20111209 product data sheet - ld6806_ser v.2 modifications: ? wlcsp4 package with backside coating added ? sot753 package added ? subtype ld6806x/xxp introduced ? minor text changes ld6806_ser v.2 20110719 product data sheet - ld6806_ser v.1 modifications: ? descriptive title updated ? table 5 : title changed ? table 10 : three parameters updated ? table 3 : pin number updated ? section 9.4 and section 9.8 drawings updated ? section 16 : values updated ? minor text changes ld6806_ser v.1 20110516 preliminary data sheet - -
ld6806_ser all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 3 ? 9 december 2011 33 of 36 nxp semiconductors ld6806 series ultra low-dropout regulator, low noise, 200 ma 20. legal information 20.1 data sheet status [1] please consult the most recently issued document before initiating or completing a design. [2] the term ?short data sheet? is explained in section ?definitions?. [3] the product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple device s. the latest product status information is available on the internet at url http://www.nxp.com . 20.2 definitions draft ? the document is a draft versi on only. the content is still under internal review and subject to formal approval, which may result in modifications or additions. nxp semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall hav e no liability for the consequences of use of such information. short data sheet ? a short data sheet is an extract from a full data sheet with the same product type number(s) and title. a short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. for detailed and full information see the relevant full data sheet, which is available on request vi a the local nxp semiconductors sales office. in case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. product specification ? the information and data provided in a product data sheet shall define the specification of the product as agreed between nxp semiconductors and its customer , unless nxp semiconductors and customer have explicitly agreed otherwis e in writing. in no event however, shall an agreement be valid in which the nxp semiconductors product is deemed to offer functions and qualities beyond those described in the product data sheet. 20.3 disclaimers limited warranty and liability ? information in this document is believed to be accurate and reliable. however, nxp semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. in no event shall nxp semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. notwithstanding any damages that customer might incur for any reason whatsoever, nxp semiconductors? aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the terms and conditions of commercial sale of nxp semiconductors. right to make changes ? nxp semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. this document supersedes and replaces all information supplied prior to the publication hereof. suitability for use ? nxp semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an nxp semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. nxp semiconductors accepts no liability for inclusion and/or use of nxp semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer?s own risk. applications ? applications that are described herein for any of these products are for illustrative purpos es only. nxp semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. customers are responsible for the design and operation of their applications and products using nxp semiconductors products, and nxp semiconductors accepts no liability for any assistance with applications or customer product design. it is customer?s sole responsibility to determine whether the nxp semiconductors product is suitable and fit for the customer?s applications and products planned, as well as fo r the planned application and use of customer?s third party customer(s). customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. nxp semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer?s applications or products, or the application or use by customer?s third party customer(s). customer is responsible for doing all necessary testing for the customer?s applic ations and products using nxp semiconductors products in order to av oid a default of the applications and the products or of the application or use by customer?s third party customer(s). nxp does not accept any liability in this respect. limiting values ? stress above one or more limiting values (as defined in the absolute maximum ratings system of iec 60134) will cause permanent damage to the device. limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the recommended operating conditions section (if present) or the characteristics sections of this document is not warranted. constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. terms and conditions of commercial sale ? nxp semiconductors products are sold subject to the gener al terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms , unless otherwise agreed in a valid written individual agreement. in case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. nxp semiconductors hereby expressly objects to applying the customer?s general terms and conditions with regard to the purchase of nxp semiconducto rs products by customer. no offer to sell or license ? nothing in this document may be interpreted or construed as an offer to sell products t hat is open for acceptance or the grant, conveyance or implication of any lic ense under any copyrights, patents or other industrial or intellectual property rights. export control ? this document as well as the item(s) described herein may be subject to export control regulations. export might require a prior authorization from competent authorities. document status [1] [2] product status [3] definition objective [short] data sheet development this document contains data from the objecti ve specification for product development. preliminary [short] data sheet qualification this document contains data from the preliminary specification. product [short] data sheet production this document contains the product specification.
ld6806_ser all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 3 ? 9 december 2011 34 of 36 nxp semiconductors ld6806 series ultra low-dropout regulator, low noise, 200 ma non-automotive qualified products ? unless this data sheet expressly states that this specific nxp semicon ductors product is automotive qualified, the product is not suitable for automotive use. it is neither qualified nor tested in accordance with automotive testing or application requirements. nxp semiconductors accepts no liabili ty for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. in the event that customer uses t he product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without nxp semiconductors? warranty of the product for such automotive applicat ions, use and specifications, and (b) whenever customer uses the product for automotive applications beyond nxp semiconductors? specifications such use shall be solely at customer?s own risk, and (c) customer fully indemnifies nxp semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive app lications beyond nxp semiconductors? standard warranty and nxp semiconduct ors? product specifications. 20.4 trademarks notice: all referenced brands, produc t names, service names and trademarks are the property of their respective owners. 21. contact information for more information, please visit: http://www.nxp.com for sales office addresses, please send an email to: salesaddresses@nxp.com
ld6806_ser all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 3 ? 9 december 2011 35 of 36 nxp semiconductors ld6806 series ultra low-dropout regulator, low noise, 200 ma 22. tables table 1. pin description for sot753 . . . . . . . . . . . . . . . .2 table 2. pin description for wlc sp4 . . . . . . . . . . . . . . . .2 table 3. pin description for sot886 . . . . . . . . . . . . . . . .2 table 4. ordering information . . . . . . . . . . . . . . . . . . . . .3 table 5. type number and nominal output voltage of high-ohmic output . . . . . . . . . . . . . . . . . . . . . . .3 table 6. type number and nominal output voltage of low.ohmic output . . . . . . . . . . . . . . . . . . . . . . . .3 table 7. limiting values . . . . . . . . . . . . . . . . . . . . . . . . . .5 table 8. operating conditions . . . . . . . . . . . . . . . . . . . . .5 table 9. thermal characteristics . . . . . . . . . . . . . . . . . . .6 table 10. electrical characteristics . . . . . . . . . . . . . . . . . .6 table 11. external load capacitor . . . . . . . . . . . . . . . . . . .18 table 12. dimensions of LD6806CX4/xxx for package outline wlcsp4; see figure 35 . . . . . . . . . . . 19 table 13. dimensions of LD6806CX4/cxxx for package outline wlcsp4 with backside coating; see figure 36 . . . . . . . . . . . . . . . . . . . . . . . . . 20 table 14. dimensions of soldering footprint wlcsp4; see figure 39 . . . . . . . . . . . . . . . . . . . . . . . . . 23 table 15. lead-free process (from j-std-020c) . . . . . . 25 table 16. snpb eutectic process (from j-std-020c) . . . 28 table 17. lead-free process (from j-std-020c) . . . . . . 28 table 18. recommended pcb design parameters . . . . 29 table 19. assembly recommendations . . . . . . . . . . . . . . 30 table 20. characteristics . . . . . . . . . . . . . . . . . . . . . . . . 30 table 21. abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . 31 table 22. revision history . . . . . . . . . . . . . . . . . . . . . . . . 32 23. figures fig 1. configuration for sot753 . . . . . . . . . . . . . . . . . . .2 fig 2. configuration for wlcsp4 . . . . . . . . . . . . . . . . . .2 fig 3. configuration for sot886 . . . . . . . . . . . . . . . . . . .2 fig 4. block diagram of ld6806x/ xxh . . . . . . . . . . . . . . .4 fig 5. block diagram of ld6806x/ xxp . . . . . . . . . . . . . . .4 fig 6. dropout as a func tion of temperature for LD6806CX4/25h . . . . . . . . . . . . . . . . . . . . . . . . . .8 fig 7. dropout as a func tion of temperature for ld6806f/25h . . . . . . . . . . . . . . . . . . . . . . . . . . . .8 fig 8. dropout as a func tion of temperature for LD6806CX4/36h . . . . . . . . . . . . . . . . . . . . . . . . . .8 fig 9. dropout as a func tion of temperature for ld6806f/36h . . . . . . . . . . . . . . . . . . . . . . . . . . . .8 fig 10. dropout as a func tion of temperature for ld6806td/36p . . . . . . . . . . . . . . . . . . . . . . . . . . .9 fig 11. output voltage variation for LD6806CX4/12h . . . .9 fig 12. output voltage variation for LD6806CX4/25h . . . .9 fig 13. quiescent current for LD6806CX4/12h . . . . . . . .10 fig 14. quiescent current for LD6806CX4/25h . . . . . . . .10 fig 15. noise density for LD6806CX4/25h . . . . . . . . . . . 11 fig 16. noise density for LD6806CX4/36h . . . . . . . . . . . 11 fig 17. line regulation for LD6806CX4/12h . . . . . . . . . .12 fig 18. line regulation for ld6806f/12h. . . . . . . . . . . . .12 fig 19. line regulation for LD6806CX4/25h . . . . . . . . . .12 fig 20. line regulation for ld6806f/25h. . . . . . . . . . . . .12 fig 21. line regulation for LD6806CX4/36h . . . . . . . . . .13 fig 22. line regulation for ld6806f/36h. . . . . . . . . . . . .13 fig 23. load regulation for LD6806CX4/12h. . . . . . . . . .13 fig 24. load regulation for ld6806f/12h . . . . . . . . . . . .13 fig 25. load regulation for LD6806CX4/25h. . . . . . . . . .14 fig 26. load regulation for ld6806f/25h . . . . . . . . . . . .14 fig 27. load regulation for LD6806CX4/36h. . . . . . . . . .14 fig 28. load regulation for ld6806f/36h . . . . . . . . . . . .14 fig 29. start-up for LD6806CX4/23h . . . . . . . . . . . . . . . .15 fig 30. shut down for ld6806f/25p . . . . . . . . . . . . . . . .15 fig 31. psrr for LD6806CX4/25h . . . . . . . . . . . . . . . .16 fig 32. psrr for LD6806CX4/36h . . . . . . . . . . . . . . . .16 fig 33. enable threshold voltage . . . . . . . . . . . . . . . . . . .17 fig 34. application diagram. . . . . . . . . . . . . . . . . . . . . . . 18 fig 35. package outline wlcsp4. . . . . . . . . . . . . . . . . . 19 fig 36. package outline wlcsp4 with backside coating. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 fig 37. package outline sot886 (xson6). . . . . . . . . . . 21 fig 38. sot753; plastic surface-mounted package; 5 leads. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 fig 39. soldering footprint wlcsp4 . . . . . . . . . . . . . . . . 23 fig 40. soldering footprint sot8 86 (xson6) . . . . . . . . . 23 fig 41. sot753 (tsop5); reflow soldering footprint . . . 24 fig 42. sot753 (tsop5); wave soldering footprint . . . . 24 fig 43. temperature profiles for large and small components. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 fig 44. temperature profiles for large and small components. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 fig 45. pb-free solder reflow profile . . . . . . . . . . . . . . . . 30
nxp semiconductors ld6806 series ultra low-dropout regulator, low noise, 200 ma ? nxp b.v. 2011. all rights reserved. for more information, please visit: http://www.nxp.com for sales office addresses, please se nd an email to: salesaddresses@nxp.com date of release: 9 december 2011 document identifier: ld6806_ser please be aware that important notices concerning this document and the product(s) described herein, have been included in section ?legal information?. 24. contents 1 product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.1 general description . . . . . . . . . . . . . . . . . . . . . 1 1.2 features and benefits . . . . . . . . . . . . . . . . . . . . 1 1.3 applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 2 pinning information . . . . . . . . . . . . . . . . . . . . . . 2 2.1 pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 2.2 pin description . . . . . . . . . . . . . . . . . . . . . . . . . 2 3 ordering information . . . . . . . . . . . . . . . . . . . . . 3 3.1 ordering options . . . . . . . . . . . . . . . . . . . . . . . . 3 4 block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 4 5 limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 5 6 recommended operating conditions. . . . . . . . 5 7 thermal characteristics . . . . . . . . . . . . . . . . . . 6 8 characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 6 9 dynamic behavior . . . . . . . . . . . . . . . . . . . . . . . 7 9.1 dropout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 9.2 output voltage variation . . . . . . . . . . . . . . . . . . 9 9.3 quiescent current . . . . . . . . . . . . . . . . . . . . . . 10 9.4 noise . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 9.5 line regulation . . . . . . . . . . . . . . . . . . . . . . . . 12 9.6 load regulation . . . . . . . . . . . . . . . . . . . . . . . . 13 9.7 start-up and shut down. . . . . . . . . . . . . . . . . . 15 9.8 power supply rejection ratio (psrr). . . . . . 16 9.9 enable threshold voltage . . . . . . . . . . . . . . . . 17 10 application information. . . . . . . . . . . . . . . . . . 18 10.1 output capacitor values . . . . . . . . . . . . . . . . . 18 11 test information . . . . . . . . . . . . . . . . . . . . . . . . 18 11.1 quality information . . . . . . . . . . . . . . . . . . . . . 18 12 package outline . . . . . . . . . . . . . . . . . . . . . . . . 19 13 soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 14 soldering of wlcsp packages. . . . . . . . . . . . 24 14.1 introduction to soldering wlcsp packages . . 24 14.2 board mounting . . . . . . . . . . . . . . . . . . . . . . . 25 14.3 reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 25 14.3.1 stand off . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 14.3.2 quality of solder joint . . . . . . . . . . . . . . . . . . . 26 14.3.3 rework . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 14.3.4 cleaning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 15 soldering of smd packages . . . . . . . . . . . . . . 27 15.1 introduction to soldering . . . . . . . . . . . . . . . . . 27 15.2 wave and reflow soldering . . . . . . . . . . . . . . . 27 15.3 wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 28 15.4 reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 28 16 mounting. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 16.1 pcb design guidelines. . . . . . . . . . . . . . . . . . 29 16.2 pcb assembly gu idelines for pb-free soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 17 abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . 31 18 references. . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 19 revision history . . . . . . . . . . . . . . . . . . . . . . . 32 20 legal information . . . . . . . . . . . . . . . . . . . . . . 33 20.1 data sheet status . . . . . . . . . . . . . . . . . . . . . . 33 20.2 definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 20.3 disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . 33 20.4 trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . 34 21 contact information . . . . . . . . . . . . . . . . . . . . 34 22 tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35 23 figures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35 24 contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36

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