pb rohs es52e9b1v-10.000m es52e9 b 1 v -10.000m series rohs compliant (pb-free) 5mm x 7mm ceramic smd 3.3vdc clipped sinewave stratum 3 tc(vc)xo operating temperature range -10c to +60c frequency stability 0.28ppm maximum nominal frequency 10.000mhz control voltage 1.5vdc 1.0vdc electrical specifications nominal frequency 10.000mhz frequency stability 0.28ppm maximum (measured at vdd=3.3vdc and vc=1.5vdc) operating temperature range -10c to +60c supply voltage 3.3vdc 5% total holdover stability 0.37ppm maximum (inclusive of frequency stability and 24 hours aging) input current 1.5ma maximum output voltage 0.8vp-p clipped sinewave minimum (external dc-cut capacitor required, 150pf recommended) total frequency tolerance 4.6ppm maximum (inclusive of frequency tolerance, frequency stability, vdd (1%), load (5%), solder reflow, and 20 year aging) load drive capability 10kohms // 10pf output logic type clipped sinewave control voltage 1.5vdc 1.0vdc control voltage range 0.0vdc to vdd frequency deviation 5ppm minimum linearity 5% maximum transfer function positive transfer characteristic input impedance 100kohms minimum phase noise -80dbc/hz at 10hz offset, -115dbc/hz at 100hz offset, -135dbc/hz at 1khz offset, and -145dbc/hz at >=10khz offset (typical values at 12.800mhz) rms phase jitter 1psec maximum (fj = 12khz to 20mhz) start up time 10msec maximum storage temperature range -40c to +125c environmental & mechanical specifications fine leak test mil-std-883, method 1014 condition a gross leak test mil-std-883, method 1014 condition c mechanical shock mil-std-202, method 213 condition c resistance to soldering heat mil-std-202, method 210 resistance to solvents mil-std-202, method 215 solderability mil-std-883, method 2003 temperature cycling mil-std-883, method 1010 vibration mil-std-883, method 2007 condition a www.ecliptek.com | specification subject to change without notice | rev c 3/13/2011 | page 1 of 5
es52e9b1v-10.000m mechanical dimensions (all dimensions in millimeters) pin connection 1 do not connect 2 do not connect 3 do not connect 4 ground 5 output 6 do not connect 7 do not connect 8 do not connect 9 supply voltage 10 voltage control line marking 1 exx.xxx e=ecliptek designator xx.xxx=nominal frequency in mhz 2 xxyzz xx=ecliptek manufacturing code y=last digit of the year zz=week of the year 4.6 1.34 1.2(x4) 1.4(x4) 1.4 1.0 1.3 1.8 www.ecliptek.com | specification subject to change without notice | rev c 3/13/2011 | page 2 of 5 7.00 0.10 5.00 0.10 1.3 max 2.20 0.15 1.20 0.20 (x4) marking orient a tion 2.00 max 0.40 0.10 0.80 0.10 1.27 0.10 (x4) 2.54 0.10 (x2) 1.00 0.10 (x5) 0.80 0.10 (x4) 1.00 0.10 (x4) 0.60 0.10 (x6) 10 9 1 2 3 4 5 6 7 8 all t oler ances are 0.1 sug g ested solder p ad la y out solder land (x4) all dimensions in millimeters solder land (x5)
es52e9b1v-10.000m www.ecliptek.com | specification subject to change without notice | rev c 3/13/2011 | page 3 of 5 output w a veform 0v dc clock output v p-p p o w er supply oscilloscope probe (note 2) v oltage meter f requency counter 0.01 f (note 1) 0.1 f (note 1) supply v oltage (v dd ) output v oltage control ground r l = 10kohms t est cir cuit f or v olta g e contr ol option current meter p o w er supply v oltage meter c l = 10pf (note 3) note 1: an e xter nal 0.1 f lo w frequency tantalum b ypass capacitor in par allel with a 0.01 f high frequency cer amic b ypass capacitor close to the pac kage g round and v dd pin is required. note 2: a lo w capacitance (<12pf), 10x atten uation f actor , high impedance (>10mohms), and high bandwidth (>300mhz) passiv e probe is recommended. note 3: capacitance v alue c l includes sum of all probe and fixture capacitance . p o w er supply switch t r i-state 1000pf
t min s t max s critical zone t to t l p ramp-up ramp-down t l t p t 25 c to peak t preheat s t l t p temperature (t) time (t) recommended solder reflow methods es52e9b1v-10.000m high temperature infrared/convection ts max to tl (ramp-up rate) 3c/second maximum preheat - temperature minimum (ts min) 150c - temperature typical (ts typ) 175c - temperature maximum (ts max) 200c - time (ts min) 60 - 180 seconds ramp-up rate (tl to tp) 3c/second maximum time maintained above: - temperature (tl) 217c - time (tl) 60 - 150 seconds peak temperature (tp) 260c maximum for 10 seconds maximum target peak temperature (tp target) 250c +0/-5c time within 5c of actual peak (tp) 20 - 40 seconds ramp-down rate 6c/second maximum time 25c to peak temperature (t) 8 minutes maximum moisture sensitivity level level 1 www.ecliptek.com | specification subject to change without notice | rev c 3/13/2011 | page 4 of 5
t min s t max s critical zone t to t l p ramp-up ramp-down t l t p t 25 c to peak t preheat s t l t p temperature (t) time (t) recommended solder reflow methods es52e9b1v-10.000m low temperature infrared/convection 230c ts max to tl (ramp-up rate) 5c/second maximum preheat - temperature minimum (ts min) n/a - temperature typical (ts typ) 150c - temperature maximum (ts max) n/a - time (ts min) 30 - 60 seconds ramp-up rate (tl to tp) 5c/second maximum time maintained above: - temperature (tl) 150c - time (tl) 200 seconds maximum peak temperature (tp) 230c maximum target peak temperature (tp target) 230c maximum 2 times time within 5c of actual peak (tp) 10 seconds maximum 2 times ramp-down rate 5c/second maximum time 25c to peak temperature (t) n/a moisture sensitivity level level 1 low temperature manual soldering 185c maximum for 10 seconds maximum, 2 times maximum. high temperature manual soldering 260c maximum for 5 seconds maximum, 2 times maximum. www.ecliptek.com | specification subject to change without notice | rev c 3/13/2011 | page 5 of 5
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