? e99143a1z-te sony reserves the right to change products and specifications without prior notice. this information does not convey any licens e by any implication or otherwise under any patents or other right. application circuits shown, if any, are typical examples illustr ating the operation of the devices. sony cannot assume responsibility for any problems arising out of the use of these circuits. absolute maximum ratings (ta=25 c) supply voltage v dd 7v control voltage vctl 5 v input power pin 25 dbm operating temperature topr 35 to +85 c storage temperature tstg 65 to +150 c description the CXG1039TN is a high isolation absorptive spdt (single pole dual throw) switch mmic used in pcs handsets. this ic is designed using the sony s gaas j-fet process and operates with cmos input. features absorptive type cmos input control low insertion loss 0.8 db (typ.) at 2.0 ghz high isolation 50 db (typ.) at 2.0 ghz small package tssop-10pin applications high isolation switch for digital cellular telephones such as pcs handsets. structure gaas j-fet mmic high isolation absorptive spdt switch mmic with integrated control logic 10 pin tssop (plastic) CXG1039TN gaas mmics are esd sensitive devices. special handling precautions are required.
2 CXG1039TN pin configuration block diagram 10pin tssop (plastic) ctl rf3 gnd gnd rf1 gnd gnd gnd v dd rf2 5 1 6 10 unit : mm sw1 rf1 sw3 sw4 sw2 rf3 rf2 50 ? 50 ? recommended circuit ctl rf1 rf3 rf2 CXG1039TN c2 100pf c2 100pf c2 100pf 1 2 3 4 5 6 7 8 9 10 rctl 1k ? rrf 100k ? c1 100pf c1 100pf v dd when using the CXG1039TN, the following external components should be used: c1: this is used for signal line filtering. 100 pf is recommended. c2: this is used for rf de-coupling and must be used in all applications. 100 pf is recommended. rctl: this is used to give improved esd performance. rrf: this resistor is used to stabilize the dc operating point at high power levels. a value of 100 k ? is recommended.
3 CXG1039TN truth table ctl h l rf1 - rf2 on rf1 - rf3 on sw1 on off sw2 off on sw3 off on sw4 on off operating condition (ta= 35 c to +85 c) control voltage (high) control voltage (low) bias voltage symbol vctl (h) vctl (l) v dd min. 2.5 0 2.7 typ. max. 3.6 0.5 4 unit. v v v
4 CXG1039TN electrical characteristics (1) v dd =3 v, vctl (l)=0 v, vctl (h)=2.8 v3 %, @2 ghz, pin=10 dbm, impedance at all ports : 50 ? (ta=25 c) item insertion loss isolation on port vswr off port vswr 3rd order input intercept point ? 1 input power for 1 dbm compression switching speed bias current control current symbol il iso vswr (on) vswr (off) ip3 p1db tsw i dd icrl min. 40 35 12 typ. 0.8 50 1.2 1.7 17 1 220 80 max. 1.2 1.5 2.0 5 350 150 unit db db dbm dbm s a a ? 1 two-tone input power up to 5 dbm electrical characteristics (2) v dd =3 v, vctl (l)=0 v, vctl (h)=2.8 v3 %, @2 ghz, pin=10 dbm, impedance at all ports : 50 ? (ta= 35 c to +85 c) item insertion loss isolation on port vswr off port vswr 3rd order input intercept point ? 1 input power for 1 dbm compression switching speed bias current control current symbol il iso vswr (on) vswr (off) ip3 p1db tsw i dd icrl min. 40 35 12 typ. 0.8 50 1.2 1.7 17 1 220 80 max. 1.4 1.5 2.0 5 450 180 unit db db dbm dbm s a a ? 1 two-tone input power up to 5 dbm
sony code eiaj code jedec code package material lead treatment lead material package mass epoxy resin solder plating copper alloy package structure 0.22 0.07 0.5 5 1.2max ? 2.8 0.1 10 6 ? 2.2 0.1 3.2 0.2 0.1 0.05 + 0.15 0.45 0.15 0 to 10 1 a (0.2) 0.22 0.07 + 0.08 (0.1) 0.12 0.015 + 0.025 detail a 0.02g tssop-10p-l01 10pin tssop(plastic) 0.1 0.1 m note: dimension ? does not include mold protrusion. 0.25 + 0.08 package outline unit : mm CXG1039TN 5 sony corporation lead plating specifications item lead material copper alloy solder composition sn-bi bi:1-4wt% plating thickness 5-18 m spec. sony code eiaj code jedec code package material lead treatment lead material package mass epoxy resin solder plating copper alloy package structure 0.22 0.07 0.5 5 1.2max ? 2.8 0.1 10 6 ? 2.2 0.1 3.2 0.2 0.1 0.05 + 0.15 0.45 0.15 0 to 10 1 a (0.2) 0.22 0.07 + 0.08 (0.1) 0.12 0.015 + 0.025 detail a 0.02g tssop-10p-l01 10pin tssop(plastic) 0.1 0.1 m note: dimension ? does not include mold protrusion. 0.25 + 0.08 sct ass'y
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